WO1993015593A1 - Ensemble d'interconnexion de tete a bande porteuse - Google Patents
Ensemble d'interconnexion de tete a bande porteuse Download PDFInfo
- Publication number
- WO1993015593A1 WO1993015593A1 PCT/US1992/010607 US9210607W WO9315593A1 WO 1993015593 A1 WO1993015593 A1 WO 1993015593A1 US 9210607 W US9210607 W US 9210607W WO 9315593 A1 WO9315593 A1 WO 9315593A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- suspension
- carrier strip
- electrically conductive
- interconnect
- conductor
- Prior art date
Links
- 239000000725 suspension Substances 0.000 claims abstract description 145
- 239000004020 conductor Substances 0.000 claims abstract description 101
- 238000009413 insulation Methods 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- 238000012545 processing Methods 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 9
- 230000004308 accommodation Effects 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- 230000001939 inductive effect Effects 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000011800 void material Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims 2
- 238000000059 patterning Methods 0.000 claims 2
- 238000000926 separation method Methods 0.000 claims 2
- 241001589086 Bellapiscis medius Species 0.000 claims 1
- 238000005299 abrasion Methods 0.000 claims 1
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 3
- 238000003860 storage Methods 0.000 abstract description 3
- 230000001681 protective effect Effects 0.000 abstract description 2
- 230000008093 supporting effect Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 23
- 238000013461 design Methods 0.000 description 6
- 230000003068 static effect Effects 0.000 description 6
- 238000002788 crimping Methods 0.000 description 3
- 230000008030 elimination Effects 0.000 description 3
- 238000003379 elimination reaction Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical group C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 241000220010 Rhode Species 0.000 description 1
- 239000004830 Super Glue Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000001976 improved effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- -1 mechanical fastening Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
Definitions
- a slider (or head) is flown above a spinning storage disk. Attached to the slider is a read/write transducer which transforms electrical pulses to small magnetic fields which are stored on the disk. The order of the magnetic fields and their subsequent orientation, aligned along the circumference of the disk in north-south configuration, defines a bit code capable of detection as the slider flies over the disk.
- the sliders are held in place above the disk by a metal spring structure known in the industry as a suspension.
- This suspension attaches to a rigid arm manipulated by a linear or rotary motion actuator designed to locate the slider at any radial position above the disk.
- the spinning disk coupled with the actuator movement serves to gain access to multiple tracks across the disk surface, each capable of containing stored data for later retrieval.
- the invention of interest defines a head interconnect assembly comprised of conductive elements such as parallel or twisted wire(s) of 44 A G fixedly attached to prepatterned film carrier.
- the conductors are routed down the carrier strip matching a predetermined orientation and placement. Conductor routing matches the pattern required to mate with the suspension member without manual manipulation during assembly.
- the conductors are fixedly spaced with the option of having the insulative coating stripped, to match multiple bonding pad placement and orientation.
- the carrier strip shall contain patterned features defining open regions of accommodation for the suspension and appendages of support for the mating conductors as well as provision for mechanized tooling and assembly.
- FIG. 1 is a perspective view of a conventional magnetic head suspension assembly
- FIG. 2 is a perspective view of the preferred embodiment showing a head suspension assembly with carrier strip interconnect attached prior to final assembly step;
- FIG. 3 is an exploded view of the preferred embodiment 3 showing the conductive interconnect, carrier strip, and suspension;
- FIG. 1 shows a conventional magnetic suspension assembly.
- the assembly includes a slider, or a transducer head 12 which is electrically connected by fine insulated wires 14 routed through a pol tetrafluoroethylene (PTFE) tube 16 held to suspension 18 by wire captures 20 and center tang 22.
- PTFE pol tetrafluoroethylene
- FIG. 1 shows a conventional magnetic suspension assembly.
- the assembly includes a slider, or a transducer head 12 which is electrically connected by fine insulated wires 14 routed through a pol tetrafluoroethylene (PTFE) tube 16 held to suspension 18 by wire captures 20 and center tang 22.
- PTFE pol tetrafluoroethylene
- the conductor elements 52 can be insulated wire, twisted or parallel such as 44 AWG diameter (or smaller) oxygen free, high conductivity copper wire with 1.7 micrometers gold plating, insulated with 5 micrometers polyurethane such as that produced by Molecu Wire of Farmingdale, New Jersey.
- FIG. 3 portrays the patterned film carrier strip 50 including central void region 56 accommodating the attachment of the head suspension assembly 54, a fixturing tab 58, for accommodating electrical hook-up and test fixturing and 60. for positioning the conductor elements 52 during the head bonding operation.
- tooling reference features 62 within film carrier strip serve to reference conductor elements 52 and suspension assembly 54 to film carrier strip 50 and, in turn, one another.
- Removal of the film carrier strip from the head suspension assembly could take place via excision at the appendages 64 leaving a small segment of the appendage material and the conductive elements attached to the suspension assembly or via complete removal of the film carrier strip leaving only the conductive elements attached to the suspension.
- Usage as portrayed with more than one suspension assembly, can be utilized with assorted Winchester flexure and Whitney suspension mechanism designs, and consistent location of patterned tooling features 62 from one head suspension assembly to another allows consistent handling equipment between head suspension assembly types.
- the presently disclosed carrier strip head interconnect is particularly useful in the following areas.
- the conductive wire leads provide means of electrical signal transfer between read/write transducer (head) and amplifier electronics.
- Using adhesive/thermoplastic for bonding the interconnect to the suspension secures the interconnect to the suspension, while avoiding internal stresses to the suspension during wire crimping and providing variable bond surface area, count and location.
- the conductor design elements provide multiple twists per linear inch, various conductor insulating coatings, various conductor metallurgies and platings, multiple conductors per interconnect and allow twisted or parallel conductor format.
- the spaced conductor design provides options for multiple spacing widths of fixed leads, strip lengths and locations of fixed leads, parallel and angular conductor routing at the head relative to one another.
- the spaced conductors at the bond sites provide means of matching conductive pad spacings on the head and on the electronics, attachment to the head with limited or no manual positioning of the conductors, attachment to the electronics without manual positioning of the conductors, accommodating su -assembly electrical test probe access, accommodating variable conductor count per interconnect, and positioning of multiple leads in a single operation or locating step.
- the fixed length service loop allows reduced variation in static bias, and allows positioning a service loop on the "left" or "right” side as well as straight out over the nose of the suspension.
- the conductive leads secured to the plastic carrier strip provide novelty in the following features. Consistent interconnect routing is provided along the X and Y (horizontal) and Z (vertical) axes of the suspension assembly.
- the interconnect support during shipping and handling avoids damaging contact with the conductors (bends) and allows damage-free multi-axis rotation of the conductors.
- the plastic film carrier strip defines alignment between the interconnect and the suspension during assembly.
- the carrier strip can aid in avoiding conductor contact with sharp metal edges of the suspension by functioning as an intermediate substrate.
- the carrier strip permits securing variable conductor lengths at the electronics end, and facilitates conductor positioning and electrical test by providing a placement tab at the electronics end. Particulate entrapment within pocketed cavities (such as the tube) is avoided. Particulate generation is avoided by eliminating the wire crimping operation. Improved consistency in static bias is achieved through repeatable interconnect routing along the suspension. Installation bias is reduced by elimination of manual interconnect routing and fixing to the suspension.
- Static bias to the suspension is reduced by reducing the interconnect structure (i.e., tube elimination) in the radius bend area of the suspension and preforming the interconnect and the carrier strip to match pre ⁇ loaded position prior to application to the suspension.
- the outrigger carrier strip format reduces the chance of thermal mismatch between the suspension and the carrier by reducing contact area attached to the suspension.
- the interconnect/suspension and the HGA assembly are automatable due to tooling and reference features on the carrier strip.
- the strip format is conducive to line processing. The "left" and "right", and the top and bottom attachment of the interconnect to the suspension is facilitated. Manipulation of the carrier strip holding the suspension facilitates handling, holding and manipulating the suspension without actually holding the suspension itself, reducing potential for handling damage and/or contamination.
- the presently disclosed carrier strip head interconnect improves upon the prior art in the following ways.
- the carrier strip allows the elimination of manual lead positioning during bonding at slide and electronic bond sites. Manual routing of the interconnect along the suspension is also avoided.
- the wire crimping operation is eliminated, which in turn, eliminates induced stress to the suspension, lowers the require_! profile of the suspension and reduces labor required for the assembly. Eliminating the need for the containment tube lowers the required profile of the suspension and reduces the mass of the interconnect assembly.
Landscapes
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP93900955A EP0624305A4 (en) | 1992-01-28 | 1992-12-08 | Carrier strip head interconnect assembly. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US808,406 | 1985-12-11 | ||
US80840692A | 1992-01-28 | 1992-01-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1993015593A1 true WO1993015593A1 (fr) | 1993-08-05 |
Family
ID=25198671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1992/010607 WO1993015593A1 (fr) | 1992-01-28 | 1992-12-08 | Ensemble d'interconnexion de tete a bande porteuse |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0624305A4 (fr) |
JP (1) | JP2592773B2 (fr) |
WO (1) | WO1993015593A1 (fr) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995013609A1 (fr) * | 1993-11-12 | 1995-05-18 | Conner Peripherals, Inc. | Support de fil metallique pour unite de disque |
US5491597A (en) * | 1994-04-15 | 1996-02-13 | Hutchinson Technology Incorporated | Gimbal flexure and electrical interconnect assembly |
US5598307A (en) * | 1994-04-15 | 1997-01-28 | Hutchinson Technology Inc. | Integrated gimbal suspension assembly |
EP0767450A2 (fr) * | 1995-10-06 | 1997-04-09 | W.L. GORE & ASSOCIATES, INC. | Interconnecteur tête/pré-amplifier en forme de ruban pour appareil à mémoire de données |
EP0806763A2 (fr) * | 1996-05-09 | 1997-11-12 | W.L. GORE & ASSOCIATES, INC. | Interconnecteur tête/pré-amplificateur en forme de ruban pour appareil à mémoire de données |
US5835306A (en) * | 1995-06-07 | 1998-11-10 | Hutchinson Technology Incorporated | Integrated gimbal suspension assembly with assymetric bond pad |
US5883759A (en) * | 1996-02-22 | 1999-03-16 | Seagate Technology, Inc. | Flex circuit head interconnect for improved electrical performance and ease of assembly |
US6134075A (en) * | 1994-04-15 | 2000-10-17 | Hutchinson Technology Incorporated | Magnetic head suspension with single layer preshaped trace interconnect |
US6147839A (en) * | 1996-12-23 | 2000-11-14 | Hutchinson Technology, Inc. | Head suspension with outriggers extending across a spring region |
US6771470B1 (en) | 1999-11-17 | 2004-08-03 | Tdk Corporation | Magnetic head assembly having a rotational arm for electrically connecting the magnetic head to an external circuit and methods of manufacturing the same |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3195079A (en) * | 1963-10-07 | 1965-07-13 | Burton Silverplating | Built up nonmetallic wave guide having metallic coating extending into corner joint and method of making same |
US4645280A (en) * | 1985-08-08 | 1987-02-24 | Rogers Corporation | Solderless connection technique between data/servo flex circuits and magnetic disc heads |
US4819094A (en) * | 1986-08-12 | 1989-04-04 | Oberg Gary R | Damped magnetic head suspension assembly |
US4853811A (en) * | 1987-08-03 | 1989-08-01 | International Business Machines Corporation | Magnetic disk drive with low profile head-suspension system |
US4991045A (en) * | 1987-12-21 | 1991-02-05 | Hutchinson Technology, Inc. | Suspension assembly |
US5001589A (en) * | 1989-05-31 | 1991-03-19 | Seagate Technology, Inc. | Tungsten and tantalum diffusion barriers for Metal-In-Gap magnetic heads |
US5012368A (en) * | 1988-04-29 | 1991-04-30 | International Business Machines Corporation | Magnetic head/support assembly and access mechanism for a disk file |
US5060956A (en) * | 1990-05-17 | 1991-10-29 | Glass Philip E | Lawn game |
US5121273A (en) * | 1990-04-12 | 1992-06-09 | Micropolis Corporation | Computer disk head interconnect assembly |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4520555A (en) * | 1982-09-27 | 1985-06-04 | Magnetic Information Technology, Inc. | Apparatus and method for aligning and assembly of a gimbal, magnetic slider head, and flexure arm |
US4616279A (en) * | 1983-05-19 | 1986-10-07 | Hewlett Packard Company | Electrical connections for thin film transducer heads |
JPS6119083A (ja) * | 1984-07-05 | 1986-01-27 | キヤノン電子株式会社 | 導電部材 |
-
1992
- 1992-12-08 EP EP93900955A patent/EP0624305A4/en not_active Withdrawn
- 1992-12-08 JP JP51319493A patent/JP2592773B2/ja not_active Expired - Lifetime
- 1992-12-08 WO PCT/US1992/010607 patent/WO1993015593A1/fr not_active Application Discontinuation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3195079A (en) * | 1963-10-07 | 1965-07-13 | Burton Silverplating | Built up nonmetallic wave guide having metallic coating extending into corner joint and method of making same |
US4645280A (en) * | 1985-08-08 | 1987-02-24 | Rogers Corporation | Solderless connection technique between data/servo flex circuits and magnetic disc heads |
US4819094A (en) * | 1986-08-12 | 1989-04-04 | Oberg Gary R | Damped magnetic head suspension assembly |
US4853811A (en) * | 1987-08-03 | 1989-08-01 | International Business Machines Corporation | Magnetic disk drive with low profile head-suspension system |
US4991045A (en) * | 1987-12-21 | 1991-02-05 | Hutchinson Technology, Inc. | Suspension assembly |
US5012368A (en) * | 1988-04-29 | 1991-04-30 | International Business Machines Corporation | Magnetic head/support assembly and access mechanism for a disk file |
US5001589A (en) * | 1989-05-31 | 1991-03-19 | Seagate Technology, Inc. | Tungsten and tantalum diffusion barriers for Metal-In-Gap magnetic heads |
US5121273A (en) * | 1990-04-12 | 1992-06-09 | Micropolis Corporation | Computer disk head interconnect assembly |
US5060956A (en) * | 1990-05-17 | 1991-10-29 | Glass Philip E | Lawn game |
Non-Patent Citations (1)
Title |
---|
See also references of EP0624305A4 * |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995013609A1 (fr) * | 1993-11-12 | 1995-05-18 | Conner Peripherals, Inc. | Support de fil metallique pour unite de disque |
US5491597A (en) * | 1994-04-15 | 1996-02-13 | Hutchinson Technology Incorporated | Gimbal flexure and electrical interconnect assembly |
US5598307A (en) * | 1994-04-15 | 1997-01-28 | Hutchinson Technology Inc. | Integrated gimbal suspension assembly |
US6587310B1 (en) | 1994-04-15 | 2003-07-01 | Hutchinson Technology, Inc. | Magnetic head suspension with single layer preshaped trace interconnect |
US5645735A (en) * | 1994-04-15 | 1997-07-08 | Hutchinson Technology Incorporated | Gimbal flexure and electrical interconnect assembly |
US6134075A (en) * | 1994-04-15 | 2000-10-17 | Hutchinson Technology Incorporated | Magnetic head suspension with single layer preshaped trace interconnect |
US5835306A (en) * | 1995-06-07 | 1998-11-10 | Hutchinson Technology Incorporated | Integrated gimbal suspension assembly with assymetric bond pad |
EP0767450A3 (fr) * | 1995-10-06 | 1998-01-07 | W.L. GORE & ASSOCIATES, INC. | Interconnecteur tête/pré-amplifier en forme de ruban pour appareil à mémoire de données |
EP0767450A2 (fr) * | 1995-10-06 | 1997-04-09 | W.L. GORE & ASSOCIATES, INC. | Interconnecteur tête/pré-amplifier en forme de ruban pour appareil à mémoire de données |
US5883759A (en) * | 1996-02-22 | 1999-03-16 | Seagate Technology, Inc. | Flex circuit head interconnect for improved electrical performance and ease of assembly |
EP0806763A3 (fr) * | 1996-05-09 | 1998-11-18 | W.L. GORE & ASSOCIATES, INC. | Interconnecteur tête/pré-amplificateur en forme de ruban pour appareil à mémoire de données |
EP0806763A2 (fr) * | 1996-05-09 | 1997-11-12 | W.L. GORE & ASSOCIATES, INC. | Interconnecteur tête/pré-amplificateur en forme de ruban pour appareil à mémoire de données |
US6147839A (en) * | 1996-12-23 | 2000-11-14 | Hutchinson Technology, Inc. | Head suspension with outriggers extending across a spring region |
US6771470B1 (en) | 1999-11-17 | 2004-08-03 | Tdk Corporation | Magnetic head assembly having a rotational arm for electrically connecting the magnetic head to an external circuit and methods of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
EP0624305A4 (en) | 1995-12-13 |
EP0624305A1 (fr) | 1994-11-17 |
JP2592773B2 (ja) | 1997-03-19 |
JPH07502855A (ja) | 1995-03-23 |
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