USD877079S1 - Electrode plate for plasma processing apparatus - Google Patents
Electrode plate for plasma processing apparatus Download PDFInfo
- Publication number
- USD877079S1 USD877079S1 US29/554,794 US201629554794F USD877079S US D877079 S1 USD877079 S1 US D877079S1 US 201629554794 F US201629554794 F US 201629554794F US D877079 S USD877079 S US D877079S
- Authority
- US
- United States
- Prior art keywords
- processing apparatus
- electrode plate
- plasma processing
- view
- taken
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2015-18692F JP1545606S (ja) | 2015-08-26 | 2015-08-26 | |
JP2015-018692 | 2015-08-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD877079S1 true USD877079S1 (en) | 2020-03-03 |
Family
ID=55484389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/554,794 Active USD877079S1 (en) | 2015-08-26 | 2016-02-16 | Electrode plate for plasma processing apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | USD877079S1 (ja) |
JP (1) | JP1545606S (ja) |
TW (1) | TWD178422S (ja) |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD411516S (en) * | 1996-03-15 | 1999-06-29 | Tokyo Electron Limited | Gas diffusion plate for electrode of semiconductor wafer processing apparatus |
USD460350S1 (en) * | 2001-03-22 | 2002-07-16 | Alan Davis | Compressed fabric article package having a wedge shape |
US6537419B1 (en) * | 2000-04-26 | 2003-03-25 | David W. Kinnard | Gas distribution plate assembly for providing laminar gas flow across the surface of a substrate |
US6793733B2 (en) * | 2002-01-25 | 2004-09-21 | Applied Materials Inc. | Gas distribution showerhead |
US6872258B2 (en) * | 2001-07-16 | 2005-03-29 | Samsung Electronics Co., Ltd. | Shower head of a wafer treatment apparatus having a gap controller |
USD570310S1 (en) * | 2006-08-01 | 2008-06-03 | Tokyo Electron Limited | Attracting plate of an electrostatic chuck for semiconductor manufacturing |
USD609652S1 (en) * | 2008-07-22 | 2010-02-09 | Tokyo Electron Limited | Wafer attracting plate |
US8221582B2 (en) * | 2008-07-07 | 2012-07-17 | Lam Research Corporation | Clamped monolithic showerhead electrode |
US8702866B2 (en) * | 2006-12-18 | 2014-04-22 | Lam Research Corporation | Showerhead electrode assembly with gas flow modification for extended electrode life |
US9484190B2 (en) * | 2014-01-25 | 2016-11-01 | Yuri Glukhoy | Showerhead-cooler system of a semiconductor-processing chamber for semiconductor wafers of large area |
USD787458S1 (en) * | 2015-11-18 | 2017-05-23 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
USD789888S1 (en) * | 2016-01-08 | 2017-06-20 | Asm Ip Holding B.V. | Electrode plate for semiconductor manufacturing apparatus |
USD790041S1 (en) * | 2016-01-08 | 2017-06-20 | Asm Ip Holding B.V. | Gas dispersing plate for semiconductor manufacturing apparatus |
USD793572S1 (en) * | 2015-06-10 | 2017-08-01 | Tokyo Electron Limited | Electrode plate for plasma processing apparatus |
-
2015
- 2015-08-26 JP JPD2015-18692F patent/JP1545606S/ja active Active
-
2016
- 2016-02-16 US US29/554,794 patent/USD877079S1/en active Active
- 2016-02-23 TW TW105300839F patent/TWD178422S/zh unknown
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD411516S (en) * | 1996-03-15 | 1999-06-29 | Tokyo Electron Limited | Gas diffusion plate for electrode of semiconductor wafer processing apparatus |
US6537419B1 (en) * | 2000-04-26 | 2003-03-25 | David W. Kinnard | Gas distribution plate assembly for providing laminar gas flow across the surface of a substrate |
USD460350S1 (en) * | 2001-03-22 | 2002-07-16 | Alan Davis | Compressed fabric article package having a wedge shape |
US6872258B2 (en) * | 2001-07-16 | 2005-03-29 | Samsung Electronics Co., Ltd. | Shower head of a wafer treatment apparatus having a gap controller |
US6793733B2 (en) * | 2002-01-25 | 2004-09-21 | Applied Materials Inc. | Gas distribution showerhead |
USD570310S1 (en) * | 2006-08-01 | 2008-06-03 | Tokyo Electron Limited | Attracting plate of an electrostatic chuck for semiconductor manufacturing |
US8702866B2 (en) * | 2006-12-18 | 2014-04-22 | Lam Research Corporation | Showerhead electrode assembly with gas flow modification for extended electrode life |
US8221582B2 (en) * | 2008-07-07 | 2012-07-17 | Lam Research Corporation | Clamped monolithic showerhead electrode |
USD609652S1 (en) * | 2008-07-22 | 2010-02-09 | Tokyo Electron Limited | Wafer attracting plate |
US9484190B2 (en) * | 2014-01-25 | 2016-11-01 | Yuri Glukhoy | Showerhead-cooler system of a semiconductor-processing chamber for semiconductor wafers of large area |
USD793572S1 (en) * | 2015-06-10 | 2017-08-01 | Tokyo Electron Limited | Electrode plate for plasma processing apparatus |
USD787458S1 (en) * | 2015-11-18 | 2017-05-23 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
USD789888S1 (en) * | 2016-01-08 | 2017-06-20 | Asm Ip Holding B.V. | Electrode plate for semiconductor manufacturing apparatus |
USD790041S1 (en) * | 2016-01-08 | 2017-06-20 | Asm Ip Holding B.V. | Gas dispersing plate for semiconductor manufacturing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP1545606S (ja) | 2016-03-14 |
TWD178422S (zh) | 2016-09-21 |
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