USD465773S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD465773S1
USD465773S1 US29/150,991 US15099101F USD465773S US D465773 S1 USD465773 S1 US D465773S1 US 15099101 F US15099101 F US 15099101F US D465773 S USD465773 S US D465773S
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US
United States
Prior art keywords
semiconductor device
view
elevational view
ornamental design
side elevational
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/150,991
Inventor
Takakazu Fukumoto
Muneharu Tokunaga
Tetsuya Matsuura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Assigned to MITSUBISHI DENKI KABUSHIKI KAISHA reassignment MITSUBISHI DENKI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUKUMOTO, TAKAKAZU, MATSUURA, TETSUYA, TOKUNAGA, MUNEHARU
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Publication of USD465773S1 publication Critical patent/USD465773S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front, bottom and right side perspective view thereof;
FIG. 3 is a front elevational view thereof, the rear elevational view is omitted as that is the same image to the front elevational view thereof;
FIG. 4 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a cross-sectional view thereof, taken along line 7—7 of FIG. 4, with the internal system omitted.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown and described.
US29/150,991 2001-08-31 2001-12-04 Semiconductor device Expired - Lifetime USD465773S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-025619 2001-08-31
JP2001025619 2001-08-31

Publications (1)

Publication Number Publication Date
USD465773S1 true USD465773S1 (en) 2002-11-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/150,991 Expired - Lifetime USD465773S1 (en) 2001-08-31 2001-12-04 Semiconductor device

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US (1) USD465773S1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD694724S1 (en) * 2012-10-03 2013-12-03 Honda Motor Co., Ltd. Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD706733S1 (en) * 2013-09-16 2014-06-10 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD707193S1 (en) * 2013-09-16 2014-06-17 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USRE45712E1 (en) * 2013-03-18 2015-10-06 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USRE45741E1 (en) * 2013-03-18 2015-10-13 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3706840A (en) 1971-05-10 1972-12-19 Intersil Inc Semiconductor device packaging
US4748538A (en) 1985-07-08 1988-05-31 Nec Corporation Semiconductor module
US4843695A (en) 1987-07-16 1989-07-04 Digital Equipment Corporation Method of assembling tab bonded semiconductor chip package
US5237201A (en) 1989-07-21 1993-08-17 Kabushiki Kaisha Toshiba TAB type semiconductor device and method of manufacturing the same
USD345731S (en) 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5464054A (en) 1993-08-09 1995-11-07 Thermalloy, Inc. Spring clamp and heat sink assembly
USD416872S (en) 1997-11-06 1999-11-23 Zf Microsystems, Inc. Single component computer
US6020625A (en) 1998-03-27 2000-02-01 Mitsubishi Denki Kabushiki Kaisha Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame
US6038132A (en) 1996-12-06 2000-03-14 Mitsubishi Denki Kabushiki Kaisha Memory module
USD421969S (en) 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US6093957A (en) 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
USD432096S (en) 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
USD432097S (en) 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD448740S1 (en) 2000-11-30 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US6300685B1 (en) 1998-08-20 2001-10-09 Oki Electric Industry Co., Ltd. Semiconductor package

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3706840A (en) 1971-05-10 1972-12-19 Intersil Inc Semiconductor device packaging
US4748538A (en) 1985-07-08 1988-05-31 Nec Corporation Semiconductor module
US4843695A (en) 1987-07-16 1989-07-04 Digital Equipment Corporation Method of assembling tab bonded semiconductor chip package
US5237201A (en) 1989-07-21 1993-08-17 Kabushiki Kaisha Toshiba TAB type semiconductor device and method of manufacturing the same
USD345731S (en) 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5464054A (en) 1993-08-09 1995-11-07 Thermalloy, Inc. Spring clamp and heat sink assembly
US6038132A (en) 1996-12-06 2000-03-14 Mitsubishi Denki Kabushiki Kaisha Memory module
US6093957A (en) 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
USD416872S (en) 1997-11-06 1999-11-23 Zf Microsystems, Inc. Single component computer
US6020625A (en) 1998-03-27 2000-02-01 Mitsubishi Denki Kabushiki Kaisha Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame
US6300685B1 (en) 1998-08-20 2001-10-09 Oki Electric Industry Co., Ltd. Semiconductor package
USD421969S (en) 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD432097S (en) 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD432096S (en) 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
USD448740S1 (en) 2000-11-30 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Non-Patent Citations (7)

* Cited by examiner, † Cited by third party
Title
U.S. patent application Ser. No. 29/144,678, filed Jul. 10, 2001.
U.S. patent application Ser. No. 29/144,816, filed Jul. 11, 2001.
U.S. patent application Ser. No. 29/144,818, filed Jul. 12, 2001.
U.S. patent application Ser. No. 29/144,819, filed Jul. 12, 2001.
U.S. patent application Ser. No. 29/144,820, filed Jul. 12, 2001.
U.S. patent application Ser. No. 29/144,821, filed Jul. 12, 2001.
U.S. patent application Ser. No. 29/150,991, filed Dec. 4, 2001.

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD694724S1 (en) * 2012-10-03 2013-12-03 Honda Motor Co., Ltd. Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USRE45712E1 (en) * 2013-03-18 2015-10-06 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USRE45741E1 (en) * 2013-03-18 2015-10-13 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD706733S1 (en) * 2013-09-16 2014-06-10 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD707193S1 (en) * 2013-09-16 2014-06-17 Photonics Electronics Technology Research Association (PETRA) Signal conversion device
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module

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