USD874413S1 - Fixture for delivering 1752 solder columns onto a substrate - Google Patents

Fixture for delivering 1752 solder columns onto a substrate Download PDF

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Publication number
USD874413S1
USD874413S1 US29/668,830 US201829668830F USD874413S US D874413 S1 USD874413 S1 US D874413S1 US 201829668830 F US201829668830 F US 201829668830F US D874413 S USD874413 S US D874413S
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United States
Prior art keywords
delivering
fixture
substrate
solder columns
columns onto
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/668,830
Inventor
Martin B. Hart
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Topline Corp
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Topline Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to US29/668,830 priority Critical patent/USD874413S1/en
Assigned to TOPLINE CORPORATION reassignment TOPLINE CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HART, MARTIN B.
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Publication of USD874413S1 publication Critical patent/USD874413S1/en
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Description

FIG. 1 is a top perspective view of a fixture for delivering 1752 solder columns onto a substrate, showing my new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a front side view thereof;
FIG. 8 is a rear side view thereof;
FIG. 9 is a top exploded perspective view thereof;
FIG. 10 is a bottom exploded perspective view thereof; and,
FIG. 11 is a bottom view of the top plate of the fixture for delivering 1752 solder columns onto a substrate, shown separately for ease of illustration.
The broken lines shown in the drawings represent portions of the fixture for delivering 1752 solder columns onto a substrate that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a fixture for delivering 1752 solder columns onto a substrate, as shown and described.
US29/668,830 2018-11-02 2018-11-02 Fixture for delivering 1752 solder columns onto a substrate Active USD874413S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/668,830 USD874413S1 (en) 2018-11-02 2018-11-02 Fixture for delivering 1752 solder columns onto a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/668,830 USD874413S1 (en) 2018-11-02 2018-11-02 Fixture for delivering 1752 solder columns onto a substrate

Publications (1)

Publication Number Publication Date
USD874413S1 true USD874413S1 (en) 2020-02-04

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US29/668,830 Active USD874413S1 (en) 2018-11-02 2018-11-02 Fixture for delivering 1752 solder columns onto a substrate

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US (1) USD874413S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD908648S1 (en) 2019-12-12 2021-01-26 Topline Corporation Adjustable fixture for aligning column grid array substrates
USD930912S1 (en) * 2017-12-22 2021-09-14 Ningbo Geostar Photoelectric Technology Co., Ltd. Welding filter
USD935424S1 (en) * 2019-05-06 2021-11-09 Lam Research Corporation Semiconductor wafer processing tool
USD1003889S1 (en) * 2019-12-24 2023-11-07 Hangzhou Chipjet Technology Co., Ltd. Data processing chip
USD1034490S1 (en) * 2022-05-09 2024-07-09 Shenzhen Deruisi Electronic Technology Co., Ltd. Bracket for heat sink of CPU

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4712721A (en) * 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
US4842184A (en) * 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US5029748A (en) * 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
US5040717A (en) * 1990-03-27 1991-08-20 Metcal, Inc. Solder delivery system
US5497938A (en) * 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
US5626278A (en) * 1994-04-15 1997-05-06 Tang; Ching C. Solder delivery and array apparatus
US5695109A (en) * 1995-11-22 1997-12-09 Industrial Technology Research Institute Solder paste inter-layer alignment apparatus for area-array on-board rework
USD421968S (en) * 1998-04-21 2000-03-28 Advantest Corporation Contactor for semiconductor IC testers
USD426522S (en) * 1998-04-21 2000-06-13 Advantest Corporation Contactor for semiconductor IC testers
US6276596B1 (en) * 2000-08-28 2001-08-21 International Business Machines Corporation Low temperature solder column attach by injection molded solder and structure formed
US6296173B2 (en) * 1996-07-17 2001-10-02 International Business Machines Corporation Method and apparatus for soldering ball grid array modules to substrates
USD503691S1 (en) * 2001-03-28 2005-04-05 International Rectifier Corporation Conductive clip for a semiconductor package
US6955285B2 (en) * 2002-12-17 2005-10-18 Senju Metal Industry Co., Ltd. Apparatus for aligning and dispensing solder columns in an array
US8277255B2 (en) * 2010-12-10 2012-10-02 Tyco Electronics Corporation Interconnect member for an electronic module with embedded components
US9108262B1 (en) 2014-04-17 2015-08-18 Topline Corporation Disposable apparatus for aligning and dispensing solder columns in an array
US9629259B1 (en) 2016-08-16 2017-04-18 Topline Corporation Refillable apparatus for aligning and depositing solder columns in a column grid array
USD808350S1 (en) 2017-03-06 2018-01-23 Topline Corporation Fixture for delivering interconnect members onto a substrate

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4712721A (en) * 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
US5029748A (en) * 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
US4842184A (en) * 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US5040717A (en) * 1990-03-27 1991-08-20 Metcal, Inc. Solder delivery system
US5626278A (en) * 1994-04-15 1997-05-06 Tang; Ching C. Solder delivery and array apparatus
US5497938A (en) * 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
US5695109A (en) * 1995-11-22 1997-12-09 Industrial Technology Research Institute Solder paste inter-layer alignment apparatus for area-array on-board rework
US6296173B2 (en) * 1996-07-17 2001-10-02 International Business Machines Corporation Method and apparatus for soldering ball grid array modules to substrates
USD426522S (en) * 1998-04-21 2000-06-13 Advantest Corporation Contactor for semiconductor IC testers
USD432504S (en) * 1998-04-21 2000-10-24 Advantest Corporation Contactor for semiconductor IC testers
USD421968S (en) * 1998-04-21 2000-03-28 Advantest Corporation Contactor for semiconductor IC testers
US6276596B1 (en) * 2000-08-28 2001-08-21 International Business Machines Corporation Low temperature solder column attach by injection molded solder and structure formed
USD503691S1 (en) * 2001-03-28 2005-04-05 International Rectifier Corporation Conductive clip for a semiconductor package
US6955285B2 (en) * 2002-12-17 2005-10-18 Senju Metal Industry Co., Ltd. Apparatus for aligning and dispensing solder columns in an array
US8277255B2 (en) * 2010-12-10 2012-10-02 Tyco Electronics Corporation Interconnect member for an electronic module with embedded components
US9108262B1 (en) 2014-04-17 2015-08-18 Topline Corporation Disposable apparatus for aligning and dispensing solder columns in an array
US9629259B1 (en) 2016-08-16 2017-04-18 Topline Corporation Refillable apparatus for aligning and depositing solder columns in a column grid array
USD808350S1 (en) 2017-03-06 2018-01-23 Topline Corporation Fixture for delivering interconnect members onto a substrate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD930912S1 (en) * 2017-12-22 2021-09-14 Ningbo Geostar Photoelectric Technology Co., Ltd. Welding filter
USD935424S1 (en) * 2019-05-06 2021-11-09 Lam Research Corporation Semiconductor wafer processing tool
USD908648S1 (en) 2019-12-12 2021-01-26 Topline Corporation Adjustable fixture for aligning column grid array substrates
USD1003889S1 (en) * 2019-12-24 2023-11-07 Hangzhou Chipjet Technology Co., Ltd. Data processing chip
USD1034490S1 (en) * 2022-05-09 2024-07-09 Shenzhen Deruisi Electronic Technology Co., Ltd. Bracket for heat sink of CPU

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