USD525207S1 - Sheet metal interconnect array - Google Patents

Sheet metal interconnect array Download PDF

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Publication number
USD525207S1
USD525207S1 US29/194,881 US19488103F USD525207S US D525207 S1 USD525207 S1 US D525207S1 US 19488103 F US19488103 F US 19488103F US D525207 S USD525207 S US D525207S
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United States
Prior art keywords
sheet metal
metal interconnect
interconnect array
array
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/194,881
Inventor
January Kister
James Jaquette
Steve Fahrner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interconnect Devices Inc
Original Assignee
Antares conTech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US29/194,881 priority Critical patent/USD525207S1/en
Application filed by Antares conTech Inc filed Critical Antares conTech Inc
Assigned to KULICKE & SOFFA INTERCONNECT, INC. reassignment KULICKE & SOFFA INTERCONNECT, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KISTER, JANUARY, FAHRNER, STEVE, JAQUETTE, JAMES
Assigned to K&S INTERCONNECT, INC. reassignment K&S INTERCONNECT, INC. CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME "KULICKE & SOFFA INTERCONNECT, INC." TO "K&S INTERCONNECT, INC." PREVIOUSLY RECORDED ON REEL 015124 FRAME 0112. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT BY JANUARY KISTER, JAMES JAQUETTE, AND STEVE FAHRNER TO K&S INTERCONNECT, INC.. Assignors: KISTER, JANUARY, FAHRNER, STEVE, JAQUETTE, JAMES
Assigned to ANTARES CONTECH,INC. reassignment ANTARES CONTECH,INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: K&S INTERCONNECT, INC.
Assigned to SILICON VALLEY BANK reassignment SILICON VALLEY BANK SECURITY AGREEMENT Assignors: ANTARES CONTECH INC
Application granted granted Critical
Publication of USD525207S1 publication Critical patent/USD525207S1/en
Assigned to SILICON VALLEY BANK reassignment SILICON VALLEY BANK SECURITY AGREEMENT Assignors: ANTARES ADVANCED TEST TECHNOLOGIES, INC.
Assigned to ANTARES ADVANCED TEST TECHNOLOGIES, INC. reassignment ANTARES ADVANCED TEST TECHNOLOGIES, INC. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: ANTARES CONTECH, INC.
Assigned to ANTARES ADVANCED TEST TECHNOLOGIES, INC. reassignment ANTARES ADVANCED TEST TECHNOLOGIES, INC. RELEASE Assignors: SILICON VALLEY BANK
Assigned to ANTARES CONTECH, INC. reassignment ANTARES CONTECH, INC. RELEASE Assignors: SILICON VALLEY BANK
Assigned to INTERCONNECT DEVICES, INC. reassignment INTERCONNECT DEVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IDI SEMI, LLC
Assigned to IDI SEMI, LLC reassignment IDI SEMI, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ANTARES ADVANCED TEST TECHNOLOGIES, INC.
Assigned to MADISON CAPITAL FUNDING, LLC, AS AGENT reassignment MADISON CAPITAL FUNDING, LLC, AS AGENT FIRST AMENDMENT TO PATENT SECURITY AGREEMENT Assignors: INTERCONNECT DEVICES, INC.
Assigned to INTERCONNECT DEVICES, INC. reassignment INTERCONNECT DEVICES, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: MADISON CAPITAL FUNDING LLC, AS AGENT
Application status is Active legal-status Critical
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top view of sheet metal interconnect array and fixed on an environmental carrier structure in exemplary number of four.

FIG. 2 is a bottom view thereof.

FIG. 3 is a front view thereof.

FIG. 4 is a side view thereof; and,

FIG. 5 is a perspective view thereof.

The broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.

Claims (1)

  1. The ornamental design for a sheet metal interconnect array, substantially as shown and described.
US29/194,881 2003-12-02 2003-12-02 Sheet metal interconnect array Active USD525207S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/194,881 USD525207S1 (en) 2003-12-02 2003-12-02 Sheet metal interconnect array

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/194,881 USD525207S1 (en) 2003-12-02 2003-12-02 Sheet metal interconnect array

Publications (1)

Publication Number Publication Date
USD525207S1 true USD525207S1 (en) 2006-07-18

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US29/194,881 Active USD525207S1 (en) 2003-12-02 2003-12-02 Sheet metal interconnect array

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Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070152686A1 (en) * 2004-05-21 2007-07-05 January Kister Knee probe having increased scrub motion
US20080001612A1 (en) * 2004-05-21 2008-01-03 January Kister Probes with self-cleaning blunt skates for contacting conductive pads
US20080068035A1 (en) * 2006-09-14 2008-03-20 Microprobe, Inc. Knee probe having reduced thickness section for control of scrub motion
US20090102495A1 (en) * 2007-10-19 2009-04-23 January Kister Vertical guided probe array providing sideways scrub motion
US7786740B2 (en) 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US7944224B2 (en) 2005-12-07 2011-05-17 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7952377B2 (en) 2007-04-10 2011-05-31 Microprobe, Inc. Vertical probe array arranged to provide space transformation
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
USRE44407E1 (en) 2006-03-20 2013-08-06 Formfactor, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US20130220678A1 (en) * 2010-11-11 2013-08-29 Kitagawa Industries Co., Ltd. Conductive member and method for producing same
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US8784117B2 (en) * 2012-07-17 2014-07-22 Hon Hai Precision Industry Co., Ltd. Electrical connector with X-type dual spring contacts for lower profile and lattice shielding therewith
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
USD785853S1 (en) 2015-12-15 2017-05-02 Thomas M. DeBellis Concentric mounting plate for light fixtures
USD785854S1 (en) 2015-12-15 2017-05-02 Thomas M. DeBellis Concentric mounting plate for light fixtures

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US20080001612A1 (en) * 2004-05-21 2008-01-03 January Kister Probes with self-cleaning blunt skates for contacting conductive pads
US8111080B2 (en) 2004-05-21 2012-02-07 Microprobe, Inc. Knee probe having reduced thickness section for control of scrub motion
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US9316670B2 (en) 2004-05-21 2016-04-19 Formfactor, Inc. Multiple contact probes
US7733101B2 (en) 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
US7759949B2 (en) 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US20070152686A1 (en) * 2004-05-21 2007-07-05 January Kister Knee probe having increased scrub motion
US8203353B2 (en) 2004-07-09 2012-06-19 Microprobe, Inc. Probes with offset arm and suspension structure
US7944224B2 (en) 2005-12-07 2011-05-17 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US8415963B2 (en) 2005-12-07 2013-04-09 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
USRE44407E1 (en) 2006-03-20 2013-08-06 Formfactor, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US7659739B2 (en) 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
US20080068035A1 (en) * 2006-09-14 2008-03-20 Microprobe, Inc. Knee probe having reduced thickness section for control of scrub motion
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US9310428B2 (en) 2006-10-11 2016-04-12 Formfactor, Inc. Probe retention arrangement
US7786740B2 (en) 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US9274143B2 (en) 2007-04-10 2016-03-01 Formfactor, Inc. Vertical probe array arranged to provide space transformation
US7952377B2 (en) 2007-04-10 2011-05-31 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US8324923B2 (en) 2007-04-10 2012-12-04 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US20090102495A1 (en) * 2007-10-19 2009-04-23 January Kister Vertical guided probe array providing sideways scrub motion
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US7671610B2 (en) 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
US9196395B2 (en) * 2010-11-11 2015-11-24 Kitagawa Industries Co., Ltd. Conductive member and method for producing same
US20130220678A1 (en) * 2010-11-11 2013-08-29 Kitagawa Industries Co., Ltd. Conductive member and method for producing same
US8784117B2 (en) * 2012-07-17 2014-07-22 Hon Hai Precision Industry Co., Ltd. Electrical connector with X-type dual spring contacts for lower profile and lattice shielding therewith
USD785853S1 (en) 2015-12-15 2017-05-02 Thomas M. DeBellis Concentric mounting plate for light fixtures
USD785854S1 (en) 2015-12-15 2017-05-02 Thomas M. DeBellis Concentric mounting plate for light fixtures

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