USD689831S1 - Adhesive tape for semiconductor manufacturing - Google Patents

Adhesive tape for semiconductor manufacturing Download PDF

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Publication number
USD689831S1
USD689831S1 US29/413,548 US201229413548F USD689831S US D689831 S1 USD689831 S1 US D689831S1 US 201229413548 F US201229413548 F US 201229413548F US D689831 S USD689831 S US D689831S
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US
United States
Prior art keywords
adhesive tape
semiconductor manufacturing
view
design
sectional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/413,548
Inventor
Kouhei Taniguchi
Takayuki Matsuzaki
Shinya Katou
Kouji Komorida
Michio Mashino
Tatsuya Sakuta
Rie Katou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to US29/413,548 priority Critical patent/USD689831S1/en
Assigned to HITACHI CHEMICAL COMPANY, LTD. reassignment HITACHI CHEMICAL COMPANY, LTD. CHANGE OF ADDRESS Assignors: HITACHI CHEMICAL COMPANY, LTD.
Application granted granted Critical
Publication of USD689831S1 publication Critical patent/USD689831S1/en
Assigned to SHOWA DENKO MATERIALS CO., LTD. reassignment SHOWA DENKO MATERIALS CO., LTD. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI CHEMICAL COMPANY, LTD.
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: SHOWA DENKO MATERIALS CO., LTD.
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF ADDRESS Assignors: RESONAC CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top plan view of an adhesive tape for semiconductor manufacturing incorporating our new design;
FIG. 2 is a bottom plan view of the adhesive tape of FIG. 1;
FIG. 3 is a rear side view of the adhesive tape of FIG. 1;
FIG. 4 is a front side view of the adhesive tape of FIG. 1;
FIG. 5 is a right side view of the adhesive tape of FIG. 1;
FIG. 6 is a left side view of the adhesive tape of FIG. 1;
FIG. 7 is a cross-sectional view taken at line 7-7 in FIG. 1;
FIG. 8 is a cross-sectional view taken at line 8-8 in FIG. 1;
FIG. 9 is an enlarged view of portion 9-9 in FIG. 7; and,
FIG. 10 is an enlarged view of portions 10-10, 11-11 in FIG. 1.
The dashed line showing of the adhesive tape is for purposes of illustrating portions of the adhesive tape and forms no part of the claimed design.
The broken lines having alternating long and short segments define bounds of the claimed design and form no part thereof.

Claims (1)

    CLAIM
  1. The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.
US29/413,548 2010-10-15 2012-02-16 Adhesive tape for semiconductor manufacturing Active USD689831S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/413,548 USD689831S1 (en) 2010-10-15 2012-02-16 Adhesive tape for semiconductor manufacturing

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPD2010-024762 2010-10-15
JP2010024762 2010-10-15
US29/389,790 USD664511S1 (en) 2010-10-15 2011-04-15 Adhesive tape for semiconductor manufacturing
US29/413,548 USD689831S1 (en) 2010-10-15 2012-02-16 Adhesive tape for semiconductor manufacturing

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/389,790 Continuation USD664511S1 (en) 2010-10-15 2011-04-15 Adhesive tape for semiconductor manufacturing

Publications (1)

Publication Number Publication Date
USD689831S1 true USD689831S1 (en) 2013-09-17

Family

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Family Applications (2)

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US29/389,790 Active USD664511S1 (en) 2010-10-15 2011-04-15 Adhesive tape for semiconductor manufacturing
US29/413,548 Active USD689831S1 (en) 2010-10-15 2012-02-16 Adhesive tape for semiconductor manufacturing

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/389,790 Active USD664511S1 (en) 2010-10-15 2011-04-15 Adhesive tape for semiconductor manufacturing

Country Status (1)

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US (2) USD664511S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD804435S1 (en) * 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD946540S1 (en) * 2020-11-02 2022-03-22 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101532640B1 (en) 2010-06-11 2015-07-01 가부시키가이샤 리코 Device removably installable in image forming apparatus

Non-Patent Citations (7)

* Cited by examiner, † Cited by third party
Title
Office Action dated Jan. 18, 2013, in Design U.S. Appl. No. 29/413,539.
Taniguchi et al., Design U.S. Appl. No. 29/389,788, filed Apr. 15, 2011.
Taniguchi et al., Design U.S. Appl. No. 29/389,794, filed Apr. 15, 2011.
Taniguchi et al., Design U.S. Appl. No. 29/389,797, filed Apr. 15, 2011.
Taniguchi et al., Design U.S. Appl. No. 29/413,509, filed Feb. 16, 2012.
Taniguchi et al., Design U.S. Appl. No. 29/413,518, filed Feb. 16, 2012.
Taniguchi et al., Design U.S. Appl. No. 29/413,539, filed Feb. 16, 2012.

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD804435S1 (en) * 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD998577S1 (en) 2019-11-14 2023-09-12 Resonac Corporation Temporary protective film for manufacturing semiconductor devices
USD946540S1 (en) * 2020-11-02 2022-03-22 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD999179S1 (en) 2020-11-02 2023-09-19 Resonac Corporation Temporary protective film for manufacturing semiconductor devices

Also Published As

Publication number Publication date
USD664511S1 (en) 2012-07-31

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