USD730304S1 - Substrate for an electronic circuit - Google Patents

Substrate for an electronic circuit Download PDF

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Publication number
USD730304S1
USD730304S1 US29/500,867 US201429500867F USD730304S US D730304 S1 USD730304 S1 US D730304S1 US 201429500867 F US201429500867 F US 201429500867F US D730304 S USD730304 S US D730304S
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US
United States
Prior art keywords
electronic circuit
substrate
view
elevational view
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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US29/500,867
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English (en)
Inventor
Manabu Matsumoto
Isao Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Toshiba Corp
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Publication date
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Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MATSUMOTO, MANABU, OZAWA, ISAO
Application granted granted Critical
Publication of USD730304S1 publication Critical patent/USD730304S1/en
Assigned to TOSHIBA MEMORY CORPORATION reassignment TOSHIBA MEMORY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KABUSHIKI KAISHA TOSHIBA
Assigned to KIOXIA CORPORATION reassignment KIOXIA CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: TOSHIBA MEMORY CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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US29/500,867 2014-05-15 2014-08-29 Substrate for an electronic circuit Active USD730304S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2014-10413F JP1519750S (cs) 2014-05-15 2014-05-15
JP2014-010413 2014-05-15

Publications (1)

Publication Number Publication Date
USD730304S1 true USD730304S1 (en) 2015-05-26

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ID=53176777

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/500,867 Active USD730304S1 (en) 2014-05-15 2014-08-29 Substrate for an electronic circuit

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US (1) USD730304S1 (cs)
JP (1) JP1519750S (cs)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD770991S1 (en) * 2013-11-05 2016-11-08 Nok Corporation Integrated circuit tag
USD776801S1 (en) * 2014-06-24 2017-01-17 Kobe Steel, Ltd Heat exchanger tube
USD780184S1 (en) * 2013-03-13 2017-02-28 Nagrastar Llc Smart card interface
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD787457S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787456S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD792410S1 (en) * 2013-03-13 2017-07-18 Nagrastar Llc Smart card interface
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
USD840404S1 (en) 2013-03-13 2019-02-12 Nagrastar, Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD937232S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD942974S1 (en) * 2018-11-20 2022-02-08 Thales Dis Ais Deutschland Gmbh Cellular module

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4165584A (en) * 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
USD264963S (en) * 1979-06-01 1982-06-15 Perception Electronics, Inc. Component mounting plate for a PC board indicator and control device
US20020027762A1 (en) * 1998-09-29 2002-03-07 Shinji Yamaguchi Electrostatic chuck
USD459706S1 (en) 2001-04-27 2002-07-02 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
US6500059B2 (en) * 2000-12-01 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
US20040179323A1 (en) * 2003-03-11 2004-09-16 Alon Litman Electrostatic chuck for wafer metrology and inspection equipment
USD526972S1 (en) * 2004-10-14 2006-08-22 Toshiba Lighting & Technology Corporation Light emitting diode module
USD531139S1 (en) * 2004-10-14 2006-10-31 Toshiba Lighting & Technology Corporation Light emitting diode module
USD637193S1 (en) 2010-11-19 2011-05-03 Apple Inc. Electronic device
US8177993B2 (en) * 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
USD670917S1 (en) * 2011-02-18 2012-11-20 Columbia Sportswear North America, Inc. Heat reflective lining material
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD686175S1 (en) * 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) * 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) * 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD702445S1 (en) * 2012-05-11 2014-04-15 Columbia Sportswear North America, Inc. Printed cooling material

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4165584A (en) * 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
USD264963S (en) * 1979-06-01 1982-06-15 Perception Electronics, Inc. Component mounting plate for a PC board indicator and control device
US20020027762A1 (en) * 1998-09-29 2002-03-07 Shinji Yamaguchi Electrostatic chuck
US6500059B2 (en) * 2000-12-01 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
USD459706S1 (en) 2001-04-27 2002-07-02 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD471524S1 (en) 2001-04-27 2003-03-11 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
US20040179323A1 (en) * 2003-03-11 2004-09-16 Alon Litman Electrostatic chuck for wafer metrology and inspection equipment
USD531139S1 (en) * 2004-10-14 2006-10-31 Toshiba Lighting & Technology Corporation Light emitting diode module
USD526972S1 (en) * 2004-10-14 2006-08-22 Toshiba Lighting & Technology Corporation Light emitting diode module
US8177993B2 (en) * 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD704155S1 (en) * 2010-08-19 2014-05-06 Epistar Corporation Wafer carrier
USD637193S1 (en) 2010-11-19 2011-05-03 Apple Inc. Electronic device
USD670917S1 (en) * 2011-02-18 2012-11-20 Columbia Sportswear North America, Inc. Heat reflective lining material
USD686175S1 (en) * 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) * 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD690671S1 (en) * 2012-03-20 2013-10-01 Veeco Instruments Inc. Wafer carrier having pockets
USD702445S1 (en) * 2012-05-11 2014-04-15 Columbia Sportswear North America, Inc. Printed cooling material
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD780184S1 (en) * 2013-03-13 2017-02-28 Nagrastar Llc Smart card interface
USD840404S1 (en) 2013-03-13 2019-02-12 Nagrastar, Llc Smart card interface
USD792411S1 (en) * 2013-03-13 2017-07-18 Nagrastar Llc Smart card interface
USD792410S1 (en) * 2013-03-13 2017-07-18 Nagrastar Llc Smart card interface
USD949864S1 (en) * 2013-03-13 2022-04-26 Nagrastar Llc Smart card interface
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD942406S1 (en) 2013-10-17 2022-02-01 Vicor Corporation Electric terminal
USD775093S1 (en) 2013-10-17 2016-12-27 Vlt, Inc. Electric terminal
USD834548S1 (en) 2013-10-17 2018-11-27 Vlt, Inc. Electric terminal
USD877708S1 (en) 2013-10-17 2020-03-10 Vlt, Inc. Electrical terminal
USD775092S1 (en) 2013-10-17 2016-12-27 Vlt, Inc. Electric terminal
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD798249S1 (en) 2013-10-17 2017-09-26 Vlt, Inc. Electric terminal
USD770991S1 (en) * 2013-11-05 2016-11-08 Nok Corporation Integrated circuit tag
USD778850S1 (en) 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD778851S1 (en) 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD778852S1 (en) 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD776801S1 (en) * 2014-06-24 2017-01-17 Kobe Steel, Ltd Heat exchanger tube
USD793973S1 (en) * 2015-01-14 2017-08-08 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787456S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD787457S1 (en) * 2015-01-14 2017-05-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
USD904355S1 (en) 2015-12-11 2020-12-08 Gemalto M2M Gmbh Radio module
USD942974S1 (en) * 2018-11-20 2022-02-08 Thales Dis Ais Deutschland Gmbh Cellular module
USD1054404S1 (en) 2018-11-20 2024-12-17 Kontron Europe Gmbh Cellular module
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD937233S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD937232S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device

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Publication number Publication date
JP1519750S (cs) 2015-03-23

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