GB9220725D0 - Insulating substrate for mounting semiconductor devices - Google Patents

Insulating substrate for mounting semiconductor devices

Info

Publication number
GB9220725D0
GB9220725D0 GB929220725A GB9220725A GB9220725D0 GB 9220725 D0 GB9220725 D0 GB 9220725D0 GB 929220725 A GB929220725 A GB 929220725A GB 9220725 A GB9220725 A GB 9220725A GB 9220725 D0 GB9220725 D0 GB 9220725D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor devices
insulating substrate
mounting semiconductor
mounting
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB929220725A
Other versions
GB2260650B (en
GB2260650A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of GB9220725D0 publication Critical patent/GB9220725D0/en
Publication of GB2260650A publication Critical patent/GB2260650A/en
Application granted granted Critical
Publication of GB2260650B publication Critical patent/GB2260650B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4839—Assembly of a flat lead with an insulating support, e.g. for TAB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
GB9220725A 1991-10-14 1992-10-01 Insulating substrate for mounting semiconductor devices Expired - Lifetime GB2260650B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP26417491 1991-10-14
JP4010422A JPH05166969A (en) 1991-10-14 1992-01-24 Semiconductor device

Publications (3)

Publication Number Publication Date
GB9220725D0 true GB9220725D0 (en) 1992-11-11
GB2260650A GB2260650A (en) 1993-04-21
GB2260650B GB2260650B (en) 1995-03-22

Family

ID=26345679

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9220725A Expired - Lifetime GB2260650B (en) 1991-10-14 1992-10-01 Insulating substrate for mounting semiconductor devices

Country Status (3)

Country Link
JP (1) JPH05166969A (en)
DE (1) DE4234506A1 (en)
GB (1) GB2260650B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2287131A (en) * 1994-02-24 1995-09-06 Plessey Semiconductors Ltd Direct copper bonded substrates
JP3316714B2 (en) * 1994-05-31 2002-08-19 三菱電機株式会社 Semiconductor device
DE4421319A1 (en) * 1994-06-17 1995-12-21 Abb Management Ag Low-inductance power semiconductor module
JP3127754B2 (en) * 1995-01-19 2001-01-29 富士電機株式会社 Semiconductor device
RU2190284C2 (en) 1998-07-07 2002-09-27 Закрытое акционерное общество "Техно-ТМ" Two-sided electronic device
US7075103B2 (en) 2003-12-19 2006-07-11 General Electric Company Multilayer device and method of making
JP4867793B2 (en) 2007-05-25 2012-02-01 株式会社豊田自動織機 Semiconductor device
EP2315284A3 (en) * 2009-10-21 2013-03-27 Toshiba Lighting & Technology Corporation Light-Emitting apparatus and luminaire
JP2015035501A (en) * 2013-08-09 2015-02-19 日本特殊陶業株式会社 Heat radiation module and semiconductor module
JP6638284B2 (en) * 2015-09-28 2020-01-29 三菱マテリアル株式会社 Substrate for power module with heat sink and power module
JP6584928B2 (en) * 2015-11-16 2019-10-02 住友電工デバイス・イノベーション株式会社 Electronic equipment

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB817635A (en) * 1956-05-04 1959-08-06 Tony Brian Harding Improvements in or relating to printed circuit assemblies
US3994430A (en) * 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
DE8219553U1 (en) * 1982-07-08 1982-10-07 Brown, Boveri & Cie Ag, 6800 Mannheim SEMICONDUCTOR MODULE
JPS59150453A (en) * 1982-12-23 1984-08-28 Toshiba Corp Manufacture of substrate for seiconductor module
SU1601788A1 (en) * 1986-01-27 1990-10-23 Предприятие П/Я В-2749 Electronic module
DE3604882A1 (en) * 1986-02-15 1987-08-20 Bbc Brown Boveri & Cie PERFORMANCE SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE MODULE
JPS62205615A (en) * 1986-03-05 1987-09-10 株式会社村田製作所 Metallization of ceramics
DE3610288A1 (en) * 1986-03-26 1987-10-01 Bbc Brown Boveri & Cie PERFORMANCE SEMICONDUCTOR MODULE
GB2201123B (en) * 1987-02-19 1990-11-14 Marconi Electronic Devices Electrical conductor arrangement
IT1202657B (en) * 1987-03-09 1989-02-09 Sgs Microelettronica Spa MANUFACTURING PROCEDURE OF A SEMICONDUCTOR MODULAR POWER DEVICE AND DEVICE WITH IT OBTAINED
DE3728096C1 (en) * 1987-07-03 1989-01-12 Duerrwaechter E Dr Doduco Flat body, especially for use as a heat sink for electronic power components
JPH01120886A (en) * 1987-11-04 1989-05-12 Mitsubishi Electric Corp Ceramic substrate
JPH01272183A (en) * 1988-04-25 1989-10-31 Toshiba Corp Ceramics circuit board
DE8808767U1 (en) * 1988-07-08 1989-11-02 Akyürek, Altan, Dipl.-Ing., Wien Electrical module component
DE3924225C2 (en) * 1988-07-22 1994-01-27 Mitsubishi Electric Corp Method for producing a ceramic-metal composite substrate and ceramic-metal composite substrate
JPH0272695A (en) * 1988-09-07 1990-03-12 Toshiba Lighting & Technol Corp hybrid integrated circuit
DE3930859C2 (en) * 1988-09-20 1997-04-30 Schulz Harder Juergen Process for soldering at least two elements
DE3837618A1 (en) * 1988-11-05 1990-05-10 Semikron Elektronik Gmbh Electrical or electronic arrangement
DE3922485C1 (en) * 1989-07-08 1990-06-13 Doduco Gmbh + Co Dr. Eugen Duerrwaechter, 7530 Pforzheim, De
DE3931551C2 (en) * 1989-09-22 1993-11-18 Schulz Harder Juergen Method of making a substrate
DE4004844C1 (en) * 1990-02-16 1991-01-03 Abb Ixys Semiconductor Gmbh Copper metallisation on ceramic substrate - obtd. by bonding copper foil directly to whole surface of substrate, then masking and etching
DE4210900A1 (en) * 1992-04-02 1993-10-14 Hoechst Ag Process for producing an adhesive bond between copper layers and ceramic

Also Published As

Publication number Publication date
GB2260650B (en) 1995-03-22
GB2260650A (en) 1993-04-21
DE4234506A1 (en) 1993-04-15
JPH05166969A (en) 1993-07-02

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 20031111