USD581237S1 - Polishing pad - Google Patents

Polishing pad Download PDF

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Publication number
USD581237S1
USD581237S1 US29/296,712 US29671207F USD581237S US D581237 S1 USD581237 S1 US D581237S1 US 29671207 F US29671207 F US 29671207F US D581237 S USD581237 S US D581237S
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Prior art keywords
polishing pad
view
sectional
cross
taken
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US29/296,712
Inventor
Takahiro Okamoto
Hiroshi Shiho
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JSR Corp
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JSR Corp
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FIG. 1 is a top plan view of a polishing pad, showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a front elevational view thereof, the left side elevational view, the right side elevational view and the rear elevational view being a mirror image of the front view shown;
FIG. 4 is an enlarged, partial view thereof taken at coordinates 44 in FIG. 1;
FIG. 5 is a greatly enlarged, view thereof taken at coordinates 55 in FIG. 1;
FIG. 6 is a cross-sectional view thereof taken along line 66 in FIG. 5;
FIG. 7 is a greatly enlarged, partial cross-sectional view of part 7 shown in FIG. 6;
FIG. 8 is a greatly enlarged, partial view thereof taken at coordinates 8-5 in FIG. 1;
FIG. 9 is a cross-sectional view thereof taken along line 99 in FIG. 8;
FIG. 10 is a further enlargement of the cross-sectional view of part 10 in FIG. 9;
FIG. 11 is a further enlargement of the cross-sectional view of part 11 in FIG. 7; and,
FIG. 12 is a further enlargement of the cross-sectional view of part 12 of FIG. 10.

Claims (1)

    CLAIM
  1. The ornamental design for a polishing pad, as shown and described.
US29/296,712 2004-03-17 2007-10-26 Polishing pad Expired - Lifetime USD581237S1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2004-8160 2004-03-17
JP2004008159 2004-03-17
JP2004008160 2004-03-17
JP2007-8159 2004-03-17
US29/213,405 USD559063S1 (en) 2004-03-17 2004-09-17 Polishing pad

Related Parent Applications (1)

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US29/213,405 Division USD559063S1 (en) 2004-03-17 2004-09-17 Polishing pad

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USD581237S1 true USD581237S1 (en) 2008-11-25

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US29/213,405 Expired - Lifetime USD559063S1 (en) 2004-03-17 2004-09-17 Polishing pad
US29/296,712 Expired - Lifetime USD581237S1 (en) 2004-03-17 2007-10-26 Polishing pad

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US29/213,405 Expired - Lifetime USD559063S1 (en) 2004-03-17 2004-09-17 Polishing pad

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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD592030S1 (en) * 2004-10-26 2009-05-12 Jsr Corporation Polishing pad
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
USD795666S1 (en) * 2014-06-06 2017-08-29 Diamond Tool Supply, Inc. Polishing pad
US10011999B2 (en) 2014-09-18 2018-07-03 Diamond Tool Supply, Inc. Method for finishing a surface using a grouting pan
US10246885B2 (en) 2014-09-18 2019-04-02 Husqvarna Construction Products North America, Inc. Grouting pan assembly with reinforcement ring
USD854902S1 (en) 2016-09-23 2019-07-30 Husqvarna Construction Products North America, Inc. Polishing or grinding pad
US10414012B2 (en) 2017-01-13 2019-09-17 Husqvarna Construction Products North America, Inc. Grinding pad apparatus
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
US10667665B2 (en) 2015-09-24 2020-06-02 Husqvarna Ab Method of using polishing or grinding pad assembly
US10710214B2 (en) 2018-01-11 2020-07-14 Husqvarna Ab Polishing or grinding pad with multilayer reinforcement
USD919396S1 (en) 2017-08-30 2021-05-18 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
USD927952S1 (en) 2017-08-30 2021-08-17 Husqvarna Ab Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
USD958626S1 (en) 2017-08-30 2022-07-26 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD117939S1 (en) * 2005-07-29 2007-07-01 東京威力科創股份有限公司 Top panel for microwave introduction window of plasma processing apparatus
USD740637S1 (en) * 2012-10-31 2015-10-13 Kwh Mirka Ltd Backing pad
USD1000928S1 (en) * 2022-06-03 2023-10-10 Beng Youl Cho Polishing pad

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US20020173231A1 (en) 2001-04-25 2002-11-21 Jsr Corporation Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer
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US6544111B1 (en) 1998-01-30 2003-04-08 Ebara Corporation Polishing apparatus and polishing table therefor
US20030068964A1 (en) 2001-10-05 2003-04-10 Governor Of Akita Prefecture Polishing apparatus
US6561890B2 (en) 1999-12-28 2003-05-13 Ace Inc. Polishing pad
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US20030207651A1 (en) 2002-05-06 2003-11-06 Seung-Kon Kim Polishing endpoint detecting method, device for detecting a polishing endpoint of a polishing process and chemical-mechanical polishing apparatus comprising the same
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USD541317S1 (en) * 2006-02-01 2007-04-24 3M Innovative Properties Company Abrasive article with holes
US7229337B2 (en) * 2003-06-16 2007-06-12 Samsung Electronics Co., Ltd. Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting
US7255629B2 (en) * 1995-03-28 2007-08-14 Applied Materials, Inc. Polishing assembly with a window
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US7273407B2 (en) * 2005-08-18 2007-09-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Transparent polishing pad
US20070232200A1 (en) * 2006-03-31 2007-10-04 Tmp Co., Ltd. Grinding sheet and grinding method
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USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
USD559065S1 (en) * 2004-10-05 2008-01-08 Jsr Corporation Polishing pad
USD559648S1 (en) * 2004-10-05 2008-01-15 Jsr Corporation Polishing pad
US20080020690A1 (en) * 2004-05-07 2008-01-24 Applied Materials, Inc. Reducing polishing pad deformation
USD560457S1 (en) * 2004-10-05 2008-01-29 Jsr Corporation Polishing pad
US20080032602A1 (en) * 2004-01-08 2008-02-07 Strasbaugh Devices and Methods for Optical Endpoint Detection During Semiconductor Wafer Polishing

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* Cited by examiner, † Cited by third party
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US1092588A (en) 1914-01-05 1914-04-07 Albert Monkiawicz Grinding-wheel.
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Title
U.S. Appl. No. 29/295,220, filed Sep. 24, 2007, Okamoto, et al.
U.S. Appl. No. 29/296,712, filed Oct. 26, 2007, Okamoto, et al.

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD592030S1 (en) * 2004-10-26 2009-05-12 Jsr Corporation Polishing pad
USD592029S1 (en) * 2004-10-26 2009-05-12 Jsr Corporation Polishing pad
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
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