USD651992S1 - Semiconductor substrate - Google Patents

Semiconductor substrate Download PDF

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Publication number
USD651992S1
USD651992S1 US29/379,485 US37948510F USD651992S US D651992 S1 USD651992 S1 US D651992S1 US 37948510 F US37948510 F US 37948510F US D651992 S USD651992 S US D651992S
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United States
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semiconductor substrate
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ornamental design
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US29/379,485
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English (en)
Inventor
Taro Nishiguchi
Makoto Sasaki
Shin Harada
Shinsuke Fujiwara
Yasuo Namikawa
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD. reassignment SUMITOMO ELECTRIC INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAMIKAWA, YASUO, HARADA, SHIN, FUJIWARA, SHINSUKE, NISHIGUCHI, TARO, SASAKI, MAKOTO
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US29/379,485 2010-08-17 2010-11-19 Semiconductor substrate Active USD651992S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2010-019920 2010-08-17
JPD2010-19920F JP1441120S (cs) 2010-08-17 2010-08-17

Publications (1)

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USD651992S1 true USD651992S1 (en) 2012-01-10

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US (1) USD651992S1 (cs)
JP (1) JP1441120S (cs)
CA (1) CA138032S (cs)

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD690672S1 (en) * 2011-10-04 2013-10-01 Kabushiki Kaisha Yaskawa Denki Encoder optical module
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD700441S1 (en) * 2011-10-14 2014-03-04 Under Armour, Inc. Camouflage pattern
USD700440S1 (en) * 2011-10-14 2014-03-04 Under Armour, Inc. Camouflage pattern
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD702240S1 (en) * 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus
USD716241S1 (en) * 2013-07-11 2014-10-28 Sumitomo Electric Printed Circuits, Inc. Wiring board
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD716741S1 (en) * 2013-07-11 2014-11-04 Sumitomo Electric Printed Circuits, Inc. Wiring board
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) * 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD789311S1 (en) * 2015-12-28 2017-06-13 Hitachi Kokusai Electric Inc. Pattern wafer
USD791091S1 (en) * 2015-12-28 2017-07-04 Hitachi Kokusai Electric Inc. Pattern wafer
USD808664S1 (en) 2016-05-16 2018-01-30 Ninja Brand Incorporated Sheet with camouflage pattern
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
USD924823S1 (en) * 2018-07-19 2021-07-13 Kokusai Electric Corporation Adiabatic plate for substrate processing apparatus
USD947144S1 (en) * 2019-05-10 2022-03-29 Tdk Corporation Vibration element for a haptic actuator

Citations (20)

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USD262962S (en) * 1978-11-03 1982-02-09 Strumpell Winton C Silicon wafer emitter electrode configuration
US4630093A (en) * 1983-11-24 1986-12-16 Sumitomo Electric Industries, Ltd. Wafer of semiconductors
US5182233A (en) * 1989-08-02 1993-01-26 Kabushiki Kaisha Toshiba Compound semiconductor pellet, and method for dicing compound semiconductor wafer
US20050106839A1 (en) * 2001-07-24 2005-05-19 Seiko Epson Corporation Transfer method, method of manufacturing thin film devices, method of maufacturing integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, IC card, and electronic appliance
US6927416B2 (en) * 2002-12-26 2005-08-09 Disco Corporation Wafer support plate
JP2005260154A (ja) 2004-03-15 2005-09-22 Tokyo Seimitsu Co Ltd チップ製造方法
US20050287846A1 (en) * 2004-06-29 2005-12-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit, and element substrate
US20060038182A1 (en) * 2004-06-04 2006-02-23 The Board Of Trustees Of The University Stretchable semiconductor elements and stretchable electrical circuits
US20060091402A1 (en) * 2004-10-29 2006-05-04 Sixon Ltd. Silicon carbide single crystal, silicon carbide substrate and manufacturing method for silicon carbide single crystal
US7112952B2 (en) * 2004-01-30 2006-09-26 Semiconductor Energy Laboratory Co., Ltd. Inspection system, inspection method, and method for manufacturing semiconductor device
US20070082508A1 (en) * 2005-10-11 2007-04-12 Chiang Tony P Methods for discretized processing and process sequence integration of regions of a substrate
US7205639B2 (en) * 2005-03-09 2007-04-17 Infineon Technologies Ag Semiconductor devices with rotated substrates and methods of manufacture thereof
US20090011598A1 (en) * 2007-07-05 2009-01-08 Denso Corporation Method of manufacturing semiconductor device including silicon carbide substrate
US7476575B2 (en) * 2004-06-24 2009-01-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit
USD589473S1 (en) * 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
US7705430B2 (en) * 2005-04-27 2010-04-27 Disco Corporation Semiconductor wafer and processing method for same
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US20100176403A1 (en) * 2009-01-13 2010-07-15 Sumitomo Electric Industries, Ltd. Silicon carbide substrate, epitaxial wafer and manufacturing method of silicon carbide substrate
US20110111593A1 (en) * 2009-11-09 2011-05-12 Masahiro Kanno Pattern formation method, pattern formation system, and method for manufacturing semiconductor device
USD638382S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD262962S (en) * 1978-11-03 1982-02-09 Strumpell Winton C Silicon wafer emitter electrode configuration
US4630093A (en) * 1983-11-24 1986-12-16 Sumitomo Electric Industries, Ltd. Wafer of semiconductors
US5182233A (en) * 1989-08-02 1993-01-26 Kabushiki Kaisha Toshiba Compound semiconductor pellet, and method for dicing compound semiconductor wafer
US20050106839A1 (en) * 2001-07-24 2005-05-19 Seiko Epson Corporation Transfer method, method of manufacturing thin film devices, method of maufacturing integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, IC card, and electronic appliance
US6927416B2 (en) * 2002-12-26 2005-08-09 Disco Corporation Wafer support plate
US7112952B2 (en) * 2004-01-30 2006-09-26 Semiconductor Energy Laboratory Co., Ltd. Inspection system, inspection method, and method for manufacturing semiconductor device
JP2005260154A (ja) 2004-03-15 2005-09-22 Tokyo Seimitsu Co Ltd チップ製造方法
US20060038182A1 (en) * 2004-06-04 2006-02-23 The Board Of Trustees Of The University Stretchable semiconductor elements and stretchable electrical circuits
US7476575B2 (en) * 2004-06-24 2009-01-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit
US20050287846A1 (en) * 2004-06-29 2005-12-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit, and element substrate
US20060091402A1 (en) * 2004-10-29 2006-05-04 Sixon Ltd. Silicon carbide single crystal, silicon carbide substrate and manufacturing method for silicon carbide single crystal
US7205639B2 (en) * 2005-03-09 2007-04-17 Infineon Technologies Ag Semiconductor devices with rotated substrates and methods of manufacture thereof
US7705430B2 (en) * 2005-04-27 2010-04-27 Disco Corporation Semiconductor wafer and processing method for same
US20070082508A1 (en) * 2005-10-11 2007-04-12 Chiang Tony P Methods for discretized processing and process sequence integration of regions of a substrate
USD589473S1 (en) * 2007-05-30 2009-03-31 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
US20090011598A1 (en) * 2007-07-05 2009-01-08 Denso Corporation Method of manufacturing semiconductor device including silicon carbide substrate
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
US20100176403A1 (en) * 2009-01-13 2010-07-15 Sumitomo Electric Industries, Ltd. Silicon carbide substrate, epitaxial wafer and manufacturing method of silicon carbide substrate
US20110111593A1 (en) * 2009-11-09 2011-05-12 Masahiro Kanno Pattern formation method, pattern formation system, and method for manufacturing semiconductor device
USD638382S1 (en) * 2010-04-09 2011-05-24 Panasonic Electric Works Co., Ltd. Electroluminescence module

Non-Patent Citations (7)

* Cited by examiner, † Cited by third party
Title
U.S. Appl. No. 29/379,460, filed Nov. 19, 2010, Taro Nishiguchi et al.
U.S. Appl. No. 29/379,471, filed Nov. 19, 2010, Taro Nishiguchi et al.
U.S. Appl. No. 29/379,488, filed Nov. 19, 2010, Taro Nishiguchi et al.
U.S. Notice of Allowance dated Aug. 30, 2011, issued in U.S. Appl. No. 29/379,471.
U.S. Notice of Allowance dated Jul. 18, 2011, issued in U.S. Appl. No. 29/379,471.
U.S. Notice of Allowance dated Jul. 25, 2011, issued in U.S. Appl. No. 29/379,460.
U.S. Office Action dated Jul. 22, 2011, issued in U.S. Appl. No. 29/379,488.

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD690672S1 (en) * 2011-10-04 2013-10-01 Kabushiki Kaisha Yaskawa Denki Encoder optical module
USD700440S1 (en) * 2011-10-14 2014-03-04 Under Armour, Inc. Camouflage pattern
USD700441S1 (en) * 2011-10-14 2014-03-04 Under Armour, Inc. Camouflage pattern
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD702240S1 (en) * 2012-04-13 2014-04-08 Blackberry Limited UICC apparatus
USD703208S1 (en) * 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD699201S1 (en) * 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
USD839220S1 (en) 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD716741S1 (en) * 2013-07-11 2014-11-04 Sumitomo Electric Printed Circuits, Inc. Wiring board
USD716241S1 (en) * 2013-07-11 2014-10-28 Sumitomo Electric Printed Circuits, Inc. Wiring board
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD786810S1 (en) * 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD789311S1 (en) * 2015-12-28 2017-06-13 Hitachi Kokusai Electric Inc. Pattern wafer
USD791091S1 (en) * 2015-12-28 2017-07-04 Hitachi Kokusai Electric Inc. Pattern wafer
USD846513S1 (en) * 2016-04-27 2019-04-23 Ngk Insulators, Ltd. Sheet heater for electrostatic chuck
USD808664S1 (en) 2016-05-16 2018-01-30 Ninja Brand Incorporated Sheet with camouflage pattern
USD924823S1 (en) * 2018-07-19 2021-07-13 Kokusai Electric Corporation Adiabatic plate for substrate processing apparatus
USD947144S1 (en) * 2019-05-10 2022-03-29 Tdk Corporation Vibration element for a haptic actuator

Also Published As

Publication number Publication date
JP1441120S (cs) 2015-05-11
CA138032S (en) 2011-11-17

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