WO1996036075A3 - Composant a semi-conducteur miniature conçu pour un montage en surface - Google Patents

Composant a semi-conducteur miniature conçu pour un montage en surface Download PDF

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Publication number
WO1996036075A3
WO1996036075A3 PCT/IB1996/000411 IB9600411W WO9636075A3 WO 1996036075 A3 WO1996036075 A3 WO 1996036075A3 IB 9600411 W IB9600411 W IB 9600411W WO 9636075 A3 WO9636075 A3 WO 9636075A3
Authority
WO
WIPO (PCT)
Prior art keywords
groove
substrate carrier
conductor tracks
semiconductor element
wall
Prior art date
Application number
PCT/IB1996/000411
Other languages
English (en)
Other versions
WO1996036075A2 (fr
Inventor
De Water Peter Wilhelmus M Van
Roelf Anco Jacob Groenhof
Cornelis Gerarus Schriks
Original Assignee
Philips Electronics Nv
Philips Norden Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics Nv, Philips Norden Ab filed Critical Philips Electronics Nv
Priority to JP8533916A priority Critical patent/JPH10503330A/ja
Priority to EP96910163A priority patent/EP0775369B1/fr
Priority to DE69615792T priority patent/DE69615792T2/de
Publication of WO1996036075A2 publication Critical patent/WO1996036075A2/fr
Publication of WO1996036075A3 publication Critical patent/WO1996036075A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

L'invention concerne un composant à semi-conducteur conçu pour un montage en surface au moyen d'un porte-substrat (1), dont la surface est pourvue d'une gorge (7) comportant des parois (8) sur lesquelles se trouvent des pistes conductrices (9), qui se prolongent sur la surface du porte-substrat (1) et constituent des conducteurs de branchement du dispositif possédant un élément semi-conducteur (10) situé dans la gorge (7) et dont la surface principale (11) est parallèle à une paroi (8), ledit élément (10) établissant un contact électrique avec les pistes conductrices (9) de la paroi (8), tandis que la gorge (7) est remplie par un matériau protecteur. L'invention est caractérisée par le fait que le porte-substrat (1) est pourvu d'une paroi latérale (15) reliant des parois (8) opposées de la gorge (7) des deux côtés de l'élément semi-conducteur (10). Cela permet de limiter considérablement les rebuts pendant et après la fabrication de composants à semi-conducteur relativement petits.
PCT/IB1996/000411 1995-05-10 1996-05-07 Composant a semi-conducteur miniature conçu pour un montage en surface WO1996036075A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP8533916A JPH10503330A (ja) 1995-05-10 1996-05-07 表面取付け用小形半導体デバイス
EP96910163A EP0775369B1 (fr) 1995-05-10 1996-05-07 Composant a semi-conducteur miniature con u pour un montage en surface
DE69615792T DE69615792T2 (de) 1995-05-10 1996-05-07 Miniatur-halbleiteranordnung für oberflächenmontage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP95201203 1995-05-10
EP95201203.7 1995-05-10

Publications (2)

Publication Number Publication Date
WO1996036075A2 WO1996036075A2 (fr) 1996-11-14
WO1996036075A3 true WO1996036075A3 (fr) 1997-02-13

Family

ID=8220281

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB1996/000411 WO1996036075A2 (fr) 1995-05-10 1996-05-07 Composant a semi-conducteur miniature conçu pour un montage en surface

Country Status (8)

Country Link
US (1) US5703401A (fr)
EP (1) EP0775369B1 (fr)
JP (1) JPH10503330A (fr)
KR (1) KR100372136B1 (fr)
CN (1) CN1097852C (fr)
DE (1) DE69615792T2 (fr)
MY (1) MY112050A (fr)
WO (1) WO1996036075A2 (fr)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US8669572B2 (en) * 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US7675145B2 (en) * 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US7635915B2 (en) * 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US8735920B2 (en) * 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8367945B2 (en) * 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US8866169B2 (en) * 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
US8049230B2 (en) * 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US8415692B2 (en) * 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
US9468070B2 (en) 2010-02-16 2016-10-11 Cree Inc. Color control of light emitting devices and applications thereof
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0439227A1 (fr) * 1990-01-23 1991-07-31 Koninklijke Philips Electronics N.V. Dispositif semiconducteur comportant un support, procédé de sa fabrication, et procédé de fabrication du support
WO1995028735A2 (fr) * 1994-04-15 1995-10-26 Philips Electronics N.V. Procede de fabrication d'un dispositif, dans lequel une barre de support est pourvue de pistes conductrices pour etablir un contact electrique avec un element semi-conducteur
WO1996003772A2 (fr) * 1994-07-26 1996-02-08 Philips Electronics N.V. Procede de fabrication d'un dispositif a semi-conducteurs pour montage en surface, et dispositif a semi-conducteurs pour montage en surface

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4147889A (en) * 1978-02-28 1979-04-03 Amp Incorporated Chip carrier
EP0139029A1 (fr) * 1983-10-19 1985-05-02 Olin Corporation Empaquetage pour semi-conducteur
GB8412674D0 (en) * 1984-05-18 1984-06-27 British Telecomm Integrated circuit chip carrier

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0439227A1 (fr) * 1990-01-23 1991-07-31 Koninklijke Philips Electronics N.V. Dispositif semiconducteur comportant un support, procédé de sa fabrication, et procédé de fabrication du support
WO1995028735A2 (fr) * 1994-04-15 1995-10-26 Philips Electronics N.V. Procede de fabrication d'un dispositif, dans lequel une barre de support est pourvue de pistes conductrices pour etablir un contact electrique avec un element semi-conducteur
WO1996003772A2 (fr) * 1994-07-26 1996-02-08 Philips Electronics N.V. Procede de fabrication d'un dispositif a semi-conducteurs pour montage en surface, et dispositif a semi-conducteurs pour montage en surface

Also Published As

Publication number Publication date
CN1097852C (zh) 2003-01-01
DE69615792D1 (de) 2001-11-15
WO1996036075A2 (fr) 1996-11-14
KR970705181A (ko) 1997-09-06
DE69615792T2 (de) 2002-05-23
EP0775369B1 (fr) 2001-10-10
US5703401A (en) 1997-12-30
CN1153579A (zh) 1997-07-02
EP0775369A2 (fr) 1997-05-28
MY112050A (en) 2001-03-31
JPH10503330A (ja) 1998-03-24
KR100372136B1 (ko) 2003-03-15

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