USD689831S1 - Adhesive tape for semiconductor manufacturing - Google Patents
Adhesive tape for semiconductor manufacturing Download PDFInfo
- Publication number
- USD689831S1 USD689831S1 US29/413,548 US201229413548F USD689831S US D689831 S1 USD689831 S1 US D689831S1 US 201229413548 F US201229413548 F US 201229413548F US D689831 S USD689831 S US D689831S
- Authority
- US
- United States
- Prior art keywords
- adhesive tape
- semiconductor manufacturing
- view
- design
- sectional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002390 adhesive tape Substances 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000004065 semiconductor Substances 0.000 title claims description 3
Images
Description
The dashed line showing of the adhesive tape is for purposes of illustrating portions of the adhesive tape and forms no part of the claimed design.
The broken lines having alternating long and short segments define bounds of the claimed design and form no part thereof.
Claims (1)
- The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/413,548 USD689831S1 (en) | 2010-10-15 | 2012-02-16 | Adhesive tape for semiconductor manufacturing |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2010-024762 | 2010-10-15 | ||
JP2010024762 | 2010-10-15 | ||
US29/389,790 USD664511S1 (en) | 2010-10-15 | 2011-04-15 | Adhesive tape for semiconductor manufacturing |
US29/413,548 USD689831S1 (en) | 2010-10-15 | 2012-02-16 | Adhesive tape for semiconductor manufacturing |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/389,790 Continuation USD664511S1 (en) | 2010-10-15 | 2011-04-15 | Adhesive tape for semiconductor manufacturing |
Publications (1)
Publication Number | Publication Date |
---|---|
USD689831S1 true USD689831S1 (en) | 2013-09-17 |
Family
ID=46547922
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/389,790 Active USD664511S1 (en) | 2010-10-15 | 2011-04-15 | Adhesive tape for semiconductor manufacturing |
US29/413,548 Active USD689831S1 (en) | 2010-10-15 | 2012-02-16 | Adhesive tape for semiconductor manufacturing |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/389,790 Active USD664511S1 (en) | 2010-10-15 | 2011-04-15 | Adhesive tape for semiconductor manufacturing |
Country Status (1)
Country | Link |
---|---|
US (2) | USD664511S1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD804435S1 (en) * | 2010-10-15 | 2017-12-05 | Hitachi Chemical Company, Ltd. | Flap in an adhesive tape for semiconductor manufacturing |
USD946540S1 (en) * | 2020-11-02 | 2022-03-22 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD962882S1 (en) * | 2019-11-14 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD962883S1 (en) * | 2020-11-02 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101532640B1 (en) | 2010-06-11 | 2015-07-01 | 가부시키가이샤 리코 | Device removably installable in image forming apparatus |
-
2011
- 2011-04-15 US US29/389,790 patent/USD664511S1/en active Active
-
2012
- 2012-02-16 US US29/413,548 patent/USD689831S1/en active Active
Non-Patent Citations (7)
Title |
---|
Office Action dated Jan. 18, 2013, in Design U.S. Appl. No. 29/413,539. |
Taniguchi et al., Design U.S. Appl. No. 29/389,788, filed Apr. 15, 2011. |
Taniguchi et al., Design U.S. Appl. No. 29/389,794, filed Apr. 15, 2011. |
Taniguchi et al., Design U.S. Appl. No. 29/389,797, filed Apr. 15, 2011. |
Taniguchi et al., Design U.S. Appl. No. 29/413,509, filed Feb. 16, 2012. |
Taniguchi et al., Design U.S. Appl. No. 29/413,518, filed Feb. 16, 2012. |
Taniguchi et al., Design U.S. Appl. No. 29/413,539, filed Feb. 16, 2012. |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD804435S1 (en) * | 2010-10-15 | 2017-12-05 | Hitachi Chemical Company, Ltd. | Flap in an adhesive tape for semiconductor manufacturing |
USD962882S1 (en) * | 2019-11-14 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD998577S1 (en) | 2019-11-14 | 2023-09-12 | Resonac Corporation | Temporary protective film for manufacturing semiconductor devices |
USD946540S1 (en) * | 2020-11-02 | 2022-03-22 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD962883S1 (en) * | 2020-11-02 | 2022-09-06 | Showa Denko Materials Co., Ltd. | Temporary protective film for manufacturing semiconductor devices |
USD999179S1 (en) | 2020-11-02 | 2023-09-19 | Resonac Corporation | Temporary protective film for manufacturing semiconductor devices |
Also Published As
Publication number | Publication date |
---|---|
USD664511S1 (en) | 2012-07-31 |
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