USRE46221E1 - Probe skates for electrical testing of convex pad topologies - Google Patents
Probe skates for electrical testing of convex pad topologies Download PDFInfo
- Publication number
- USRE46221E1 USRE46221E1 US13/545,571 US201213545571A USRE46221E US RE46221 E1 USRE46221 E1 US RE46221E1 US 201213545571 A US201213545571 A US 201213545571A US RE46221 E USRE46221 E US RE46221E
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- Prior art keywords
- skate
- conductive pad
- debris
- probe
- conductive
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
Definitions
- the invention relates generally to an apparatus and method of using contacting tips of probes in scrubbing and electrical testing of a device under test. More particularly, the invention relates to an apparatus and method of using contacting tips having probe skates with geometries that provide self-cleaning and a reduction in sensitivity to overdrive motion.
- test probes are placed in contact with conductive pads of a device under test (DUT) to provide a test signal for such verification of the circuit, where the conductive pads are positioned on the surface of a wafer or DUT.
- DUT device under test
- These pads are known to have bump-like or convex shape, with the base of the pad incorporated into the wafer surface.
- a problem exists with a non-conductive layer of debris on the pad such as a non-conductive oxide layer impeding the conductive pad from receiving the test signal, where the debris is an artifact of the fabrication process.
- the scrub motion includes engaging a probe tip with a conductive pad, and applying an overdrive motion to the pad to cause the probe to scrub the layer of debris from the pad.
- Numerous problems arise from this method such as controlling the probe scrubbing action, managing undesirable debris accumulation on the probe tip, and the added need for a complicated and invasive probe cleaning processes to remove the debris from the probe tips. Consistent scrub control is of paramount importance.
- a probe is often too sensitive to the overdrive motion from the pad, causing a scrub depth that is too deep that not only removes a portion of the non-conductive layer, but also damages or breaches the conductive pad, thus rendering the wafer unusable.
- a contact bump at the end of a probe has a nub made from rhodium nickel alloy fused to the contact bump. While such an alloy lends itself for creating a tip that is more robust for scrubbing, the need to disrupt fabrication throughput for a probe tip cleaning process still exists. Further, the geometry of the contact bump made from the alloy nub lends itself for undesirable accumulation of debris, thus necessitating relatively frequent cleaning. Another attempt has been implemented that includes a knife-like probe end in an effort to reduce debris accumulation for limiting the need for abrasive cleaning. Unfortunately, such geometry has been shown to lack scrubbing control and damage the pad due to the probe having a hypersensitivity to overdrive motion.
- a method of using a self-cleaning probe tip is needed that provides effective scrubbing for enabling testing. Further needed is a probe having a self-cleaning skate that is less sensitive to overdrive motion to enable consistent and predictable scrubbing for more reliable wafer testing and to alleviate the need for test redundancies.
- the present invention provides a probe having a self-cleaning tip, or skate, for engaging a conductive pad.
- the probe includes a contact end for receiving a test current, a probe retention portion below the contact end and a block for holding the retention portion. Further, a probe arm below the retention portion has a probe contact tip there below and a generally planar self-cleaning skate disposed perpendicular below the contact tip.
- the self-cleaning skate has a generally square front end, a generally round back end and a generally flat middle section therebetween.
- the skate has a skate height up to 1 ⁇ 2 of the skate length and a skate width up to 1 ⁇ 6 of the skate length.
- the self-cleaning skate width is narrower than a width of the contacting tip.
- the skate may have different cross-sections such as a U-shape, a semi-circular shape, a V-shape, box-shape, or a parallelogram-shape, where the parallelogram cross-section has a first parallel side connected to the bottom of the contact tip and a second parallel side for contacting the conductive pad, whereby the first parallel side is larger than the second parallel side.
- the box-shape cross-section has a first horizontal side connected to the bottom of the contact tip and a second horizontal side for contacting the conductive pad, where the second horizontal side further includes radii at each edge of the second horizontal side.
- the self-cleaning skate length is aligned along a scrub direction.
- the conductive pad is generally convex and has a granular non-conductive surface layer of debris such as a non-conductive oxidation surface.
- the pad is moved to engage the skate. Once engaged, an overdrive motion is applied to the conductive pad causing the probe to flex and move the skate across the conductive pad to scrub debris from the pad.
- the scrubbed debris is displace along the skate and moved around the skate round back end to a position on the skate that is away from the conductive pad.
- the probe arm has a base arm below the retention portion, a knee below the base arm, and a reverse arm below the knee. Further, a contact tip is below the reverse arm and the self-cleaning skate is below the contact tip.
- the skate round back end has a radius with a size as large as the length of the skate height. In another embodiment of the invention, the round back end of the skate is a variable radius back end.
- the overdrive motion causes the skate to pivot such that the middle section forms an angle up to 35 degrees with respect to a horizontal plane, while the round back end remains engaged with the conductive pad.
- Reversing the overdrive motion causes the skate to reverse its movement, where the skate moves from an up angle to approximately a horizontal position while maintaining engagement with the conductive pad.
- the skate translates along the horizontal position in a direction towards the skate back end, where the debris is further displaced along the round back end and away from the conductive pad.
- the conductive pad moves away from the skate to disengage the probe from the conductive pad.
- the pad is in an extended overdrive motion beyond the previous overdrive motion, causing the probe move in a manner to further displace the debris away from the conductive pad.
- the extended overdrive motion is applied after at least two touch down cycles.
- Such overdrive motion of the conductive pad is between 1-5 mil.
- the conductive pads for engaging the probe tip are replaced by a cleaning sheet having debris adhesion properties for removing the debris from the skate.
- One aspect of the present invention is a method of using the self-cleaning skate by providing a conductive pad having a generally convex shape and a non-conductive layer of debris, such as a granular non-conductive oxidation surface, and providing a conductive probe for engaging the conductive pad.
- the probe includes a contact end for receiving a test current, a retention portion below the contact end, a block for holding the retention portion, a probe arm below the retention portion, a probe contact tip below the arm, and a generally planar self-cleaning skate disposed perpendicular below the contact tip, where the skate has a generally square front end, a generally round back end and a generally flat middle section therebetween.
- the skate is positioned above the conductive pad, where the conductive pad is translated, causing the skate to engage the conductive pad.
- Overdrive motion is then provided to the conductive pad causing the skate to scrub the debris from the conductive pad and clean the debris from the region of the skate that contacts the conductive pad.
- the cleaning occurs from the overdrive motion moving the skate to form an angle between the skate middle section and a horizontal plane, while engaging the round back end with the conductive pad.
- the overdrive motion induces a translation motion of the skate back end along the pad in a direction towards the skate front end while the skate middle section is further angled with respect to the horizontal plane.
- the method according to the current invention improves overdrive control by making the scrubbing and cleaning less sensitive to the overdrive motion, where the debris layer is removed without breaching or damaging the conductive pad and debris is displaced from the conductive pad to the skate. Further, a current (i) is applied to the probe after the self-cleaning skate contacts the conductive pad. Using the self-cleaning skate according to the invention is accomplished after at least two engagement cycles.
- the probe arm includes a base arm below the retention portion, a knee below the base arm, and a reverse arm below the knee, where the contact tip is below the reverse arm and the self-cleaning skate is below the contact tip.
- the self-cleaning skate is positioned above the pad by disposing an approximate center location of the flat middle end above an edge of the conductive pad, where the skate engages the conductive pad with the center of the skate positioned on the conductive pad edge.
- Some key advantages of the invention are the features of the self-cleaning skate extend the mean time between failure of the probe caused by debris buildup on the skate. Additionally, due to the unique skate design, a scrub channel may be made on irregularly shaped conductive pads at any location on the pad.
- the current invention provides better control of the skate during overdrive motion, where improved tolerance to overdrive motion enables reliable pad testing on silicon wafers before dicing.
- FIG. 1 shows a planar view of a block holding a probe having a self-cleaning skate engaging a conductive pad according to the present invention.
- FIG. 2 shows a planar view of a probe tip having a self-cleaning skate that is positioned over a conductive pad according to the present invention.
- FIG. 3 shows a perspective view of a block holding multiple probes with self-cleaning skates positioned over multiple conductive pads according to the present invention.
- FIGS. 4a-4c show planar views of some embodiments of the self-cleaning skate according to the present invention.
- FIGS. 5a-5f show planar cross-section views of some embodiments of the self-cleaning skate according to the present invention.
- FIGS. 6a-6b show planar views of the overdrive of the conductive pad operating on the probe according to the present invention.
- FIGS. 7a-7i show a sequence of planar partial cutaway views of the self-cleaning skate scrubbing across a conductive pad according to the present invention.
- FIGS. 8a-8i show a sequence of planar partial cutaway views of the self-cleaning skate scrubbing across a conductive pad with initial the skate position on a pad edge according to the present invention.
- FIG. 9a-9d show planar views of a conductive pad before and after scrubbing.
- FIG. 10 is a flow-chart that shows the steps for using the self-cleaning skate according to the present invention.
- the conductive pad of a semiconductor wafer can be fabricated as a dome-shape, or even a pedestal having a dome-shape located at the pedestal top, where the dome feature may be non-uniform and asymmetric. New methods of testing and new conductive test probes are required to address these evolving fabrication technologies.
- the conductive pad has a non-conductive layer of debris that includes a non-conductive oxide layer on the dome surface that impedes electrical contact between the probe tip and the conductive pad.
- this layer requires a scrubbing step to remove some of the non-conductive layer of debris to enable electrical contact between the conductive pad and the probe tip. It is desirable to remove this layer and apply a test current to the pad to verify circuit design and fabrication integrity, while simultaneously controlling the probe tip position on the pad and cleaning the probe end.
- the scrubbing process requires the conductive pad to be positioned below the probe tip and then moved to make contact with the probe tip.
- an overdrive motion is applied to the conductive pad whereby the probe flexes to allow the probe tip to traverse the conductive pad and scrub the non-conductive layer of debris from the pad surface while applying a test current (i) through the probe.
- a test current i
- problems arise when scrubbing and testing the dome-shaped conductive pads. These problems include controlling the probe tip to ensure it remains on the conductive pad during scrubbing and testing, ensuring the translation of the probe tip across the pad is not too sensitive to the overdrive motion, and managing the debris that is removed to ensure electrical continuity and prevent or limit accumulation of debris on the probe tip.
- the present invention provides a probe having a self-cleaning tip, or skate, for engaging a conductive pad of the semiconductor wafer, where the conductive pad may have a dome-shape or be a pedestal having a dome-shape.
- the probe includes a contact end for receiving a test current, a probe retention portion below the contact end and a block for holding the retention portion.
- a probe arm below the retention portion has a probe contact tip there below and a generally planar self-cleaning skate disposed perpendicular below the contact tip.
- the self-cleaning skate has a generally square front end, a generally round back end and a generally flat middle section therebetween. This configuration may be made into an array of probes suited for scrubbing and testing semiconductor wafers having many conductive pads arranged according to a circuit, or multiple circuits, integrated to the wafer.
- the skate of the probe contacting tip may have a height up to 1 ⁇ 2 of the skate length and a skate width up to 1 ⁇ 6 of the skate length. Additionally, the self-cleaning skate may have a width that is generally narrower than a width of the contacting tip.
- These skates may have a cross-section such as a U-shape, semi-circular shape, V-shape, box-shape, and parallelogram-shape, where the parallelogram cross-section has a first parallel side connected to the bottom of the contact tip and a second parallel side for contacting the conductive pad, whereby the first parallel side is larger than the second parallel side.
- the box-shape cross-section may have a first horizontal side connected to the contact tip and a second horizontal side for contacting the conductive pad, where the second horizontal side further includes radii at each edge of the second horizontal side.
- the self-cleaning skate length is aligned along a scrub direction.
- One conductive pad addressed in the current invention is generally convex having a non-conductive layer, such as a granular non-conductive oxidation layer, that is an artifact of the wafer fabrication process.
- the conductive pad is moved to engage the skate. Once engaged, an overdrive motion is applied to the conductive pad causing the probe arm to flex. This flexing allows the skate to remain in contact with the conductive pad while moving across the pad to scrub the non-conductive layer of debris and remove the debris from the conductive pad.
- An intended consequence of the skate design according to the current invention is the scrubbed debris is displaced along the skate and moved around the skate round back end to a position on the skate that is away from said conductive pad.
- the probe arm has a base arm below the retention portion, a knee below the base arm, and a reverse arm below the knee. Further, the contact tip is below the reverse arm and the self-cleaning skate is below the contact tip.
- the skate round back end has a radius with a size up to the length of the skate height.
- the round back end of the skate may be a variable radius, or multiple radii, back end.
- the overdrive motion causes the skate to pivot such that the middle section forms an angle up to 35 degrees with respect to a horizontal plane, while the round back end is engaged with the conductive pad. Further, by reversing the overdrive motion, the skate moves in a reverse direction across the conductive pad, where the skate moves from an up angle to approximately a horizontal position while engaging the conductive pad. Here, the skate translates along the horizontal position in a direction towards the skate back end, where the debris is further displaced along the round back end and away from the conductive pad. Finally, the conductive pad moves away from the skate to disengage the probe from the conductive pad, whereby a scrub channel is evident on the surface of the pad.
- the pad is extended in an overdrive motion that is beyond the previous overdrive motion, the probe is caused to move in a manner that further displaces the already displaced debris away from the conductive pad.
- the extended overdrive motion is applied after at least two touch down cycles.
- Such overdrive motion of the conductive pad may be between 1-5 mil.
- the conductive pads are replaced by a cleaning sheet having debris adhesion properties for removing the debris from the skate.
- a method of using the self-cleaning skate according to the current invention includes providing the conductive pad having with the generally convex shape and a non-conductive layer, such as a granular oxidation surface, and providing a conductive probe for engaging the conductive pad that includes a contact end for receiving a test current, a retention portion below the contact end, a block for holding the retention portion, a probe arm below the retention portion, a probe contact tip below the arm, and a generally planar self-cleaning skate disposed perpendicularly below the contact tip, where the skate has a generally square front end, a generally round back end and a generally flat middle section therebetween.
- the skate is positioned above the conductive pad, where the conductive pad is translated causing the skate to engage the conductive pad.
- Overdrive motion is provided to the conductive pad causing the skate to scrub the non-conductive layer of debris and remove it from the conductive pad and then clean the debris from the skate.
- the cleaning occurs by the overdrive motion flexing the probe and causing the skate to move across the pad to form an angle of the skate middle section with respect to a horizontal plane while still engaging the round back end with the conductive pad.
- the overdrive motion induces translation motion of the skate back end in a direction towards the skate front end across the conductive pad while the skate middle section is further angled with respect to the horizontal plane.
- debris such as a non-conductive oxide, is displaced along the skate, where the debris moves around the round back end to a position on the skate that is away from the conductive pad.
- Reversing the overdrive motion to the pad causes the skate middle section to move from the angle to approximately the horizontal position, where the skate flat middle section is in contact with the conductive pad.
- the debris on the skate back end moves to a position away from the conductive pad.
- the overdrive motion of the conductive pad translates the skate along the horizontal position and further moves the debris around the round back end to a position on the skate that is away from the conductive pad.
- the pad is translated to cause the probe to disengage from the conductive pad.
- the method according to the current invention improves overdrive control by making the scrubbing and cleaning less sensitive to the overdrive motion, where the oxidation layer is removed without breaching the conductive pad and debris is displaced from the conductive pad to the skate. Accordingly, a current (i) is applied after said self-cleaning skate contacts the conductive pad.
- the probe arm includes a base arm below the retention portion, a knee below the base arm, and a reverse arm below the knee, where the contact tip is below the reverse arm and the self-cleaning skate is below the contact tip.
- the self-cleaning skate is positioned above the pad by disposing an approximate center location of the flat middle end above an edge of the conductive pad, where the skate to engages the conductive pad with the center of the skate positioned on the conductive pad edge.
- FIG. 1 is a planar view of a scrubbing system 100 that includes a block 102 holding a probe 104 having a self-cleaning skate 106 for engaging a conductive pad 108 to scrub debris (see FIG. 2 ) from the conductive pad 108 while applying the test current (i), according to the present invention.
- the probe includes a contact end 110 for receiving the test current (i) (not shown), a probe retention portion 112 , below the contact end, that is held by the block 102 .
- a probe arm 114 below the retention portion 112 has a probe contact tip 116 at the end, with a generally planar self-cleaning skate 106 disposed perpendicular below the contact tip 116 .
- the probe arm 114 has a base arm 118 below the retention portion, a knee 120 below the base arm 118 , and a reverse arm 122 below the knee 120 , where the contact tip 116 is below the reverse arm 122 and the self-cleaning skate 106 is below the contact tip 116 .
- FIG. 2 Illustrated in FIG. 2 is a planar view of the probe tip 116 having the self-cleaning skate 106 positioned over a conductive pad 108 according to one embodiment of the present invention.
- the self-cleaning skate 106 depicted is generally planar and disposed perpendicular below the contact tip 116 , where the skate 106 has a generally square front end 200 , a generally round back end 202 and a generally flat middle section 204 therebetween.
- the conductive pad 108 has a layer of non-conductive granular debris 208 formed in a generally convex shape on a generally cylindrical base 210 , where the non-conductive granular debris 208 can be a non-conductive oxide layer resulting from a breakdown of the surface of the metallic conductive pad in the fabrication processes.
- FIG. 3 depicts a perspective view of the block 102 holding multiple probes 104 with self-cleaning skates 106 positioned over multiple conductive pads 108 according to one embodiment of the present invention.
- the conductive pads 108 are embedded into a semiconductor wafer 300 , where the wafer 300 and pads 108 are driven upwards to cause the conductive pads 108 to engage the self-cleaning skates 106 for scrubbing and testing as will be described below.
- FIGS. 4a-4c show planar views the self-cleaning skate according to the present invention.
- a self-cleaning skate 106 is depicted that has a generally square front end 200 , a generally round back end 202 and a generally flat middle section 204 therebetween.
- FIG. 4b depicts another embodiment of the invention with the generally round back end 202 of the self-cleaning skate 106 having a variable radius, or multiple radii, depicted here having a first radius R 1 and a second radius R 2 in this embodiment. Depicted in FIG.
- FIG. 4c is an end planar view of the self-cleaning skate 106 connected perpendicularly to bottom of the contact tip 116 where shown are the skate width 400 , skate height 402 and the skate length 404 (see FIG. 4a ).
- the self-cleaning skate 106 has a height 402 up to 1 ⁇ 2 of the skate length 404 and a skate width 400 up to 1 ⁇ 6 of the skate length 404 , and the skate width 400 is narrower than the contacting tip width 406 .
- the self-cleaning skate 106 may have many different cross-section geometries.
- FIGS. 5a-5e show planar views of some cross-section embodiments of the self-cleaning skate according to the present invention.
- FIG. 5 a depicts box-shape cross-section 500
- FIG. 5b depicts a U-shape cross-section 502
- FIG. 5c depicts a parallelogram-shape cross-section 504
- FIG. 5d depicts a V-shape cross-section 506
- FIG. 5e depicts a semi-circular shape cross-section 508
- FIG. 5f depicts a box-shape having rounded edges 510
- the parallelogram cross-section 504 has a first parallel side 512 connected to the bottom of the contact tip 116 and a second parallel side 514 for contacting the conductive pad (not shown), where the first parallel side 512 is larger than the second parallel side 514 .
- the cross-sections depicted here are a small sample of the many possible cross-section geometries that may be used with the current invention to obtain the desired results of scrubbing and testing the conductive pads 108 .
- FIGS. 6a and 6b show planar views of the overdrive of the conductive pad operating on the probe according to the present invention.
- the self-cleaning skate 108 according to one embodiment of the current invention, that utilizes the round back end 202 to smoothly scrub across the conductive pad 108 when subject to overdrive motion 600 to scrub debris 208 while not breaching the conductive pad 108 .
- Overdrive motion 600 can range from 1-5 mil.
- the skate 106 is positioned with the center of the flat middle section 204 located near an edge of the conductive pad 108 , where the skate 106 is shown to contact the pad 108 .
- FIG. 6b Depicted in FIG. 6b is an overdrive motion 600 applied to the conductive pad 108 , where dashed lines 602 are provided to show a relative overdrive displacement of the conductive pad 108 .
- One benefit of the round back end 202 is that it averts the skate 106 from binding in the debris 208 when the overdrive motion 600 is applied, preventing the probe 106 from unpredictably releasing from the debris 208 and springing off of the pad 108 , which is undesirable. Further, the added linear distance along the bottom surface of the skate 106 attained by having the round back end 202 provides improved tolerance to overdrive 600 .
- the current invention improves the skate 106 response to overdrive motion 600 of the conductive pad 108 , where movement of the skate 106 having the generally round back end 202 allows the skate 106 to smoothly scrub across the conductive pad 108 .
- a probe end not having the features according to the current invention is known to become caught in the debris 208 while the overdrive motion 600 continues, thus causing the probe arm to build up potential energy.
- the consequence of this undesirable state is the potential energy eventually surpasses the debris strength and the skate releases across the conductive pad 108 , rapidly and without control, swinging beyond the conductive pad 108 thus potentially damaging the skate 106 and/or the pad 108 .
- FIGS. 7a-7i show a sequence of planar partial cutaway views of the self-cleaning skate 106 that scrubs a channel 704 (see FIG. 7i ) in the conductive pad according to the present invention.
- FIG. 7a Depicted in FIG. 7a is the probe 104 having a contact tip 116 with the self-cleaning skate 106 attached at the bottom and positioned above the conductive pad 108 .
- the conductive pad 108 is depicted in a cutaway view for illustrative purposes, where a layer of granular debris 208 , such as a non-conductive oxide layer, is depicted as a convex shape on top of the conductive pad 108 (see FIG. 9 for drawing of the pad and granular debris).
- the conductive pad 108 is raised, or translated, to cause the self-cleaning skate 106 to engage the layer of debris 208 of the conductive pad 108 , as depicted in FIG. 7b .
- a test current (i) is applied to the probe and the conductive pad 108 is provided an overdrive motion 600 causing the skate 106 to scrub the debris 208 from the conductive pad 108 and clean the debris 208 from the bottom of the skate 106 as illustrated in this sequence.
- FIGS. 7c-7e depict the response of the probe 104 when subject to overdrive motion 600 from the conductive pad 108 , where the probe 114 flexes and causes the contact tip 116 to rotate 700 and form an angle between the skate middle section 204 and a horizontal plane on the pad 108 while engaging the round back end 202 with the conductive pad 108 .
- Overdrive motion 600 is continued in FIGS. 7d and 7e to induce a horizontal translational motion 702 of the skate 106 in a direction from the back end 202 towards the front end 200 across the conductive pad 108 while the skate middle section 204 is further rotated 700 with respect to the horizontal plane.
- debris 208 is displaced along the skate 106 and moved around the round back end 202 to a position on the skate 106 that is away from the conductive pad 108 .
- the skate 106 moves in a manner such that the skate middle section 204 rotates 700 from the angle to approximately the horizontal position, as depicted in FIG. 7f , where the skate flat middle section 204 is in contact with the conductive pad 108 .
- the debris 208 on the skate back end 202 moves to a position away from the conductive pad 108 as the flat middle section 204 is further rotated 700 down to a horizontal position.
- the reverse overdrive motion 600 causes the skate 106 to translate 702 in an opposite direction along the horizontal position on the conductive pad 108 , depicted in FIG. 7h , and further moves the debris 208 around the round back end 202 to a position on the skate 106 that is away from the conductive pad 108 .
- the reverse overdrive motion 600 of the conductive pad 108 continues to cause the probe 104 to disengage from the conductive pad, as depicted in FIG. 7i , where this scrubbing method improves overdrive 600 control by making the skate 106 movement less sensitive to the overdrive 600 .
- the oxidation layer 208 is removed without breaching the conductive pad 108 and the debris 208 is displaced from the conductive pad 108 along the skate 106 to a position away from the pad 108 .
- FIGS. 8a-8i show planar views of the overdrive motion 600 of the conductive pad 108 operating on the probe 114 having a self-cleaning skate 106 according to the present invention.
- Depicted in FIG. 8a is the probe 114 having a contact tip 116 with the self-cleaning skate 106 attached at the bottom.
- the skate 106 is positioned with the skate middle section 204 above the edge of the conductive pad 108 .
- the conductive pad 108 is depicted in a cutaway view for illustrative purposes, where a layer of granular debris 208 is depicted on top of the conductive pad 108 (see FIG. 9 for drawing of the pad and granular debris).
- the conductive pad 106 is moved to cause the self-cleaning skate 106 to engage the debris layer 208 of the conductive pad 108 , as depicted in FIG. 8b .
- the conductive pad 108 is provided an overdrive motion 600 causing the skate 106 to scrub the debris 208 from the conductive pad 108 and clean the debris 208 from the skate 106 .
- FIGS. 8c-8e depict the response of the probe 114 when subject to overdrive motion 600 from the conductive pad 208 moving in an upward direction, where the probe 114 flexes and causes the contact tip 116 to rotate 700 and form an angle between the skate middle section 204 and a horizontal plane while engaging the round back end 202 with the conductive pad 108 .
- the square front end 200 is on the convex shape of the conductive pad 108 while the round back end 202 is off the pad 108 .
- Overdrive motion 600 is continued in FIG. 8e to induce a translation 702 of the skate 106 in a direction from the back end 202 towards the front end 200 across the conductive pad 108 while the skate middle section 204 further rotates 700 with respect to the horizontal plane.
- debris 208 is displaced along the skate 106 and moved around the round back end 202 to a position on the skate 106 that is away from the conductive pad 108 .
- the skate 106 rotates 700 in a manner such that the skate middle section 204 forms a smaller angle with respect to the horizontal plane, while simultaneously translating 702 in a direction from the front end 200 towards the back end 202 across the conductive pad 108 as depicted in FIGS. 8f and 8g , where the skate flat middle section 204 is in contact with the conductive pad.
- the debris 208 on the skate back end 202 moves to a position away from the conductive pad 108 as the flat middle section 204 is further rotated down to a horizontal position.
- FIG. 8h Depicted in FIG. 8h is the skate 106 translating 702 with the middle section 204 in a horizontal orientation, and the reverse overdrive motion 600 of the conductive pad 108 continues to cause the probe 114 to disengage from the conductive pad, as depicted in FIG. 8i .
- the sequence described here illustrates how the self-cleaning skate 106 improves overdrive control by making the skate 106 movement less sensitive to the overdrive.
- the debris layer 208 is removed without breaching the conductive pad 108 , where the debris 208 is displaced from the conductive pad 108 to a position on the skate 106 that is away from the pad 108 .
- a scrub channel 600 that exposes the conductive metal 706 of the conductive pad 108 .
- FIGS. 9a-9d depict planar views of a conductive pad 108 before and after scrubbing.
- FIG. 9a shows a side planar view of a typical conductive pad 108 having a splayed-cylindrical conductive metal base 706 and a layer of debris 208 , such as a non-conductive oxide layer, on a convex pad 108 .
- FIG. 9a shows a side planar view of a typical conductive pad 108 having a splayed-cylindrical conductive metal base 706 and a layer of debris 208 , such as a non-conductive oxide layer, on a convex pad 108 .
- FIG. 9b shows a top planar view of a typical conductive pad 108 having a generally granular surface of debris 208 to be scrubbed for enabling conduction of the test signal (i) from the skate 106 to the pad 108 .
- FIG. 9c illustrates a scrub channel 704 made across the center of the pad 108 as per the description related to FIG. 7 above
- FIG. 9d illustrates a scrub channel 704 made near the edge of the pad 108 as per the description related to FIG. 8 above.
- the drawings of the conductive pad 108 are depicted to have a general convex shape, in practice the surface pad 108 can be an irregular shape.
- the self-cleaning skate 106 are able to provide useful scrub channels 704 in these irregular shapes and in numerous pad locations to provide conduction for the test signal (i) with tolerance to overdrive motion 600 and without breaching the pad 108 , where the thickness of the pad may be only slightly more thick than the debris layer.
- FIG. 10 is a flow diagram depicting the steps for using the self-cleaning skate according to the present invention.
- the steps include providing a conductive pad 1000 , providing a conductive probe having a conductive self-cleaning skate with a square front end, a round back end and a flat middle section 1002 , positioning the skate above the conductive pad 1004 , translating the conductive pad to engage the skate 1006 , and providing overdrive motion to the pad 1008 and moving the skate to scrub debris from the pad and clean debris from the skate 1008 , wherein the method improves overdrive control by making the scrubbing and the cleaning less sensitive to the overdrive, where the debris layer is removed without breaching the conductive pad and debris is displaced from the conductive pad to a position on the skate that is away from the pad.
Abstract
A probe for engaging a conductive pad is provided. The probe includes a probe contact end for receiving a test current, a probe retention portion below the contact end, a block for holding the probe retention portion, a probe arm below the retention portion, a probe contact tip below the arm, and a generally planar self-cleaning skate disposed perpendicular below the contact tip. The self-cleaning skate has a square front, a round back and a flat middle section. The conductive pad is of generally convex shape having a granular non-conductive surface of debris and moves to engage the skate, whereby an overdrive motion is applied to the pad causing the skate to move across and scrub non-conductive debris from the pad displacing the debris along the skate and around the skate round back end to a position on the skate that is away from the pad.
Description
Notice: More than one reissue application has been filed for the reissue of U.S. Pat. No. 7,436,192. The reissue applications are application Ser. No. 12/903,566, filed on Oct. 13, 2010 (now U.S. Pat. No. Re. 43,503) and Ser. No. 13/545,571 (the present application), filed on Jul. 10, 2012, which is a divisional of application Ser. No. 12/903,566.
This application is a divisional reissue application of U.S. application Ser. No. 12/903,566 (now U.S. Pat. No. Re. 43,503), filed Oct. 13, 2010, which is a reissue of U.S. Pat. No. 7,436,192 issued Oct. 14, 2008, which is a continuation-in-part application of the inventor's prior U.S. application Ser. No. 11/480,302 (U.S. Pat. No. 7,759,949) filed Jun. 29, 2006, for PROBES WITH SELF-CLEANING SKATES FOR CONTACTING CONDUCTIVE PADS, to which claims the benefit of U.S. application Ser. No. 10/850,921 filed on May 21, 2004, now U.S. Pat. No. 7,148,709, U.S. application Ser. No. 10/888,347 filed on Jul. 9, 2004 and U.S. application Ser. No. 11/450,977 filed on Jun. 9, 2006.
The invention relates generally to an apparatus and method of using contacting tips of probes in scrubbing and electrical testing of a device under test. More particularly, the invention relates to an apparatus and method of using contacting tips having probe skates with geometries that provide self-cleaning and a reduction in sensitivity to overdrive motion.
Semiconductor wafer testing before dicing is a necessary and critical process step. Such testing provides early verification of circuit design and fabrication integrity. Typically, test probes are placed in contact with conductive pads of a device under test (DUT) to provide a test signal for such verification of the circuit, where the conductive pads are positioned on the surface of a wafer or DUT. These pads are known to have bump-like or convex shape, with the base of the pad incorporated into the wafer surface. A problem exists with a non-conductive layer of debris on the pad such as a non-conductive oxide layer impeding the conductive pad from receiving the test signal, where the debris is an artifact of the fabrication process. Currently, a scrubbing method is used to remove some of the non-conductive layer from the pads before applying the test signal. Many methods exist for removing the debris layer such as using the probe tip itself to scrub the pad while applying the test signal. For information about corresponding probe designs and scrub motion mechanics the reader is referred to U.S. Pat. No. 5,436,571 to Karasawa; U.S. Pat. Nos. 5,773,987 and 6,433,571 both to Montoya; U.S. Pat. No. 5,932,323 to Throssel and U.S. Appl. 2006/0082380 to Tanioka et al. Additional information about the probe-oxide semiconductor interface is found in U.S. Pat. No. 5,767,691 to Verkuil.
The scrub motion includes engaging a probe tip with a conductive pad, and applying an overdrive motion to the pad to cause the probe to scrub the layer of debris from the pad. Numerous problems arise from this method such as controlling the probe scrubbing action, managing undesirable debris accumulation on the probe tip, and the added need for a complicated and invasive probe cleaning processes to remove the debris from the probe tips. Consistent scrub control is of paramount importance. A probe is often too sensitive to the overdrive motion from the pad, causing a scrub depth that is too deep that not only removes a portion of the non-conductive layer, but also damages or breaches the conductive pad, thus rendering the wafer unusable. Debris accumulation on the probe tip degrades the electrical continuity between the probe and conductive pad, often times restricting the test signal and providing erroneous test results, where implementation of an undesirable test redundancy may then become necessary. Complicated probe tip cleaning methods, such as use of abrasion cleaning, have been used to remove debris from the probe tip by scouring. Such a technique not only disrupts the fabrication throughput, but also degrades the probe tip, resulting in shortened utility of the probes and requiring premature replacement.
Current attempts to address these issues have been met with shortcomings, where in one case a contact bump at the end of a probe has a nub made from rhodium nickel alloy fused to the contact bump. While such an alloy lends itself for creating a tip that is more robust for scrubbing, the need to disrupt fabrication throughput for a probe tip cleaning process still exists. Further, the geometry of the contact bump made from the alloy nub lends itself for undesirable accumulation of debris, thus necessitating relatively frequent cleaning. Another attempt has been implemented that includes a knife-like probe end in an effort to reduce debris accumulation for limiting the need for abrasive cleaning. Unfortunately, such geometry has been shown to lack scrubbing control and damage the pad due to the probe having a hypersensitivity to overdrive motion. For additional information about probe tip geometries the reader is referred to U.S. Pat. No. 6,633,176 and U.S. Appl. 2005/0189955 both to Takemoto et al., and U.S. Pat. No. 6,842,023 to Yoshida et al. employs contact probe whose tip tapers to a sloping blade or chisel.
It would be considered an advance in the art to provide a probe design having a probe tip with a self-cleaning skate that alleviates the need for using abrasion techniques to remove debris from the probe tip. A method of using a self-cleaning probe tip is needed that provides effective scrubbing for enabling testing. Further needed is a probe having a self-cleaning skate that is less sensitive to overdrive motion to enable consistent and predictable scrubbing for more reliable wafer testing and to alleviate the need for test redundancies.
The present invention provides a probe having a self-cleaning tip, or skate, for engaging a conductive pad. The probe includes a contact end for receiving a test current, a probe retention portion below the contact end and a block for holding the retention portion. Further, a probe arm below the retention portion has a probe contact tip there below and a generally planar self-cleaning skate disposed perpendicular below the contact tip. The self-cleaning skate has a generally square front end, a generally round back end and a generally flat middle section therebetween.
In one embodiment of the invention, the skate has a skate height up to ½ of the skate length and a skate width up to ⅙ of the skate length. In one aspect of the current invention, the self-cleaning skate width is narrower than a width of the contacting tip. In another aspect of the invention, the skate may have different cross-sections such as a U-shape, a semi-circular shape, a V-shape, box-shape, or a parallelogram-shape, where the parallelogram cross-section has a first parallel side connected to the bottom of the contact tip and a second parallel side for contacting the conductive pad, whereby the first parallel side is larger than the second parallel side. Further, the box-shape cross-section has a first horizontal side connected to the bottom of the contact tip and a second horizontal side for contacting the conductive pad, where the second horizontal side further includes radii at each edge of the second horizontal side. According to the embodiments of the current invention, the self-cleaning skate length is aligned along a scrub direction.
The conductive pad is generally convex and has a granular non-conductive surface layer of debris such as a non-conductive oxidation surface. The pad is moved to engage the skate. Once engaged, an overdrive motion is applied to the conductive pad causing the probe to flex and move the skate across the conductive pad to scrub debris from the pad. The scrubbed debris is displace along the skate and moved around the skate round back end to a position on the skate that is away from the conductive pad. In one aspect of the invention, the probe arm has a base arm below the retention portion, a knee below the base arm, and a reverse arm below the knee. Further, a contact tip is below the reverse arm and the self-cleaning skate is below the contact tip.
In one embodiment of the invention, the skate round back end has a radius with a size as large as the length of the skate height. In another embodiment of the invention, the round back end of the skate is a variable radius back end.
In one aspect of the invention, the overdrive motion causes the skate to pivot such that the middle section forms an angle up to 35 degrees with respect to a horizontal plane, while the round back end remains engaged with the conductive pad. Reversing the overdrive motion causes the skate to reverse its movement, where the skate moves from an up angle to approximately a horizontal position while maintaining engagement with the conductive pad. Here, the skate translates along the horizontal position in a direction towards the skate back end, where the debris is further displaced along the round back end and away from the conductive pad. Finally, the conductive pad moves away from the skate to disengage the probe from the conductive pad.
In one aspect of the invention, the pad is in an extended overdrive motion beyond the previous overdrive motion, causing the probe move in a manner to further displace the debris away from the conductive pad. Here, the extended overdrive motion is applied after at least two touch down cycles. Such overdrive motion of the conductive pad is between 1-5 mil.
As an advancement in removing the debris from the skate, in one aspect of the invention, the conductive pads for engaging the probe tip are replaced by a cleaning sheet having debris adhesion properties for removing the debris from the skate.
One aspect of the present invention is a method of using the self-cleaning skate by providing a conductive pad having a generally convex shape and a non-conductive layer of debris, such as a granular non-conductive oxidation surface, and providing a conductive probe for engaging the conductive pad. The probe includes a contact end for receiving a test current, a retention portion below the contact end, a block for holding the retention portion, a probe arm below the retention portion, a probe contact tip below the arm, and a generally planar self-cleaning skate disposed perpendicular below the contact tip, where the skate has a generally square front end, a generally round back end and a generally flat middle section therebetween. The skate is positioned above the conductive pad, where the conductive pad is translated, causing the skate to engage the conductive pad. Overdrive motion is then provided to the conductive pad causing the skate to scrub the debris from the conductive pad and clean the debris from the region of the skate that contacts the conductive pad. The cleaning occurs from the overdrive motion moving the skate to form an angle between the skate middle section and a horizontal plane, while engaging the round back end with the conductive pad. The overdrive motion induces a translation motion of the skate back end along the pad in a direction towards the skate front end while the skate middle section is further angled with respect to the horizontal plane. As the skate back end translates across the conductive pad, debris and non-conductive oxides are displaced along the skate, where the debris moves around the round back end to a position on the skate that is away from the conductive pad. Reversing the overdrive motion to the pad causes the skate middle section to move from the angle to approximately the horizontal position, where the skate flat middle section is in contact with the conductive pad. Here, the debris on the skate back end moves to a position away from the conductive pad. Continuing to reverse the overdrive motion translates the skate along the horizontal position and further moving the debris around the round back end to a position on the skate that is away from the conductive pad. Finally, the pad is translated to cause the probe to disengage from the conductive pad. The method according to the current invention improves overdrive control by making the scrubbing and cleaning less sensitive to the overdrive motion, where the debris layer is removed without breaching or damaging the conductive pad and debris is displaced from the conductive pad to the skate. Further, a current (i) is applied to the probe after the self-cleaning skate contacts the conductive pad. Using the self-cleaning skate according to the invention is accomplished after at least two engagement cycles.
In one aspect of the method according to the current invention, the probe arm includes a base arm below the retention portion, a knee below the base arm, and a reverse arm below the knee, where the contact tip is below the reverse arm and the self-cleaning skate is below the contact tip.
In another aspect of the invention, the self-cleaning skate is positioned above the pad by disposing an approximate center location of the flat middle end above an edge of the conductive pad, where the skate engages the conductive pad with the center of the skate positioned on the conductive pad edge.
Some key advantages of the invention are the features of the self-cleaning skate extend the mean time between failure of the probe caused by debris buildup on the skate. Additionally, due to the unique skate design, a scrub channel may be made on irregularly shaped conductive pads at any location on the pad. The current invention provides better control of the skate during overdrive motion, where improved tolerance to overdrive motion enables reliable pad testing on silicon wafers before dicing.
The objectives and advantages of the present invention will be understood by reading the following detailed description in conjunction with the drawings, in which:
Although the following detailed description contains many specifics for the purposes of illustration, anyone of ordinary skill in the art will readily appreciate that many variations and alterations to the following exemplary details are within the scope of the invention. Accordingly, the following preferred embodiment of the invention is set forth without any loss of generality to, and without imposing limitations upon, the claimed invention.
Semiconductor wafer processing methods and technology have been dynamic fields and continue to be the focus of much research and development. Among the numerous areas of these fields, early verification of process integrity and circuit design is an important step for effective cost control and manufacturing efficiency. As new methods of fabrication and new semiconductor wafer features evolve, testing methods must adapt to these changes. For example, the conductive pad of a semiconductor wafer can be fabricated as a dome-shape, or even a pedestal having a dome-shape located at the pedestal top, where the dome feature may be non-uniform and asymmetric. New methods of testing and new conductive test probes are required to address these evolving fabrication technologies. Typically, the conductive pad has a non-conductive layer of debris that includes a non-conductive oxide layer on the dome surface that impedes electrical contact between the probe tip and the conductive pad. In the testing phase, this layer requires a scrubbing step to remove some of the non-conductive layer of debris to enable electrical contact between the conductive pad and the probe tip. It is desirable to remove this layer and apply a test current to the pad to verify circuit design and fabrication integrity, while simultaneously controlling the probe tip position on the pad and cleaning the probe end. In the current invention, the scrubbing process requires the conductive pad to be positioned below the probe tip and then moved to make contact with the probe tip. Once engaged, an overdrive motion is applied to the conductive pad whereby the probe flexes to allow the probe tip to traverse the conductive pad and scrub the non-conductive layer of debris from the pad surface while applying a test current (i) through the probe. Problems arise when scrubbing and testing the dome-shaped conductive pads. These problems include controlling the probe tip to ensure it remains on the conductive pad during scrubbing and testing, ensuring the translation of the probe tip across the pad is not too sensitive to the overdrive motion, and managing the debris that is removed to ensure electrical continuity and prevent or limit accumulation of debris on the probe tip.
To address these issues, the present invention provides a probe having a self-cleaning tip, or skate, for engaging a conductive pad of the semiconductor wafer, where the conductive pad may have a dome-shape or be a pedestal having a dome-shape. The probe includes a contact end for receiving a test current, a probe retention portion below the contact end and a block for holding the retention portion. Further, a probe arm below the retention portion has a probe contact tip there below and a generally planar self-cleaning skate disposed perpendicular below the contact tip. The self-cleaning skate has a generally square front end, a generally round back end and a generally flat middle section therebetween. This configuration may be made into an array of probes suited for scrubbing and testing semiconductor wafers having many conductive pads arranged according to a circuit, or multiple circuits, integrated to the wafer.
The skate of the probe contacting tip may have a height up to ½ of the skate length and a skate width up to ⅙ of the skate length. Additionally, the self-cleaning skate may have a width that is generally narrower than a width of the contacting tip. These skates may have a cross-section such as a U-shape, semi-circular shape, V-shape, box-shape, and parallelogram-shape, where the parallelogram cross-section has a first parallel side connected to the bottom of the contact tip and a second parallel side for contacting the conductive pad, whereby the first parallel side is larger than the second parallel side. Further, the box-shape cross-section may have a first horizontal side connected to the contact tip and a second horizontal side for contacting the conductive pad, where the second horizontal side further includes radii at each edge of the second horizontal side. In these aspects, the self-cleaning skate length is aligned along a scrub direction.
One conductive pad addressed in the current invention is generally convex having a non-conductive layer, such as a granular non-conductive oxidation layer, that is an artifact of the wafer fabrication process. The conductive pad is moved to engage the skate. Once engaged, an overdrive motion is applied to the conductive pad causing the probe arm to flex. This flexing allows the skate to remain in contact with the conductive pad while moving across the pad to scrub the non-conductive layer of debris and remove the debris from the conductive pad. An intended consequence of the skate design according to the current invention, is the scrubbed debris is displaced along the skate and moved around the skate round back end to a position on the skate that is away from said conductive pad.
In one aspect of the invention, to enable further control of the skate as the pad is subject to the overdrive motion, the probe arm has a base arm below the retention portion, a knee below the base arm, and a reverse arm below the knee. Further, the contact tip is below the reverse arm and the self-cleaning skate is below the contact tip.
According to the design of the self-cleaning skate, the skate round back end has a radius with a size up to the length of the skate height. Alternatively, the round back end of the skate may be a variable radius, or multiple radii, back end.
According to the aspects of the invention, the overdrive motion causes the skate to pivot such that the middle section forms an angle up to 35 degrees with respect to a horizontal plane, while the round back end is engaged with the conductive pad. Further, by reversing the overdrive motion, the skate moves in a reverse direction across the conductive pad, where the skate moves from an up angle to approximately a horizontal position while engaging the conductive pad. Here, the skate translates along the horizontal position in a direction towards the skate back end, where the debris is further displaced along the round back end and away from the conductive pad. Finally, the conductive pad moves away from the skate to disengage the probe from the conductive pad, whereby a scrub channel is evident on the surface of the pad.
In one aspect of the invention, the pad is extended in an overdrive motion that is beyond the previous overdrive motion, the probe is caused to move in a manner that further displaces the already displaced debris away from the conductive pad. Here, the extended overdrive motion is applied after at least two touch down cycles. Such overdrive motion of the conductive pad may be between 1-5 mil.
Prior to the current invention, a separate process was required for removing accumulated debris from probes, such as scouring or buffing the probe ends. This added step is known to be invasive to the fabrication process, where in addition to a need for a separate mechanical configuration in the fabrication process, the probes are subject to additional ware from abrasion that shortens their utility. As an advancement in removing the debris from the skate, in one aspect of the invention, the conductive pads are replaced by a cleaning sheet having debris adhesion properties for removing the debris from the skate.
A method of using the self-cleaning skate according to the current invention includes providing the conductive pad having with the generally convex shape and a non-conductive layer, such as a granular oxidation surface, and providing a conductive probe for engaging the conductive pad that includes a contact end for receiving a test current, a retention portion below the contact end, a block for holding the retention portion, a probe arm below the retention portion, a probe contact tip below the arm, and a generally planar self-cleaning skate disposed perpendicularly below the contact tip, where the skate has a generally square front end, a generally round back end and a generally flat middle section therebetween. The skate is positioned above the conductive pad, where the conductive pad is translated causing the skate to engage the conductive pad. Overdrive motion is provided to the conductive pad causing the skate to scrub the non-conductive layer of debris and remove it from the conductive pad and then clean the debris from the skate. The cleaning occurs by the overdrive motion flexing the probe and causing the skate to move across the pad to form an angle of the skate middle section with respect to a horizontal plane while still engaging the round back end with the conductive pad. The overdrive motion induces translation motion of the skate back end in a direction towards the skate front end across the conductive pad while the skate middle section is further angled with respect to the horizontal plane. As the skate back end translates across the conductive pad, debris, such as a non-conductive oxide, is displaced along the skate, where the debris moves around the round back end to a position on the skate that is away from the conductive pad. Reversing the overdrive motion to the pad causes the skate middle section to move from the angle to approximately the horizontal position, where the skate flat middle section is in contact with the conductive pad. Here, the debris on the skate back end moves to a position away from the conductive pad. Continuing to reverse the overdrive motion of the conductive pad translates the skate along the horizontal position and further moves the debris around the round back end to a position on the skate that is away from the conductive pad. Finally, the pad is translated to cause the probe to disengage from the conductive pad. The method according to the current invention improves overdrive control by making the scrubbing and cleaning less sensitive to the overdrive motion, where the oxidation layer is removed without breaching the conductive pad and debris is displaced from the conductive pad to the skate. Accordingly, a current (i) is applied after said self-cleaning skate contacts the conductive pad.
Using the self-cleaning skate according to the invention is accomplished after at least two said engagement cycles.
In one aspect of the current invention, the probe arm includes a base arm below the retention portion, a knee below the base arm, and a reverse arm below the knee, where the contact tip is below the reverse arm and the self-cleaning skate is below the contact tip.
In another aspect of the invention, the self-cleaning skate is positioned above the pad by disposing an approximate center location of the flat middle end above an edge of the conductive pad, where the skate to engages the conductive pad with the center of the skate positioned on the conductive pad edge.
Referring now to the figures, FIG. 1 is a planar view of a scrubbing system 100 that includes a block 102 holding a probe 104 having a self-cleaning skate 106 for engaging a conductive pad 108 to scrub debris (see FIG. 2 ) from the conductive pad 108 while applying the test current (i), according to the present invention. The probe includes a contact end 110 for receiving the test current (i) (not shown), a probe retention portion 112, below the contact end, that is held by the block 102. A probe arm 114 below the retention portion 112 has a probe contact tip 116 at the end, with a generally planar self-cleaning skate 106 disposed perpendicular below the contact tip 116. According to one embodiment of the invention and depicted in FIG. 1 , the probe arm 114 has a base arm 118 below the retention portion, a knee 120 below the base arm 118, and a reverse arm 122 below the knee 120, where the contact tip 116 is below the reverse arm 122 and the self-cleaning skate 106 is below the contact tip 116.
Illustrated in FIG. 2 is a planar view of the probe tip 116 having the self-cleaning skate 106 positioned over a conductive pad 108 according to one embodiment of the present invention. Here, the self-cleaning skate 106 depicted is generally planar and disposed perpendicular below the contact tip 116, where the skate 106 has a generally square front end 200, a generally round back end 202 and a generally flat middle section 204 therebetween. Further depicted, the conductive pad 108 has a layer of non-conductive granular debris 208 formed in a generally convex shape on a generally cylindrical base 210, where the non-conductive granular debris 208 can be a non-conductive oxide layer resulting from a breakdown of the surface of the metallic conductive pad in the fabrication processes.
Depicted in FIG. 6b is an overdrive motion 600 applied to the conductive pad 108, where dashed lines 602 are provided to show a relative overdrive displacement of the conductive pad 108. One benefit of the round back end 202 is that it averts the skate 106 from binding in the debris 208 when the overdrive motion 600 is applied, preventing the probe 106 from unpredictably releasing from the debris 208 and springing off of the pad 108, which is undesirable. Further, the added linear distance along the bottom surface of the skate 106 attained by having the round back end 202 provides improved tolerance to overdrive 600.
The current invention improves the skate 106 response to overdrive motion 600 of the conductive pad 108, where movement of the skate 106 having the generally round back end 202 allows the skate 106 to smoothly scrub across the conductive pad 108. A probe end not having the features according to the current invention is known to become caught in the debris 208 while the overdrive motion 600 continues, thus causing the probe arm to build up potential energy. The consequence of this undesirable state is the potential energy eventually surpasses the debris strength and the skate releases across the conductive pad 108, rapidly and without control, swinging beyond the conductive pad 108 thus potentially damaging the skate 106 and/or the pad 108.
By selecting the initial position of the skate 106 relative to the pad 108, the scrub channel 600 can be made in all locations on the surface of the conductive pad 108, where the invention provides better control of the motion of the skate 106 across the pad 108, while preserving the integrity of the conductive pad 108 and the skate 106. FIGS. 9a-9d depict planar views of a conductive pad 108 before and after scrubbing. FIG. 9a shows a side planar view of a typical conductive pad 108 having a splayed-cylindrical conductive metal base 706 and a layer of debris 208, such as a non-conductive oxide layer, on a convex pad 108. FIG. 9b shows a top planar view of a typical conductive pad 108 having a generally granular surface of debris 208 to be scrubbed for enabling conduction of the test signal (i) from the skate 106 to the pad 108. FIG. 9c illustrates a scrub channel 704 made across the center of the pad 108 as per the description related to FIG. 7 above, and FIG. 9d illustrates a scrub channel 704 made near the edge of the pad 108 as per the description related to FIG. 8 above. Though the drawings of the conductive pad 108 are depicted to have a general convex shape, in practice the surface pad 108 can be an irregular shape. The self-cleaning skate 106 according to the embodiments described are able to provide useful scrub channels 704 in these irregular shapes and in numerous pad locations to provide conduction for the test signal (i) with tolerance to overdrive motion 600 and without breaching the pad 108, where the thickness of the pad may be only slightly more thick than the debris layer.
The present invention has now been described in accordance with several exemplary embodiments, which are intended to be illustrative in all aspects, rather than restrictive. Thus, the present invention is capable of many variations in detailed implementation, which may be derived from the description contained herein by a person of ordinary skill in the art. All such variations are considered to be within the scope and spirit of the present invention as defined by the following claims and their legal equivalents.
Claims (41)
1. A probe for engaging a conductive pad, said probe comprising:
a. a probe contact end for receiving a test current;
b. a probe retention portion below said contact end;
c. a block holding said retention portion;
d. a probe arm below said retention portion;
e. a probe contact tip below said arm; and
f. a generally planar self-cleaning skate disposed perpendicular below said contact tip having a generally square front end, a generally round back end and a generally flat middle section therebetween, wherein said conductive pad of generally convex shape and having a granular non-conductive surface layer of debris moves to engage said skate, whereby an overdrive motion is applied to said conductive pad thereby causing said skate to move across said conductive pad to scrub non-conductive debris from said conductive pad and displace said debris along said skate and move said debris near said skate round back end to a position on said skate that is away from said conductive pad.
2. The probe according to claim 1 , wherein said non-conductive surface layer of debris is a non-conductive oxide.
3. The probe according to claim 1 , wherein said skate comprises a skate height up to ½ of a skate length and a skate width up to ⅙ of said skate length.
4. The probe according to claim 3 , wherein said self-cleaning skate width is narrower than a width of said contacting tip.
5. The probe according to claim 1 , wherein said skate has a cross-section selected from a group consisting of U-shape, semi-circular shape, V-shape, box-shape, and parallelogram-shape.
6. The probe according to claim 5 , wherein said parallelogram cross-section has a first parallel side connected to said contact tip and a second parallel side for contacting said conductive pad, whereby said first parallel side is larger than said second parallel side.
7. The probe according to claim 5 , wherein said box-shape cross-section comprises a first horizontal side connected to said contact tip and a second horizontal side for contacting said conductive pad, whereby said second horizontal side further comprises radii at each edge of said second horizontal side.
8. The probe according to claim 1 , wherein said probe arm comprises a base arm below said retention portion, a knee below said base arm, and a reverse arm below said knee, whereby said contact tip is below said reverse arm and said self-cleaning skate is below said contact tip.
9. The probe according to claim 1 , wherein said skate round back end has a radius with a size up to a length of said skate height.
10. The probe according to claim 1 , wherein said round back end is a variable radius back end.
11. The probe according to claim 1 , wherein said overdrive motion causes said skate to pivot, whereby said middle section forms an angle up to 35 degrees with respect to a horizontal plane while said round back end is engaged with said conductive pad.
12. The probe according to claim 1 , wherein reversing said overdrive motion causes said skate to move in a reverse direction, whereby
a. said skate moves from an angle to approximately a horizontal position while maintaining said engagement with said conductive pad;
b. said skate translates along said horizontal position in a direction towards said skate back end, whereby said debris is further displaced along said round back end and away from said conductive pad; and
c. said conductive pad moves away from said skate to disengage said probe from said conductive pad.
13. The probe according to claim 1 , wherein in an extended overdrive motion beyond said overdrive motion is applied to said conductive pad causing said probe to move in a manner to further displace said displaced debris away from said conductive pad.
14. The probe according to claim 13 , wherein said extended overdrive motion is applied after at least two touch down cycles.
15. The probe according to claim 1 , wherein said conductive pad moves between 1-5 mil.
16. The probe according to claim 1 , wherein said conductive pad is a cleaning sheet having debris adhesion properties for removing said debris from said skate.
17. The probe according to claim 1 , wherein said self-cleaning skate length is aligned along a scrub direction.
18. A conductive probe for engaging a conductive pad comprising:
a. a contact end for receiving a test current;
b. a retention portion below said contact end;
c. a block holding said retention portion;
d. a base arm portion below said retention portion;
e. a knee below said base arm portion;
f. a reverse arm portion below said knee;
g. a contact tip below said reverse arm portion; and
h. a generally planar self-cleaning skate disposed perpendicular below said contact tip having a generally square front end, a generally round back end and a generally flat middle section therebetween, wherein said conductive pad is of generally convex shape and having a granular non-conductive surface layer of debris moves to engage said skate, whereby an overdrive motion is applied to said conductive pad thereby causing said skate to move across said conductive pad to scrub said debris from said conductive pad and displace said debris along said skate and move said debris near said skate round back end to a position on said skate that is away from said conductive pad.
19. A method of using a self-cleaning skate comprising:
a. providing a conductive pad having a generally convex shape and a granular non-conductive surface layer of debris;
b. providing a conductive probe for engaging said conductive pad, the conductive probe comprising:
i. a contact end for receiving a test current;
ii. a retention portion below said contact end
iii. a block holding said retention portion;
iv. a probe arm below said retention portion;
v. a probe contact tip below said arm; and
vi. a generally planar self-cleaning skate disposed perpendicular below said contact tip having a generally square front end, a generally round back end and a generally flat middle section therebetween;
c. positioning said skate above said conductive pad;
d. translating said conductive pad causing said skate to engage said conductive pad;
e. providing an overdrive motion to said conductive pad causing said skate to scrub said debris to expose conductive material of said conductive pad and clean said debris from said skate wherein said cleaning comprises:
i. forming an angle of said skate middle section with respect to a horizontal plane while engaging said round back end with said conductive pad;
ii. inducing a translation motion of said skate back end in a direction towards said skate front end across said conductive pad while said skate middle section is further angled with respect to said horizontal plane;
iii. displacing said debris along said skate and moving said debris around said round back end to a position on said skate that is away from said conductive pad;
iv. reversing said overdrive motion to said pad causing said skate middle section to move from said angle to approximately said horizontal position, wherein said skate flat middle section is in contact with said conductive pad whereby said debris on said skate back end moves to a position away from said conductive pad; and
v. translating said skate along said horizontal position and further moving said debris around said round back end to a position on said skate that is away from said conductive pad; and
vi. translating said pad to cause said probe to disengage from said conductive pad,
wherein said method improves overdrive control by making said scrubbing and said cleaning less sensitive to said overdrive, whereby said non-conductive layer of debris is removed without breaching said conductive pad and debris is displaced from said conductive pad to said skate.
20. The method of claim 19 , wherein using said self-cleaning method is accomplished after at least two said engagement cycles.
21. The method of claim 19 , wherein said non-conductive layer of debris is a non-conductive oxide layer.
22. The method of claim 19 , wherein a current (i) is applied after said self-cleaning skate contacts said conductive pad.
23. The method of claim 19 , wherein said probe arm comprises a base arm below said retention portion, a knee below said base arm, and a reverse arm below said knee, whereby said contact tip is below said reverse arm and said self-cleaning skate is below said contact tip.
24. The method of claim 19 , wherein positioning said self-cleaning skate above said pad comprises disposing said skate at an approximate center location of said flat middle end above an edge of said conductive pad.
25. The method of claim 24 , wherein engaging said conductive pad comprises engaging said approximate center of said skate with said conductive pad edge.
26. A method of using a self-cleaning skate comprising:
positioning the self-cleaning skate having at least one rounded edge and at least one flat edge blade above a conductive pad;
engaging the skate and the conductive pad;
causing the skate to scrub at least a portion of debris disposed on the conductive pad thereby exposing conductive material; and
cleaning the debris from the skate.
27. The method of claim 26 wherein the conductive pad has a generally convex shape.
28. The method of claim 26 wherein the conductive pad has a non-conductive surface layer of debris.
29. The method of claim 28 wherein the conductive pad has a granular non-conductive surface layer of debris.
30. The method of claim 26 further comprising providing a motion to the conductive pad.
31. The method of claim 30 further comprising providing an overdrive motion to the conductive pad.
32. The method of claim 31 wherein the overdrive motion ranges from about 1 to about 5 millimeters.
33. The method of claim 26 wherein cleaning the debris from the skate comprises:
forming an angle of the skate middle section with respect to a horizontal plane while engaging the round back end with the conductive pad;
inducing a translation motion of the skate back end in a direction toward the skate front end across the conductive pad while the skate middle section is further angled with respect to the horizontal plane; and
displacing the debris along the skate and moving the debris around the round back end to a position on the skate that is away from the conductive pad.
34. The method of claim 33 further comprising reversing the motion to the pad causing the skate middle section to move from the angle to approximately the horizontal position, wherein the skate middle section is in contact with the conductive pad and whereby the debris on the skate back end moves to a position away from the conductive pad.
35. The method of claim 34 further comprising translating the skate along the horizontal position and further moving the debris around the round back end to a position on the skate that is away from the conductive pad.
36. The method of claim 33 further comprising translating the conductive pad to cause the probe to disengage from the conductive pad.
37. The method of claim 26 wherein the debris comprises a non-conductive oxide layer.
38. The method of claim 26 further comprising applying a current after the skate contacts the conductive pad.
39. The method of claim 26 wherein positioning the self-cleaning skate above the conductive pad comprises disposing the skate at an approximate center location of the flat middle end above an edge of the conductive pad.
40. The method of claim 26 further comprising translating the conductive pad causing the skate to engage the conductive pad.
41. The method of claim 40 further comprising engaging the conductive pad at an approximate center of the skate with the conductive pad.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/545,571 USRE46221E1 (en) | 2004-05-21 | 2012-07-10 | Probe skates for electrical testing of convex pad topologies |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
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US10/850,921 US7148709B2 (en) | 2004-05-21 | 2004-05-21 | Freely deflecting knee probe with controlled scrub motion |
US10/888,347 US7091729B2 (en) | 2004-07-09 | 2004-07-09 | Cantilever probe with dual plane fixture and probe apparatus therewith |
US11/450,977 US7733101B2 (en) | 2004-05-21 | 2006-06-09 | Knee probe having increased scrub motion |
US11/480,302 US7759949B2 (en) | 2004-05-21 | 2006-06-29 | Probes with self-cleaning blunt skates for contacting conductive pads |
US11/701,236 US7436192B2 (en) | 2006-06-29 | 2007-01-31 | Probe skates for electrical testing of convex pad topologies |
US12/903,566 USRE43503E1 (en) | 2006-06-29 | 2010-10-13 | Probe skates for electrical testing of convex pad topologies |
US13/545,571 USRE46221E1 (en) | 2004-05-21 | 2012-07-10 | Probe skates for electrical testing of convex pad topologies |
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US11/701,236 Reissue US7436192B2 (en) | 2004-05-21 | 2007-01-31 | Probe skates for electrical testing of convex pad topologies |
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US13/545,571 Active 2026-08-23 USRE46221E1 (en) | 2004-05-21 | 2012-07-10 | Probe skates for electrical testing of convex pad topologies |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11761982B1 (en) | 2019-12-31 | 2023-09-19 | Microfabrica Inc. | Probes with planar unbiased spring elements for electronic component contact and methods for making such probes |
US11774467B1 (en) | 2020-09-01 | 2023-10-03 | Microfabrica Inc. | Method of in situ modulation of structural material properties and/or template shape |
US11802891B1 (en) | 2019-12-31 | 2023-10-31 | Microfabrica Inc. | Compliant pin probes with multiple spring segments and compression spring deflection stabilization structures, methods for making, and methods for using |
US11973301B2 (en) | 2022-02-24 | 2024-04-30 | Microfabrica Inc. | Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6441315B1 (en) * | 1998-11-10 | 2002-08-27 | Formfactor, Inc. | Contact structures with blades having a wiping motion |
US9476911B2 (en) | 2004-05-21 | 2016-10-25 | Microprobe, Inc. | Probes with high current carrying capability and laser machining methods |
USRE43503E1 (en) * | 2006-06-29 | 2012-07-10 | Microprobe, Inc. | Probe skates for electrical testing of convex pad topologies |
US8988091B2 (en) | 2004-05-21 | 2015-03-24 | Microprobe, Inc. | Multiple contact probes |
US9097740B2 (en) | 2004-05-21 | 2015-08-04 | Formfactor, Inc. | Layered probes with core |
US7759949B2 (en) | 2004-05-21 | 2010-07-20 | Microprobe, Inc. | Probes with self-cleaning blunt skates for contacting conductive pads |
US8907689B2 (en) | 2006-10-11 | 2014-12-09 | Microprobe, Inc. | Probe retention arrangement |
US7514948B2 (en) | 2007-04-10 | 2009-04-07 | Microprobe, Inc. | Vertical probe array arranged to provide space transformation |
US8723546B2 (en) | 2007-10-19 | 2014-05-13 | Microprobe, Inc. | Vertical guided layered probe |
US8230593B2 (en) | 2008-05-29 | 2012-07-31 | Microprobe, Inc. | Probe bonding method having improved control of bonding material |
Citations (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2754203A (en) | 1953-05-22 | 1956-07-10 | Rem Cru Titanium Inc | Thermally stable beta alloys of titanium |
US4314855A (en) * | 1979-12-17 | 1982-02-09 | Bell Telephone Laboratories, Incorporated | Method of cleaning test probes |
US4871964A (en) | 1988-04-12 | 1989-10-03 | G. G. B. Industries, Inc. | Integrated circuit probing apparatus |
US4973903A (en) | 1986-12-23 | 1990-11-27 | Texas Instruments Incorporated | Adjustable probe for probe assembly |
US5468993A (en) | 1992-02-14 | 1995-11-21 | Rohm Co., Ltd. | Semiconductor device with polygonal shaped die pad |
US5642056A (en) | 1993-12-22 | 1997-06-24 | Tokyo Electron Limited | Probe apparatus for correcting the probe card posture before testing |
US6359452B1 (en) | 1998-07-22 | 2002-03-19 | Nortel Networks Limited | Method and apparatus for testing an electronic assembly |
US6414502B1 (en) | 1996-10-29 | 2002-07-02 | Agilent Technologies, Inc. | Loaded-board, guided-probe test fixture |
US20020177782A1 (en) | 2000-10-16 | 2002-11-28 | Remon Medical Technologies, Ltd. | Barometric pressure correction based on remote sources of information |
US6496026B1 (en) | 2000-02-25 | 2002-12-17 | Microconnect, Inc. | Method of manufacturing and testing an electronic device using a contact device having fingers and a mechanical ground |
US6538336B1 (en) | 2000-11-14 | 2003-03-25 | Rambus Inc. | Wirebond assembly for high-speed integrated circuits |
US20030218244A1 (en) | 2002-03-18 | 2003-11-27 | Lahiri Syamal Kumar | Miniaturized contact spring |
US20030218865A1 (en) | 2002-05-24 | 2003-11-27 | Macias Jose Javier | Semiconductor thermal management system |
US6768331B2 (en) | 2002-04-16 | 2004-07-27 | Teradyne, Inc. | Wafer-level contactor |
US6891385B2 (en) | 2001-12-27 | 2005-05-10 | Formfactor, Inc. | Probe card cooling assembly with direct cooling of active electronic components |
US7015707B2 (en) * | 2002-03-20 | 2006-03-21 | Gabe Cherian | Micro probe |
US7036221B2 (en) | 1996-07-09 | 2006-05-02 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a semiconductor element-mounting board |
US7061257B2 (en) | 1993-11-16 | 2006-06-13 | Formfactor, Inc. | Probe card assembly |
US7068057B2 (en) | 1997-06-10 | 2006-06-27 | Cascade Microtech, Inc. | Low-current pogo probe card |
US20060189867A1 (en) | 2005-02-22 | 2006-08-24 | Ian Revie | Probe |
US20060186905A1 (en) | 2005-02-22 | 2006-08-24 | Fujitsu Limited | Contactor for electronic parts and a contact method |
US7109731B2 (en) | 1996-08-08 | 2006-09-19 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US20060208752A1 (en) | 2003-04-15 | 2006-09-21 | Michinobu Tanioka | Inspection probe |
US20060261828A1 (en) | 2004-04-28 | 2006-11-23 | Cram Daniel P | Resilient contact probe apparatus |
US7143500B2 (en) | 2001-06-25 | 2006-12-05 | Micron Technology, Inc. | Method to prevent damage to probe card |
US7148709B2 (en) * | 2004-05-21 | 2006-12-12 | Microprobe, Inc. | Freely deflecting knee probe with controlled scrub motion |
US7281305B1 (en) | 2006-03-31 | 2007-10-16 | Medtronic, Inc. | Method of attaching a capacitor to a feedthrough assembly of a medical device |
US20080001613A1 (en) * | 2006-06-29 | 2008-01-03 | January Kister | Probe skates for electrical testing of convex pad topologies |
US20090079455A1 (en) | 2007-09-26 | 2009-03-26 | Formfactor, Inc. | Reduced scrub contact element |
US7667471B2 (en) | 2004-12-14 | 2010-02-23 | Advantest Corporation | Contact pin probe card and electronic device test apparatus using same |
US7733101B2 (en) | 2004-05-21 | 2010-06-08 | Microprobe, Inc. | Knee probe having increased scrub motion |
US7733103B2 (en) | 2006-09-29 | 2010-06-08 | Mico Tn Ltd. | Probe card |
USRE43503E1 (en) * | 2006-06-29 | 2012-07-10 | Microprobe, Inc. | Probe skates for electrical testing of convex pad topologies |
US8230593B2 (en) | 2008-05-29 | 2012-07-31 | Microprobe, Inc. | Probe bonding method having improved control of bonding material |
US20120242363A1 (en) | 2011-03-21 | 2012-09-27 | Formfactor, Inc. | Non-Linear Vertical Leaf Spring |
US8299394B2 (en) | 2007-06-15 | 2012-10-30 | Sv Probe Pte Ltd. | Approach for assembling and repairing probe assemblies using laser welding |
US8310253B1 (en) | 2009-07-14 | 2012-11-13 | Xilinx, Inc. | Hybrid probe card |
US20120286816A1 (en) | 2004-05-21 | 2012-11-15 | Microprobe, Inc. | Probes with high current carrying capability and laser machining methods |
US20120313660A1 (en) | 2004-07-09 | 2012-12-13 | Microprobe, Inc. | Probes with offset arm and suspension structure |
US20130082729A1 (en) | 2011-09-30 | 2013-04-04 | Formfactor, Inc. | Probe With Cantilevered Beam Having Solid And Hollow Sections |
US8415963B2 (en) | 2005-12-07 | 2013-04-09 | Microprobe, Inc. | Low profile probe having improved mechanical scrub and reduced contact inductance |
US20130093450A1 (en) | 2007-04-10 | 2013-04-18 | Formfactor, Inc. | Vertical probe array arranged to provide space transformation |
USRE44407E1 (en) | 2006-03-20 | 2013-08-06 | Formfactor, Inc. | Space transformers employing wire bonds for interconnections with fine pitch contacts |
Family Cites Families (201)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1147037A (en) | 1966-08-06 | 1969-04-02 | Ibm | Connector assembly |
US3599093A (en) | 1969-04-28 | 1971-08-10 | Rca Corp | Apparatus including a wire tipped probe for testing semiconductor wafers |
US3710251A (en) | 1971-04-07 | 1973-01-09 | Collins Radio Co | Microelectric heat exchanger pedestal |
US3812311A (en) | 1972-12-11 | 1974-05-21 | Electronic Memories & Magnetic | Miniature type switch probe for testing integrated circuit assemblies or the like |
US4116523A (en) | 1976-01-23 | 1978-09-26 | James M. Foster | High frequency probe |
US4027935A (en) | 1976-06-21 | 1977-06-07 | International Business Machines Corporation | Contact for an electrical contactor assembly |
US4115736A (en) | 1977-03-09 | 1978-09-19 | The United States Of America As Represented By The Secretary Of The Air Force | Probe station |
US4523144A (en) | 1980-05-27 | 1985-06-11 | Japan Electronic Materials Corp. | Complex probe card for testing a semiconductor wafer |
US4423376A (en) | 1981-03-20 | 1983-12-27 | International Business Machines Corporation | Contact probe assembly having rotatable contacting probe elements |
JPS58210631A (en) | 1982-05-31 | 1983-12-07 | Toshiba Corp | Ic tester utilizing electron beam |
US4525697A (en) | 1982-12-13 | 1985-06-25 | Eaton Corporation | Thermally responsive controller and switch assembly therefor |
US4618821A (en) | 1983-09-19 | 1986-10-21 | Lenz Seymour S | Test probe assembly for microelectronic circuits |
ATE45427T1 (en) | 1983-11-07 | 1989-08-15 | Martin Maelzer | ADAPTER FOR A PCB TESTER. |
US4508356A (en) | 1984-06-06 | 1985-04-02 | Robert Janian | Modified C-shaped mechanical spring seal |
US4593961A (en) | 1984-12-20 | 1986-06-10 | Amp Incorporated | Electrical compression connector |
US4618767A (en) | 1985-03-22 | 1986-10-21 | International Business Machines Corporation | Low-energy scanning transmission electron microscope |
JPH0646550B2 (en) | 1985-08-19 | 1994-06-15 | 株式会社東芝 | Electronic beam fixed position irradiation control method and electronic beam fixed position irradiation control device |
US5476211A (en) | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
US5829128A (en) | 1993-11-16 | 1998-11-03 | Formfactor, Inc. | Method of mounting resilient contact structures to semiconductor devices |
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US4706019A (en) | 1985-11-15 | 1987-11-10 | Fairchild Camera And Instrument Corporation | Electron beam test probe system for analyzing integrated circuits |
EP0255541A4 (en) | 1986-01-15 | 1988-04-26 | Rogers Corp | Electrical circuit board interconnect. |
US4757255A (en) | 1986-03-03 | 1988-07-12 | National Semiconductor Corporation | Environmental box for automated wafer probing |
US4747698A (en) | 1986-04-30 | 1988-05-31 | International Business Machines Corp. | Scanning thermal profiler |
US4730158A (en) | 1986-06-06 | 1988-03-08 | Santa Barbara Research Center | Electron-beam probing of photodiodes |
EP0256541A3 (en) | 1986-08-19 | 1990-03-14 | Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung | Contacting device |
US4772846A (en) | 1986-12-29 | 1988-09-20 | Hughes Aircraft Company | Wafer alignment and positioning apparatus for chip testing by voltage contrast electron microscopy |
DE3882563D1 (en) | 1987-03-31 | 1993-09-02 | Siemens Ag | DEVICE FOR THE ELECTRICAL FUNCTIONAL TESTING OF WIRING AREAS, ESPECIALLY OF PCB. |
JP2784570B2 (en) | 1987-06-09 | 1998-08-06 | 日本テキサス・インスツルメンツ 株式会社 | Socket |
JPH01128535A (en) * | 1987-11-13 | 1989-05-22 | Hitachi Ltd | Probe for measuring semiconductor element |
US5225771A (en) | 1988-05-16 | 1993-07-06 | Dri Technology Corp. | Making and testing an integrated circuit using high density probe points |
JPH01313969A (en) | 1988-06-13 | 1989-12-19 | Hitachi Ltd | Semiconductor device |
US4901013A (en) | 1988-08-19 | 1990-02-13 | American Telephone And Telegraph Company, At&T Bell Laboratories | Apparatus having a buckling beam probe assembly |
US5030318A (en) | 1989-09-28 | 1991-07-09 | Polycon Corporation | Method of making electrical probe diaphragms |
US5399982A (en) | 1989-11-13 | 1995-03-21 | Mania Gmbh & Co. | Printed circuit board testing device with foil adapter |
DE4237591A1 (en) | 1992-11-06 | 1994-05-11 | Mania Gmbh | PCB test facility with foil adapter |
US5205739A (en) | 1989-11-13 | 1993-04-27 | Augat Inc. | High density parallel interconnect |
US5471151A (en) | 1990-02-14 | 1995-11-28 | Particle Interconnect, Inc. | Electrical interconnect using particle enhanced joining of metal surfaces |
US5015947A (en) | 1990-03-19 | 1991-05-14 | Tektronix, Inc. | Low capacitance probe tip |
US5026291A (en) | 1990-08-10 | 1991-06-25 | E. I. Du Pont De Nemours And Company | Board mounted connector system |
JP3208734B2 (en) | 1990-08-20 | 2001-09-17 | 東京エレクトロン株式会社 | Probe device |
JPH0638382Y2 (en) | 1990-09-10 | 1994-10-05 | モレックス インコーポレーテッド | Surface mount connector for connecting boards |
US5207585A (en) | 1990-10-31 | 1993-05-04 | International Business Machines Corporation | Thin interface pellicle for dense arrays of electrical interconnects |
US5061192A (en) | 1990-12-17 | 1991-10-29 | International Business Machines Corporation | High density connector |
JPH07105420B2 (en) | 1991-08-26 | 1995-11-13 | ヒューズ・エアクラフト・カンパニー | Electrical connection with molded contacts |
US5230632A (en) | 1991-12-19 | 1993-07-27 | International Business Machines Corporation | Dual element electrical contact and connector assembly utilizing same |
JP3723232B2 (en) | 1992-03-10 | 2005-12-07 | シリコン システムズ インコーポレーテッド | Probe needle adjustment tool and probe needle adjustment method |
US5576631A (en) | 1992-03-10 | 1996-11-19 | Virginia Panel Corporation | Coaxial double-headed spring contact probe assembly |
US5237743A (en) | 1992-06-19 | 1993-08-24 | International Business Machines Corporation | Method of forming a conductive end portion on a flexible circuit member |
US5371654A (en) | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
US5422574A (en) | 1993-01-14 | 1995-06-06 | Probe Technology Corporation | Large scale protrusion membrane for semiconductor devices under test with very high pin counts |
US7368924B2 (en) | 1993-04-30 | 2008-05-06 | International Business Machines Corporation | Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof |
US5676599A (en) | 1993-05-03 | 1997-10-14 | Lohr & Bromkamp Gmbh | Outer joint part for a tripod joint |
US5884398A (en) | 1993-11-16 | 1999-03-23 | Form Factor, Inc. | Mounting spring elements on semiconductor devices |
US7073254B2 (en) | 1993-11-16 | 2006-07-11 | Formfactor, Inc. | Method for mounting a plurality of spring contact elements |
US5772451A (en) | 1993-11-16 | 1998-06-30 | Form Factor, Inc. | Sockets for electronic components and methods of connecting to electronic components |
US6336269B1 (en) | 1993-11-16 | 2002-01-08 | Benjamin N. Eldridge | Method of fabricating an interconnection element |
US6246247B1 (en) | 1994-11-15 | 2001-06-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US6835898B2 (en) | 1993-11-16 | 2004-12-28 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
US5974662A (en) | 1993-11-16 | 1999-11-02 | Formfactor, Inc. | Method of planarizing tips of probe elements of a probe card assembly |
US6029344A (en) | 1993-11-16 | 2000-02-29 | Formfactor, Inc. | Composite interconnection element for microelectronic components, and method of making same |
US5806181A (en) | 1993-11-16 | 1998-09-15 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
US6624648B2 (en) | 1993-11-16 | 2003-09-23 | Formfactor, Inc. | Probe card assembly |
US6482013B2 (en) | 1993-11-16 | 2002-11-19 | Formfactor, Inc. | Microelectronic spring contact element and electronic component having a plurality of spring contact elements |
US5500607A (en) | 1993-12-22 | 1996-03-19 | International Business Machines Corporation | Probe-oxide-semiconductor method and apparatus for measuring oxide charge on a semiconductor wafer |
US5802699A (en) | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
US5632631A (en) | 1994-06-07 | 1997-05-27 | Tessera, Inc. | Microelectronic contacts with asperities and methods of making same |
US5615824A (en) | 1994-06-07 | 1997-04-01 | Tessera, Inc. | Soldering with resilient contacts |
JPH07333232A (en) | 1994-06-13 | 1995-12-22 | Canon Inc | Formation of cantilever having probe |
US5936421A (en) | 1994-10-11 | 1999-08-10 | Virginia Panel Corporation | Coaxial double-headed spring contact probe assembly and coaxial surface contact for engagement therewith |
EP1408337A3 (en) | 1994-11-15 | 2007-09-19 | FormFactor, Inc. | Probe card assembly |
GB9503953D0 (en) | 1995-02-28 | 1995-04-19 | Plessey Semiconductors Ltd | An mcm-d probe tip |
US5720098A (en) | 1995-05-12 | 1998-02-24 | Probe Technology | Method for making a probe preserving a uniform stress distribution under deflection |
DE69635083T2 (en) | 1995-05-26 | 2006-05-18 | Formfactor, Inc., Livermore | PREPARATION OF COMPOUNDS AND APPARATUSES USING A SURGERY SUBSTRATE |
US5701085A (en) | 1995-07-05 | 1997-12-23 | Sun Microsystems, Inc. | Apparatus for testing flip chip or wire bond integrated circuits |
US5834946A (en) | 1995-10-19 | 1998-11-10 | Mosaid Technologies Incorporated | Integrated circuit test head |
US5742174A (en) | 1995-11-03 | 1998-04-21 | Probe Technology | Membrane for holding a probe tip in proper location |
US5892539A (en) | 1995-11-08 | 1999-04-06 | Alpha Innotech Corporation | Portable emission microscope workstation for failure analysis |
US5970167A (en) | 1995-11-08 | 1999-10-19 | Alpha Innotech Corporation | Integrated circuit failure analysis using color voltage contrast |
US6483328B1 (en) | 1995-11-09 | 2002-11-19 | Formfactor, Inc. | Probe card for probing wafers with raised contact elements |
US5994152A (en) | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
US5773987A (en) | 1996-02-26 | 1998-06-30 | Motorola, Inc. | Method for probing a semiconductor wafer using a motor controlled scrub process |
US6071630A (en) | 1996-03-04 | 2000-06-06 | Shin-Etsu Chemical Co., Ltd. | Electrostatic chuck |
US5764409A (en) | 1996-04-26 | 1998-06-09 | Alpha Innotech Corp | Elimination of vibration by vibration coupling in microscopy applications |
WO1997043654A1 (en) | 1996-05-17 | 1997-11-20 | Formfactor, Inc. | Microelectronic spring contact elements |
EP0901695A4 (en) | 1996-05-24 | 2000-04-12 | Tessera Inc | Connectors for microelectronic elements |
US5644249A (en) | 1996-06-07 | 1997-07-01 | Probe Technology | Method and circuit testing apparatus for equalizing a contact force between probes and pads |
US5751157A (en) | 1996-07-22 | 1998-05-12 | Probe Technology | Method and apparatus for aligning probes |
US6247228B1 (en) | 1996-08-12 | 2001-06-19 | Tessera, Inc. | Electrical connection with inwardly deformable contacts |
US6133072A (en) | 1996-12-13 | 2000-10-17 | Tessera, Inc. | Microelectronic connector with planar elastomer sockets |
US5764072A (en) | 1996-12-20 | 1998-06-09 | Probe Technology | Dual contact probe assembly for testing integrated circuits |
US6690185B1 (en) | 1997-01-15 | 2004-02-10 | Formfactor, Inc. | Large contactor with multiple, aligned contactor units |
JP3099947B2 (en) | 1997-02-03 | 2000-10-16 | 日本電子材料株式会社 | Vertical probe card |
US7063541B2 (en) | 1997-03-17 | 2006-06-20 | Formfactor, Inc. | Composite microelectronic spring structure and method for making same |
US5884395A (en) | 1997-04-04 | 1999-03-23 | Probe Technology | Assembly structure for making integrated circuit chip probe cards |
CA2572499A1 (en) | 1997-04-04 | 1998-10-15 | University Of Southern California | Method for electrochemical fabrication including use of multiple structural and/or sacrificial materials |
US5923178A (en) | 1997-04-17 | 1999-07-13 | Cerprobe Corporation | Probe assembly and method for switchable multi-DUT testing of integrated circuit wafers |
JPH10311864A (en) | 1997-05-12 | 1998-11-24 | Yokogawa Electric Corp | Semiconductor tester device |
JPH10319044A (en) | 1997-05-15 | 1998-12-04 | Mitsubishi Electric Corp | Probe card |
US5847936A (en) | 1997-06-20 | 1998-12-08 | Sun Microsystems, Inc. | Optimized routing scheme for an integrated circuit/printed circuit board |
JPH1144727A (en) | 1997-07-24 | 1999-02-16 | Hioki Ee Corp | Circuit board inspecting device |
DE69837690T2 (en) | 1997-07-24 | 2007-12-27 | Mitsubishi Denki K.K. | Device for removing foreign matter adhered to a probe tip end surface |
US6066957A (en) | 1997-09-11 | 2000-05-23 | Delaware Capital Formation, Inc. | Floating spring probe wireless test fixture |
US6204674B1 (en) | 1997-10-31 | 2001-03-20 | Probe Technology, Inc. | Assembly structure for making integrated circuit chip probe cards |
JPH11233216A (en) | 1998-02-16 | 1999-08-27 | Nippon Denki Factory Engineering Kk | Ic socket for test |
US6411112B1 (en) | 1998-02-19 | 2002-06-25 | International Business Machines Corporation | Off-axis contact tip and dense packing design for a fine pitch probe |
US6246245B1 (en) | 1998-02-23 | 2001-06-12 | Micron Technology, Inc. | Probe card, test method and test system for semiconductor wafers |
US5952843A (en) | 1998-03-24 | 1999-09-14 | Vinh; Nguyen T. | Variable contact pressure probe |
US6064215A (en) | 1998-04-08 | 2000-05-16 | Probe Technology, Inc. | High temperature probe card for testing integrated circuits |
US6292003B1 (en) | 1998-07-01 | 2001-09-18 | Xilinx, Inc. | Apparatus and method for testing chip scale package integrated circuits |
US6433571B1 (en) | 1998-07-06 | 2002-08-13 | Motorola, Inc. | Process for testing a semiconductor device |
US6031282A (en) | 1998-08-27 | 2000-02-29 | Advantest Corp. | High performance integrated circuit chip package |
JP3279294B2 (en) * | 1998-08-31 | 2002-04-30 | 三菱電機株式会社 | Semiconductor device test method, semiconductor device test probe needle, method of manufacturing the same, and probe card provided with the probe needle |
US6184576B1 (en) | 1998-09-21 | 2001-02-06 | Advantest Corp. | Packaging and interconnection of contact structure |
US6215320B1 (en) | 1998-10-23 | 2001-04-10 | Teradyne, Inc. | High density printed circuit board |
US6441315B1 (en) | 1998-11-10 | 2002-08-27 | Formfactor, Inc. | Contact structures with blades having a wiping motion |
US6332270B2 (en) | 1998-11-23 | 2001-12-25 | International Business Machines Corporation | Method of making high density integral test probe |
US6504223B1 (en) | 1998-11-30 | 2003-01-07 | Advantest Corp. | Contact structure and production method thereof and probe contact assembly using same |
US6579804B1 (en) | 1998-11-30 | 2003-06-17 | Advantest, Corp. | Contact structure and production method thereof and probe contact assembly using same |
US6255126B1 (en) | 1998-12-02 | 2001-07-03 | Formfactor, Inc. | Lithographic contact elements |
US6419500B1 (en) | 1999-03-08 | 2002-07-16 | Kulicke & Soffa Investment, Inc. | Probe assembly having floatable buckling beam probes and apparatus for abrading the same |
US6184676B1 (en) | 1999-03-12 | 2001-02-06 | Credence Systems Corporation | Cooling system for test head |
JP3745184B2 (en) | 1999-03-25 | 2006-02-15 | 株式会社東京カソード研究所 | Probe for probe card and manufacturing method thereof |
US6259261B1 (en) | 1999-04-16 | 2001-07-10 | Sony Corporation | Method and apparatus for electrically testing semiconductor devices fabricated on a wafer |
US6486689B1 (en) | 1999-05-26 | 2002-11-26 | Nidec-Read Corporation | Printed circuit board testing apparatus and probe device for use in the same |
US6917525B2 (en) | 2001-11-27 | 2005-07-12 | Nanonexus, Inc. | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
JP2001004698A (en) | 1999-06-18 | 2001-01-12 | Mitsubishi Electric Corp | Socket for test, manufacture of its contact terminal, and electronic apparatus or semiconductor package |
US6218203B1 (en) | 1999-06-28 | 2001-04-17 | Advantest Corp. | Method of producing a contact structure |
JP2003506686A (en) | 1999-07-28 | 2003-02-18 | ナノネクサス インコーポレイテッド | Structure and manufacturing method of integrated circuit wafer probe card assembly |
JP4579361B2 (en) | 1999-09-24 | 2010-11-10 | 軍生 木本 | Contact assembly |
US6641430B2 (en) | 2000-02-14 | 2003-11-04 | Advantest Corp. | Contact structure and production method thereof and probe contact assembly using same |
US6676438B2 (en) | 2000-02-14 | 2004-01-13 | Advantest Corp. | Contact structure and production method thereof and probe contact assembly using same |
US6566898B2 (en) | 2000-03-06 | 2003-05-20 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
US6586955B2 (en) | 2000-03-13 | 2003-07-01 | Tessera, Inc. | Methods and structures for electronic probing arrays |
JP2001356134A (en) | 2000-04-13 | 2001-12-26 | Innotech Corp | Probe card device and probe used therefor |
US6529021B1 (en) | 2000-04-25 | 2003-03-04 | International Business Machines Corporation | Self-scrub buckling beam probe |
JP2001326046A (en) | 2000-05-17 | 2001-11-22 | Enplas Corp | Contact pin assembly |
JP2001338955A (en) | 2000-05-29 | 2001-12-07 | Texas Instr Japan Ltd | Semiconductor device and its manufacturing method |
US6424164B1 (en) | 2000-06-13 | 2002-07-23 | Kulicke & Soffa Investment, Inc. | Probe apparatus having removable beam probes |
US6420887B1 (en) | 2000-06-13 | 2002-07-16 | Kulicke & Soffa Investment, Inc. | Modulated space transformer for high density buckling beam probe and method for making the same |
IT1318734B1 (en) | 2000-08-04 | 2003-09-10 | Technoprobe S R L | VERTICAL PROBE MEASUREMENT HEAD. |
JP3486841B2 (en) | 2000-08-09 | 2004-01-13 | 日本電子材料株式会社 | Vertical probe card |
US6970005B2 (en) | 2000-08-24 | 2005-11-29 | Texas Instruments Incorporated | Multiple-chip probe and universal tester contact assemblage |
US6570396B1 (en) | 2000-11-24 | 2003-05-27 | Kulicke & Soffa Investment, Inc. | Interface structure for contacting probe beams |
JP2002162415A (en) | 2000-11-28 | 2002-06-07 | Japan Electronic Materials Corp | Probe for probe card |
US7064564B2 (en) | 2001-02-01 | 2006-06-20 | Antares Contech, Inc. | Bundled probe apparatus for multiple terminal contacting |
JP2002296297A (en) | 2001-03-29 | 2002-10-09 | Isao Kimoto | Contact assembly |
US6525552B2 (en) | 2001-05-11 | 2003-02-25 | Kulicke And Soffa Investments, Inc. | Modular probe apparatus |
US7108546B2 (en) | 2001-06-20 | 2006-09-19 | Formfactor, Inc. | High density planar electrical interface |
US6523255B2 (en) | 2001-06-21 | 2003-02-25 | International Business Machines Corporation | Process and structure to repair damaged probes mounted on a space transformer |
JP4496456B2 (en) | 2001-09-03 | 2010-07-07 | 軍生 木本 | Prober equipment |
US20030116346A1 (en) | 2001-12-21 | 2003-06-26 | Forster James Allam | Low cost area array probe for circuits having solder-ball contacts are manufactured using a wire bonding machine |
WO2003056346A1 (en) | 2001-12-25 | 2003-07-10 | Sumitomo Electric Industries, Ltd. | Contact probe |
US6727719B2 (en) | 2002-01-11 | 2004-04-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Piercer combined prober for CU interconnect water-level preliminary electrical test |
US7265565B2 (en) | 2003-02-04 | 2007-09-04 | Microfabrica Inc. | Cantilever microprobes for contacting electronic components and methods for making such probes |
US6911835B2 (en) | 2002-05-08 | 2005-06-28 | Formfactor, Inc. | High performance probe system |
US6965244B2 (en) | 2002-05-08 | 2005-11-15 | Formfactor, Inc. | High performance probe system |
US6707311B2 (en) | 2002-07-09 | 2004-03-16 | Advantest Corp. | Contact structure with flexible cable and probe contact assembly using same |
US6773938B2 (en) | 2002-08-29 | 2004-08-10 | Micron Technology, Inc. | Probe card, e.g., for testing microelectronic components, and methods for making same |
US6917102B2 (en) | 2002-10-10 | 2005-07-12 | Advantest Corp. | Contact structure and production method thereof and probe contact assembly using same |
US6765228B2 (en) | 2002-10-11 | 2004-07-20 | Taiwan Semiconductor Maunfacturing Co., Ltd. | Bonding pad with separate bonding and probing areas |
US20040119485A1 (en) | 2002-12-20 | 2004-06-24 | Koch Daniel J. | Probe finger structure and method for making a probe finger structure |
US7202682B2 (en) | 2002-12-20 | 2007-04-10 | Formfactor, Inc. | Composite motion probing |
US6945827B2 (en) | 2002-12-23 | 2005-09-20 | Formfactor, Inc. | Microelectronic contact structure |
US6897666B2 (en) | 2002-12-31 | 2005-05-24 | Intel Corporation | Embedded voltage regulator and active transient control device in probe head for improved power delivery and method |
KR100573089B1 (en) | 2003-03-17 | 2006-04-24 | 주식회사 파이컴 | Probe and manufacturing method thereof |
US6965245B2 (en) | 2003-05-01 | 2005-11-15 | K&S Interconnect, Inc. | Prefabricated and attached interconnect structure |
JP2004347565A (en) | 2003-05-26 | 2004-12-09 | Nec Electronics Corp | Inspection method for probe card and semiconductor device |
USD510043S1 (en) | 2003-06-11 | 2005-09-27 | K&S Interconnect, Inc. | Continuously profiled probe beam |
US6853205B1 (en) | 2003-07-17 | 2005-02-08 | Chipmos Technologies (Bermuda) Ltd. | Probe card assembly |
US6890185B1 (en) | 2003-11-03 | 2005-05-10 | Kulicke & Soffa Interconnect, Inc. | Multipath interconnect with meandering contact cantilevers |
USD525207S1 (en) | 2003-12-02 | 2006-07-18 | Antares Contech, Inc. | Sheet metal interconnect array |
US7071715B2 (en) | 2004-01-16 | 2006-07-04 | Formfactor, Inc. | Probe card configuration for low mechanical flexural strength electrical routing substrates |
US7059865B2 (en) | 2004-01-16 | 2006-06-13 | K & S Interconnect, Inc. | See-saw interconnect assembly with dielectric carrier grid providing spring suspension |
US7218127B2 (en) | 2004-02-18 | 2007-05-15 | Formfactor, Inc. | Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component |
JP2005241275A (en) | 2004-02-24 | 2005-09-08 | Japan Electronic Materials Corp | Probe card |
JP2005265720A (en) | 2004-03-19 | 2005-09-29 | Nec Corp | Electric contact structure, and forming method therefor, and element inspection method |
US7091729B2 (en) | 2004-07-09 | 2006-08-15 | Micro Probe | Cantilever probe with dual plane fixture and probe apparatus therewith |
US9097740B2 (en) | 2004-05-21 | 2015-08-04 | Formfactor, Inc. | Layered probes with core |
US8988091B2 (en) | 2004-05-21 | 2015-03-24 | Microprobe, Inc. | Multiple contact probes |
US7659739B2 (en) | 2006-09-14 | 2010-02-09 | Micro Porbe, Inc. | Knee probe having reduced thickness section for control of scrub motion |
US7046021B2 (en) | 2004-06-30 | 2006-05-16 | Microprobe | Double acting spring probe |
US6956389B1 (en) | 2004-08-16 | 2005-10-18 | Jem America Corporation | Highly resilient cantilever spring probe for testing ICs |
US7459795B2 (en) | 2004-08-19 | 2008-12-02 | Formfactor, Inc. | Method to build a wirebond probe card in a many at a time fashion |
US7279916B2 (en) | 2004-10-05 | 2007-10-09 | Nanoconduction, Inc. | Apparatus and test device for the application and measurement of prescribed, predicted and controlled contact pressure on wires |
US7088118B2 (en) | 2004-12-15 | 2006-08-08 | Chipmos Technologies (Bermuda) Ltd. | Modularized probe card for high frequency probing |
TWI271524B (en) | 2005-02-02 | 2007-01-21 | Mjc Probe Inc | Vertical probe card |
WO2006091454A1 (en) | 2005-02-24 | 2006-08-31 | Sv Probe Pte Ltd. | Probes for a wafer test apparatus |
US7126361B1 (en) | 2005-08-03 | 2006-10-24 | Qualitau, Inc. | Vertical probe card and air cooled probe head system |
US7345492B2 (en) | 2005-12-14 | 2008-03-18 | Microprobe, Inc. | Probe cards employing probes having retaining portions for potting in a retention arrangement |
US20070145989A1 (en) | 2005-12-27 | 2007-06-28 | Hua Zhu | Probe card with improved transient power delivery |
TWI284209B (en) | 2005-12-30 | 2007-07-21 | Ind Tech Res Inst | A method of fabricating vertical probe head |
JP2007273233A (en) | 2006-03-31 | 2007-10-18 | Fujitsu Ltd | Socket, circuit component with socket, and information processing device provided with circuit component |
US7150658B1 (en) | 2006-06-19 | 2006-12-19 | Excel Cell Electronic Co., Ltd. | Terminal for an electrical connector |
JP2008070146A (en) | 2006-09-12 | 2008-03-27 | Yokowo Co Ltd | Socket for inspection |
US7782072B2 (en) | 2006-09-27 | 2010-08-24 | Formfactor, Inc. | Single support structure probe group with staggered mounting pattern |
US8907689B2 (en) | 2006-10-11 | 2014-12-09 | Microprobe, Inc. | Probe retention arrangement |
US7786740B2 (en) | 2006-10-11 | 2010-08-31 | Astria Semiconductor Holdings, Inc. | Probe cards employing probes having retaining portions for potting in a potting region |
US7671610B2 (en) | 2007-10-19 | 2010-03-02 | Microprobe, Inc. | Vertical guided probe array providing sideways scrub motion |
US8723546B2 (en) | 2007-10-19 | 2014-05-13 | Microprobe, Inc. | Vertical guided layered probe |
TW201109669A (en) | 2009-09-07 | 2011-03-16 | Pleader Yamaichi Co Ltd | Cantilever probe structure capable of providing large current and the measurement of electrical voltage |
-
2010
- 2010-10-13 US US12/903,566 patent/USRE43503E1/en not_active Expired - Fee Related
-
2012
- 2012-07-10 US US13/545,571 patent/USRE46221E1/en active Active
Patent Citations (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2754203A (en) | 1953-05-22 | 1956-07-10 | Rem Cru Titanium Inc | Thermally stable beta alloys of titanium |
US4314855A (en) * | 1979-12-17 | 1982-02-09 | Bell Telephone Laboratories, Incorporated | Method of cleaning test probes |
US4973903A (en) | 1986-12-23 | 1990-11-27 | Texas Instruments Incorporated | Adjustable probe for probe assembly |
US4871964A (en) | 1988-04-12 | 1989-10-03 | G. G. B. Industries, Inc. | Integrated circuit probing apparatus |
US5468993A (en) | 1992-02-14 | 1995-11-21 | Rohm Co., Ltd. | Semiconductor device with polygonal shaped die pad |
US7061257B2 (en) | 1993-11-16 | 2006-06-13 | Formfactor, Inc. | Probe card assembly |
US5642056A (en) | 1993-12-22 | 1997-06-24 | Tokyo Electron Limited | Probe apparatus for correcting the probe card posture before testing |
US7036221B2 (en) | 1996-07-09 | 2006-05-02 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a semiconductor element-mounting board |
US7109731B2 (en) | 1996-08-08 | 2006-09-19 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US6414502B1 (en) | 1996-10-29 | 2002-07-02 | Agilent Technologies, Inc. | Loaded-board, guided-probe test fixture |
US7068057B2 (en) | 1997-06-10 | 2006-06-27 | Cascade Microtech, Inc. | Low-current pogo probe card |
US6359452B1 (en) | 1998-07-22 | 2002-03-19 | Nortel Networks Limited | Method and apparatus for testing an electronic assembly |
US6496026B1 (en) | 2000-02-25 | 2002-12-17 | Microconnect, Inc. | Method of manufacturing and testing an electronic device using a contact device having fingers and a mechanical ground |
US20020177782A1 (en) | 2000-10-16 | 2002-11-28 | Remon Medical Technologies, Ltd. | Barometric pressure correction based on remote sources of information |
US6538336B1 (en) | 2000-11-14 | 2003-03-25 | Rambus Inc. | Wirebond assembly for high-speed integrated circuits |
US7143500B2 (en) | 2001-06-25 | 2006-12-05 | Micron Technology, Inc. | Method to prevent damage to probe card |
US6891385B2 (en) | 2001-12-27 | 2005-05-10 | Formfactor, Inc. | Probe card cooling assembly with direct cooling of active electronic components |
US20030218244A1 (en) | 2002-03-18 | 2003-11-27 | Lahiri Syamal Kumar | Miniaturized contact spring |
US7015707B2 (en) * | 2002-03-20 | 2006-03-21 | Gabe Cherian | Micro probe |
US6768331B2 (en) | 2002-04-16 | 2004-07-27 | Teradyne, Inc. | Wafer-level contactor |
US20030218865A1 (en) | 2002-05-24 | 2003-11-27 | Macias Jose Javier | Semiconductor thermal management system |
US20060208752A1 (en) | 2003-04-15 | 2006-09-21 | Michinobu Tanioka | Inspection probe |
US20060261828A1 (en) | 2004-04-28 | 2006-11-23 | Cram Daniel P | Resilient contact probe apparatus |
US7733101B2 (en) | 2004-05-21 | 2010-06-08 | Microprobe, Inc. | Knee probe having increased scrub motion |
US7148709B2 (en) * | 2004-05-21 | 2006-12-12 | Microprobe, Inc. | Freely deflecting knee probe with controlled scrub motion |
US20120286816A1 (en) | 2004-05-21 | 2012-11-15 | Microprobe, Inc. | Probes with high current carrying capability and laser machining methods |
US20120313660A1 (en) | 2004-07-09 | 2012-12-13 | Microprobe, Inc. | Probes with offset arm and suspension structure |
US7667471B2 (en) | 2004-12-14 | 2010-02-23 | Advantest Corporation | Contact pin probe card and electronic device test apparatus using same |
US20060189867A1 (en) | 2005-02-22 | 2006-08-24 | Ian Revie | Probe |
US20060186905A1 (en) | 2005-02-22 | 2006-08-24 | Fujitsu Limited | Contactor for electronic parts and a contact method |
US8415963B2 (en) | 2005-12-07 | 2013-04-09 | Microprobe, Inc. | Low profile probe having improved mechanical scrub and reduced contact inductance |
USRE44407E1 (en) | 2006-03-20 | 2013-08-06 | Formfactor, Inc. | Space transformers employing wire bonds for interconnections with fine pitch contacts |
US7281305B1 (en) | 2006-03-31 | 2007-10-16 | Medtronic, Inc. | Method of attaching a capacitor to a feedthrough assembly of a medical device |
US20080001613A1 (en) * | 2006-06-29 | 2008-01-03 | January Kister | Probe skates for electrical testing of convex pad topologies |
US7436192B2 (en) * | 2006-06-29 | 2008-10-14 | Microprobe, Inc. | Probe skates for electrical testing of convex pad topologies |
USRE43503E1 (en) * | 2006-06-29 | 2012-07-10 | Microprobe, Inc. | Probe skates for electrical testing of convex pad topologies |
US7733103B2 (en) | 2006-09-29 | 2010-06-08 | Mico Tn Ltd. | Probe card |
US20130093450A1 (en) | 2007-04-10 | 2013-04-18 | Formfactor, Inc. | Vertical probe array arranged to provide space transformation |
US8299394B2 (en) | 2007-06-15 | 2012-10-30 | Sv Probe Pte Ltd. | Approach for assembling and repairing probe assemblies using laser welding |
US20090079455A1 (en) | 2007-09-26 | 2009-03-26 | Formfactor, Inc. | Reduced scrub contact element |
US20120313621A1 (en) | 2008-05-29 | 2012-12-13 | Microprobe, Inc. | Probe bonding method having improved control of bonding material |
US8230593B2 (en) | 2008-05-29 | 2012-07-31 | Microprobe, Inc. | Probe bonding method having improved control of bonding material |
US8310253B1 (en) | 2009-07-14 | 2012-11-13 | Xilinx, Inc. | Hybrid probe card |
US20120242363A1 (en) | 2011-03-21 | 2012-09-27 | Formfactor, Inc. | Non-Linear Vertical Leaf Spring |
US20130082729A1 (en) | 2011-09-30 | 2013-04-04 | Formfactor, Inc. | Probe With Cantilevered Beam Having Solid And Hollow Sections |
Non-Patent Citations (5)
Title |
---|
Bennett, Scott et al. "Precision Point Probe Card Analyzers: Probe Force," pp. 1-4, 2003. Applied Precision, www.appliedprecision.com. |
Broz, Jerry J. et al. "Controlling Contact Resistance," pp. 1-4, May 2004, EE-Evaluation Engineering, www.evaluationengineering.com. |
Dabrowiecki, Krzysztof R&D Group. "Advances in Conventional Cantilever Probe Card," pp. 1-28, Jun. 6-9, 1999. Southwest Test Workshop, San Diego, CA. |
Stalnaker, Scott et al. "SWTW2003: Controlling Contact Resistance with Probe Tip Shape & Cleaning Recipe Optimization," pp. 1-31, Jun. 1-4, 2003. Southwest Test Workshop, Long Beach, CA. |
Tunaboylu, Bahadir et al. "SWTW2003: Vertical Probe Development for Copper Bump Test Challenges," pp. 1-26, Jun. 2, 2003. Southwest Test Workshop, Long Beach CA. |
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