USD523403S1 - Substrate for a semiconductor device - Google Patents

Substrate for a semiconductor device Download PDF

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Publication number
USD523403S1
USD523403S1 US29/217,556 US21755604F USD523403S US D523403 S1 USD523403 S1 US D523403S1 US 21755604 F US21755604 F US 21755604F US D523403 S USD523403 S US D523403S
Authority
US
United States
Prior art keywords
substrate
semiconductor device
ornamental design
elevational view
mirror image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/217,556
Inventor
Yukiko Mizukoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIZUKOSHI, YUKIKO
Application granted granted Critical
Publication of USD523403S1 publication Critical patent/USD523403S1/en
Assigned to TOSHIBA MEMORY CORPORATION reassignment TOSHIBA MEMORY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KABUSHIKI KAISHA TOSHIBA
Assigned to KIOXIA CORPORATION reassignment KIOXIA CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: TOSHIBA MEMORY CORPORATION
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a substrate for a semiconductor device, showing my new design; the opposite side being a mirror image thereof;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a right side elevational view thereof; the opposite side being a mirror image thereof; and,
FIG. 4 is a rear elevational view thereof.

Claims (1)

  1. The ornamental design for a substrate for a semiconductor device, as shown and described.
US29/217,556 2004-09-09 2004-11-19 Substrate for a semiconductor device Expired - Lifetime USD523403S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004027496 2004-09-09

Publications (1)

Publication Number Publication Date
USD523403S1 true USD523403S1 (en) 2006-06-20

Family

ID=36586831

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/217,556 Expired - Lifetime USD523403S1 (en) 2004-09-09 2004-11-19 Substrate for a semiconductor device

Country Status (1)

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US (1) USD523403S1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD973030S1 (en) * 2021-02-23 2022-12-20 Dong Woon Anatech Co., Ltd Semiconductor device
USD989013S1 (en) * 2021-06-18 2023-06-13 Dong Woon Anatech Co., Ltd Semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD1046799S1 (en) 2018-10-31 2024-10-15 Asahi Kasei Microdevices Corporation Semiconductor module
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD973030S1 (en) * 2021-02-23 2022-12-20 Dong Woon Anatech Co., Ltd Semiconductor device
USD989013S1 (en) * 2021-06-18 2023-06-13 Dong Woon Anatech Co., Ltd Semiconductor device

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