USD1086086S1 - Separator of substrate processing apparatus - Google Patents

Separator of substrate processing apparatus

Info

Publication number
USD1086086S1
USD1086086S1 US29/832,777 US202229832777F USD1086086S US D1086086 S1 USD1086086 S1 US D1086086S1 US 202229832777 F US202229832777 F US 202229832777F US D1086086 S USD1086086 S US D1086086S
Authority
US
United States
Prior art keywords
separator
processing apparatus
substrate processing
view
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/832,777
Other languages
English (en)
Inventor
Yusaku OKAJIMA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKAJIMA, YUSAKU
Application granted granted Critical
Publication of USD1086086S1 publication Critical patent/USD1086086S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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US29/832,777 2021-10-01 2022-03-30 Separator of substrate processing apparatus Active USD1086086S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021021414F JP1713190S (enrdf_load_stackoverflow) 2021-10-01 2021-10-01
JP2021-021414D 2021-10-01

Publications (1)

Publication Number Publication Date
USD1086086S1 true USD1086086S1 (en) 2025-07-29

Family

ID=81209963

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/832,777 Active USD1086086S1 (en) 2021-10-01 2022-03-30 Separator of substrate processing apparatus

Country Status (3)

Country Link
US (1) USD1086086S1 (enrdf_load_stackoverflow)
JP (1) JP1713190S (enrdf_load_stackoverflow)
TW (1) TWD230582S (enrdf_load_stackoverflow)

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6231038B1 (en) * 1998-12-01 2001-05-15 Greene Tweed Of Delaware, Inc. Two-piece clamp ring for holding semiconductor wafer or other workpiece
US7484958B2 (en) * 2003-07-16 2009-02-03 Shin-Etsu Handotai Co., Ltd. Vertical boat for heat treatment and method for producing the same
US20090197424A1 (en) * 2008-01-31 2009-08-06 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method for manufacturing semiconductor device
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
US8028978B2 (en) * 1996-07-15 2011-10-04 Semitool, Inc. Wafer handling system
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
USD739831S1 (en) * 2013-03-22 2015-09-29 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
US20170073813A1 (en) * 2015-09-11 2017-03-16 Eugene Technology Co., Ltd. Substrate processing apparatus
USD824440S1 (en) * 2016-02-12 2018-07-31 Hitachi Kokusai Electric Inc. Heater of substrate processing apparatus
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
US20200152490A1 (en) * 2016-07-26 2020-05-14 Kokusai Electric Corporation Heating element, substrate processing apparatus, and method of manufacturing semiconductor device
US10840118B2 (en) * 2015-10-27 2020-11-17 Eugene Technology Co., Ltd. Substrate processing apparatus and method for assembling tube assembly
US20210207268A1 (en) * 2018-09-20 2021-07-08 Kokusai Electric Corporation Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
USD981970S1 (en) * 2021-03-04 2023-03-28 Kokusai Electric Corporation Substrate mounting plate for substrate processing apparatus
USD982537S1 (en) * 2021-03-15 2023-04-04 Kokusai Electric Corporation Separator of substrate processing apparatus
USD1023959S1 (en) * 2021-05-11 2024-04-23 Asm Ip Holding B.V. Electrode for substrate processing apparatus
USD1070797S1 (en) * 2022-03-15 2025-04-15 Kokusai Electric Corporation Furnace for substrate processing apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD908103S1 (en) 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8028978B2 (en) * 1996-07-15 2011-10-04 Semitool, Inc. Wafer handling system
US6231038B1 (en) * 1998-12-01 2001-05-15 Greene Tweed Of Delaware, Inc. Two-piece clamp ring for holding semiconductor wafer or other workpiece
US7484958B2 (en) * 2003-07-16 2009-02-03 Shin-Etsu Handotai Co., Ltd. Vertical boat for heat treatment and method for producing the same
US20090197424A1 (en) * 2008-01-31 2009-08-06 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method for manufacturing semiconductor device
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
USD739831S1 (en) * 2013-03-22 2015-09-29 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
US20170073813A1 (en) * 2015-09-11 2017-03-16 Eugene Technology Co., Ltd. Substrate processing apparatus
US10840118B2 (en) * 2015-10-27 2020-11-17 Eugene Technology Co., Ltd. Substrate processing apparatus and method for assembling tube assembly
USD824440S1 (en) * 2016-02-12 2018-07-31 Hitachi Kokusai Electric Inc. Heater of substrate processing apparatus
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
US20200152490A1 (en) * 2016-07-26 2020-05-14 Kokusai Electric Corporation Heating element, substrate processing apparatus, and method of manufacturing semiconductor device
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
US20210207268A1 (en) * 2018-09-20 2021-07-08 Kokusai Electric Corporation Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
USD981970S1 (en) * 2021-03-04 2023-03-28 Kokusai Electric Corporation Substrate mounting plate for substrate processing apparatus
USD982537S1 (en) * 2021-03-15 2023-04-04 Kokusai Electric Corporation Separator of substrate processing apparatus
USD1023959S1 (en) * 2021-05-11 2024-04-23 Asm Ip Holding B.V. Electrode for substrate processing apparatus
USD1070797S1 (en) * 2022-03-15 2025-04-15 Kokusai Electric Corporation Furnace for substrate processing apparatus

Also Published As

Publication number Publication date
JP1713190S (enrdf_load_stackoverflow) 2022-04-21
TWD230582S (zh) 2024-04-01

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