USD833988S1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- USD833988S1 USD833988S1 US29/575,417 US201629575417F USD833988S US D833988 S1 USD833988 S1 US D833988S1 US 201629575417 F US201629575417 F US 201629575417F US D833988 S USD833988 S US D833988S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- view
- elevational view
- ornamental design
- side elevational
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The broken lines illustrate portions of the heat sink and form no part of the claimed design.
Claims (1)
- The ornamental design for a heat sink, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201630338852 | 2016-07-22 | ||
CN201630338852 | 2016-07-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD833988S1 true USD833988S1 (en) | 2018-11-20 |
Family
ID=59677788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/575,417 Active USD833988S1 (en) | 2016-07-22 | 2016-08-24 | Heat sink |
Country Status (3)
Country | Link |
---|---|
US (1) | USD833988S1 (en) |
JP (1) | JP1584755S (en) |
TW (1) | TWD181170S (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD924186S1 (en) * | 2020-03-09 | 2021-07-06 | Cambricon Technologies Corporation Limited | Board card |
USD953280S1 (en) * | 2020-01-17 | 2022-05-31 | Furukawa Electric Co., Ltd | Heat sink |
USD954005S1 (en) | 2019-09-12 | 2022-06-07 | Furukawa Electric Co., Ltd. | Heatsink |
USD971862S1 (en) * | 2018-12-28 | 2022-12-06 | Furukawa Electric Co., Ltd. | Heatsink |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD487885S1 (en) * | 2003-03-14 | 2004-03-30 | Datech Technology Co., Ltd. | Heat pipe heat sink assembly |
USD496338S1 (en) * | 2003-03-10 | 2004-09-21 | Asia Vital Components Co., Ltd. | Double-winged radiator for central processing unit |
USD573110S1 (en) * | 2007-07-27 | 2008-07-15 | Nidec Corporation | Heat sink |
USD579423S1 (en) * | 2007-11-19 | 2008-10-28 | Foxconn Technology Co., Ltd. | Heat sink |
USD582359S1 (en) * | 2008-01-07 | 2008-12-09 | Cooler Master Co., Ltd. | Heat dissipator |
US20090260782A1 (en) * | 2008-04-17 | 2009-10-22 | Aavid Thermalloy, Llc | Heat sink base plate with heat pipe |
US20120067550A1 (en) * | 2010-09-22 | 2012-03-22 | David Shih | Heat sink structure embedded with heat pipes |
US20130168055A1 (en) * | 2011-12-30 | 2013-07-04 | Asia Vital Components Co., Ltd. | Thermal module |
US20140202666A1 (en) * | 2013-01-22 | 2014-07-24 | Asia Vital Components Co., Ltd. | Thermal module |
USD715750S1 (en) * | 2013-11-26 | 2014-10-21 | Kilpatrick Townsend & Stockton Llp | Power heat sink with imbedded fly cut heat pipes |
US20150219400A1 (en) * | 2012-12-06 | 2015-08-06 | Furukawa Electric Co., Ltd. | Heat sink |
US20170082377A1 (en) * | 2015-09-17 | 2017-03-23 | Asia Vital Components Co., Ltd. | Heat dissipation device |
US20170094843A1 (en) * | 2015-09-24 | 2017-03-30 | Abb Schweiz Ag | Cooling device and method for cooling at least two power electronic devices |
US20170102186A1 (en) * | 2015-10-09 | 2017-04-13 | Tsung-Hsien Huang | Heat sink assembly |
USD786807S1 (en) * | 2014-09-19 | 2017-05-16 | General Electric Company | Heat sink |
US20170153065A1 (en) * | 2015-12-01 | 2017-06-01 | Asia Vital Components Co., Ltd. | Assembling structure of heat dissipation device |
US20170153063A1 (en) * | 2015-11-26 | 2017-06-01 | Asia Vital Components Co., Ltd. | Heat dissipation unit |
US20170229376A1 (en) * | 2011-02-25 | 2017-08-10 | Asia Vital Components Co., Ltd. | Thermal module |
-
2016
- 2016-08-18 TW TW105304756F patent/TWD181170S/en unknown
- 2016-08-24 US US29/575,417 patent/USD833988S1/en active Active
- 2016-08-25 JP JPD2016-18060F patent/JP1584755S/ja active Active
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD496338S1 (en) * | 2003-03-10 | 2004-09-21 | Asia Vital Components Co., Ltd. | Double-winged radiator for central processing unit |
USD487885S1 (en) * | 2003-03-14 | 2004-03-30 | Datech Technology Co., Ltd. | Heat pipe heat sink assembly |
USD573110S1 (en) * | 2007-07-27 | 2008-07-15 | Nidec Corporation | Heat sink |
USD579423S1 (en) * | 2007-11-19 | 2008-10-28 | Foxconn Technology Co., Ltd. | Heat sink |
USD582359S1 (en) * | 2008-01-07 | 2008-12-09 | Cooler Master Co., Ltd. | Heat dissipator |
US20090260782A1 (en) * | 2008-04-17 | 2009-10-22 | Aavid Thermalloy, Llc | Heat sink base plate with heat pipe |
US20120067550A1 (en) * | 2010-09-22 | 2012-03-22 | David Shih | Heat sink structure embedded with heat pipes |
US20170229376A1 (en) * | 2011-02-25 | 2017-08-10 | Asia Vital Components Co., Ltd. | Thermal module |
US20130168055A1 (en) * | 2011-12-30 | 2013-07-04 | Asia Vital Components Co., Ltd. | Thermal module |
US20150219400A1 (en) * | 2012-12-06 | 2015-08-06 | Furukawa Electric Co., Ltd. | Heat sink |
US20140202666A1 (en) * | 2013-01-22 | 2014-07-24 | Asia Vital Components Co., Ltd. | Thermal module |
USD715750S1 (en) * | 2013-11-26 | 2014-10-21 | Kilpatrick Townsend & Stockton Llp | Power heat sink with imbedded fly cut heat pipes |
USD786807S1 (en) * | 2014-09-19 | 2017-05-16 | General Electric Company | Heat sink |
US20170082377A1 (en) * | 2015-09-17 | 2017-03-23 | Asia Vital Components Co., Ltd. | Heat dissipation device |
US20170094843A1 (en) * | 2015-09-24 | 2017-03-30 | Abb Schweiz Ag | Cooling device and method for cooling at least two power electronic devices |
US20170102186A1 (en) * | 2015-10-09 | 2017-04-13 | Tsung-Hsien Huang | Heat sink assembly |
US20170153063A1 (en) * | 2015-11-26 | 2017-06-01 | Asia Vital Components Co., Ltd. | Heat dissipation unit |
US20170153065A1 (en) * | 2015-12-01 | 2017-06-01 | Asia Vital Components Co., Ltd. | Assembling structure of heat dissipation device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD971862S1 (en) * | 2018-12-28 | 2022-12-06 | Furukawa Electric Co., Ltd. | Heatsink |
USD954005S1 (en) | 2019-09-12 | 2022-06-07 | Furukawa Electric Co., Ltd. | Heatsink |
USD953280S1 (en) * | 2020-01-17 | 2022-05-31 | Furukawa Electric Co., Ltd | Heat sink |
USD924186S1 (en) * | 2020-03-09 | 2021-07-06 | Cambricon Technologies Corporation Limited | Board card |
Also Published As
Publication number | Publication date |
---|---|
JP1584755S (en) | 2017-08-28 |
TWD181170S (en) | 2017-02-01 |
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