WO1994017559A1 - Dispositifs peltier - Google Patents

Dispositifs peltier Download PDF

Info

Publication number
WO1994017559A1
WO1994017559A1 PCT/GB1994/000162 GB9400162W WO9417559A1 WO 1994017559 A1 WO1994017559 A1 WO 1994017559A1 GB 9400162 W GB9400162 W GB 9400162W WO 9417559 A1 WO9417559 A1 WO 9417559A1
Authority
WO
WIPO (PCT)
Prior art keywords
peltier device
end plates
semiconductor material
sink
electrically insulating
Prior art date
Application number
PCT/GB1994/000162
Other languages
English (en)
Inventor
Stylianos Panayi
Albert Edward Barker
Original Assignee
Global Domestic Products Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Global Domestic Products Limited filed Critical Global Domestic Products Limited
Priority to AU58893/94A priority Critical patent/AU5889394A/en
Publication of WO1994017559A1 publication Critical patent/WO1994017559A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Definitions

  • improved peltier devices avoid the use of thick ceramic end plates and are characterised by a microns-thin layer of an electrically insulating material bonded to opposed surface regions of the two heat sinks, an electrically conductive layer superimposed on each coating of electrically insulating material, and a layer of semiconductor material disposed between the two electrically conductive layers, the component parts of the entire device being bonded together as a consolidated structure.
  • An object of the present invention is to provide a further improved form of peltier device.
  • Fig. 1 is an end view of a conventional peltier device
  • FIG. 1 A conventionally constructed peltier device is illustrated in Fig. 1.
  • Two ceramic end plates 10 and 11 each of the same size and shape and mounted symmetrically i.e. identically aligned with respect to each other.
  • the end plates 10 and 11 are some 0.5mm in thickness and are thus very poor thermal conductors.
  • the two end plates 10 and 11 are separated by an assembly of semiconductor pillars 12 which are in the order of 1mm across, the two end plates 10 and 11 have only a space of 1mm between them, and the semiconductor pillars 12 occupy substantially the entire internal space between the two plates. Accordingly, there is very little available space either between the two end plates 10 and 1 1 or across the intervening space between them which could provide room for access to means for mounting primary, secondary or further heat sinks with respect to the end plates.
  • Fig. 4 there is illustrated a means of construction whereby secondary metallic heat absorption and heat dissipation sinks 15 and 16 respectively may be made self-supporting and may clamp the peltier device between them without any risk of damaging the more delicate end plates 10a and 11a of the device.
  • the heat dissipation sink 16 is configured to provide a supporting platform 17 which engages the outer surface of end plate 11 a, the end plate 10a being fixed against the surface of the heat absorption sink 15.
  • Threaded studs 18 extend outwardly from the heat absorption sink 15 and carry resilient supporting bushes 19, and the heat dissipation sink 16 has apertures whereby it may be located on the threaded studs 18 and clamped thereto by nuts 20.
  • the platform 17 of the heat dissipation sink 16 has apertures greater than the diameter of studs 'c' on end plate 11a and is secured by further nuts 21 applied thereto.
  • the heat dissipation sink 16 is advanced towards the heat absorption sink 15 so that the two parts meet and engage accurately on the threaded studs 18, before the platform 17 engages the studs 'c ⁇
  • a typical power supply to peltier devices of this kind may be in the form of a an electrically conductive track printed onto the electrically insulating material and delivering 12 volts at 70 watts. In the operation of the device this causes one of the end plates to become hot and the other to become cold. The heat is absorbed from and by the secondary heat sinks, and the device relies for efficient operation upon the heat being taken away from the hot end plate at least at the same rate as it is being presented to it. If the heat is not removed at the required rate then the device operates against a "thermal back pressure". This means that the energy being fed into the device is not being effectively used because the heat is not being dissipated at a sufficient rate. This energy must be dissipated in some manner and would be given off as heat thus exacerbating the problem of heat dissipation.
  • thermocouples which are not so accurate and are relatively slow to respond as well as often displaying characteristics of hysteresis.
  • the temperature sensing coatings/tracks 23 may be disposed in many different positions in relation to the position of the semiconductor pillars, and as illustrated in 4g, may be placed on the external surface of the end plate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Les dispositifs Peltier sont constitués habituellement d'une paire de plaques terminales en céramique épaisses entre lesquelles est placé un ensemble de colonnettes à semiconducteur, une piste d'alimentation en énergie électrique étant disposée entre chaque plaque terminale et les colonnettes. Le dispositif est placé entre un puits d'absorption de chaleur métallique (13) ainsi qu'un dissipateur de chaleur métallique (14), ce qui permet le transfert de la température de l'un vers l'autre. Les plaques terminales en céramique sont de faibles conducteurs thermiques et sont remplacées, selon un mode de réalisation de l'invention, par des puits de chaleur primaires métalliques (10, 11) sur lesquels est déposée une couche d'isolant électrique devant être située de part et autre des colonnettes à semiconducteur. Les plaques terminales métalliques (10, 119) (puits de chaleur primaires) sont non symétriques, permettant ainsi l'inclusion sur chaque plaque d'une tige filetée de fixation ou analogue, grâce à laquelle le dispositif Peltier peut être fixé à des puits d'absorption de chaleur (13) et à des dissipateurs (14) secondaires d'un appareil tel que l'armoire d'un réfrigérateur ou d'un congélateur.
PCT/GB1994/000162 1993-01-30 1994-01-27 Dispositifs peltier WO1994017559A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU58893/94A AU5889394A (en) 1993-01-30 1994-01-27 Peltier devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB939301884A GB9301884D0 (en) 1993-01-30 1993-01-30 Peltier devices
GB9301884.4 1993-01-30

Publications (1)

Publication Number Publication Date
WO1994017559A1 true WO1994017559A1 (fr) 1994-08-04

Family

ID=10729603

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB1994/000162 WO1994017559A1 (fr) 1993-01-30 1994-01-27 Dispositifs peltier

Country Status (3)

Country Link
AU (1) AU5889394A (fr)
GB (1) GB9301884D0 (fr)
WO (1) WO1994017559A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0201967A1 (fr) * 1985-05-09 1986-11-20 Ferro Techniek B.V. Dispositif de chauffage
JPS631084A (ja) * 1986-06-20 1988-01-06 Matsushita Refrig Co 熱電効果素子
US5040381A (en) * 1990-04-19 1991-08-20 Prime Computer, Inc. Apparatus for cooling circuits
GB2247348A (en) * 1990-07-17 1992-02-26 Global Domestic Prod Ltd Peltier devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0201967A1 (fr) * 1985-05-09 1986-11-20 Ferro Techniek B.V. Dispositif de chauffage
JPS631084A (ja) * 1986-06-20 1988-01-06 Matsushita Refrig Co 熱電効果素子
US5040381A (en) * 1990-04-19 1991-08-20 Prime Computer, Inc. Apparatus for cooling circuits
GB2247348A (en) * 1990-07-17 1992-02-26 Global Domestic Prod Ltd Peltier devices

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 200 (E - 619) 9 June 1988 (1988-06-09) *

Also Published As

Publication number Publication date
AU5889394A (en) 1994-08-15
GB9301884D0 (en) 1993-03-17

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