USD480371S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD480371S1 USD480371S1 US29/161,321 US16132102F USD480371S US D480371 S1 USD480371 S1 US D480371S1 US 16132102 F US16132102 F US 16132102F US D480371 S USD480371 S US D480371S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- elevational view
- ornamental design
- mirror image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 3
Images
Description
FIG. 1 is a front, bottom and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof; and,
FIG. 5 is a rear elevational view thereof.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001035198 | 2001-11-30 | ||
| JP2001-035198 | 2001-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD480371S1 true USD480371S1 (en) | 2003-10-07 |
Family
ID=28658863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/161,321 Expired - Lifetime USD480371S1 (en) | 2001-11-30 | 2002-05-29 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD480371S1 (en) |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD694724S1 (en) * | 2012-10-03 | 2013-12-03 | Honda Motor Co., Ltd. | Semiconductor device |
| USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD720310S1 (en) * | 2011-06-17 | 2014-12-30 | Soraa, Inc. | Triangular semiconductor die |
| USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
| US8975694B1 (en) | 2013-03-07 | 2015-03-10 | Vlt, Inc. | Low resistance power switching device |
| USD732488S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD732487S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD758329S1 (en) * | 2013-08-06 | 2016-06-07 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD763806S1 (en) * | 2012-12-12 | 2016-08-16 | Soraa, Inc. | Triangular semiconductor die |
| USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
| USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
| USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
| USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
| USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD1043594S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1043595S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1052545S1 (en) * | 2022-11-01 | 2024-11-26 | Rohm Co., Ltd. | Semiconductor device |
| USD1059315S1 (en) * | 2022-11-02 | 2025-01-28 | Ganrich Semiconductor Corporation | Package structure for a semiconductor element |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD259559S (en) | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
| US5105257A (en) | 1990-08-08 | 1992-04-14 | Mitsubishi Denki Kabushiki Kaisha | Packaged semiconductor device and semiconductor device packaging element |
| US5309018A (en) | 1992-04-28 | 1994-05-03 | Rohm Co., Ltd. | Lead frame having deformable supports |
| US5585670A (en) | 1995-09-05 | 1996-12-17 | Mitsubishi Electric Semiconductor Software Co. | Semiconductor device package |
| US5925927A (en) | 1996-12-18 | 1999-07-20 | Texas Instruments Incoporated | Reinforced thin lead frames and leads |
| USD416872S (en) | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
| US6020625A (en) | 1998-03-27 | 2000-02-01 | Mitsubishi Denki Kabushiki Kaisha | Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame |
| US6093957A (en) | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
| US6177718B1 (en) | 1998-04-28 | 2001-01-23 | Kabushiki Kaisha Toshiba | Resin-sealed semiconductor device |
| USD473199S1 (en) | 2001-11-30 | 2003-04-15 | Kabushiki Kaisha Toshiba | Portion of semiconductor device |
-
2002
- 2002-05-29 US US29/161,321 patent/USD480371S1/en not_active Expired - Lifetime
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD259559S (en) | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
| US5105257A (en) | 1990-08-08 | 1992-04-14 | Mitsubishi Denki Kabushiki Kaisha | Packaged semiconductor device and semiconductor device packaging element |
| US5309018A (en) | 1992-04-28 | 1994-05-03 | Rohm Co., Ltd. | Lead frame having deformable supports |
| US5585670A (en) | 1995-09-05 | 1996-12-17 | Mitsubishi Electric Semiconductor Software Co. | Semiconductor device package |
| US5925927A (en) | 1996-12-18 | 1999-07-20 | Texas Instruments Incoporated | Reinforced thin lead frames and leads |
| US6093957A (en) | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
| USD416872S (en) | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
| US6020625A (en) | 1998-03-27 | 2000-02-01 | Mitsubishi Denki Kabushiki Kaisha | Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame |
| US6177718B1 (en) | 1998-04-28 | 2001-01-23 | Kabushiki Kaisha Toshiba | Resin-sealed semiconductor device |
| USD473199S1 (en) | 2001-11-30 | 2003-04-15 | Kabushiki Kaisha Toshiba | Portion of semiconductor device |
Non-Patent Citations (5)
| Title |
|---|
| Extract of Denpa Shimbum (newspaper) showing a AV decoder system LSI (MN677521) for a DVD player. |
| Extract of Denpa Shimbun (newspaper) showing a CCD signal processor (VSP2101). |
| Extract of Denpa Shimbun (newspaper) showing a PAM built-in microcomputer (MB91110). |
| Extract of Denpa Shimbun (newspaper) showing a Scan USB (NET 1031). |
| TOSHIBA Catalog of micro controller (TMP86CM25F). |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD720310S1 (en) * | 2011-06-17 | 2014-12-30 | Soraa, Inc. | Triangular semiconductor die |
| USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD694724S1 (en) * | 2012-10-03 | 2013-12-03 | Honda Motor Co., Ltd. | Semiconductor device |
| USD763806S1 (en) * | 2012-12-12 | 2016-08-16 | Soraa, Inc. | Triangular semiconductor die |
| USD752000S1 (en) | 2013-03-07 | 2016-03-22 | Vlt, Inc. | Semiconductor device |
| USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
| US8975694B1 (en) | 2013-03-07 | 2015-03-10 | Vlt, Inc. | Low resistance power switching device |
| US9269661B1 (en) | 2013-03-07 | 2016-02-23 | Vlt, Inc. | Low resistance power switching device |
| USD732488S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD758329S1 (en) * | 2013-08-06 | 2016-06-07 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD732487S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
| USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
| USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
| USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
| USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD864135S1 (en) | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
| USD1043594S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1043595S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1052545S1 (en) * | 2022-11-01 | 2024-11-26 | Rohm Co., Ltd. | Semiconductor device |
| USD1059315S1 (en) * | 2022-11-02 | 2025-01-28 | Ganrich Semiconductor Corporation | Package structure for a semiconductor element |
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