USD874413S1 - Fixture for delivering 1752 solder columns onto a substrate - Google Patents

Fixture for delivering 1752 solder columns onto a substrate Download PDF

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Publication number
USD874413S1
USD874413S1 US29/668,830 US201829668830F USD874413S US D874413 S1 USD874413 S1 US D874413S1 US 201829668830 F US201829668830 F US 201829668830F US D874413 S USD874413 S US D874413S
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United States
Prior art keywords
delivering
fixture
substrate
solder columns
columns onto
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/668,830
Inventor
Martin B. Hart
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Topline Corp
Original Assignee
Topline Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to US29/668,830 priority Critical patent/USD874413S1/en
Assigned to TOPLINE CORPORATION reassignment TOPLINE CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HART, MARTIN B.
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Publication of USD874413S1 publication Critical patent/USD874413S1/en
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Description

FIG. 1 is a top perspective view of a fixture for delivering 1752 solder columns onto a substrate, showing my new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a front side view thereof;
FIG. 8 is a rear side view thereof;
FIG. 9 is a top exploded perspective view thereof;
FIG. 10 is a bottom exploded perspective view thereof; and,
FIG. 11 is a bottom view of the top plate of the fixture for delivering 1752 solder columns onto a substrate, shown separately for ease of illustration.
The broken lines shown in the drawings represent portions of the fixture for delivering 1752 solder columns onto a substrate that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a fixture for delivering 1752 solder columns onto a substrate, as shown and described.
US29/668,830 2018-11-02 2018-11-02 Fixture for delivering 1752 solder columns onto a substrate Active USD874413S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/668,830 USD874413S1 (en) 2018-11-02 2018-11-02 Fixture for delivering 1752 solder columns onto a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/668,830 USD874413S1 (en) 2018-11-02 2018-11-02 Fixture for delivering 1752 solder columns onto a substrate

Publications (1)

Publication Number Publication Date
USD874413S1 true USD874413S1 (en) 2020-02-04

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ID=69188178

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US29/668,830 Active USD874413S1 (en) 2018-11-02 2018-11-02 Fixture for delivering 1752 solder columns onto a substrate

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US (1) USD874413S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD908648S1 (en) 2019-12-12 2021-01-26 Topline Corporation Adjustable fixture for aligning column grid array substrates
USD930912S1 (en) * 2017-12-22 2021-09-14 Ningbo Geostar Photoelectric Technology Co., Ltd. Welding filter
USD935424S1 (en) * 2019-05-06 2021-11-09 Lam Research Corporation Semiconductor wafer processing tool

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4712721A (en) * 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
US4842184A (en) * 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US5029748A (en) * 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
US5040717A (en) * 1990-03-27 1991-08-20 Metcal, Inc. Solder delivery system
US5497938A (en) * 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
US5626278A (en) * 1994-04-15 1997-05-06 Tang; Ching C. Solder delivery and array apparatus
US5695109A (en) * 1995-11-22 1997-12-09 Industrial Technology Research Institute Solder paste inter-layer alignment apparatus for area-array on-board rework
USD421968S (en) * 1998-04-21 2000-03-28 Advantest Corporation Contactor for semiconductor IC testers
USD426522S (en) * 1998-04-21 2000-06-13 Advantest Corporation Contactor for semiconductor IC testers
US6276596B1 (en) * 2000-08-28 2001-08-21 International Business Machines Corporation Low temperature solder column attach by injection molded solder and structure formed
US6296173B2 (en) * 1996-07-17 2001-10-02 International Business Machines Corporation Method and apparatus for soldering ball grid array modules to substrates
USD503691S1 (en) * 2001-03-28 2005-04-05 International Rectifier Corporation Conductive clip for a semiconductor package
US6955285B2 (en) * 2002-12-17 2005-10-18 Senju Metal Industry Co., Ltd. Apparatus for aligning and dispensing solder columns in an array
US8277255B2 (en) * 2010-12-10 2012-10-02 Tyco Electronics Corporation Interconnect member for an electronic module with embedded components
US9108262B1 (en) 2014-04-17 2015-08-18 Topline Corporation Disposable apparatus for aligning and dispensing solder columns in an array
US9629259B1 (en) 2016-08-16 2017-04-18 Topline Corporation Refillable apparatus for aligning and depositing solder columns in a column grid array
USD808350S1 (en) 2017-03-06 2018-01-23 Topline Corporation Fixture for delivering interconnect members onto a substrate

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4712721A (en) * 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
US5029748A (en) * 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
US4842184A (en) * 1988-06-23 1989-06-27 Ltv Aerospace & Defense Company Method and apparatus for applying solder preforms
US5040717A (en) * 1990-03-27 1991-08-20 Metcal, Inc. Solder delivery system
US5626278A (en) * 1994-04-15 1997-05-06 Tang; Ching C. Solder delivery and array apparatus
US5497938A (en) * 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
US5695109A (en) * 1995-11-22 1997-12-09 Industrial Technology Research Institute Solder paste inter-layer alignment apparatus for area-array on-board rework
US6296173B2 (en) * 1996-07-17 2001-10-02 International Business Machines Corporation Method and apparatus for soldering ball grid array modules to substrates
USD421968S (en) * 1998-04-21 2000-03-28 Advantest Corporation Contactor for semiconductor IC testers
USD432504S (en) * 1998-04-21 2000-10-24 Advantest Corporation Contactor for semiconductor IC testers
USD426522S (en) * 1998-04-21 2000-06-13 Advantest Corporation Contactor for semiconductor IC testers
US6276596B1 (en) * 2000-08-28 2001-08-21 International Business Machines Corporation Low temperature solder column attach by injection molded solder and structure formed
USD503691S1 (en) * 2001-03-28 2005-04-05 International Rectifier Corporation Conductive clip for a semiconductor package
US6955285B2 (en) * 2002-12-17 2005-10-18 Senju Metal Industry Co., Ltd. Apparatus for aligning and dispensing solder columns in an array
US8277255B2 (en) * 2010-12-10 2012-10-02 Tyco Electronics Corporation Interconnect member for an electronic module with embedded components
US9108262B1 (en) 2014-04-17 2015-08-18 Topline Corporation Disposable apparatus for aligning and dispensing solder columns in an array
US9629259B1 (en) 2016-08-16 2017-04-18 Topline Corporation Refillable apparatus for aligning and depositing solder columns in a column grid array
USD808350S1 (en) 2017-03-06 2018-01-23 Topline Corporation Fixture for delivering interconnect members onto a substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD930912S1 (en) * 2017-12-22 2021-09-14 Ningbo Geostar Photoelectric Technology Co., Ltd. Welding filter
USD935424S1 (en) * 2019-05-06 2021-11-09 Lam Research Corporation Semiconductor wafer processing tool
USD908648S1 (en) 2019-12-12 2021-01-26 Topline Corporation Adjustable fixture for aligning column grid array substrates

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