USD822628S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD822628S1
USD822628S1 US29/598,531 US201729598531F USD822628S US D822628 S1 USD822628 S1 US D822628S1 US 201729598531 F US201729598531 F US 201729598531F US D822628 S USD822628 S US D822628S
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United States
Prior art keywords
semiconductor device
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design
ornamental design
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US29/598,531
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English (en)
Inventor
Kentaro NASU
Kenji Nishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
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Rohm Co Ltd
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NASU, KENTARO, NISHIDA, KENJI
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US29/598,531 2017-01-31 2017-03-27 Semiconductor device Active USD822628S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2017-1616F JP1584883S (cs) 2017-01-31 2017-01-31
JP2017-001616 2017-01-31

Publications (1)

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USD822628S1 true USD822628S1 (en) 2018-07-10

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US (1) USD822628S1 (cs)
JP (1) JP1584883S (cs)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1052545S1 (en) * 2022-11-01 2024-11-26 Rohm Co., Ltd. Semiconductor device
USD1059315S1 (en) * 2022-11-02 2025-01-28 Ganrich Semiconductor Corporation Package structure for a semiconductor element

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD389808S (en) * 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD739363S1 (en) * 2011-06-17 2015-09-22 Soraa, Inc. Array of triangular semiconductor dies
USD751999S1 (en) * 2012-12-31 2016-03-22 Soraa, Inc. Array of triangular semiconductor dice
USD756317S1 (en) * 2014-08-26 2016-05-17 Féinics Amatech Teoranta Layout for contact pads and connection bridges of a transponder chip module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD805485S1 (en) * 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD389808S (en) * 1996-01-09 1998-01-27 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD803171S1 (en) * 2011-06-17 2017-11-21 Soraa, Inc. Array of triangular semiconductor dies
USD739363S1 (en) * 2011-06-17 2015-09-22 Soraa, Inc. Array of triangular semiconductor dies
USD751999S1 (en) * 2012-12-31 2016-03-22 Soraa, Inc. Array of triangular semiconductor dice
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD752000S1 (en) * 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
USD805485S1 (en) * 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD756317S1 (en) * 2014-08-26 2016-05-17 Féinics Amatech Teoranta Layout for contact pads and connection bridges of a transponder chip module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD810706S1 (en) * 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1052545S1 (en) * 2022-11-01 2024-11-26 Rohm Co., Ltd. Semiconductor device
USD1059315S1 (en) * 2022-11-02 2025-01-28 Ganrich Semiconductor Corporation Package structure for a semiconductor element

Also Published As

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