US20160153725A1 - Heat dissipation fin set - Google Patents

Heat dissipation fin set Download PDF

Info

Publication number
US20160153725A1
US20160153725A1 US14/686,362 US201514686362A US2016153725A1 US 20160153725 A1 US20160153725 A1 US 20160153725A1 US 201514686362 A US201514686362 A US 201514686362A US 2016153725 A1 US2016153725 A1 US 2016153725A1
Authority
US
United States
Prior art keywords
fin
heat dissipation
guiding hole
plurality
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/686,362
Inventor
Yi-Lun Cheng
Chih-Kai Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inventec (Pudong) Technology Corp
Inventec Corp
Original Assignee
Inventec (Pudong) Technology Corp
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201410707240.5A priority Critical patent/CN105636407A/en
Priority to CN201410707240.5 priority
Application filed by Inventec (Pudong) Technology Corp, Inventec Corp filed Critical Inventec (Pudong) Technology Corp
Assigned to INVENTEC CORPORATION, INVENTEC (PUDONG) TECHNOLOGY CORPORATION reassignment INVENTEC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, YI-LUN, YANG, CHIH-KAI
Publication of US20160153725A1 publication Critical patent/US20160153725A1/en
Application status is Abandoned legal-status Critical

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4882Assembly of heatsink parts
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes

Abstract

A heat dissipation fin set includes a first fin; and a second fin. The second fin is adjacent to and parallel to the first fin. A projection plane is defined as being parallel to the first fin and the second fin. If the first fin and the second fin are projected onto the projection plane to form a plurality of projection profiles respectively, the plurality of projection profiles are different from each other.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 201410707240.5 filed in China on Nov. 27, 2014, the entire contents of which are hereby incorporated by reference.
  • BACKGROUND OF THE INVENTION
  • 1. Technical Field of the Invention
  • The disclosure relates to a heat dissipation fin set, and more particularly to a heat dissipation fin set with multiple heat dissipation fins.
  • 2. Description of the Related Art
  • With the development of technology in recent years, speeds of computing of electronic devices are faster than before, and the electronic devices are miniaturized. In order to meet the requirement of consumers, the electronic devices are developed to be smaller in size and light in weight.
  • When the speed of computing of the electronic device is increased, much heat is generated accordingly. In order to dissipate the heat generated, a better heat dissipation module is disposed for conducting the heat generated from heat sources of the electronic device. For example, the heat dissipation is a fan, a heat dissipation fin set, a heat pipe or combinations thereof. Specifically, on the one hand, the fan can drive an air flow to perform heat dissipation on the heat sources through heat convection. On the other hand, the heat dissipation fin set and the heat pipe can be thermally connected with the heat sources for removing the heat.
  • However, since the electronic devices become smaller and lighter than before, there is no enough spare room within the electronic device to perform heat convection, and larger heat dissipation fin set and the heat pipe are not allowed to be disposed therein. Moreover, the heat dissipation fin set comprises multiple heat dissipation fins, when the air flow passes between every two of the heat dissipation fins adjacent to each other, the air flow may produce several boundary layers each being formed on the heat dissipation fins and their shape are parabolic-shaped. The closer the air flow to the heat dissipation fin set is, the lower the velocity of the air flow is. Accordingly, when the velocity of the air flow is reduced, the air flow cannot efficiently dissipate the heat swiftly, thereby affecting the total efficiency of the heat dissipation.
  • All in all, manufacturers try to develop the heat dissipation with better efficiency when the electronic devices are miniaturized.
  • SUMMARY OF THE INVENTION
  • An aspect of the disclosure provides a heat dissipation fin set comprising a first fin; and a second fin. The second fin is adjacent to and parallel to the first fin. A projection plane is defined as being parallel to the first fin and the second fin. If the first fin and the second fin are projected onto the projection plane to form a plurality of projection profiles respectively, the plurality of projection profiles are different from each other.
  • Another aspect of the disclosure provides heat dissipation fin set comprising a plurality of heat dissipation fins. A projection plane having a normal line is defined such that the normal line is perpendicular to surfaces of the plurality of heat dissipation fins. If any two heat dissipation fins that are adjacent to each other are projected onto the projection plane to form a plurality of projection profiles respectively, the plurality of projection profiles are different from each other.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present disclosure will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only and thus are not limitative of the present disclosure and wherein:
  • FIG. 1 is a schematic perspective view of a heat dissipation fin set according to an embodiment of the disclosure;
  • FIG. 2 is an exploded view of the heat dissipation fin set according to the embodiment of the disclosure;
  • FIG. 3 is a front view of the heat dissipation fin set according to the embodiment of the disclosure;
  • FIG. 4 is a front view of a third fin according to the embodiment of the disclosure;
  • FIG. 5 is a front view of a first fin according to the embodiment of the disclosure;
  • FIG. 6 is a front view of a second fin according to the embodiment of the disclosure; and
  • FIG. 7 is a cross-sectional view of the heat dissipation fin set along a line 7-7 of FIG. 3.
  • DETAILED DESCRIPTION
  • In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.
  • The disclosure provides a heat dissipation fin set which is adapted to electronic devices, such as, but not limited to, a desktop computer, a server, a laptop computer, an all-in-one computer, a smart phone (i.e., a handset). In this disclosure, the heat dissipation fin set is for performing heat dissipation on a heat source of an electronic device.
  • The following introduces the heat dissipation fin set. Please refer to FIG. 1 to FIG. 3. FIG. 1 is a schematic perspective view of a heat dissipation fin set according to an embodiment of the disclosure, FIG. 2 is an exploded view of the heat dissipation fin set according to the embodiment of the disclosure, and FIG. 3 is a front view of the heat dissipation fin set according to the embodiment of the disclosure;
  • According to an embodiment of the disclosure, a plurality of heat dissipation fin sets 1 is arranged in sequence. Each heat dissipation fin set 1 comprises a first side 14 and a second side 15 that are opposite to each other. Arranged sequentially, the plurality of heat dissipation fin sets 1 is disposed in a line (i.e., in a row), an air flow can flow through the plurality of heat dissipation fin sets 1 from the first side 14 to the second side 15 or from the second side 15 to the first side 14. In this embodiment of the disclosure, each heat dissipation fin set 1 comprises a plurality of heat dissipation fins, that is, a first fin 12 and a second fin 13. The first fin 12 and the second fin 13 are arranged in a line face-to-face and parallel to each other. In this and some other embodiments, the heat dissipation fin set 1 further comprises a third fin 11 located at a side of the heat dissipation fin set 1 and parallel to the first fin 12. In other words, the first fin 12 is located between the third fin 11 and the second fin 13. Furthermore, the first fin 12, the second fin 13 and the third fin 11 have a first surface 122, a second surface 132 and a third surface 112, respectively. In this disclosure, a projection plane has a normal line being defined such that the normal line is perpendicular to the first surface 122 of the first fin 12, the second surface 132 of the second fin 13, and the third surface 112 of the third fin 11 of the heat dissipation fin set 1. In other words, the first surface 122 of the first fin 12, the second surface 132 of the second fin 13, and the third surface 112 of the third fin 11 of the heat dissipation fin set 1 are substantially parallel to each other. In addition, the first surface 122, the second surface 132 and the third surface 112 face in the same direction, and the disclosure is not limited thereto. It should be noted that in each of the heat dissipation fin set 1, the first fin 12, the second fin 13 and the third fin 11 each project a projection profile onto the projection plane. These projection profiles are different from each other onto the projection plane. In other words, shapes and silhouettes of the first surface 122 of the first fin 12, the second surface 132 of the second fin 13 and the third surface 112 of the third fin 11 of the heat dissipation fin set 1 are different from each other.
  • In this disclosure, the first fin 12, the second fin 13 and the third fin 11 have different shapes and silhouettes. When air flows passes through channels between every two of the third fin 11, the first fin 12 and the second fin 13 that are adjacent to each other, boundary layers formed on surfaces of the third fin 11, the first fin 12 and the second fin 13 can be destroyed, thereby reducing the probabilities of the decrease of the velocity of the air flows. That is to say, the configuration of the third fin 11, the first fin 12 and the second fin 13 maintains the turbulences of the air flows, thereby speeding up the air flow. Thus, the total efficiency of the heat dissipation of the heat dissipation fin set 1 is enhanced.
  • The following describes the combination manner of the fins, and take the third fin 11 as an example. Please refer to FIG. 2 and FIG. 4, and FIG. 4 is a front view of a third fin according to the embodiment of the disclosure. In this and some other embodiments, the third fin 11 comprises a main body 113, a first connecting section 114 and a second connecting section 115. The first connecting section 114 and the second connecting section 115 are connected to two sides of the main body 113 that are opposite to each other, and a shape of the third fin 11 is U-shaped. Thus, the first connecting section 114 and the second connecting section 115 of the third fin 11 can be fastened to the second fin 13 which is adjacent to the third fin 11 by attachment, adherence or welding. Consequently, the main body 113, the first connecting section 114 and the second connecting section 115 of the third fin 11 and the adjacent second fin 13 form a channel therein together. Through this structure, every two of the third fin 11, the first fin 12 and the second fin 13 that are adjacent to each other can be connected to (i.e., bridge) each other as well as forming the channel therebetween. However, the disclosure is not limited to above-mentioned structure. For example, in other embodiments, the heat dissipation fin set 1 further comprises a carrying plate, and the third fin 11 only comprises the main body 113 erected on the carrying plate. Moreover, in this and some other embodiments, the third fin 11 further has a third guiding hole 111 disposed at the main body 113. The heat dissipation fin set 1 further comprises a heat pipe 20 with one end being contact with a heat source, e.g. a central processing unit or a chip, of the electronic device and with the other end penetrating the third guiding hole 111 of the third fin 11 of the heat dissipation fin set 1.
  • Moreover, as shown in FIG. 4, the shape of the third fin 11 is symmetrical to a central axis C1 of the third fin 11, but the disclosure is not limited to the symmetry of the shape of the third fin 11. In other embodiments, the shape of the third fin 11 is not symmetrical to a central axis C1 of the third fin 11 but asymmetrical and irregular.
  • The following describes the configurations of the first fin 12 and the second fin 13, please refer to FIG. 5, which is a front view of a first fin according to the embodiment of the disclosure. In this and some other embodiments, each first fin 12 has a first guiding hole 121 where the heat pipe 20 can penetrate. In this and some other embodiments, each first fin 12 has four first through holes 123, 124, 125 and 126. The first through holes 123, 124, 125 and 126 are disposed around the first guiding hole 121. Two sides (i.e., the first side 14 and the second side 15 shown in FIG. 1) of the first fin 12 adjacent to each other has first recesses 127 and 128, respectively. The first recesses 127 and 128 are formed towards a central axis C2 from the first side 14 and the second side 15, respectively.
  • The first fin 12 and the second fin 13 also have components similar to the first connecting section 114 and second connecting section 115 of the third fin 11. Thus, the third fin 11, the first fin 12 and the second fin 13 are connected to each other through these components. Since the configurations of the first connecting section and the second connecting section of the first fin 12 and the second fin 13 are similar to that of the third fin 11, the repeated description is not described again herein.
  • Please refer to FIG. 6, which is a front view of a second fin according to the embodiment of the disclosure. In this and some other embodiments, the second fin 13 has a second guiding hole 131 where the heat pipe 20 can penetrate. Heat generated by the heat source can be directly conducted to the second fin 13 through the heat pipe 20. Then the heat can be evenly transmitted to the third fin 11, the first fin 12 and the second fin 13 of each heat dissipation fin set 1 via heat conduction. In this and some other embodiments, since the third fin 11, the first fin 12 and the second fin 13 of the heat dissipation fin set 1 are arranged in a line and the heat pipe 20 is a straight tube, the projection profiles projected by the third guiding hole 111 of the third fin 11, the first guiding hole 121 and the first fin 12 and the second guiding hole 131 of the second fin 13 are formed onto the projection plane and overlapped (namely, match) with each other.
  • In this and some other embodiments, each second fin 13 further has two second through holes 133 and 135 and two third through holes 134 and 136. The second through holes 133 and 135 and the third through holes 134 and 136 are disposed around the second guiding holes 131. Dimensions (e.g., shapes, silhouettes and sizes) of the second through holes 133 and 135 are different from dimensions (e.g., shapes, silhouettes and sizes) of the third through holes 134 and 136. In this embodiment, a central axis C3 of the second fin 13 penetrates through the third through holes 134 and 136. Shortest distances L1 between the first through holes 123, 124, 125 and 126 and the central axis C2 of the first fin 12 are different from shortest distances L2 between the second through holes 133 and 135 and the central axis C3 of the second fin 13. Moreover, in this and some other embodiments, two sides (i.e., the first side 14 and the second side 15 shown in FIG. 1) of the second fin 13 that are opposite to each other have two second recesses 137 and 138, respectively. The two second recesses 137 and 138 formed toward the central axis C3 from the first side 14 and the second side 15, respectively. Please refer to FIG. 5 and FIG. 6, shortest distances L3 between the first recesses 127 and 128 and the central axis C2 of the first fin 12 are different from shortest distances L4 between the second recesses 137 and 138 and the central axis C3 of the second fin 13. In addition, shapes of the first fin 12 and the second fin 13 are symmetrical to the central axes C2 and C3, respectively, but the disclosure is not limited to these symmetrical shapes. In other embodiments, the shapes of the first fin 12 and second fin 13 are not symmetrical to the central axes C2 and C3 but asymmetrical or irregular.
  • Furthermore, in some embodiments, the heat dissipation fin set 1 further comprises a fan (not shown, e.g., a centrifugal fan) disposed at the first side 14 of the heat dissipation fin set 1. Hence, the fan is for driving an air flow to flow from the first side 14 towards the second side 15 through the channels between the third fin 11, the first fin 12 and the second fin 13. Accordingly, the heat accumulated in the third fin 11, the first fin 12 and the second fin 13 can be removed away. Thanks to the disposition of the fan, the efficiency of the heat dissipation of the heat dissipation fin set 1 is enhanced.
  • In short, the first fin 12 comprises the first through holes 123, 124, 125 and 126 and the first recesses 127 and 128, and the second fin 13 comprises the second through holes 133 and 135, the third through holes 134 and 136 and the second recesses 137 and 138. Thus, it means the shapes of the third fin 11, the first fin 12 and the second fin 13 are different from each other, such that the third fin 11, the first fin 12 and the second fin 13 that are adjacent to each other form multiple holes which stagger with each other (i.e., the first through holes 123, 124, 125 and 126, the first recesses 127 and 128, the second through holes 133 and 135, the third through holes 134 and 136, and the second recesses 137 and 138). Please refer to FIG. 7, which is a cross-sectional view of the heat dissipation fin set along a line 7-7 of FIG. 3. When air flows are generated to flow along a first direction D1 from the first side 14 towards the second side 15 of the heat dissipation fin set 1, the air flows can pass through or pass by the first through holes 123 and 126, the first recesses 127 and 128, the second through holes 133 and 135, the third through hole 136, and the second recesses 137 and 138. Turbulences of the air flows are generated within the channels between the third fin 11, the first fin 12 and the second fin 13, destroying the growth of the boundary layers. Thus, the velocities of the air flows on the surfaces of the third fin 11, the first fin 12 and the second fin 13 are increased, enhancing the efficiency of the heat dissipation of the heat dissipation fin set 1.
  • Moreover, the heat dissipation fin set 1 according the above-mentioned embodiments comprises the first fin 12, the second fin 13 and the third fin 11, but the disclosure is not limited to the quantity, the type and the arrangement of the fins. For example, two third fins 11 are disposed at two sides of the heat dissipation fin set 1, and the first fin 12 and the second fin 13 stagger therein. Alternatively, for example, the heat dissipation fin set 1 further comprises a fourth fin with a fourth through hole and a fifth fin with a fifth through hole. The first fin 12, the second fin 13, the fourth fin and the fifth fin randomly disposed inside the heat dissipation fin set 1. In other embodiments, the fins of the heat dissipation fin set 1 are randomly arranged with each other. In short, when projections regions projected by the fins (e.g., the first fin 12, the second fin 13 and the third fin 11) of the heat dissipation fin set 1 are different from each other onto the projection plane in order to destroy the growth of the boundary layers on the surfaces of the fins, this kind of heat dissipation fin set 1 belongs to the scope of the present disclosure.
  • According to the embodiments of the disclosure, the heat dissipation fin set comprises the first fin and the second fin, both projecting the projection profiles onto the projection plane, and the projection profiles are different from each other. Consequently, when an air flow passes through the heat dissipation fin set, the first fin and the second fin can destroy the growth of the boundary layers formed on the surfaces thereof, solving the problem that the velocity of the air flow may decreased due to the boundary layer. Thus, the efficiency of the heat dissipation is enhanced.

Claims (10)

What is claimed is:
1. A heat dissipation fin set, comprising:
a first fin; and
a second fin being adjacent to and parallel to the first fin;
wherein a projection plane is defined as being parallel to the first fin and the second fin, if the first fin and the second fin are projected onto the projection plane to form a plurality of projection profiles respectively, the plurality of projection profiles are different from each other.
2. The heat dissipation fin set according to claim 1, further comprising a third fin located at a side of the heat dissipation fin set and being parallel to the first fin.
3. The heat dissipation fin set according to claim 2, further comprising a heat pipe, the first fin comprising a first guiding hole, the second fin comprising a second guiding hole, the third fin comprising a third guiding hole, and the heat pipe penetrating through the first guiding hole, the second guiding hole and the third guiding hole.
4. The heat dissipation fin set according to claim 3, wherein if the third guiding hole, the first guiding hole and the second guiding hole are projected onto the projection planes to form the plurality of projection profiles respectively, the plurality of projection profiles corresponding to the third guiding hole, and the first guiding hole and the second guiding hole are overlapped with each other.
5. The heat dissipation fin set according to claim 4, wherein the first fin comprises a plurality of first through holes disposed around the first guiding hole, and the second fin comprises a plurality of second through holes disposed around the second guiding hole.
6. The heat dissipation fin set according to claim 3, wherein the first fin comprises four first through holes disposed around the first guiding hole.
7. The heat dissipation fin set according to claim 6, wherein the second fin comprises two second through holes and two third through holes, the second through holes and the third through holes are together disposed around the second guiding hole, and dimensions of the second through holes are different from dimensions of the third through holes.
8. The heat dissipation fin set according to claim 1, wherein the first fin comprises two first recesses located on two sides of the first fin that are opposite to each other.
9. The heat dissipation fin set according to claim 8, wherein the second fin comprises two second recesses located on two sides of the second fin that are opposite to each other, and shortest distances between each first recess and a central axis of the heat dissipation fin set are different from shortest distances between the second recess and the central axis.
10. A heat dissipation fin set, comprising a plurality of heat dissipation fins, a projection plane having a normal line being defined such that the normal line is perpendicular to surfaces of the plurality of heat dissipation fins, if any two heat dissipation fins that are adjacent to each other are projected onto the projection plane to form a plurality of projection profiles respectively, the plurality of projection profiles are different from each other.
US14/686,362 2014-11-27 2015-04-14 Heat dissipation fin set Abandoned US20160153725A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201410707240.5A CN105636407A (en) 2014-11-27 2014-11-27 Radiating fin group
CN201410707240.5 2014-11-27

Publications (1)

Publication Number Publication Date
US20160153725A1 true US20160153725A1 (en) 2016-06-02

Family

ID=56050731

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/686,362 Abandoned US20160153725A1 (en) 2014-11-27 2015-04-14 Heat dissipation fin set

Country Status (2)

Country Link
US (1) US20160153725A1 (en)
CN (1) CN105636407A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD798831S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798830S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798829S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1115411A (en) * 1912-02-08 1914-10-27 Standard Heat And Ventilation Company Inc Heating appliance.
US6651733B1 (en) * 2002-10-16 2003-11-25 Sunonwealth Electric Machine Industry Co., Ltd. Heat sink
US20090014154A1 (en) * 2005-11-09 2009-01-15 Tir Technology Lp Passive Thermal Management System

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004036938A (en) * 2002-07-01 2004-02-05 Matsushita Electric Ind Co Ltd Heat exchanger and air conditioner comprising the same
CN2845004Y (en) * 2005-10-26 2006-12-06 陈世明 Low pressure heat radiator
EP2299488B1 (en) * 2009-08-06 2014-07-23 Cpumate Inc. Heat-dissipating fin assembly with heat-conducting structure
CN201589566U (en) * 2009-10-13 2010-09-22 南实企业有限公司;潘冠达 Radiating fin group and radiating device provided with same
CN201589564U (en) * 2009-10-27 2010-09-22 彩威实业有限公司 Radiating fin and radiator provided with same
TWM380512U (en) * 2009-10-29 2010-05-11 Wistron Corp Heat sink and heat-dissipation fins thereof
CN201803638U (en) * 2010-03-12 2011-04-20 中兴通讯股份有限公司 Orthoptera radiator
CN202151032U (en) * 2011-05-31 2012-02-22 东莞市东兴铝材制造有限公司 Radiator
KR20130019076A (en) * 2011-08-16 2013-02-26 엘에스산전 주식회사 Heat sinking plate
CN202432477U (en) * 2011-12-08 2012-09-12 东莞市东逸电气科技有限公司 External LED streetlamp radiator
CN102937348B (en) * 2012-12-04 2015-01-14 北京卡林新能源技术有限公司 Silencing and noise-reducing coil pipe heat exchanger as well as ultra-silencing fan coil pipe and soundproofing heat exchanger

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1115411A (en) * 1912-02-08 1914-10-27 Standard Heat And Ventilation Company Inc Heating appliance.
US6651733B1 (en) * 2002-10-16 2003-11-25 Sunonwealth Electric Machine Industry Co., Ltd. Heat sink
US20090014154A1 (en) * 2005-11-09 2009-01-15 Tir Technology Lp Passive Thermal Management System

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD798831S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798830S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD798829S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink

Also Published As

Publication number Publication date
CN105636407A (en) 2016-06-01

Similar Documents

Publication Publication Date Title
US7520316B2 (en) Heat sink with heat pipes
US20030141041A1 (en) Tube-style radiator structure for computer
JP2006295178A (en) Heatsink apparatus for electronic device
US20060144572A1 (en) Heat dissipating device
US7295437B2 (en) Heat dissipation device for multiple heat-generating components
US6778392B2 (en) Heat dissipation device for electronic component
US6343016B1 (en) Heat sink
US7055578B2 (en) Heat dissipation device assembly with fan cover
US6964295B1 (en) Heat dissipation device
US7561417B2 (en) Thermal module and fin assembly thereof
CN100444714C (en) Radiator
US20080180905A1 (en) Heat dissipation air duct
US20080017350A1 (en) Heat sink
CN2752958Y (en) Radiator device with guide structure
US20040226690A1 (en) Tubular heat dissipation device
US7565925B2 (en) Heat dissipation device
US7423877B2 (en) Heat dissipation device
US20040120115A1 (en) Heat-dissipating assembly
US6992890B2 (en) Heat sink
US20070175610A1 (en) Heat dissipating device
US8477495B2 (en) Airflow guide member and electronic device having the same
US7251134B2 (en) Extended fin array
US7495920B2 (en) Heat dissipation device
US20070246190A1 (en) Heat dissipating structure having different compactness
US7286357B2 (en) Computer system with cooling device for CPU

Legal Events

Date Code Title Description
AS Assignment

Owner name: INVENTEC CORPORATION, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHENG, YI-LUN;YANG, CHIH-KAI;REEL/FRAME:035407/0117

Effective date: 20150302

Owner name: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHENG, YI-LUN;YANG, CHIH-KAI;REEL/FRAME:035407/0117

Effective date: 20150302