USD930796S1 - Liquid discharge nozzle for semiconductor substrate processing apparatus - Google Patents

Liquid discharge nozzle for semiconductor substrate processing apparatus Download PDF

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Publication number
USD930796S1
USD930796S1 US29/744,996 US202029744996F USD930796S US D930796 S1 USD930796 S1 US D930796S1 US 202029744996 F US202029744996 F US 202029744996F US D930796 S USD930796 S US D930796S
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United States
Prior art keywords
processing apparatus
semiconductor substrate
substrate processing
liquid discharge
discharge nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/744,996
Inventor
Yoshifumi Amano
Kazuhiro Aiura
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
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Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AIURA, KAZUHIRO, AMANO, YOSHIFUMI
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Description

FIG. 1 is a front, top perspective view of a liquid discharge nozzle for semiconductor substrate processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left-side elevational view thereof;
FIG. 5 is a right-side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a liquid discharge nozzle for semiconductor substrate processing apparatus, as shown and described.
US29/744,996 2020-06-08 2020-08-03 Liquid discharge nozzle for semiconductor substrate processing apparatus Active USD930796S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-011295 2020-06-08
JP2020011295F JP1683121S (en) 2020-06-08 2020-06-08 Nozzle for liquid ejection

Publications (1)

Publication Number Publication Date
USD930796S1 true USD930796S1 (en) 2021-09-14

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ID=75378233

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US29/744,996 Active USD930796S1 (en) 2020-06-08 2020-08-03 Liquid discharge nozzle for semiconductor substrate processing apparatus

Country Status (3)

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US (1) USD930796S1 (en)
JP (1) JP1683121S (en)
TW (1) TWD215672S (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD341418S (en) * 1991-02-22 1993-11-16 Tokyo Electron Limited Supply nozzle for applying liquid resist to a semiconductor wafer
USD636845S1 (en) * 2010-01-27 2011-04-26 Sintokogio, Ltd. Nozzle for an air blast process
USD637267S1 (en) * 2010-01-27 2011-05-03 Sintokogio, Ltd. Nozzle for an air blast process
USD823906S1 (en) * 2017-04-13 2018-07-24 Oerlikon Metco (Us) Inc. Powder injector
USD824966S1 (en) * 2016-10-14 2018-08-07 Oerlikon Metco (Us) Inc. Powder injector
USD903836S1 (en) * 2019-05-29 2020-12-01 Carefusion 303, Inc. Y-spigot body
USD906485S1 (en) * 2017-09-27 2020-12-29 Natural Gas Solutions North America, Llc Shaft seal
USD907744S1 (en) * 2018-08-01 2021-01-12 Lutz Pumpen Gmbh Dispenser nozzle

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD469790S1 (en) 2001-05-18 2003-02-04 Oy Trial Ab Nozzle
JP5638768B2 (en) 2009-04-24 2014-12-10 武蔵エンジニアリング株式会社 Nozzle rotation mechanism and coating apparatus having the same
USD774908S1 (en) 2014-04-10 2016-12-27 3M Innovative Properties Company Nozzle for syringe
USD771248S1 (en) 2014-10-01 2016-11-08 Adhezion Biomedical, Llc Dispensing applicator having a curved elongated nozzle
USD783784S1 (en) 2015-01-30 2017-04-11 Criser, S.A. De C.V. Nozzle for a drain hose

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD341418S (en) * 1991-02-22 1993-11-16 Tokyo Electron Limited Supply nozzle for applying liquid resist to a semiconductor wafer
USD636845S1 (en) * 2010-01-27 2011-04-26 Sintokogio, Ltd. Nozzle for an air blast process
USD637267S1 (en) * 2010-01-27 2011-05-03 Sintokogio, Ltd. Nozzle for an air blast process
USD824966S1 (en) * 2016-10-14 2018-08-07 Oerlikon Metco (Us) Inc. Powder injector
USD823906S1 (en) * 2017-04-13 2018-07-24 Oerlikon Metco (Us) Inc. Powder injector
USD906485S1 (en) * 2017-09-27 2020-12-29 Natural Gas Solutions North America, Llc Shaft seal
USD907744S1 (en) * 2018-08-01 2021-01-12 Lutz Pumpen Gmbh Dispenser nozzle
USD903836S1 (en) * 2019-05-29 2020-12-01 Carefusion 303, Inc. Y-spigot body

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Liquid Paste Filling Machine Filling Nozzle Head, Dec. 10, 2020, Amazon.com, May 5, 2021.URL: https://www.amazon.com/WINUS-Filling-Nozzle-1000ml-Machine/dp/B08G8KPF43 (Year: 2020). *

Also Published As

Publication number Publication date
TWD215672S (en) 2021-12-01
JP1683121S (en) 2021-04-12

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