USD994624S1 - Power semiconductor module - Google Patents

Power semiconductor module Download PDF

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Publication number
USD994624S1
USD994624S1 US29/808,484 US202129808484F USD994624S US D994624 S1 USD994624 S1 US D994624S1 US 202129808484 F US202129808484 F US 202129808484F US D994624 S USD994624 S US D994624S
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United States
Prior art keywords
power semiconductor
semiconductor module
view
module
ornamental design
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Active
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US29/808,484
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English (en)
Inventor
Yuki Nakano
Kenji Yamamoto
Yasunori Kutsuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
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Rohm Co Ltd
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KUTSUMA, Yasunori, NAKANO, YUKI, YAMAMOTO, KENJI
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US29/808,484 2021-03-23 2021-09-20 Power semiconductor module Active USD994624S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021006002F JP1696315S (ja) 2021-03-23 2021-03-23 電力用半導体素子
JP2021-006002D 2021-03-23

Publications (1)

Publication Number Publication Date
USD994624S1 true USD994624S1 (en) 2023-08-08

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US29/808,484 Active USD994624S1 (en) 2021-03-23 2021-09-20 Power semiconductor module

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JP (1) JP1696315S (ja)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3352726A (en) * 1964-04-13 1967-11-14 Philco Ford Corp Method of fabricating planar semiconductor devices
US20080197471A1 (en) * 2007-02-16 2008-08-21 Matsushita Electric Industrial Co., Ltd. Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method
USD642996S1 (en) * 2010-04-09 2011-08-09 Panasonic Electric Works Co., Ltd. Electroluminescence apparatus
USD664506S1 (en) * 2011-02-04 2012-07-31 Panasonic Corporation Electroluminescence module
USD692843S1 (en) * 2012-05-02 2013-11-05 Sumitomo Electric Industries, Ltd. Semiconductor device
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
US10262928B2 (en) * 2017-03-23 2019-04-16 Rohm Co., Ltd. Semiconductor device
US20190115465A1 (en) * 2017-10-12 2019-04-18 Hitachi, Ltd. Silicon carbide semiconductor device, power module, and power conversion device
JP1664282S (ja) 2019-07-24 2020-07-27
US20210296226A1 (en) * 2017-03-08 2021-09-23 Mitsubishi Electric Corporation Semiconductor device, method for manufacturing the same, and semiconductor module
US11522058B2 (en) * 2020-09-11 2022-12-06 Kabushiki Kaisha Toshiba Semiconductor device with field plate electrode
US11538936B2 (en) * 2020-03-04 2022-12-27 Rohm Co., Ltd. Semiconductor device

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3352726A (en) * 1964-04-13 1967-11-14 Philco Ford Corp Method of fabricating planar semiconductor devices
US20080197471A1 (en) * 2007-02-16 2008-08-21 Matsushita Electric Industrial Co., Ltd. Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method
USD642996S1 (en) * 2010-04-09 2011-08-09 Panasonic Electric Works Co., Ltd. Electroluminescence apparatus
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
USD664506S1 (en) * 2011-02-04 2012-07-31 Panasonic Corporation Electroluminescence module
USD692843S1 (en) * 2012-05-02 2013-11-05 Sumitomo Electric Industries, Ltd. Semiconductor device
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
US20210296226A1 (en) * 2017-03-08 2021-09-23 Mitsubishi Electric Corporation Semiconductor device, method for manufacturing the same, and semiconductor module
US10262928B2 (en) * 2017-03-23 2019-04-16 Rohm Co., Ltd. Semiconductor device
US20190115465A1 (en) * 2017-10-12 2019-04-18 Hitachi, Ltd. Silicon carbide semiconductor device, power module, and power conversion device
JP1664282S (ja) 2019-07-24 2020-07-27
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
US11538936B2 (en) * 2020-03-04 2022-12-27 Rohm Co., Ltd. Semiconductor device
US11522058B2 (en) * 2020-09-11 2022-12-06 Kabushiki Kaisha Toshiba Semiconductor device with field plate electrode

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