USD994624S1 - Power semiconductor module - Google Patents
Power semiconductor module Download PDFInfo
- Publication number
- USD994624S1 USD994624S1 US29/808,484 US202129808484F USD994624S US D994624 S1 USD994624 S1 US D994624S1 US 202129808484 F US202129808484 F US 202129808484F US D994624 S USD994624 S US D994624S
- Authority
- US
- United States
- Prior art keywords
- power semiconductor
- semiconductor module
- view
- module
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021006002F JP1696315S (ja) | 2021-03-23 | 2021-03-23 | 電力用半導体素子 |
JP2021-006002D | 2021-03-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD994624S1 true USD994624S1 (en) | 2023-08-08 |
Family
ID=83402304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/808,484 Active USD994624S1 (en) | 2021-03-23 | 2021-09-20 | Power semiconductor module |
Country Status (2)
Country | Link |
---|---|
US (1) | USD994624S1 (ja) |
JP (1) | JP1696315S (ja) |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3352726A (en) * | 1964-04-13 | 1967-11-14 | Philco Ford Corp | Method of fabricating planar semiconductor devices |
US20080197471A1 (en) * | 2007-02-16 | 2008-08-21 | Matsushita Electric Industrial Co., Ltd. | Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method |
USD642996S1 (en) * | 2010-04-09 | 2011-08-09 | Panasonic Electric Works Co., Ltd. | Electroluminescence apparatus |
USD664506S1 (en) * | 2011-02-04 | 2012-07-31 | Panasonic Corporation | Electroluminescence module |
USD692843S1 (en) * | 2012-05-02 | 2013-11-05 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD701843S1 (en) * | 2010-12-28 | 2014-04-01 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
US10262928B2 (en) * | 2017-03-23 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
US20190115465A1 (en) * | 2017-10-12 | 2019-04-18 | Hitachi, Ltd. | Silicon carbide semiconductor device, power module, and power conversion device |
JP1664282S (ja) | 2019-07-24 | 2020-07-27 | ||
US20210296226A1 (en) * | 2017-03-08 | 2021-09-23 | Mitsubishi Electric Corporation | Semiconductor device, method for manufacturing the same, and semiconductor module |
US11522058B2 (en) * | 2020-09-11 | 2022-12-06 | Kabushiki Kaisha Toshiba | Semiconductor device with field plate electrode |
US11538936B2 (en) * | 2020-03-04 | 2022-12-27 | Rohm Co., Ltd. | Semiconductor device |
-
2021
- 2021-03-23 JP JP2021006002F patent/JP1696315S/ja active Active
- 2021-09-20 US US29/808,484 patent/USD994624S1/en active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3352726A (en) * | 1964-04-13 | 1967-11-14 | Philco Ford Corp | Method of fabricating planar semiconductor devices |
US20080197471A1 (en) * | 2007-02-16 | 2008-08-21 | Matsushita Electric Industrial Co., Ltd. | Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method |
USD642996S1 (en) * | 2010-04-09 | 2011-08-09 | Panasonic Electric Works Co., Ltd. | Electroluminescence apparatus |
USD701843S1 (en) * | 2010-12-28 | 2014-04-01 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD664506S1 (en) * | 2011-02-04 | 2012-07-31 | Panasonic Corporation | Electroluminescence module |
USD692843S1 (en) * | 2012-05-02 | 2013-11-05 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
US20210296226A1 (en) * | 2017-03-08 | 2021-09-23 | Mitsubishi Electric Corporation | Semiconductor device, method for manufacturing the same, and semiconductor module |
US10262928B2 (en) * | 2017-03-23 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
US20190115465A1 (en) * | 2017-10-12 | 2019-04-18 | Hitachi, Ltd. | Silicon carbide semiconductor device, power module, and power conversion device |
JP1664282S (ja) | 2019-07-24 | 2020-07-27 | ||
USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
US11538936B2 (en) * | 2020-03-04 | 2022-12-27 | Rohm Co., Ltd. | Semiconductor device |
US11522058B2 (en) * | 2020-09-11 | 2022-12-06 | Kabushiki Kaisha Toshiba | Semiconductor device with field plate electrode |
Also Published As
Publication number | Publication date |
---|---|
JP1696315S (ja) | 2021-10-04 |
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Legal Events
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |