WO1990010953A1 - Quartz resonator with mounting pedestals - Google Patents

Quartz resonator with mounting pedestals Download PDF

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Publication number
WO1990010953A1
WO1990010953A1 PCT/US1990/000417 US9000417W WO9010953A1 WO 1990010953 A1 WO1990010953 A1 WO 1990010953A1 US 9000417 W US9000417 W US 9000417W WO 9010953 A1 WO9010953 A1 WO 9010953A1
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WO
WIPO (PCT)
Prior art keywords
quartz crystal
mounting
pedestals
plate
crystal resonator
Prior art date
Application number
PCT/US1990/000417
Other languages
French (fr)
Inventor
Marc Kenneth Chason
Michael John Onystok
Donald Jon Ryback
Paul F. Fenlon
J. Earl Foster
Kenneth James Morrissey
Original Assignee
Motorola, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola, Inc. filed Critical Motorola, Inc.
Priority to KR1019900702400A priority Critical patent/KR920700482A/en
Publication of WO1990010953A1 publication Critical patent/WO1990010953A1/en

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0504—Holders; Supports for bulk acoustic wave devices
    • H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps

Definitions

  • This invention relates to piezoelectric quartz crystals.
  • this invention relates to mounting piezoelectric quartz crystals used as crystal resonators.
  • Piezoelectric quartz crystal resonators are fabricated from single crystal quartz wafers that are cut from large quartz stones. Crystal resonators cut from a wafer will have different temperature- frequency characteristics as well as different vibration modes depending upon the cut angle. Depending upon this angle, some quartz crystal wafers will vibrate in substantially a single plane; others might vibrate in multiple directions.
  • a GT-cut quartz resonator vibrates in an extensional mode, i.e., in a single plane.
  • an extensional mode i.e., in a single plane.
  • This node is mathematically a single point but effectively includes a very small nodal area surrounding it.
  • the GT-cut quartz resonator is held between two vibration-isolation structures which suspend the vibrating plate.
  • a GT-cut crystal mounted at the edges by means of this vibration isolating mounting scheme must typically be patterned and etched using chemical and photolithographic processes and requires increased surface area for the resonator device.
  • An alternate method of mounting a GT-cut crystal avoiding the increased device. size and the complex processing associated with fabrication of a vibration isolating mounting arm or arms would be an improvement over the prior art.
  • the pedestals are attached to both sides of the GT-cut crystal faces.
  • metallic pedestals are grown on electrodes deposited on the face of the crystal so that they are in contact with electrodes applied to the face of the crystal to permit application of the driving signal.
  • GT-cut crystals having resonant frequencies over 1 MHz have been successfully mounted with pedestals attached to the center nodes having resonator Q's (defined below) in excess of 25000.
  • Metallic mounting pedestals are grown in the nodal area using metal deposition processes such as electroplating, evaporation or sputtering.
  • quartz pedestals can be formed by etching away excess quartz material leaving supporting pedestals intact.
  • An upper and lower pedestal permits mounting of the crystal plate to a substrate and electrical connection to other circuits. Either pedestal could be used to support the crystal.
  • Quartz wafers on the order of two inches on a side or larger, can be photolithographically processed such that multiple quartz resonators with center mounting pedestals located about the nodes of GT-cut crystals can be processed in a batch mode.
  • Figure 1 shows an isometric view of a thin quartz crystal plate and the approximate location of a node of a GT-cut crystal.
  • Figure 2 shows a cross-sectional elevation view of a quartz crystal plate, with electrodes mounted on the plate and mounted on pedestals.
  • Figure 3 shows a mask applied to a quartz wafer from which numerous individual quartz crystal resonators are fabricated.
  • Figure 4 shows a pedestal mask used to locate the individual pedestals on the electrodes positioned by means of the mask shown in figure 3.
  • Figure 5 shows a side view of pedestals grown onto electrodes on a quartz crystal.
  • FIG 1 there is shown a representative thin quartz crystal plate (10) used in a GT-cut crystal.
  • the thin quartz crystal plate (10) is substantially two planar and opposed surfaces (6 and 8) bounded by two relatively short sides (4 and 4') and two relatively long sides (5 and 5').
  • the crystal plate (10) could also include circular or square or other geometric shapes when using d fferent crystal cuts.
  • a center nodal area (16) substantially in the center of the rectangular plate (10), where plate vibration is minimal. This nodal area (16) has some finite area and does vibrate but at substantially reduced amplitude compared with other areas of the plate (10).
  • nodal area (16) For different crystal cuts, and different geometries other than that shown in figure 1, the location of a nodal area (16) (or possibly nodes) might change.
  • the nodal area (16) For a GT-cut crystal at its fundamental frequency the nodal area (16) is substantially in the center of the rectangular plate (10).
  • the nodal area (16) will change as the dimensions of the plate (10) change. As the plate (10) gets larger, the nodal are (16) will also increase. As the area of the crystal plate (10) decreases the nodal area will also decrease.
  • the crystal plate (10) vibrates in an extensional mode, i.e., the plate (10) will vibrate in the plane of the plate, substantially in the directions shown by the arrows (12 and 14).
  • a crystal resonator (11) comprised of a crystal plate (10), planar electrodes (18 and 20) deposited on both sides of the crystal plate (10), and the support pedestals (22 and 24). These pedestals (22 and 24) are substantially columnar structures by virtue of the method of fabricating them, which is described below. Other geometric shapes for the pedestals might be usable.
  • the crystal plate (10) has a metallic electrode layer (18 and 20) deposited upon each side of the crystal plate (10). An electric signal can be applied to the crystal (10) via the electrodes (18 and 20), coupled to the conductive pedestals (22 and 24) which are coupled respectively to a wire (26) and a conductor (19).
  • the pedestals (22 and 24) are non-conductive, e.g., quartz or other material
  • coating the non-conductive pedestals with suitable conductor may be required to provide a signal path to the electrodes (18 and 20). Constructing the structure shown in figure 2 requires a series of steps. First, a suitable quartz wafer is metallized on both sides. Secondly, a mask is overlaid upon the metallization layer to define the electrodes (18 and 20). Thereafter, the pedestals (22 and 24) are located on both sides of the wafer using another mask to position the pedestals where the nodes (16) are located.
  • the metallization described above is actually comprised of two layers: 1) an adhesive metal layer; and 2) a metal electrode layer deposited upon the adhesive layer.
  • the adhesive layer is typically 100-200 angstroms of chromium; the electrode layer is typically 1000 to 5000 angstroms of copper or gold. Other adhesive and electrode layer combinations are possible. Note, both surfaces of the quartz wafer (6 and 8) are coated with adhesive and electrode layers.
  • Resonator electrodes are defined on the electrode layer using standard photolithographic processing techniques well-known to those skilled in the art.
  • the mask (30) shown in figure 3 is sued to define the electrodes (31) of the resonators.
  • individual electrodes are defined by the plurality of small squares (31) which are rotated through a predetermined angle as shown, required to produce the GT-cut.
  • the resonator electrodes defined by the mask (30) are defined on both sides of the crystal.
  • a dry-film photoresist is applied to both surfaces of the crystal.
  • a pedestal mask (40), as shown in figure 4, defines the location of the pedestals (22 and 24) with respect to the electrodes.
  • copper pedestals are grown on exposed electrode surfaces. While the preferred embodiment used copper pedestals, alternate materials would include gold or other suitable metal.
  • a dry film photoresist defines a vertical growth template for the pedestals which are centered over the nodal regions of each resonator electrode. After the pedestals are grown, any remaining photoresist is removed. Remaining areas of the quartz wafer are then etched away leaving the individual quartz resonator.
  • the resonator (11) as shown in figure 2 is attached to a base conductor (19) on the substrate (28) using conductive cement, for example. Electrical connection can be made to the second pedestal (22) via a wire (26) bonded to the pedestal (22). Electrical connection can also be made to the pedestal (22) from a second substrate, not shown.
  • FIG 5 there is shown a side view of the resonator (11) and the pedestals (22 and 24) grown using a dry-film photoresist.
  • the pedestals are substantially columnar and coaxial and appear to have mushroom-like caps due to the continued growth of the pedestal above the dry film photoresist material.
  • Resonators have been fabricated using this process that had individual dimensions of approximately 3.0 mm by 3.5 mm by 0.1 mm and had operating frequencies of around 1.066 megahertz.
  • Resonator Q values of devices ranges to 26000. Q was measured as the operating frequency of the resonator divided by its 3 dB bandwidth.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

A GT-cut resonator is mounted at its center node (16) using mounting pedestals (22 and 24). The pedestals (22 and 24) are positioned substantially within the geometric center (16) of the vibrating quartz crystal plate (10) where vibration displacement is minimum. The pedestals (22 and 24) supporting the vibrating plate (10) may be attached to one or more substrates (28).

Description

QUARTZ RESONATOR WITH MOUNTING PED ST AT fl
PACasGROV OF THg INVENTION
This invention relates to piezoelectric quartz crystals. In particular this invention relates to mounting piezoelectric quartz crystals used as crystal resonators.
Piezoelectric quartz crystal resonators are fabricated from single crystal quartz wafers that are cut from large quartz stones. Crystal resonators cut from a wafer will have different temperature- frequency characteristics as well as different vibration modes depending upon the cut angle. Depending upon this angle, some quartz crystal wafers will vibrate in substantially a single plane; others might vibrate in multiple directions.
A GT-cut quartz resonator vibrates in an extensional mode, i.e., in a single plane. When operating at its fundamental frequency it moves or vibrates when a signal is applied to it with zero displacement node substantially in the center of the crystal plate. This node is mathematically a single point but effectively includes a very small nodal area surrounding it.
One possible way of mounting a GT-cut crystal so as to not affect its vibration is to mount the crystal at the nodal area. In the past, center mounting GT-cut crystals has only been possible with relatively large crystals resonating at relatively low frequencies, typically below 100 KHz. As the resonant frequency of the crystal increases the area of a GT-cut crystal decreases and the nodal area also decreases. Mounting the crystal at the nodal; area becomes increasingly more difficult. Prior art methods of mounting GT-cut crystal plates have included methods such as those disclosed in U.S. Patent No. 4,447,753, issued to Ochiai, for a Miniature GT-Cut Quartz Resonator. In this patent the GT-cut quartz resonator is held between two vibration-isolation structures which suspend the vibrating plate. A GT-cut crystal mounted at the edges by means of this vibration isolating mounting scheme, must typically be patterned and etched using chemical and photolithographic processes and requires increased surface area for the resonator device. An alternate method of mounting a GT-cut crystal avoiding the increased device. size and the complex processing associated with fabrication of a vibration isolating mounting arm or arms would be an improvement over the prior art.
SUMMARY OF THE INVENTION
There is provided an apparatus and method for mounting GT- cut quartz and other crystal types using pedestals attached to or about nodes of vibrating crystal plates. The pedestals are attached to both sides of the GT-cut crystal faces. In the preferred embodiment, metallic pedestals are grown on electrodes deposited on the face of the crystal so that they are in contact with electrodes applied to the face of the crystal to permit application of the driving signal. GT-cut crystals having resonant frequencies over 1 MHz, have been successfully mounted with pedestals attached to the center nodes having resonator Q's (defined below) in excess of 25000.
Metallic mounting pedestals are grown in the nodal area using metal deposition processes such as electroplating, evaporation or sputtering. Alternatively, quartz pedestals can be formed by etching away excess quartz material leaving supporting pedestals intact. An upper and lower pedestal permits mounting of the crystal plate to a substrate and electrical connection to other circuits. Either pedestal could be used to support the crystal.
Large quartz wafers, on the order of two inches on a side or larger, can be photolithographically processed such that multiple quartz resonators with center mounting pedestals located about the nodes of GT-cut crystals can be processed in a batch mode.
BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows an isometric view of a thin quartz crystal plate and the approximate location of a node of a GT-cut crystal.
Figure 2 shows a cross-sectional elevation view of a quartz crystal plate, with electrodes mounted on the plate and mounted on pedestals. Figure 3 shows a mask applied to a quartz wafer from which numerous individual quartz crystal resonators are fabricated. Figure 4 shows a pedestal mask used to locate the individual pedestals on the electrodes positioned by means of the mask shown in figure 3.
Figure 5 shows a side view of pedestals grown onto electrodes on a quartz crystal.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring to figure 1, there is shown a representative thin quartz crystal plate (10) used in a GT-cut crystal. The thin quartz crystal plate (10) is substantially two planar and opposed surfaces (6 and 8) bounded by two relatively short sides (4 and 4') and two relatively long sides (5 and 5'). The crystal plate (10) could also include circular or square or other geometric shapes when using d fferent crystal cuts. In figure 1, there is shown a center nodal area (16), substantially in the center of the rectangular plate (10), where plate vibration is minimal. This nodal area (16) has some finite area and does vibrate but at substantially reduced amplitude compared with other areas of the plate (10). For different crystal cuts, and different geometries other than that shown in figure 1, the location of a nodal area (16) (or possibly nodes) might change. For a GT-cut crystal at its fundamental frequency the nodal area (16) is substantially in the center of the rectangular plate (10).
In a GT-cut crystal the nodal area (16) will change as the dimensions of the plate (10) change. As the plate (10) gets larger, the nodal are (16) will also increase. As the area of the crystal plate (10) decreases the nodal area will also decrease. With a GT-cut, the crystal plate (10) vibrates in an extensional mode, i.e., the plate (10) will vibrate in the plane of the plate, substantially in the directions shown by the arrows (12 and 14).
Referring to figure 2, there is shown a crystal resonator (11) comprised of a crystal plate (10), planar electrodes (18 and 20) deposited on both sides of the crystal plate (10), and the support pedestals (22 and 24). These pedestals (22 and 24) are substantially columnar structures by virtue of the method of fabricating them, which is described below. Other geometric shapes for the pedestals might be usable. In the preferred embodiment, the crystal plate (10) has a metallic electrode layer (18 and 20) deposited upon each side of the crystal plate (10). An electric signal can be applied to the crystal (10) via the electrodes (18 and 20), coupled to the conductive pedestals (22 and 24) which are coupled respectively to a wire (26) and a conductor (19). If the pedestals (22 and 24) are non-conductive, e.g., quartz or other material, coating the non-conductive pedestals with suitable conductor may be required to provide a signal path to the electrodes (18 and 20). Constructing the structure shown in figure 2 requires a series of steps. First, a suitable quartz wafer is metallized on both sides. Secondly, a mask is overlaid upon the metallization layer to define the electrodes (18 and 20). Thereafter, the pedestals (22 and 24) are located on both sides of the wafer using another mask to position the pedestals where the nodes (16) are located.
Referring now to figure 3, there is shown a mask (30) which is overlaid upon an appropriately metallized quartz wafer (29). In the preferred embodiment, the metallization described above is actually comprised of two layers: 1) an adhesive metal layer; and 2) a metal electrode layer deposited upon the adhesive layer. The adhesive layer is typically 100-200 angstroms of chromium; the electrode layer is typically 1000 to 5000 angstroms of copper or gold. Other adhesive and electrode layer combinations are possible. Note, both surfaces of the quartz wafer (6 and 8) are coated with adhesive and electrode layers.
Resonator electrodes are defined on the electrode layer using standard photolithographic processing techniques well-known to those skilled in the art. The mask (30) shown in figure 3 is sued to define the electrodes (31) of the resonators. In figure 3, individual electrodes are defined by the plurality of small squares (31) which are rotated through a predetermined angle as shown, required to produce the GT-cut. The resonator electrodes defined by the mask (30) are defined on both sides of the crystal.
After the electrodes are defined, a dry-film photoresist is applied to both surfaces of the crystal. A pedestal mask (40), as shown in figure 4, defines the location of the pedestals (22 and 24) with respect to the electrodes. Using electroplating processes, copper pedestals are grown on exposed electrode surfaces. While the preferred embodiment used copper pedestals, alternate materials would include gold or other suitable metal.
In the preferred embodiment, a dry film photoresist defines a vertical growth template for the pedestals which are centered over the nodal regions of each resonator electrode. After the pedestals are grown, any remaining photoresist is removed. Remaining areas of the quartz wafer are then etched away leaving the individual quartz resonator. The resonator (11) as shown in figure 2, is attached to a base conductor (19) on the substrate (28) using conductive cement, for example. Electrical connection can be made to the second pedestal (22) via a wire (26) bonded to the pedestal (22). Electrical connection can also be made to the pedestal (22) from a second substrate, not shown.
Referring now to figure 5, there is shown a side view of the resonator (11) and the pedestals (22 and 24) grown using a dry-film photoresist. The pedestals are substantially columnar and coaxial and appear to have mushroom-like caps due to the continued growth of the pedestal above the dry film photoresist material.
Resonators have been fabricated using this process that had individual dimensions of approximately 3.0 mm by 3.5 mm by 0.1 mm and had operating frequencies of around 1.066 megahertz. Resonator Q values of devices ranges to 26000. Q was measured as the operating frequency of the resonator divided by its 3 dB bandwidth.

Claims

WHAT IS CLAIMED IS;
1. A quartz crystal resonator comprising:
a quartz crystal thin plate having first and second, substantially opposing and substantially planar faces, said quartz crystal plate having at least one, substantially non-vibrating node in said planar faces;
a first mounting pedestal electroplated to said first face of said quartz crystal plate substantially centered about said node;
a second mounting pedestal electroplated to said second face of said quartz crystal plate substantially centered about said node; and
substrate means for mounting said quartz crystal thin plate by said first mounting pedestal such that said quartz crystal thin plate is capable of vibrating.
2. The quartz crystal resonator of claim 1 wherein said node is located substantially in the center of said first and second faces.
3. The quartz crystal resonator of claim 1 wherein said quartz crystal plate is a GT-cut quartz crystal plate.
4. The quartz crystal resonator of claim 1 wherein said first and second mounting pedestals are substantially columnar structures and substantially orthogonal to said first and second faces of said quartz crystal plate.
5. The quartz crystal resonator of claim 1 wherein said first and second mounting pedestals are metallic.
6. The quartz crystal resonator of claim 1 wherein said first and second mounting pedestals are quartz crystal.
7. The quartz crystal resonator of claim 5 where said mounting pedestals are metallized.
8. The quartz crystal resonator of claim 1 including first and second electrodes disposed between said mounting pedestals, deposited upon said first and second faces respectively, said electrodes operatively coupling electrical signals to said crystal plate.
9. The quartz crystal resonator of claim 7 wherein said electrodes are metallic.
10. The quartz crystal resonator of claim 7 wherein said first and second mounting pedestals are metallic.
11. The quartz crystal resonator of claim 9 wherein said first and second pedestals are electroplated onto said first and second electrodes.
12. The quartz crystal resonator of claim 10 wherein said quartz crystal plate is a GT-cut quartz crystal plate.
13. A method of mounting a quartz crystal plate to a substrate, said quartz crystal having at least one center node, said method comprised of the steps of:
electroplating a first mounting pedestal to said first side, substantially about said center node;
electroplating a second mounting pedestal to said second side, substantially about said center node; and
mounting said quartz crystal plate to a substrate using one of said first and second mounting pedestals.
14. The method of claim 12 including the step of coupling substantially planar electrodes to said quartz crystal plate, said electrodes being between said mounting pedestals and said quartz crystal plate.
15. The method of claim 13 where said electrodes are metallic.
16. The method of claim 13 where said pedestals are metallic.
17. A quartz crystal resonator having a substantially planar quartz crystal plate having first and second sides with at least one center node formed by the process of:
depositing a first electrode upon said first side:
depositing a second electrode upon said second side;
electroplating a first mounting pedestal to said first side, said pedestal centered substantially about said node; and
electroplating a second mounting pedestal to said second side, said pedestal centered substantially about said node.
18. The quartz crystal resonator of claim 16 where the process of depositing said first and second mounting pedestals comprises electroplating a metal onto said first and second electrodes.
19. The quartz crystal resonator of claim 16 where the process of depositing said first and second electrodes comprises vacuum depositing a metallization layers on said quartz crystal.
20. The quartz crystal resonator of claim 16 where the process further includes mounting said first mounting pedestal to a substrate using a conductive bonding agent.
21. The quartz crystal resonator of claim 16 where the process further includes mounting said first and said second mounting pedestals to a substrate using a conductive bonding agent.
22. A quartz crystal resonator comprising:
a quartz crystal thin plate having first and second substantially opposing and substantially planar faces, said quartz crystal plate having at least one substantially no-vibrating node in said planar faces and having first and second quartz mounting pedestals integrally formed from said quartz crystal thin plate, said pedestals centered about said node for mounting said quartz crystal thin late by at least one of said mounting pedestals such that said quartz crystal plate is capable of vibrating.
23. The quartz crystal resonator of claim 22 wherein said quartz crystal thin plate and said mounting pedestals include an electroplated layer over said first and second faces and over said first and second mounting pedestals.
PCT/US1990/000417 1989-03-08 1990-01-29 Quartz resonator with mounting pedestals WO1990010953A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019900702400A KR920700482A (en) 1989-03-08 1990-09-20 Method of installing the crystal crystal plate on the substrate and the crystal crystal resonator

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32063589A 1989-03-08 1989-03-08
US320,635 1989-03-08

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WO1990010953A1 true WO1990010953A1 (en) 1990-09-20

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CN (1) CN1045495A (en)
WO (1) WO1990010953A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106685375A (en) * 2016-12-15 2017-05-17 合肥晶威特电子有限责任公司 SMD quartz crystal resonator base and machining method
CN112117981A (en) * 2020-09-23 2020-12-22 河北博威集成电路有限公司 Quartz crystal resonator and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2194676A (en) * 1937-02-26 1940-03-26 Telefunken Gmbh Piezoelectric oscillator
US3017525A (en) * 1956-11-26 1962-01-16 John M Wolfskill Mounting support for piezoelectric crystal units
US4418299A (en) * 1977-01-12 1983-11-29 Kabushiki Kaisha Suwa Seikosha Face-shear mode quartz crystal vibrators and method of manufacture

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2194676A (en) * 1937-02-26 1940-03-26 Telefunken Gmbh Piezoelectric oscillator
US3017525A (en) * 1956-11-26 1962-01-16 John M Wolfskill Mounting support for piezoelectric crystal units
US4418299A (en) * 1977-01-12 1983-11-29 Kabushiki Kaisha Suwa Seikosha Face-shear mode quartz crystal vibrators and method of manufacture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106685375A (en) * 2016-12-15 2017-05-17 合肥晶威特电子有限责任公司 SMD quartz crystal resonator base and machining method
CN112117981A (en) * 2020-09-23 2020-12-22 河北博威集成电路有限公司 Quartz crystal resonator and preparation method thereof

Also Published As

Publication number Publication date
KR920700482A (en) 1992-02-19
CN1045495A (en) 1990-09-19

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