USD701843S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD701843S1
USD701843S1 US29/389,545 US201129389545F USD701843S US D701843 S1 USD701843 S1 US D701843S1 US 201129389545 F US201129389545 F US 201129389545F US D701843 S USD701843 S US D701843S
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United States
Prior art keywords
semiconductor device
view
ornamental design
showing
indicia
Prior art date
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US29/389,545
Inventor
Takeyoshi Masuda
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD. reassignment SUMITOMO ELECTRIC INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MASUDA, TAKEYOSHI
Priority to US29/481,535 priority Critical patent/USD737229S1/en
Priority to US29/481,536 priority patent/USD737230S1/en
Application granted granted Critical
Publication of USD701843S1 publication Critical patent/USD701843S1/en
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FIG. 1 is a front view of a semiconductor device of a third embodiment showing my new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is an enlarged perspective view showing the area defined by indicia 7A and 7B of FIG. 1 thereof; and,
FIG. 8 is an enlarged perspective view showing the area defined by indicia 7A and 8C of FIG. 1 thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown.
US29/389,545 2010-12-28 2011-04-13 Semiconductor device Active USD701843S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/481,535 USD737229S1 (en) 2010-12-28 2014-02-06 Semiconductor device
US29/481,536 USD737230S1 (en) 2010-12-28 2014-02-06 Semiconductor device

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2010031448 2010-12-28
JP2010031446 2010-12-28
JPD.2010-031446 2010-12-28
JP2010031447 2010-12-28
JPD.2010-031448 2010-12-28
JPD.2010-031447 2010-12-28

Related Child Applications (2)

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US29/481,536 Division USD737230S1 (en) 2010-12-28 2014-02-06 Semiconductor device
US29/481,535 Division USD737229S1 (en) 2010-12-28 2014-02-06 Semiconductor device

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Publication Number Publication Date
USD701843S1 true USD701843S1 (en) 2014-04-01

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US29/389,545 Active USD701843S1 (en) 2010-12-28 2011-04-13 Semiconductor device
US29/481,536 Active USD737230S1 (en) 2010-12-28 2014-02-06 Semiconductor device
US29/481,535 Active USD737229S1 (en) 2010-12-28 2014-02-06 Semiconductor device

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US29/481,536 Active USD737230S1 (en) 2010-12-28 2014-02-06 Semiconductor device
US29/481,535 Active USD737229S1 (en) 2010-12-28 2014-02-06 Semiconductor device

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD737230S1 (en) * 2010-12-28 2015-08-25 Sumitomo Electric Industries, Ltd. Semiconductor device
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD994624S1 (en) * 2021-03-23 2023-08-08 Rohm Co., Ltd. Power semiconductor module
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module
USD1030686S1 (en) * 2021-03-23 2024-06-11 Rohm Co., Ltd. Power semiconductor module
USD1056861S1 (en) * 2021-03-23 2025-01-07 Rohm Co., Ltd. Power semiconductor module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1555473S (en) * 2015-10-26 2016-08-08
JP1555474S (en) * 2015-10-26 2016-08-08

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USD574339S1 (en) * 2005-06-24 2008-08-05 Nitto Denko Corporation Pattern formed on the ground layer of a multilayer printed circuit board
US20100000765A1 (en) * 2006-07-15 2010-01-07 Sharp Kabushiki Kaisha Substrate for a display panel, a display panel having the substrate, a production process of the substrate, and a production process of the display panel
US20100132981A1 (en) * 2008-11-28 2010-06-03 Kabushiki Kaisha Toshiba Printed wiring board and electronic apparatus
US20100163282A1 (en) * 2006-10-24 2010-07-01 Hiroyoshi Tagi Printed wiring board, method for manufacturing printed wiring board, and electric device
US20100175912A1 (en) * 2009-01-15 2010-07-15 Shih Juei-Tao Ic package having colored pattern
US20100200276A1 (en) * 2009-02-11 2010-08-12 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
US7981709B2 (en) * 2007-04-05 2011-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device and method for fabricating the same
US20120118614A1 (en) * 2009-11-20 2012-05-17 Fujifilm Corporation Conductive sheet, method for using conductive sheet, and capacitive touch panel
US20120186855A1 (en) * 2011-01-24 2012-07-26 Teh-Zheng Lin Substrate of touch panel in manufacturing and the method for forming the same
US20120205141A1 (en) * 2011-02-10 2012-08-16 Fujikura Ltd. Printed wiring board

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US6969909B2 (en) * 2002-12-20 2005-11-29 Vlt, Inc. Flip chip FET device
US6897561B2 (en) * 2003-06-06 2005-05-24 Semiconductor Components Industries, Llc Semiconductor power device having a diamond shaped metal interconnect scheme
JP4810072B2 (en) * 2004-06-15 2011-11-09 株式会社東芝 Nitrogen compound-containing semiconductor devices
CN101207968B (en) * 2006-12-22 2011-11-09 鸿富锦精密工业(深圳)有限公司 Circuit board
US9029866B2 (en) * 2009-08-04 2015-05-12 Gan Systems Inc. Gallium nitride power devices using island topography
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AU2011241423A1 (en) * 2010-04-13 2012-11-08 Gan Systems Inc. High density gallium nitride devices using island topology
CN102403310A (en) * 2010-09-13 2012-04-04 登丰微电子股份有限公司 Metal Oxide Semiconductor Field Effect Transistor Layout and Structure
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
JP1463922S (en) * 2012-05-02 2016-02-29
TWI457055B (en) * 2013-02-20 2014-10-11 Novatek Microelectronics Corp Flexible circuit board and ground line strucure

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060267030A1 (en) * 2002-04-24 2006-11-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing same
USD574339S1 (en) * 2005-06-24 2008-08-05 Nitto Denko Corporation Pattern formed on the ground layer of a multilayer printed circuit board
US20100000765A1 (en) * 2006-07-15 2010-01-07 Sharp Kabushiki Kaisha Substrate for a display panel, a display panel having the substrate, a production process of the substrate, and a production process of the display panel
US20100163282A1 (en) * 2006-10-24 2010-07-01 Hiroyoshi Tagi Printed wiring board, method for manufacturing printed wiring board, and electric device
US7981709B2 (en) * 2007-04-05 2011-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device and method for fabricating the same
US8203151B2 (en) * 2007-04-05 2012-06-19 Sumitomo Electric Industries, Ltd. Semiconductor device and method for fabricating the same
US20100132981A1 (en) * 2008-11-28 2010-06-03 Kabushiki Kaisha Toshiba Printed wiring board and electronic apparatus
US20100175912A1 (en) * 2009-01-15 2010-07-15 Shih Juei-Tao Ic package having colored pattern
US20100200276A1 (en) * 2009-02-11 2010-08-12 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
US20120118614A1 (en) * 2009-11-20 2012-05-17 Fujifilm Corporation Conductive sheet, method for using conductive sheet, and capacitive touch panel
US20120186855A1 (en) * 2011-01-24 2012-07-26 Teh-Zheng Lin Substrate of touch panel in manufacturing and the method for forming the same
US20120205141A1 (en) * 2011-02-10 2012-08-16 Fujikura Ltd. Printed wiring board

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD737230S1 (en) * 2010-12-28 2015-08-25 Sumitomo Electric Industries, Ltd. Semiconductor device
USD737229S1 (en) * 2010-12-28 2015-08-25 Sumitomo Electric Industries, Ltd. Semiconductor device
US9269661B1 (en) 2013-03-07 2016-02-23 Vlt, Inc. Low resistance power switching device
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD994624S1 (en) * 2021-03-23 2023-08-08 Rohm Co., Ltd. Power semiconductor module
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module
USD1030686S1 (en) * 2021-03-23 2024-06-11 Rohm Co., Ltd. Power semiconductor module
USD1056861S1 (en) * 2021-03-23 2025-01-07 Rohm Co., Ltd. Power semiconductor module

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USD737229S1 (en) 2015-08-25
USD737230S1 (en) 2015-08-25

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