USD803799S1 - Lead frame - Google Patents
Lead frame Download PDFInfo
- Publication number
- USD803799S1 USD803799S1 US29/543,043 US201529543043F USD803799S US D803799 S1 USD803799 S1 US D803799S1 US 201529543043 F US201529543043 F US 201529543043F US D803799 S USD803799 S US D803799S
- Authority
- US
- United States
- Prior art keywords
- lead frame
- taken along
- along line
- view
- end view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines in FIG. 2 labeled as “10” are included to indicate the point at which the magnified view is cut off and form no part of the claimed design. The broken lines shown in FIGS. 8, 9, 11, 12, 13, 14, 16, 17, 18, 19 and 20 are included to show environment and form no part of the claimed design.
Claims (1)
- The ornamental design for a lead frame, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2015-8835F JP1537979S (en) | 2015-04-20 | 2015-04-20 | |
JP2015-008835 | 2015-04-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD803799S1 true USD803799S1 (en) | 2017-11-28 |
Family
ID=54549587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/543,043 Active USD803799S1 (en) | 2015-04-20 | 2015-10-20 | Lead frame |
Country Status (3)
Country | Link |
---|---|
US (1) | USD803799S1 (en) |
JP (1) | JP1537979S (en) |
TW (1) | TWD175795S (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD892763S1 (en) * | 2018-09-07 | 2020-08-11 | Shenzhen Grandsun Electronic Co., Ltd. | Earphone |
USD956705S1 (en) * | 2019-11-07 | 2022-07-05 | Lam Research Corporation | Cooling plate for a semiconductor processing apparatus |
Citations (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6316821B1 (en) * | 1998-09-28 | 2001-11-13 | Cypress Semiconductor Corporation | High density lead frames and methods for plastic injection molding |
US6409775B1 (en) * | 1999-02-09 | 2002-06-25 | Matsushita Electric Industrial Co., Ltd. | Method of molding a plurality of solid electrolytic capacitors on a metal lead frame |
USD465207S1 (en) * | 2001-06-08 | 2002-11-05 | Gem Services, Inc. | Leadframe matrix for a surface mount package |
US6486538B1 (en) * | 1999-05-27 | 2002-11-26 | Infineon Technologies Ag | Chip carrier having ventilation channels |
USD483336S1 (en) * | 2002-11-15 | 2003-12-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD483337S1 (en) * | 2002-11-25 | 2003-12-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484104S1 (en) | 2002-11-25 | 2003-12-23 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484103S1 (en) * | 2002-11-15 | 2003-12-23 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484859S1 (en) * | 2003-02-07 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484858S1 (en) * | 2002-11-15 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD485243S1 (en) * | 2002-10-22 | 2004-01-13 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD485244S1 (en) * | 2002-12-17 | 2004-01-13 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD485808S1 (en) * | 2003-01-03 | 2004-01-27 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD486802S1 (en) * | 2002-12-17 | 2004-02-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD487431S1 (en) * | 2003-01-03 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD487432S1 (en) | 2003-02-07 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD488136S1 (en) * | 2003-01-03 | 2004-04-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD491900S1 (en) * | 2002-12-17 | 2004-06-22 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD492266S1 (en) * | 2002-11-15 | 2004-06-29 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD494939S1 (en) * | 2002-12-17 | 2004-08-24 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD505122S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD505121S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD513608S1 (en) * | 2003-01-03 | 2006-01-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD588080S1 (en) * | 2007-09-26 | 2009-03-10 | Gem Services, Inc. | 2021-8J matrix leadframe |
USD588557S1 (en) * | 2007-10-02 | 2009-03-17 | Gem Services, Inc. | 4040-28J matrix leadframe |
US20100052125A1 (en) * | 2008-08-29 | 2010-03-04 | Sanyo Electric Co., Ltd. | Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |
US20110212341A1 (en) * | 2010-02-26 | 2011-09-01 | Freescale Semiconductor, Inc. | Lead frame sheet |
US20120248588A1 (en) * | 2011-03-28 | 2012-10-04 | Shinko Electric Industries Co., Ltd. | Lead frame |
JP2013128007A (en) * | 2011-12-16 | 2013-06-27 | Toshiba Corp | Manufacturing method of photocoupler and lead frame sheet for photocoupler |
US20140191381A1 (en) * | 2013-01-09 | 2014-07-10 | Texas Instruments Incorporated | Integrated circuit module with dual leadframe |
US20140252401A1 (en) * | 2013-03-05 | 2014-09-11 | Nichia Corporation | Lead frame and light emitting device |
US20140252574A1 (en) * | 2013-03-05 | 2014-09-11 | Nichia Corporation | Lead frame and semiconductor device |
US20140327004A1 (en) * | 2013-05-03 | 2014-11-06 | Infineon Technologies Ag | Lead Frame Strips with Support Members |
US20150064849A1 (en) * | 2013-08-30 | 2015-03-05 | Infineon Technologies Ag | Lead Frame Strips with Electrical Isolation of Die Paddles |
US20160005663A1 (en) * | 2014-07-07 | 2016-01-07 | Infineon Technologies Ag | Extended contact area for leadframe strip testing |
US20160027721A1 (en) * | 2014-07-28 | 2016-01-28 | Texas Instruments Incorporated | Leadframe Strip And Leadframes |
US20160218051A1 (en) * | 2015-01-22 | 2016-07-28 | Sh Materials Co., Ltd. | Lead frame |
US9607934B2 (en) * | 2013-07-31 | 2017-03-28 | Nichia Corporation | Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package |
-
2015
- 2015-04-20 JP JPD2015-8835F patent/JP1537979S/ja active Active
- 2015-10-20 TW TW104305867F patent/TWD175795S/en unknown
- 2015-10-20 US US29/543,043 patent/USD803799S1/en active Active
Patent Citations (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6316821B1 (en) * | 1998-09-28 | 2001-11-13 | Cypress Semiconductor Corporation | High density lead frames and methods for plastic injection molding |
US6409775B1 (en) * | 1999-02-09 | 2002-06-25 | Matsushita Electric Industrial Co., Ltd. | Method of molding a plurality of solid electrolytic capacitors on a metal lead frame |
US6486538B1 (en) * | 1999-05-27 | 2002-11-26 | Infineon Technologies Ag | Chip carrier having ventilation channels |
USD465207S1 (en) * | 2001-06-08 | 2002-11-05 | Gem Services, Inc. | Leadframe matrix for a surface mount package |
USD485243S1 (en) * | 2002-10-22 | 2004-01-13 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD492266S1 (en) * | 2002-11-15 | 2004-06-29 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484103S1 (en) * | 2002-11-15 | 2003-12-23 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484858S1 (en) * | 2002-11-15 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD483336S1 (en) * | 2002-11-15 | 2003-12-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484104S1 (en) | 2002-11-25 | 2003-12-23 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD483337S1 (en) * | 2002-11-25 | 2003-12-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD491900S1 (en) * | 2002-12-17 | 2004-06-22 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD485244S1 (en) * | 2002-12-17 | 2004-01-13 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD494939S1 (en) * | 2002-12-17 | 2004-08-24 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD486802S1 (en) * | 2002-12-17 | 2004-02-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD513608S1 (en) * | 2003-01-03 | 2006-01-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD488136S1 (en) * | 2003-01-03 | 2004-04-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD487431S1 (en) * | 2003-01-03 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD485808S1 (en) * | 2003-01-03 | 2004-01-27 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD505122S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD505121S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD487432S1 (en) | 2003-02-07 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484859S1 (en) * | 2003-02-07 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD588080S1 (en) * | 2007-09-26 | 2009-03-10 | Gem Services, Inc. | 2021-8J matrix leadframe |
USD588557S1 (en) * | 2007-10-02 | 2009-03-17 | Gem Services, Inc. | 4040-28J matrix leadframe |
US20100052125A1 (en) * | 2008-08-29 | 2010-03-04 | Sanyo Electric Co., Ltd. | Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |
US20110212341A1 (en) * | 2010-02-26 | 2011-09-01 | Freescale Semiconductor, Inc. | Lead frame sheet |
US20120248588A1 (en) * | 2011-03-28 | 2012-10-04 | Shinko Electric Industries Co., Ltd. | Lead frame |
JP2013128007A (en) * | 2011-12-16 | 2013-06-27 | Toshiba Corp | Manufacturing method of photocoupler and lead frame sheet for photocoupler |
US20140191381A1 (en) * | 2013-01-09 | 2014-07-10 | Texas Instruments Incorporated | Integrated circuit module with dual leadframe |
US20140252401A1 (en) * | 2013-03-05 | 2014-09-11 | Nichia Corporation | Lead frame and light emitting device |
US20140252574A1 (en) * | 2013-03-05 | 2014-09-11 | Nichia Corporation | Lead frame and semiconductor device |
US20140327004A1 (en) * | 2013-05-03 | 2014-11-06 | Infineon Technologies Ag | Lead Frame Strips with Support Members |
US9607934B2 (en) * | 2013-07-31 | 2017-03-28 | Nichia Corporation | Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package |
US20150064849A1 (en) * | 2013-08-30 | 2015-03-05 | Infineon Technologies Ag | Lead Frame Strips with Electrical Isolation of Die Paddles |
US20160005663A1 (en) * | 2014-07-07 | 2016-01-07 | Infineon Technologies Ag | Extended contact area for leadframe strip testing |
US20160027721A1 (en) * | 2014-07-28 | 2016-01-28 | Texas Instruments Incorporated | Leadframe Strip And Leadframes |
US20160218051A1 (en) * | 2015-01-22 | 2016-07-28 | Sh Materials Co., Ltd. | Lead frame |
Non-Patent Citations (1)
Title |
---|
Excel Cell Electronic Co., dated Dec. 29, 2014, [online], [site visited Mar. 31, 2017]. Available from Internet, <URL:http://www.ece.com.tw/product.php>. * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD892763S1 (en) * | 2018-09-07 | 2020-08-11 | Shenzhen Grandsun Electronic Co., Ltd. | Earphone |
USD956705S1 (en) * | 2019-11-07 | 2022-07-05 | Lam Research Corporation | Cooling plate for a semiconductor processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP1537979S (en) | 2015-11-16 |
TWD175795S (en) | 2016-05-21 |
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