USD803800S1 - Lead frame - Google Patents

Lead frame Download PDF

Info

Publication number
USD803800S1
USD803800S1 US29/543,060 US201529543060F USD803800S US D803800 S1 USD803800 S1 US D803800S1 US 201529543060 F US201529543060 F US 201529543060F US D803800 S USD803800 S US D803800S
Authority
US
United States
Prior art keywords
taken along
along line
lead frame
view
end view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/543,060
Other languages
English (en)
Inventor
Atsushi Takeshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Devices and Storage Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAKESHITA, ATSUSHI
Application granted granted Critical
Publication of USD803800S1 publication Critical patent/USD803800S1/en
Assigned to KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Assigned to TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION reassignment TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KABUSHIKI KAISHA TOSHIBA
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

US29/543,060 2015-04-20 2015-10-20 Lead frame Active USD803800S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-008836 2015-04-20
JPD2015-8836F JP1537980S (enrdf_load_stackoverflow) 2015-04-20 2015-04-20

Publications (1)

Publication Number Publication Date
USD803800S1 true USD803800S1 (en) 2017-11-28

Family

ID=54549588

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/543,060 Active USD803800S1 (en) 2015-04-20 2015-10-20 Lead frame

Country Status (3)

Country Link
US (1) USD803800S1 (enrdf_load_stackoverflow)
JP (1) JP1537980S (enrdf_load_stackoverflow)
TW (1) TWD175797S (enrdf_load_stackoverflow)

Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316821B1 (en) * 1998-09-28 2001-11-13 Cypress Semiconductor Corporation High density lead frames and methods for plastic injection molding
US6409775B1 (en) * 1999-02-09 2002-06-25 Matsushita Electric Industrial Co., Ltd. Method of molding a plurality of solid electrolytic capacitors on a metal lead frame
US6433424B1 (en) * 2000-12-14 2002-08-13 International Rectifier Corporation Semiconductor device package and lead frame with die overhanging lead frame pad
US6486538B1 (en) * 1999-05-27 2002-11-26 Infineon Technologies Ag Chip carrier having ventilation channels
US6494597B1 (en) * 1999-10-26 2002-12-17 San-Hua Yu Bowl on lead frame in light emitting diode
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
US20040094827A1 (en) * 2002-11-18 2004-05-20 Hideya Takakura Leadframe for semiconductor device, method for manufacturing semiconductor device using the same, semiconductor device using the same, and electronic equipment
USD491900S1 (en) * 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD492266S1 (en) * 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) * 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
US20050046012A1 (en) * 2003-08-26 2005-03-03 Stats Chippac Ltd. Leadframe-based mold array package heat spreader and fabrication method therefor
USD505121S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
US20100052125A1 (en) * 2008-08-29 2010-03-04 Sanyo Electric Co., Ltd. Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
US20110212341A1 (en) * 2010-02-26 2011-09-01 Freescale Semiconductor, Inc. Lead frame sheet
US20120248588A1 (en) * 2011-03-28 2012-10-04 Shinko Electric Industries Co., Ltd. Lead frame
JP2013128007A (ja) * 2011-12-16 2013-06-27 Toshiba Corp フォトカプラの製造方法及びフォトカプラ用リードフレームシート
US20140191381A1 (en) * 2013-01-09 2014-07-10 Texas Instruments Incorporated Integrated circuit module with dual leadframe
US20140291824A1 (en) * 2013-03-28 2014-10-02 Infineon Technologies Ag Leadframe, Semiconductor Package Including a Leadframe and Method for Producing a Leadframe
US20140327004A1 (en) * 2013-05-03 2014-11-06 Infineon Technologies Ag Lead Frame Strips with Support Members
US9054091B2 (en) * 2013-06-10 2015-06-09 Alpha & Omega Semiconductor, Inc. Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures
US20160005663A1 (en) * 2014-07-07 2016-01-07 Infineon Technologies Ag Extended contact area for leadframe strip testing
US20160027721A1 (en) * 2014-07-28 2016-01-28 Texas Instruments Incorporated Leadframe Strip And Leadframes
US20160218051A1 (en) * 2015-01-22 2016-07-28 Sh Materials Co., Ltd. Lead frame
USD780722S1 (en) * 2015-01-13 2017-03-07 Avery Dennison Retail Information Services, Llc Antenna
US9607934B2 (en) * 2013-07-31 2017-03-28 Nichia Corporation Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package

Patent Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316821B1 (en) * 1998-09-28 2001-11-13 Cypress Semiconductor Corporation High density lead frames and methods for plastic injection molding
US6409775B1 (en) * 1999-02-09 2002-06-25 Matsushita Electric Industrial Co., Ltd. Method of molding a plurality of solid electrolytic capacitors on a metal lead frame
US6486538B1 (en) * 1999-05-27 2002-11-26 Infineon Technologies Ag Chip carrier having ventilation channels
US6494597B1 (en) * 1999-10-26 2002-12-17 San-Hua Yu Bowl on lead frame in light emitting diode
US6433424B1 (en) * 2000-12-14 2002-08-13 International Rectifier Corporation Semiconductor device package and lead frame with die overhanging lead frame pad
USD492266S1 (en) * 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
US20040094827A1 (en) * 2002-11-18 2004-05-20 Hideya Takakura Leadframe for semiconductor device, method for manufacturing semiconductor device using the same, semiconductor device using the same, and electronic equipment
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) * 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD491900S1 (en) * 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
US20050046012A1 (en) * 2003-08-26 2005-03-03 Stats Chippac Ltd. Leadframe-based mold array package heat spreader and fabrication method therefor
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
US20100052125A1 (en) * 2008-08-29 2010-03-04 Sanyo Electric Co., Ltd. Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
US20110212341A1 (en) * 2010-02-26 2011-09-01 Freescale Semiconductor, Inc. Lead frame sheet
US20120248588A1 (en) * 2011-03-28 2012-10-04 Shinko Electric Industries Co., Ltd. Lead frame
JP2013128007A (ja) * 2011-12-16 2013-06-27 Toshiba Corp フォトカプラの製造方法及びフォトカプラ用リードフレームシート
US20140191381A1 (en) * 2013-01-09 2014-07-10 Texas Instruments Incorporated Integrated circuit module with dual leadframe
US20140291824A1 (en) * 2013-03-28 2014-10-02 Infineon Technologies Ag Leadframe, Semiconductor Package Including a Leadframe and Method for Producing a Leadframe
US20140327004A1 (en) * 2013-05-03 2014-11-06 Infineon Technologies Ag Lead Frame Strips with Support Members
US9054091B2 (en) * 2013-06-10 2015-06-09 Alpha & Omega Semiconductor, Inc. Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures
US9607934B2 (en) * 2013-07-31 2017-03-28 Nichia Corporation Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package
US20160005663A1 (en) * 2014-07-07 2016-01-07 Infineon Technologies Ag Extended contact area for leadframe strip testing
US20160027721A1 (en) * 2014-07-28 2016-01-28 Texas Instruments Incorporated Leadframe Strip And Leadframes
USD780722S1 (en) * 2015-01-13 2017-03-07 Avery Dennison Retail Information Services, Llc Antenna
US20160218051A1 (en) * 2015-01-22 2016-07-28 Sh Materials Co., Ltd. Lead frame

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Excel Cell Electronic Co., dated Dec. 29, 2014, [online], [site visited Mar. 31, 2017]. Available from Internet, <URL: http://www.ece.com.tw/product.php>. *

Also Published As

Publication number Publication date
TWD175797S (zh) 2016-05-21
JP1537980S (enrdf_load_stackoverflow) 2015-11-16

Similar Documents

Publication Publication Date Title
USD876905S1 (en) Jug
USD807110S1 (en) Bottle
USD749977S1 (en) Band
USD750524S1 (en) Band
USD774294S1 (en) Shoe upper
USD756968S1 (en) Speaker
USD769704S1 (en) Pointed zip tie
USD716640S1 (en) Twist tie mount
USD786797S1 (en) Power strip
USD753618S1 (en) Television
USD743101S1 (en) Cosmetic container
USD740809S1 (en) Storage drive
USD815842S1 (en) Portion of a frame for displaying an object
USD782856S1 (en) Table
USD801147S1 (en) Handle for a saw
USD731078S1 (en) Transition strip
USD755599S1 (en) Scissors
USD736170S1 (en) Television
USD745349S1 (en) Saw blade tang
USD725447S1 (en) Head of hoe-rake
USD761247S1 (en) Server for computer
USD764249S1 (en) Rod stiffener clamp
USD745350S1 (en) Saw blade tang
USD759453S1 (en) Wire cutter and stripper
USD731835S1 (en) Lounge end