USD525207S1 - Sheet metal interconnect array - Google Patents

Sheet metal interconnect array Download PDF

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Publication number
USD525207S1
USD525207S1 US29/194,881 US19488103F USD525207S US D525207 S1 USD525207 S1 US D525207S1 US 19488103 F US19488103 F US 19488103F US D525207 S USD525207 S US D525207S
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United States
Prior art keywords
sheet metal
metal interconnect
interconnect array
array
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/194,881
Inventor
January Kister
James Jaquette
Steve Fahrner
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Interconnect Devices Inc
Original Assignee
Antares conTech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US29/194,881 priority Critical patent/USD525207S1/en
Application filed by Antares conTech Inc filed Critical Antares conTech Inc
Assigned to KULICKE & SOFFA INTERCONNECT, INC. reassignment KULICKE & SOFFA INTERCONNECT, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KISTER, JANUARY, FAHRNER, STEVE, JAQUETTE, JAMES
Assigned to K&S INTERCONNECT, INC. reassignment K&S INTERCONNECT, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME "KULICKE & SOFFA INTERCONNECT, INC." TO "K&S INTERCONNECT, INC." PREVIOUSLY RECORDED ON REEL 015124 FRAME 0112. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT BY JANUARY KISTER, JAMES JAQUETTE, AND STEVE FAHRNER TO K&S INTERCONNECT, INC.. Assignors: KISTER, JANUARY, FAHRNER, STEVE, JAQUETTE, JAMES
Assigned to ANTARES CONTECH,INC. reassignment ANTARES CONTECH,INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: K&S INTERCONNECT, INC.
Assigned to SILICON VALLEY BANK reassignment SILICON VALLEY BANK SECURITY AGREEMENT Assignors: ANTARES CONTECH INC
Application granted granted Critical
Publication of USD525207S1 publication Critical patent/USD525207S1/en
Assigned to SILICON VALLEY BANK reassignment SILICON VALLEY BANK SECURITY AGREEMENT Assignors: ANTARES ADVANCED TEST TECHNOLOGIES, INC.
Assigned to ANTARES ADVANCED TEST TECHNOLOGIES, INC. reassignment ANTARES ADVANCED TEST TECHNOLOGIES, INC. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: ANTARES CONTECH, INC.
Assigned to ANTARES CONTECH, INC. reassignment ANTARES CONTECH, INC. RELEASE Assignors: SILICON VALLEY BANK
Assigned to ANTARES ADVANCED TEST TECHNOLOGIES, INC. reassignment ANTARES ADVANCED TEST TECHNOLOGIES, INC. RELEASE Assignors: SILICON VALLEY BANK
Assigned to INTERCONNECT DEVICES, INC. reassignment INTERCONNECT DEVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IDI SEMI, LLC
Assigned to IDI SEMI, LLC reassignment IDI SEMI, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ANTARES ADVANCED TEST TECHNOLOGIES, INC.
Assigned to MADISON CAPITAL FUNDING, LLC, AS AGENT reassignment MADISON CAPITAL FUNDING, LLC, AS AGENT FIRST AMENDMENT TO PATENT SECURITY AGREEMENT Assignors: INTERCONNECT DEVICES, INC.
Assigned to INTERCONNECT DEVICES, INC. reassignment INTERCONNECT DEVICES, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: MADISON CAPITAL FUNDING LLC, AS AGENT
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top view of sheet metal interconnect array and fixed on an environmental carrier structure in exemplary number of four.
FIG. 2 is a bottom view thereof.
FIG. 3 is a front view thereof.
FIG. 4 is a side view thereof; and,
FIG. 5 is a perspective view thereof.
The broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.

Claims (1)

  1. The ornamental design for a sheet metal interconnect array, substantially as shown and described.
US29/194,881 2003-12-02 2003-12-02 Sheet metal interconnect array Expired - Lifetime USD525207S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/194,881 USD525207S1 (en) 2003-12-02 2003-12-02 Sheet metal interconnect array

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/194,881 USD525207S1 (en) 2003-12-02 2003-12-02 Sheet metal interconnect array

Publications (1)

Publication Number Publication Date
USD525207S1 true USD525207S1 (en) 2006-07-18

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US29/194,881 Expired - Lifetime USD525207S1 (en) 2003-12-02 2003-12-02 Sheet metal interconnect array

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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070152686A1 (en) * 2004-05-21 2007-07-05 January Kister Knee probe having increased scrub motion
US20080001612A1 (en) * 2004-05-21 2008-01-03 January Kister Probes with self-cleaning blunt skates for contacting conductive pads
US20080068035A1 (en) * 2006-09-14 2008-03-20 Microprobe, Inc. Knee probe having reduced thickness section for control of scrub motion
US20090102495A1 (en) * 2007-10-19 2009-04-23 January Kister Vertical guided probe array providing sideways scrub motion
US7786740B2 (en) 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US7944224B2 (en) 2005-12-07 2011-05-17 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7952377B2 (en) 2007-04-10 2011-05-31 Microprobe, Inc. Vertical probe array arranged to provide space transformation
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
USRE44407E1 (en) 2006-03-20 2013-08-06 Formfactor, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US20130220678A1 (en) * 2010-11-11 2013-08-29 Kitagawa Industries Co., Ltd. Conductive member and method for producing same
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US8784117B2 (en) * 2012-07-17 2014-07-22 Hon Hai Precision Industry Co., Ltd. Electrical connector with X-type dual spring contacts for lower profile and lattice shielding therewith
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
USD785853S1 (en) 2015-12-15 2017-05-02 Thomas M. DeBellis Concentric mounting plate for light fixtures
USD785854S1 (en) 2015-12-15 2017-05-02 Thomas M. DeBellis Concentric mounting plate for light fixtures
USD898985S1 (en) 2019-01-03 2020-10-13 Thomas M. DeBellis Rectilinear mounting plate for light fixtures
USD899673S1 (en) 2019-01-03 2020-10-20 Thomas M. DeBellis Rectilinear mounting plate for light fixtures

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US20080001612A1 (en) * 2004-05-21 2008-01-03 January Kister Probes with self-cleaning blunt skates for contacting conductive pads
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US8111080B2 (en) 2004-05-21 2012-02-07 Microprobe, Inc. Knee probe having reduced thickness section for control of scrub motion
US9316670B2 (en) 2004-05-21 2016-04-19 Formfactor, Inc. Multiple contact probes
US7733101B2 (en) 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
US7759949B2 (en) 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US20070152686A1 (en) * 2004-05-21 2007-07-05 January Kister Knee probe having increased scrub motion
US8203353B2 (en) 2004-07-09 2012-06-19 Microprobe, Inc. Probes with offset arm and suspension structure
US7944224B2 (en) 2005-12-07 2011-05-17 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US8415963B2 (en) 2005-12-07 2013-04-09 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
USRE44407E1 (en) 2006-03-20 2013-08-06 Formfactor, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US7659739B2 (en) 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
US20080068035A1 (en) * 2006-09-14 2008-03-20 Microprobe, Inc. Knee probe having reduced thickness section for control of scrub motion
US7786740B2 (en) 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US9310428B2 (en) 2006-10-11 2016-04-12 Formfactor, Inc. Probe retention arrangement
US9274143B2 (en) 2007-04-10 2016-03-01 Formfactor, Inc. Vertical probe array arranged to provide space transformation
US7952377B2 (en) 2007-04-10 2011-05-31 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US8324923B2 (en) 2007-04-10 2012-12-04 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US7671610B2 (en) 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US20090102495A1 (en) * 2007-10-19 2009-04-23 January Kister Vertical guided probe array providing sideways scrub motion
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
US20130220678A1 (en) * 2010-11-11 2013-08-29 Kitagawa Industries Co., Ltd. Conductive member and method for producing same
US9196395B2 (en) * 2010-11-11 2015-11-24 Kitagawa Industries Co., Ltd. Conductive member and method for producing same
US8784117B2 (en) * 2012-07-17 2014-07-22 Hon Hai Precision Industry Co., Ltd. Electrical connector with X-type dual spring contacts for lower profile and lattice shielding therewith
USD785853S1 (en) 2015-12-15 2017-05-02 Thomas M. DeBellis Concentric mounting plate for light fixtures
USD785854S1 (en) 2015-12-15 2017-05-02 Thomas M. DeBellis Concentric mounting plate for light fixtures
USD898985S1 (en) 2019-01-03 2020-10-13 Thomas M. DeBellis Rectilinear mounting plate for light fixtures
USD899673S1 (en) 2019-01-03 2020-10-20 Thomas M. DeBellis Rectilinear mounting plate for light fixtures

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