WO1992012610A1 - Dispositif de traitement de materiau a l'arc de plasma - Google Patents

Dispositif de traitement de materiau a l'arc de plasma Download PDF

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Publication number
WO1992012610A1
WO1992012610A1 PCT/SU1990/000287 SU9000287W WO9212610A1 WO 1992012610 A1 WO1992012610 A1 WO 1992012610A1 SU 9000287 W SU9000287 W SU 9000287W WO 9212610 A1 WO9212610 A1 WO 9212610A1
Authority
WO
WIPO (PCT)
Prior art keywords
plasma
οsi
ρazοmκnuτοgο
κazhdοgο
πlοsκοsτi
Prior art date
Application number
PCT/SU1990/000287
Other languages
English (en)
Russian (ru)
Inventor
Pavel Pavlovich Kulik
Oleg Vyacheslavovich Sinyagin
Iskander Malikovich Tokmulin
Original Assignee
Inzhenerny Tsentr ''plazmodinamika''
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inzhenerny Tsentr ''plazmodinamika'' filed Critical Inzhenerny Tsentr ''plazmodinamika''
Priority to GB9316309A priority Critical patent/GB2271044B/en
Priority to PCT/SU1990/000287 priority patent/WO1992012610A1/fr
Publication of WO1992012610A1 publication Critical patent/WO1992012610A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/32—Plasma torches using an arc
    • H05H1/44—Plasma torches using an arc using more than one torch
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/48—Generating plasma using an arc
    • H05H1/50—Generating plasma using an arc and using applied magnetic fields, e.g. for focusing or rotating the arc

Definitions

  • the hardware is available for the electric device ⁇ : 5 for processing, and more than that, the device is free to pay for the process.
  • s ⁇ len ⁇ idami provided between ⁇ e ⁇ - ⁇ magni ⁇ nym ⁇ v ⁇ d ⁇ m, ⁇ nets ⁇ g ⁇ ⁇ as ⁇ l ⁇ zhen between 0 and ⁇ sy ⁇ shi ⁇ v ⁇ da s ⁇ ve ⁇ s ⁇ vuyuschim ele ⁇ dnym uzl ⁇ m and tse ⁇ ⁇ ntsa ⁇ v ⁇ da ⁇ as ⁇ l ⁇ zhen in ⁇ l ⁇ s ⁇ s ⁇ i simme ⁇ ii ⁇ l ⁇ s ⁇ v da ⁇ n ⁇ g ⁇ ⁇ az ⁇ m ⁇ nu ⁇ g ⁇ magni ⁇ v ⁇ da.
  • Ele ⁇ d ⁇ ye nodes 4 ⁇ d ⁇ lyucheny is ⁇ chni ⁇ u b ⁇ ⁇ ⁇ s ⁇ yann ⁇ g ⁇ ⁇ a za ⁇ e ⁇ - ⁇ Lena ⁇ sn ⁇ vanin ⁇ a 3 ⁇ m ⁇ schyu ⁇ nsh ⁇ ey ⁇ v 7.
  • Ele ⁇ d- nye nodes 4 us ⁇ an ⁇ vle ⁇ n simme ⁇ ichn ⁇ ⁇ n ⁇ si ⁇ eln ⁇ ⁇ l ⁇ s ⁇ - s ⁇ p in ⁇ y ⁇ as ⁇ l ⁇ zhena ⁇ s 2 shi ⁇ ts ⁇ v ⁇ da I. ⁇ a ⁇ azhd ⁇ m ⁇ nsh ⁇ eyne 7 / Shre ⁇ le ⁇
  • the selenoid 9 the connected to the source 10 10 of the current. Every 3 electrical nodes 3 have a simplicity of space, and are fun!
  • plan II Part of the unit 7, located between the village of 9, is plan II, made from an external magnetic material.
  • Blocktein 7 and plate II are the ZC output of the disconnected magnet.
  • End Plan II that is, the end of the exit is located between the I and the common electrical device.
  • the device is used for electrical components - these devices are located on the unit with 2 busbars I with a step of 360 units / ⁇ ..
  • Each elec- tric unit no. 4 is made in the form of a cigar-10 camcorder 12 (Fig. 3) with a 13th potentiometer;
  • each electrical node 4 generates a plasma with a speed of 20, conventionally 30-30 shown in Fig. 3.5. Plasma streams 20 ⁇ and descend to a zone of 21 mixing and plasma:: 22.
  • ⁇ Celenoids 2 source 10 of the output of electric power is also: current and health: non-plasma: the magnetic field is not disturbed; ⁇ > -
  • the matteiad 19 is kept at a natural center. - 7 -
  • the other part of the plasma channel is accelerated by a moving plasma and intensively and equally warming up along the course of the plasma channel.
  • ⁇ deivist ⁇ is the power of a gas-driven gas quasi-bending of bending gas flow (plasma).
  • Zsli would be of g s ⁇ 1s ⁇ ve byl ⁇ ⁇ l ⁇ ⁇ dn ⁇ ⁇ le ⁇ , ⁇ ⁇ : sluchashyum ⁇ l ⁇ neni ⁇ s ⁇ ui 20 s ⁇ nu v ⁇ z ⁇ as ⁇ aniya indg ⁇ tsii 3 (v ⁇ iz ⁇ ⁇ si ⁇ ⁇ ig.4 on), the power ele ⁇ magsh ⁇ -
  • the claimed device is more efficient and has a higher output, which indicates that the plasma burner is inactive: - ⁇ - ⁇ ⁇ ⁇ ⁇ eue ⁇ ⁇ e ⁇ n ⁇ l ⁇ gii ⁇ b ⁇ ab ⁇ p Te: T she ⁇ a ⁇ u ⁇ z ⁇ laz- ⁇ .i ⁇ ⁇ tsen ⁇ e summa ⁇ n ⁇ g ⁇ ⁇ a ⁇ lucha ⁇ ⁇ , changing znache ⁇ iya ele ⁇ iches ⁇ i ⁇ ⁇ v in duga ⁇ , ⁇ as ⁇ dy gaz ⁇ g che ⁇ ez ele ⁇ -.
  • ⁇ 5 ⁇ ⁇ ⁇ 2 (0,5- ⁇ 0) ⁇ 0- 3 ⁇ .

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Arc Welding Control (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)

Abstract

Un dispositif de traitement d'un matériau à l'arc de plasma comprend un conduit de charge (1) autour duquel sont montés des générateurs de jets de plasma à arc électrique, ainsi qu'un système magnétique constitué par des circuits magnétiques ouverts, chaque générateur de jets de plasma à arc électrique étant constitué par deux électrodes (4). Des électro-aimants (9) sont montés sur les pôles (8) du circuit magnétique ouvert. La section du circuit magnétique ouvert entre les électro-aimants (9) est dotée d'une prise ferromagnétique. Le dispositif de l'invention peut être utilisé dans différents domaines industriels dans le traitement thermique ou chimique de matériaux au plasma.
PCT/SU1990/000287 1990-12-26 1990-12-26 Dispositif de traitement de materiau a l'arc de plasma WO1992012610A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB9316309A GB2271044B (en) 1990-12-26 1990-12-26 Apparatus for plasma-arc machining
PCT/SU1990/000287 WO1992012610A1 (fr) 1990-12-26 1990-12-26 Dispositif de traitement de materiau a l'arc de plasma

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SU1990/000287 WO1992012610A1 (fr) 1990-12-26 1990-12-26 Dispositif de traitement de materiau a l'arc de plasma

Publications (1)

Publication Number Publication Date
WO1992012610A1 true WO1992012610A1 (fr) 1992-07-23

Family

ID=21617724

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SU1990/000287 WO1992012610A1 (fr) 1990-12-26 1990-12-26 Dispositif de traitement de materiau a l'arc de plasma

Country Status (2)

Country Link
GB (1) GB2271044B (fr)
WO (1) WO1992012610A1 (fr)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996023394A1 (fr) * 1995-01-26 1996-08-01 ZAKRYTOE AKTSIONERNOE OBSCHESTVO PROIZVODSTVENNAYA FIRMA 'Az' Appareil generateur de flux plasmique
US5767627A (en) * 1997-01-09 1998-06-16 Trusi Technologies, Llc Plasma generation and plasma processing of materials
US6040548A (en) * 1996-05-31 2000-03-21 Ipec Precision, Inc. Apparatus for generating and deflecting a plasma jet
US6139678A (en) * 1997-11-20 2000-10-31 Trusi Technologies, Llc Plasma processing methods and apparatus
US6168697B1 (en) 1998-03-10 2001-01-02 Trusi Technologies Llc Holders suitable to hold articles during processing and article processing methods
US6238587B1 (en) 1996-05-31 2001-05-29 Ipec Precison, Inc. Method for treating articles with a plasma jet
US6261375B1 (en) 1999-05-19 2001-07-17 Tru-Si Technologies, Inc. Plasma processing methods and apparatus
US6423923B1 (en) 2000-08-04 2002-07-23 Tru-Si Technologies, Inc. Monitoring and controlling separate plasma jets to achieve desired properties in a combined stream
US6660643B1 (en) 1999-03-03 2003-12-09 Rwe Schott Solar, Inc. Etching of semiconductor wafer edges
US6749764B1 (en) 2000-11-14 2004-06-15 Tru-Si Technologies, Inc. Plasma processing comprising three rotational motions of an article being processed
US7491344B2 (en) * 2002-11-07 2009-02-17 Samsung Electronics Co., Ltd. Method for etching an object using a plasma and an object etched by a plasma
JP2010511285A (ja) * 2006-11-28 2010-04-08 ウラジミール・イー・ベラシュチェンコ プラズマ装置およびシステム
EP2270845A2 (fr) 1996-10-29 2011-01-05 Tru-Si Technologies Inc. Circuits intégrés et leurs procédés de fabrication

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI954843A (fi) * 1995-10-11 1997-04-12 Valtion Teknillinen Menetelmä ja laite plasman muodostamiseksi
WO1997018694A1 (fr) * 1995-11-13 1997-05-22 Ist Instant Surface Technology S.A. Reacteur a jet de plasma
US6278241B1 (en) * 1995-11-13 2001-08-21 Tepla Ag Four-nozzle plasma generator for forming an activated jet
WO1997019895A1 (fr) * 1995-11-27 1997-06-05 Volgogradskoe Otkrytoe Aktsionernoe Obschestvo 'khimprom' Procede de production de dioxyde de titane et reacteur chimico-plasmique pour la mise en oeuvre de ce procede
GB2324196B (en) * 1997-04-09 2001-10-24 Aea Technology Plc Plasma processing
WO1998053201A1 (fr) * 1997-05-23 1998-11-26 Societe Nationale D'etude Et De Construction De Moteurs D'aviation 'snecma' Dispositif de concentration de faisceau d'ions pour propulseur a plasma et propulseur a plasma equipe d'un tel dispositif

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2622029A1 (de) * 1975-05-20 1976-12-02 Soudure Autogene Elect Vorrichtung zur erzeugung eines hochtemperatur-plasmas
GB1525393A (en) * 1974-10-02 1978-09-20 Daido Steel Co Ltd Heat treating apparatus and method
EP0075953A1 (fr) * 1981-09-30 1983-04-06 Kabushiki Kaisha Toshiba Appareils à plasme
DE3805732A1 (de) * 1988-02-24 1989-09-07 Linde Ag Plasmabrenner

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1525393A (en) * 1974-10-02 1978-09-20 Daido Steel Co Ltd Heat treating apparatus and method
DE2622029A1 (de) * 1975-05-20 1976-12-02 Soudure Autogene Elect Vorrichtung zur erzeugung eines hochtemperatur-plasmas
EP0075953A1 (fr) * 1981-09-30 1983-04-06 Kabushiki Kaisha Toshiba Appareils à plasme
DE3805732A1 (de) * 1988-02-24 1989-09-07 Linde Ag Plasmabrenner

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996023394A1 (fr) * 1995-01-26 1996-08-01 ZAKRYTOE AKTSIONERNOE OBSCHESTVO PROIZVODSTVENNAYA FIRMA 'Az' Appareil generateur de flux plasmique
US6040548A (en) * 1996-05-31 2000-03-21 Ipec Precision, Inc. Apparatus for generating and deflecting a plasma jet
US6238587B1 (en) 1996-05-31 2001-05-29 Ipec Precison, Inc. Method for treating articles with a plasma jet
EP2270846A2 (fr) 1996-10-29 2011-01-05 Tru-Si Technologies Inc. Circuits intégrés et leurs procédés de fabrication
EP2270845A2 (fr) 1996-10-29 2011-01-05 Tru-Si Technologies Inc. Circuits intégrés et leurs procédés de fabrication
US5767627A (en) * 1997-01-09 1998-06-16 Trusi Technologies, Llc Plasma generation and plasma processing of materials
WO1998031038A1 (fr) 1997-01-09 1998-07-16 Trusi Technologies, Llc Production de plasma et traitement de materiaux au plasma
US6627039B1 (en) 1997-11-20 2003-09-30 Tru-Si Technologies, Inc. Plasma processing methods and apparatus
US6139678A (en) * 1997-11-20 2000-10-31 Trusi Technologies, Llc Plasma processing methods and apparatus
US6323134B1 (en) 1997-11-20 2001-11-27 Tru-Si Technologies, Inc. Plasma processing methods and apparatus
US7179397B2 (en) 1997-11-20 2007-02-20 Tru-Si Technologies, Inc. Plasma processing methods and apparatus
US6168697B1 (en) 1998-03-10 2001-01-02 Trusi Technologies Llc Holders suitable to hold articles during processing and article processing methods
US6660643B1 (en) 1999-03-03 2003-12-09 Rwe Schott Solar, Inc. Etching of semiconductor wafer edges
US6287976B1 (en) 1999-05-19 2001-09-11 Tru-Si Technologies, Inc. Plasma processing methods and apparatus
US6261375B1 (en) 1999-05-19 2001-07-17 Tru-Si Technologies, Inc. Plasma processing methods and apparatus
US6541729B2 (en) 2000-08-04 2003-04-01 Tru-Si Technologies, Inc. Monitoring and controlling separate plasma jets to achieve desired properties in a combined stream
US6423923B1 (en) 2000-08-04 2002-07-23 Tru-Si Technologies, Inc. Monitoring and controlling separate plasma jets to achieve desired properties in a combined stream
US6749764B1 (en) 2000-11-14 2004-06-15 Tru-Si Technologies, Inc. Plasma processing comprising three rotational motions of an article being processed
US7491344B2 (en) * 2002-11-07 2009-02-17 Samsung Electronics Co., Ltd. Method for etching an object using a plasma and an object etched by a plasma
JP2010511285A (ja) * 2006-11-28 2010-04-08 ウラジミール・イー・ベラシュチェンコ プラズマ装置およびシステム
KR101495199B1 (ko) 2006-11-28 2015-02-24 블라디미르 이. 벨라쉬첸코 플라즈마 장치 및 시스템

Also Published As

Publication number Publication date
GB2271044A (en) 1994-03-30
GB9316309D0 (en) 1993-09-22
GB2271044B (en) 1995-06-21

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