USD874413S1 - Fixture for delivering 1752 solder columns onto a substrate - Google Patents
Fixture for delivering 1752 solder columns onto a substrate Download PDFInfo
- Publication number
- USD874413S1 USD874413S1 US29/668,830 US201829668830F USD874413S US D874413 S1 USD874413 S1 US D874413S1 US 201829668830 F US201829668830 F US 201829668830F US D874413 S USD874413 S US D874413S
- Authority
- US
- United States
- Prior art keywords
- delivering
- fixture
- substrate
- solder columns
- columns onto
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solders Inorganic materials 0.000 title claims description 5
- 239000000758 substrates Substances 0.000 title claims description 5
Images
Description
The broken lines shown in the drawings represent portions of the fixture for delivering 1752 solder columns onto a substrate that form no part of the claimed design.
Claims (1)
- The ornamental design for a fixture for delivering 1752 solder columns onto a substrate, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/668,830 USD874413S1 (en) | 2018-11-02 | 2018-11-02 | Fixture for delivering 1752 solder columns onto a substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/668,830 USD874413S1 (en) | 2018-11-02 | 2018-11-02 | Fixture for delivering 1752 solder columns onto a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
USD874413S1 true USD874413S1 (en) | 2020-02-04 |
Family
ID=69188178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/668,830 Active USD874413S1 (en) | 2018-11-02 | 2018-11-02 | Fixture for delivering 1752 solder columns onto a substrate |
Country Status (1)
Country | Link |
---|---|
US (1) | USD874413S1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD908648S1 (en) | 2019-12-12 | 2021-01-26 | Topline Corporation | Adjustable fixture for aligning column grid array substrates |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4705205A (en) * | 1983-06-30 | 1987-11-10 | Raychem Corporation | Chip carrier mounting device |
US4712721A (en) * | 1986-03-17 | 1987-12-15 | Raychem Corp. | Solder delivery systems |
US4842184A (en) * | 1988-06-23 | 1989-06-27 | Ltv Aerospace & Defense Company | Method and apparatus for applying solder preforms |
US5029748A (en) * | 1987-07-10 | 1991-07-09 | Amp Incorporated | Solder preforms in a cast array |
US5040717A (en) * | 1990-03-27 | 1991-08-20 | Metcal, Inc. | Solder delivery system |
US5497938A (en) * | 1994-09-01 | 1996-03-12 | Intel Corporation | Tape with solder forms and methods for transferring solder to chip assemblies |
US5626278A (en) * | 1994-04-15 | 1997-05-06 | Tang; Ching C. | Solder delivery and array apparatus |
US5695109A (en) * | 1995-11-22 | 1997-12-09 | Industrial Technology Research Institute | Solder paste inter-layer alignment apparatus for area-array on-board rework |
USD421968S (en) * | 1998-04-21 | 2000-03-28 | Advantest Corporation | Contactor for semiconductor IC testers |
USD426522S (en) * | 1998-04-21 | 2000-06-13 | Advantest Corporation | Contactor for semiconductor IC testers |
US6276596B1 (en) * | 2000-08-28 | 2001-08-21 | International Business Machines Corporation | Low temperature solder column attach by injection molded solder and structure formed |
US6296173B2 (en) * | 1996-07-17 | 2001-10-02 | International Business Machines Corporation | Method and apparatus for soldering ball grid array modules to substrates |
USD503691S1 (en) * | 2001-03-28 | 2005-04-05 | International Rectifier Corporation | Conductive clip for a semiconductor package |
US6955285B2 (en) * | 2002-12-17 | 2005-10-18 | Senju Metal Industry Co., Ltd. | Apparatus for aligning and dispensing solder columns in an array |
US8277255B2 (en) * | 2010-12-10 | 2012-10-02 | Tyco Electronics Corporation | Interconnect member for an electronic module with embedded components |
US9108262B1 (en) | 2014-04-17 | 2015-08-18 | Topline Corporation | Disposable apparatus for aligning and dispensing solder columns in an array |
US9629259B1 (en) | 2016-08-16 | 2017-04-18 | Topline Corporation | Refillable apparatus for aligning and depositing solder columns in a column grid array |
USD808350S1 (en) | 2017-03-06 | 2018-01-23 | Topline Corporation | Fixture for delivering interconnect members onto a substrate |
-
2018
- 2018-11-02 US US29/668,830 patent/USD874413S1/en active Active
Patent Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4705205A (en) * | 1983-06-30 | 1987-11-10 | Raychem Corporation | Chip carrier mounting device |
US4712721A (en) * | 1986-03-17 | 1987-12-15 | Raychem Corp. | Solder delivery systems |
US5029748A (en) * | 1987-07-10 | 1991-07-09 | Amp Incorporated | Solder preforms in a cast array |
US4842184A (en) * | 1988-06-23 | 1989-06-27 | Ltv Aerospace & Defense Company | Method and apparatus for applying solder preforms |
US5040717A (en) * | 1990-03-27 | 1991-08-20 | Metcal, Inc. | Solder delivery system |
US5626278A (en) * | 1994-04-15 | 1997-05-06 | Tang; Ching C. | Solder delivery and array apparatus |
US5497938A (en) * | 1994-09-01 | 1996-03-12 | Intel Corporation | Tape with solder forms and methods for transferring solder to chip assemblies |
US5695109A (en) * | 1995-11-22 | 1997-12-09 | Industrial Technology Research Institute | Solder paste inter-layer alignment apparatus for area-array on-board rework |
US6296173B2 (en) * | 1996-07-17 | 2001-10-02 | International Business Machines Corporation | Method and apparatus for soldering ball grid array modules to substrates |
USD421968S (en) * | 1998-04-21 | 2000-03-28 | Advantest Corporation | Contactor for semiconductor IC testers |
USD432504S (en) * | 1998-04-21 | 2000-10-24 | Advantest Corporation | Contactor for semiconductor IC testers |
USD426522S (en) * | 1998-04-21 | 2000-06-13 | Advantest Corporation | Contactor for semiconductor IC testers |
US6276596B1 (en) * | 2000-08-28 | 2001-08-21 | International Business Machines Corporation | Low temperature solder column attach by injection molded solder and structure formed |
USD503691S1 (en) * | 2001-03-28 | 2005-04-05 | International Rectifier Corporation | Conductive clip for a semiconductor package |
US6955285B2 (en) * | 2002-12-17 | 2005-10-18 | Senju Metal Industry Co., Ltd. | Apparatus for aligning and dispensing solder columns in an array |
US8277255B2 (en) * | 2010-12-10 | 2012-10-02 | Tyco Electronics Corporation | Interconnect member for an electronic module with embedded components |
US9108262B1 (en) | 2014-04-17 | 2015-08-18 | Topline Corporation | Disposable apparatus for aligning and dispensing solder columns in an array |
US9629259B1 (en) | 2016-08-16 | 2017-04-18 | Topline Corporation | Refillable apparatus for aligning and depositing solder columns in a column grid array |
USD808350S1 (en) | 2017-03-06 | 2018-01-23 | Topline Corporation | Fixture for delivering interconnect members onto a substrate |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD908648S1 (en) | 2019-12-12 | 2021-01-26 | Topline Corporation | Adjustable fixture for aligning column grid array substrates |
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Legal Events
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |