USD803799S1 - Lead frame - Google Patents

Lead frame Download PDF

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Publication number
USD803799S1
USD803799S1 US29/543,043 US201529543043F USD803799S US D803799 S1 USD803799 S1 US D803799S1 US 201529543043 F US201529543043 F US 201529543043F US D803799 S USD803799 S US D803799S
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US
United States
Prior art keywords
lead frame
taken along
along line
view
end view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/543,043
Inventor
Atsushi Takeshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Devices and Storage Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAKESHITA, ATSUSHI
Application granted granted Critical
Publication of USD803799S1 publication Critical patent/USD803799S1/en
Assigned to TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION reassignment TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KABUSHIKI KAISHA TOSHIBA
Assigned to TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, KABUSHIKI KAISHA TOSHIBA reassignment TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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FIG. 1 is a front, top and right side perspective view of a lead frame, showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof, the opposite side being symmetrical;
FIG. 6 is a rear view thereof;
FIG. 7 is an enlarged view thereof taken along line 7-7 in FIG. 4;
FIG. 8 is an enlarged end view thereof taken along line 8-8 in FIG. 2;
FIG. 9 is an enlarged end view thereof taken along line 9-9 in FIG. 2;
FIG. 10 is an enlarged fragmented view thereof taken along line 10 in FIG. 2;
FIG. 11 is an end view thereof taken along line 11-11 in FIG. 10;
FIG. 12 is an end view thereof taken along line 12-12 in FIG. 10;
FIG. 13 is an end view thereof taken along line 13-13 in FIG. 10;
FIG. 14 is an end view thereof taken along line 14-14 in FIG. 10;
FIG. 15 is an end view thereof taken along line 15-15 in FIG. 10;
FIG. 16 is an end view thereof taken along line 16-16 in FIG. 10;
FIG. 17 is an end view thereof taken along line 17-17 in FIG. 10;
FIG. 18 is an end view thereof taken along line 18-18 in FIG. 10;
FIG. 19 is an end view thereof taken along line 19-19 in FIG. 10; and,
FIG. 20 is an end view thereof taken along line 20-20 in FIG. 10.
The broken lines in FIG. 2 labeled as “10” are included to indicate the point at which the magnified view is cut off and form no part of the claimed design. The broken lines shown in FIGS. 8, 9, 11, 12, 13, 14, 16, 17, 18, 19 and 20 are included to show environment and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a lead frame, as shown and described.
US29/543,043 2015-04-20 2015-10-20 Lead frame Active USD803799S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2015-8835F JP1537979S (en) 2015-04-20 2015-04-20
JP2015-008835 2015-04-20

Publications (1)

Publication Number Publication Date
USD803799S1 true USD803799S1 (en) 2017-11-28

Family

ID=54549587

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/543,043 Active USD803799S1 (en) 2015-04-20 2015-10-20 Lead frame

Country Status (3)

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US (1) USD803799S1 (en)
JP (1) JP1537979S (en)
TW (1) TWD175795S (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD892763S1 (en) * 2018-09-07 2020-08-11 Shenzhen Grandsun Electronic Co., Ltd. Earphone
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus

Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316821B1 (en) * 1998-09-28 2001-11-13 Cypress Semiconductor Corporation High density lead frames and methods for plastic injection molding
US6409775B1 (en) * 1999-02-09 2002-06-25 Matsushita Electric Industrial Co., Ltd. Method of molding a plurality of solid electrolytic capacitors on a metal lead frame
USD465207S1 (en) * 2001-06-08 2002-11-05 Gem Services, Inc. Leadframe matrix for a surface mount package
US6486538B1 (en) * 1999-05-27 2002-11-26 Infineon Technologies Ag Chip carrier having ventilation channels
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483337S1 (en) * 2002-11-25 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484103S1 (en) * 2002-11-15 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485243S1 (en) * 2002-10-22 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD486802S1 (en) * 2002-12-17 2004-02-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD491900S1 (en) * 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD492266S1 (en) * 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) * 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD513608S1 (en) * 2003-01-03 2006-01-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
USD588557S1 (en) * 2007-10-02 2009-03-17 Gem Services, Inc. 4040-28J matrix leadframe
US20100052125A1 (en) * 2008-08-29 2010-03-04 Sanyo Electric Co., Ltd. Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
US20110212341A1 (en) * 2010-02-26 2011-09-01 Freescale Semiconductor, Inc. Lead frame sheet
US20120248588A1 (en) * 2011-03-28 2012-10-04 Shinko Electric Industries Co., Ltd. Lead frame
JP2013128007A (en) * 2011-12-16 2013-06-27 Toshiba Corp Manufacturing method of photocoupler and lead frame sheet for photocoupler
US20140191381A1 (en) * 2013-01-09 2014-07-10 Texas Instruments Incorporated Integrated circuit module with dual leadframe
US20140252401A1 (en) * 2013-03-05 2014-09-11 Nichia Corporation Lead frame and light emitting device
US20140252574A1 (en) * 2013-03-05 2014-09-11 Nichia Corporation Lead frame and semiconductor device
US20140327004A1 (en) * 2013-05-03 2014-11-06 Infineon Technologies Ag Lead Frame Strips with Support Members
US20150064849A1 (en) * 2013-08-30 2015-03-05 Infineon Technologies Ag Lead Frame Strips with Electrical Isolation of Die Paddles
US20160005663A1 (en) * 2014-07-07 2016-01-07 Infineon Technologies Ag Extended contact area for leadframe strip testing
US20160027721A1 (en) * 2014-07-28 2016-01-28 Texas Instruments Incorporated Leadframe Strip And Leadframes
US20160218051A1 (en) * 2015-01-22 2016-07-28 Sh Materials Co., Ltd. Lead frame
US9607934B2 (en) * 2013-07-31 2017-03-28 Nichia Corporation Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package

Patent Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316821B1 (en) * 1998-09-28 2001-11-13 Cypress Semiconductor Corporation High density lead frames and methods for plastic injection molding
US6409775B1 (en) * 1999-02-09 2002-06-25 Matsushita Electric Industrial Co., Ltd. Method of molding a plurality of solid electrolytic capacitors on a metal lead frame
US6486538B1 (en) * 1999-05-27 2002-11-26 Infineon Technologies Ag Chip carrier having ventilation channels
USD465207S1 (en) * 2001-06-08 2002-11-05 Gem Services, Inc. Leadframe matrix for a surface mount package
USD485243S1 (en) * 2002-10-22 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD492266S1 (en) * 2002-11-15 2004-06-29 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484103S1 (en) * 2002-11-15 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484858S1 (en) * 2002-11-15 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483336S1 (en) * 2002-11-15 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484104S1 (en) 2002-11-25 2003-12-23 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD483337S1 (en) * 2002-11-25 2003-12-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD491900S1 (en) * 2002-12-17 2004-06-22 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485244S1 (en) * 2002-12-17 2004-01-13 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD494939S1 (en) * 2002-12-17 2004-08-24 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD486802S1 (en) * 2002-12-17 2004-02-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD513608S1 (en) * 2003-01-03 2006-01-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD488136S1 (en) * 2003-01-03 2004-04-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487431S1 (en) * 2003-01-03 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD485808S1 (en) * 2003-01-03 2004-01-27 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505122S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD505121S1 (en) * 2003-01-03 2005-05-17 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD487432S1 (en) 2003-02-07 2004-03-09 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD484859S1 (en) * 2003-02-07 2004-01-06 Gem Services, Inc. Portion of a matrix for surface mount package leadframe
USD588080S1 (en) * 2007-09-26 2009-03-10 Gem Services, Inc. 2021-8J matrix leadframe
USD588557S1 (en) * 2007-10-02 2009-03-17 Gem Services, Inc. 4040-28J matrix leadframe
US20100052125A1 (en) * 2008-08-29 2010-03-04 Sanyo Electric Co., Ltd. Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
US20110212341A1 (en) * 2010-02-26 2011-09-01 Freescale Semiconductor, Inc. Lead frame sheet
US20120248588A1 (en) * 2011-03-28 2012-10-04 Shinko Electric Industries Co., Ltd. Lead frame
JP2013128007A (en) * 2011-12-16 2013-06-27 Toshiba Corp Manufacturing method of photocoupler and lead frame sheet for photocoupler
US20140191381A1 (en) * 2013-01-09 2014-07-10 Texas Instruments Incorporated Integrated circuit module with dual leadframe
US20140252401A1 (en) * 2013-03-05 2014-09-11 Nichia Corporation Lead frame and light emitting device
US20140252574A1 (en) * 2013-03-05 2014-09-11 Nichia Corporation Lead frame and semiconductor device
US20140327004A1 (en) * 2013-05-03 2014-11-06 Infineon Technologies Ag Lead Frame Strips with Support Members
US9607934B2 (en) * 2013-07-31 2017-03-28 Nichia Corporation Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package
US20150064849A1 (en) * 2013-08-30 2015-03-05 Infineon Technologies Ag Lead Frame Strips with Electrical Isolation of Die Paddles
US20160005663A1 (en) * 2014-07-07 2016-01-07 Infineon Technologies Ag Extended contact area for leadframe strip testing
US20160027721A1 (en) * 2014-07-28 2016-01-28 Texas Instruments Incorporated Leadframe Strip And Leadframes
US20160218051A1 (en) * 2015-01-22 2016-07-28 Sh Materials Co., Ltd. Lead frame

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Excel Cell Electronic Co., dated Dec. 29, 2014, [online], [site visited Mar. 31, 2017]. Available from Internet, <URL:http://www.ece.com.tw/product.php>. *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD892763S1 (en) * 2018-09-07 2020-08-11 Shenzhen Grandsun Electronic Co., Ltd. Earphone
USD956705S1 (en) * 2019-11-07 2022-07-05 Lam Research Corporation Cooling plate for a semiconductor processing apparatus

Also Published As

Publication number Publication date
JP1537979S (en) 2015-11-16
TWD175795S (en) 2016-05-21

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