USD701843S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD701843S1 USD701843S1 US29/389,545 US201129389545F USD701843S US D701843 S1 USD701843 S1 US D701843S1 US 201129389545 F US201129389545 F US 201129389545F US D701843 S USD701843 S US D701843S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
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- ornamental design
- showing
- indicia
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000004065 semiconductor Substances 0.000 title claims description 3
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Description
Claims (1)
- The ornamental design for a semiconductor device, as shown.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/481,535 USD737229S1 (en) | 2010-12-28 | 2014-02-06 | Semiconductor device |
| US29/481,536 USD737230S1 (en) | 2010-12-28 | 2014-02-06 | Semiconductor device |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010031448 | 2010-12-28 | ||
| JP2010031446 | 2010-12-28 | ||
| JPD.2010-031446 | 2010-12-28 | ||
| JP2010031447 | 2010-12-28 | ||
| JPD.2010-031448 | 2010-12-28 | ||
| JPD.2010-031447 | 2010-12-28 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/481,536 Division USD737230S1 (en) | 2010-12-28 | 2014-02-06 | Semiconductor device |
| US29/481,535 Division USD737229S1 (en) | 2010-12-28 | 2014-02-06 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD701843S1 true USD701843S1 (en) | 2014-04-01 |
Family
ID=50349213
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/389,545 Active USD701843S1 (en) | 2010-12-28 | 2011-04-13 | Semiconductor device |
| US29/481,536 Active USD737230S1 (en) | 2010-12-28 | 2014-02-06 | Semiconductor device |
| US29/481,535 Active USD737229S1 (en) | 2010-12-28 | 2014-02-06 | Semiconductor device |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/481,536 Active USD737230S1 (en) | 2010-12-28 | 2014-02-06 | Semiconductor device |
| US29/481,535 Active USD737229S1 (en) | 2010-12-28 | 2014-02-06 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| US (3) | USD701843S1 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
| US8975694B1 (en) | 2013-03-07 | 2015-03-10 | Vlt, Inc. | Low resistance power switching device |
| USD732488S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD732487S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD737230S1 (en) * | 2010-12-28 | 2015-08-25 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| USD758329S1 (en) * | 2013-08-06 | 2016-06-07 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD761745S1 (en) * | 2013-06-28 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| USD994624S1 (en) * | 2021-03-23 | 2023-08-08 | Rohm Co., Ltd. | Power semiconductor module |
| USD1021831S1 (en) * | 2021-03-23 | 2024-04-09 | Rohm Co., Ltd. | Power semiconductor module |
| USD1030686S1 (en) * | 2021-03-23 | 2024-06-11 | Rohm Co., Ltd. | Power semiconductor module |
| USD1056861S1 (en) * | 2021-03-23 | 2025-01-07 | Rohm Co., Ltd. | Power semiconductor module |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1555473S (en) * | 2015-10-26 | 2016-08-08 | ||
| JP1555474S (en) * | 2015-10-26 | 2016-08-08 |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060267030A1 (en) * | 2002-04-24 | 2006-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing same |
| USD574339S1 (en) * | 2005-06-24 | 2008-08-05 | Nitto Denko Corporation | Pattern formed on the ground layer of a multilayer printed circuit board |
| US20100000765A1 (en) * | 2006-07-15 | 2010-01-07 | Sharp Kabushiki Kaisha | Substrate for a display panel, a display panel having the substrate, a production process of the substrate, and a production process of the display panel |
| US20100132981A1 (en) * | 2008-11-28 | 2010-06-03 | Kabushiki Kaisha Toshiba | Printed wiring board and electronic apparatus |
| US20100163282A1 (en) * | 2006-10-24 | 2010-07-01 | Hiroyoshi Tagi | Printed wiring board, method for manufacturing printed wiring board, and electric device |
| US20100175912A1 (en) * | 2009-01-15 | 2010-07-15 | Shih Juei-Tao | Ic package having colored pattern |
| US20100200276A1 (en) * | 2009-02-11 | 2010-08-12 | Broadcom Corporation | Implementations of twisted differential pairs on a circuit board |
| US7981709B2 (en) * | 2007-04-05 | 2011-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device and method for fabricating the same |
| US20120118614A1 (en) * | 2009-11-20 | 2012-05-17 | Fujifilm Corporation | Conductive sheet, method for using conductive sheet, and capacitive touch panel |
| US20120186855A1 (en) * | 2011-01-24 | 2012-07-26 | Teh-Zheng Lin | Substrate of touch panel in manufacturing and the method for forming the same |
| US20120205141A1 (en) * | 2011-02-10 | 2012-08-16 | Fujikura Ltd. | Printed wiring board |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5355008A (en) * | 1993-11-19 | 1994-10-11 | Micrel, Inc. | Diamond shaped gate mesh for cellular MOS transistor array |
| WO1996031907A1 (en) * | 1995-04-06 | 1996-10-10 | Industrial Technology Research Institute | N-sided polygonal cell lay-out for multiple cell transistor |
| US6002156A (en) * | 1997-09-16 | 1999-12-14 | Winbond Electronics Corp. | Distributed MOSFET structure with enclosed gate for improved transistor size/layout area ratio and uniform ESD triggering |
| JP3307597B2 (en) * | 1998-09-30 | 2002-07-24 | 株式会社 アドテック | Printed wiring device |
| JP3524908B2 (en) * | 2002-01-21 | 2004-05-10 | 株式会社半導体理工学研究センター | Semiconductor device |
| US6713823B1 (en) * | 2002-03-08 | 2004-03-30 | Volterra Semiconductor Corporation | Conductive routings in integrated circuits |
| JP4396200B2 (en) * | 2002-10-30 | 2010-01-13 | 株式会社デンソー | Semiconductor device |
| US6969909B2 (en) * | 2002-12-20 | 2005-11-29 | Vlt, Inc. | Flip chip FET device |
| US6897561B2 (en) * | 2003-06-06 | 2005-05-24 | Semiconductor Components Industries, Llc | Semiconductor power device having a diamond shaped metal interconnect scheme |
| JP4810072B2 (en) * | 2004-06-15 | 2011-11-09 | 株式会社東芝 | Nitrogen compound-containing semiconductor devices |
| CN101207968B (en) * | 2006-12-22 | 2011-11-09 | 鸿富锦精密工业(深圳)有限公司 | Circuit board |
| US9029866B2 (en) * | 2009-08-04 | 2015-05-12 | Gan Systems Inc. | Gallium nitride power devices using island topography |
| JP5427644B2 (en) * | 2010-02-25 | 2014-02-26 | 株式会社日立製作所 | Printed board |
| AU2011241423A1 (en) * | 2010-04-13 | 2012-11-08 | Gan Systems Inc. | High density gallium nitride devices using island topology |
| CN102403310A (en) * | 2010-09-13 | 2012-04-04 | 登丰微电子股份有限公司 | Metal Oxide Semiconductor Field Effect Transistor Layout and Structure |
| USD701843S1 (en) * | 2010-12-28 | 2014-04-01 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| JP1463922S (en) * | 2012-05-02 | 2016-02-29 | ||
| TWI457055B (en) * | 2013-02-20 | 2014-10-11 | Novatek Microelectronics Corp | Flexible circuit board and ground line strucure |
-
2011
- 2011-04-13 US US29/389,545 patent/USD701843S1/en active Active
-
2014
- 2014-02-06 US US29/481,536 patent/USD737230S1/en active Active
- 2014-02-06 US US29/481,535 patent/USD737229S1/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060267030A1 (en) * | 2002-04-24 | 2006-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing same |
| USD574339S1 (en) * | 2005-06-24 | 2008-08-05 | Nitto Denko Corporation | Pattern formed on the ground layer of a multilayer printed circuit board |
| US20100000765A1 (en) * | 2006-07-15 | 2010-01-07 | Sharp Kabushiki Kaisha | Substrate for a display panel, a display panel having the substrate, a production process of the substrate, and a production process of the display panel |
| US20100163282A1 (en) * | 2006-10-24 | 2010-07-01 | Hiroyoshi Tagi | Printed wiring board, method for manufacturing printed wiring board, and electric device |
| US7981709B2 (en) * | 2007-04-05 | 2011-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device and method for fabricating the same |
| US8203151B2 (en) * | 2007-04-05 | 2012-06-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device and method for fabricating the same |
| US20100132981A1 (en) * | 2008-11-28 | 2010-06-03 | Kabushiki Kaisha Toshiba | Printed wiring board and electronic apparatus |
| US20100175912A1 (en) * | 2009-01-15 | 2010-07-15 | Shih Juei-Tao | Ic package having colored pattern |
| US20100200276A1 (en) * | 2009-02-11 | 2010-08-12 | Broadcom Corporation | Implementations of twisted differential pairs on a circuit board |
| US20120118614A1 (en) * | 2009-11-20 | 2012-05-17 | Fujifilm Corporation | Conductive sheet, method for using conductive sheet, and capacitive touch panel |
| US20120186855A1 (en) * | 2011-01-24 | 2012-07-26 | Teh-Zheng Lin | Substrate of touch panel in manufacturing and the method for forming the same |
| US20120205141A1 (en) * | 2011-02-10 | 2012-08-16 | Fujikura Ltd. | Printed wiring board |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD737230S1 (en) * | 2010-12-28 | 2015-08-25 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| USD737229S1 (en) * | 2010-12-28 | 2015-08-25 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| US9269661B1 (en) | 2013-03-07 | 2016-02-23 | Vlt, Inc. | Low resistance power switching device |
| US8975694B1 (en) | 2013-03-07 | 2015-03-10 | Vlt, Inc. | Low resistance power switching device |
| USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
| USD752000S1 (en) | 2013-03-07 | 2016-03-22 | Vlt, Inc. | Semiconductor device |
| USD761745S1 (en) * | 2013-06-28 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| USD732487S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD758329S1 (en) * | 2013-08-06 | 2016-06-07 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD732488S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD994624S1 (en) * | 2021-03-23 | 2023-08-08 | Rohm Co., Ltd. | Power semiconductor module |
| USD1021831S1 (en) * | 2021-03-23 | 2024-04-09 | Rohm Co., Ltd. | Power semiconductor module |
| USD1030686S1 (en) * | 2021-03-23 | 2024-06-11 | Rohm Co., Ltd. | Power semiconductor module |
| USD1056861S1 (en) * | 2021-03-23 | 2025-01-07 | Rohm Co., Ltd. | Power semiconductor module |
Also Published As
| Publication number | Publication date |
|---|---|
| USD737229S1 (en) | 2015-08-25 |
| USD737230S1 (en) | 2015-08-25 |
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