USD798830S1 - Cooling device for an electronic component heat sink - Google Patents

Cooling device for an electronic component heat sink Download PDF

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Publication number
USD798830S1
USD798830S1 US29/566,046 US201629566046F USD798830S US D798830 S1 USD798830 S1 US D798830S1 US 201629566046 F US201629566046 F US 201629566046F US D798830 S USD798830 S US D798830S
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US
United States
Prior art keywords
electronic component
heat sink
cooling device
component heat
elevational view
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US29/566,046
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English (en)
Inventor
Eiji Anzai
Takumi Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Light Metal Co Ltd
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Nippon Light Metal Co Ltd
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Publication date
Application filed by Nippon Light Metal Co Ltd filed Critical Nippon Light Metal Co Ltd
Assigned to NIPPON LIGHT METAL COMPANY, LTD. reassignment NIPPON LIGHT METAL COMPANY, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ANZAI, EIJI, NAKAMURA, TAKUMI
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US29/566,046 2015-12-04 2016-05-26 Cooling device for an electronic component heat sink Active USD798830S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-027261 2015-12-04
JPD2015-27261F JP1548346S (zh) 2015-12-04 2015-12-04

Publications (1)

Publication Number Publication Date
USD798830S1 true USD798830S1 (en) 2017-10-03

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US29/566,046 Active USD798830S1 (en) 2015-12-04 2016-05-26 Cooling device for an electronic component heat sink

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US (1) USD798830S1 (zh)
JP (1) JP1548346S (zh)
TW (1) TWD179350S (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD849567S1 (en) * 2016-12-21 2019-05-28 Mecalc (Pty) Limited Electronic instruments casing
USD849566S1 (en) * 2016-12-21 2019-05-28 Mecalc (Pty) Limited Electronic instruments casing

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014117A (en) * 1990-03-30 1991-05-07 International Business Machines Corporation High conduction flexible fin cooling module
US6478082B1 (en) * 2000-05-22 2002-11-12 Jia Hao Li Heat dissipating apparatus with nest wind duct
US20040031587A1 (en) * 2001-11-29 2004-02-19 Fong Wang Ching Heat-exchanging fin device fro enhancing heat exchange efficiency
US20040244947A1 (en) * 2003-05-14 2004-12-09 Inventor Precision Co., Ltd. Heat sinks for a cooler
US20060289147A1 (en) * 2005-06-23 2006-12-28 Jon Zuo Modular heat sink
US20080017360A1 (en) * 2006-07-20 2008-01-24 International Business Machines Corporation Heat exchanger with angled secondary fins extending from primary fins
USD567343S1 (en) * 2006-09-08 2008-04-22 Spx Cooling Technologies, Inc. Film fill pack
US20090032217A1 (en) * 2007-07-31 2009-02-05 Adc Telecommunications, Inc. Apparatus for spreading heat over a finned surface
USD586763S1 (en) * 2007-08-23 2009-02-17 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
USD601515S1 (en) * 2008-12-17 2009-10-06 Celsia Technologies Taiwan, Inc. Heat sink
US20090303681A1 (en) * 2008-06-05 2009-12-10 International Business Machines Corporation COINED-SHEET-METAL HEATSINKS FOR CLOSELY PACKAGED HEAT-PRODUCING DEVICES SUCH AS DUAL IN-LINE MEMORY MODULES (DIMMs)
US20090321045A1 (en) * 2008-06-30 2009-12-31 Alcatel-Lucent Technologies Inc. Monolithic structurally complex heat sink designs
US20100236755A1 (en) * 2009-03-19 2010-09-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20130020060A1 (en) * 2010-09-02 2013-01-24 Cooper-Standard Automotive, Inc. Heat exchanger
USD676118S1 (en) * 2011-06-24 2013-02-12 Hiform As Heat exchanger panel
US20130186604A1 (en) * 2010-09-21 2013-07-25 Carrier Corporation Micro-channel heat exchanger including independent heat exchange circuits and method
USD689835S1 (en) * 2013-01-08 2013-09-17 Eryn Smith Electrostatic carrier tray
US20150173242A1 (en) * 2012-09-03 2015-06-18 Abb Technology Ag Modular cooling system
US20160054074A1 (en) * 2014-08-19 2016-02-25 Abb Technology Oy Cooling element
US20160153725A1 (en) * 2014-11-27 2016-06-02 Inventec (Pudong) Technology Corporation Heat dissipation fin set
US20160192534A1 (en) * 2014-12-22 2016-06-30 Airbus Operations (S.A.S.) Cold plate, forming in particular a structural part of an item of equipment having heat-generating components
USD763804S1 (en) * 2014-02-06 2016-08-16 Kobe Steel, Ltd. Plate for heat exchanger
US20160341488A1 (en) * 2015-05-21 2016-11-24 Man Zai Industrial Co., Ltd. Refrigerant heat dissipating apparatus
US20170055370A1 (en) * 2015-08-20 2017-02-23 Cooler Master Co., Ltd. Liquid-cooling heat dissipation device

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014117A (en) * 1990-03-30 1991-05-07 International Business Machines Corporation High conduction flexible fin cooling module
US6478082B1 (en) * 2000-05-22 2002-11-12 Jia Hao Li Heat dissipating apparatus with nest wind duct
US20040031587A1 (en) * 2001-11-29 2004-02-19 Fong Wang Ching Heat-exchanging fin device fro enhancing heat exchange efficiency
US20040244947A1 (en) * 2003-05-14 2004-12-09 Inventor Precision Co., Ltd. Heat sinks for a cooler
US20060289147A1 (en) * 2005-06-23 2006-12-28 Jon Zuo Modular heat sink
US20080017360A1 (en) * 2006-07-20 2008-01-24 International Business Machines Corporation Heat exchanger with angled secondary fins extending from primary fins
USD567343S1 (en) * 2006-09-08 2008-04-22 Spx Cooling Technologies, Inc. Film fill pack
US20090032217A1 (en) * 2007-07-31 2009-02-05 Adc Telecommunications, Inc. Apparatus for spreading heat over a finned surface
USD586763S1 (en) * 2007-08-23 2009-02-17 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US20090303681A1 (en) * 2008-06-05 2009-12-10 International Business Machines Corporation COINED-SHEET-METAL HEATSINKS FOR CLOSELY PACKAGED HEAT-PRODUCING DEVICES SUCH AS DUAL IN-LINE MEMORY MODULES (DIMMs)
US20090321045A1 (en) * 2008-06-30 2009-12-31 Alcatel-Lucent Technologies Inc. Monolithic structurally complex heat sink designs
USD601515S1 (en) * 2008-12-17 2009-10-06 Celsia Technologies Taiwan, Inc. Heat sink
US20100236755A1 (en) * 2009-03-19 2010-09-23 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20130020060A1 (en) * 2010-09-02 2013-01-24 Cooper-Standard Automotive, Inc. Heat exchanger
US20130186604A1 (en) * 2010-09-21 2013-07-25 Carrier Corporation Micro-channel heat exchanger including independent heat exchange circuits and method
USD676118S1 (en) * 2011-06-24 2013-02-12 Hiform As Heat exchanger panel
US20150173242A1 (en) * 2012-09-03 2015-06-18 Abb Technology Ag Modular cooling system
USD689835S1 (en) * 2013-01-08 2013-09-17 Eryn Smith Electrostatic carrier tray
USD763804S1 (en) * 2014-02-06 2016-08-16 Kobe Steel, Ltd. Plate for heat exchanger
US20160054074A1 (en) * 2014-08-19 2016-02-25 Abb Technology Oy Cooling element
US20160153725A1 (en) * 2014-11-27 2016-06-02 Inventec (Pudong) Technology Corporation Heat dissipation fin set
US20160192534A1 (en) * 2014-12-22 2016-06-30 Airbus Operations (S.A.S.) Cold plate, forming in particular a structural part of an item of equipment having heat-generating components
US20160341488A1 (en) * 2015-05-21 2016-11-24 Man Zai Industrial Co., Ltd. Refrigerant heat dissipating apparatus
US20170055370A1 (en) * 2015-08-20 2017-02-23 Cooler Master Co., Ltd. Liquid-cooling heat dissipation device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD849567S1 (en) * 2016-12-21 2019-05-28 Mecalc (Pty) Limited Electronic instruments casing
USD849566S1 (en) * 2016-12-21 2019-05-28 Mecalc (Pty) Limited Electronic instruments casing

Also Published As

Publication number Publication date
JP1548346S (zh) 2016-10-17
TWD179350S (zh) 2016-11-01

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