USD1034491S1 - Edge ring - Google Patents

Edge ring Download PDF

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Publication number
USD1034491S1
USD1034491S1 US29/744,119 US202029744119F USD1034491S US D1034491 S1 USD1034491 S1 US D1034491S1 US 202029744119 F US202029744119 F US 202029744119F US D1034491 S USD1034491 S US D1034491S
Authority
US
United States
Prior art keywords
edge ring
view
ring
enlarged partial
assembled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/744,119
Inventor
Kin Pong Lo
Vladimir Nagorny
Wei Liu
Theresa Kramer Guarini
Bernard L. Hwang
Malcolm J. Bevan
Jacob Abraham
Swayambhu Prasad BEHERA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/744,119 priority Critical patent/USD1034491S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LO, KIN PONG, ABRAHAM, JACOB, BEHERA, Swayambhu Prasad, BEVAN, MALCOLM J., GUARINI, THERESA KRAMER, HWANG, BERNARD L., LIU, WEI, NAGORNY, VLADIMIR
Priority to TW110300464F priority patent/TWD214021S/en
Priority to JP2021001755F priority patent/JP1704603S/en
Priority to JP2021022645F priority patent/JP1708662S/en
Application granted granted Critical
Publication of USD1034491S1 publication Critical patent/USD1034491S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front isometric top view of an edge ring.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a first side view thereof.
FIG. 5 is a second side view thereof.
FIG. 6 is an enlarged partial view of the section 6 shown in FIG. 1 .
FIG. 7 is a cross sectional view along line 7-7 of FIG. 2 thereof.
FIG. 8 is an enlarged partial side view thereof.
FIG. 9 is an enlarged partial view of the section 9 shown in FIG. 2 .
FIG. 10 is an enlarged partial cross sectional view of the section 10 shown in FIG. 7 .
FIG. 11 is another front isometric top view thereof assembled with an overhang ring.
FIG. 12 is another top plan view thereof assembled with the overhang ring.
FIG. 13 is a third side view thereof assembled with the overhang ring; and,
FIG. 14 is an enlarged partial cross sectional view along line 14-14 of FIG. 12 thereof assembled with an overhang ring.
The broken lines appearing in FIGS. 1-14 illustrate portions of the edge ring assembly that form no part of the claimed design. The dot-dot-dash broken lines show boundaries of cross sectional or enlarged views that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an edge ring, as shown and described.
US29/744,119 2020-07-27 2020-07-27 Edge ring Active USD1034491S1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US29/744,119 USD1034491S1 (en) 2020-07-27 2020-07-27 Edge ring
TW110300464F TWD214021S (en) 2020-07-27 2021-01-27 Edge ring
JP2021001755F JP1704603S (en) 2020-07-27 2021-01-27 Edge ring
JP2021022645F JP1708662S (en) 2020-07-27 2021-10-18 Edge ring and overhang ring assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/744,119 USD1034491S1 (en) 2020-07-27 2020-07-27 Edge ring

Publications (1)

Publication Number Publication Date
USD1034491S1 true USD1034491S1 (en) 2024-07-09

Family

ID=80216999

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/744,119 Active USD1034491S1 (en) 2020-07-27 2020-07-27 Edge ring

Country Status (3)

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US (1) USD1034491S1 (en)
JP (2) JP1704603S (en)
TW (1) TWD214021S (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1082731S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor
USD1082729S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor cover
USD1082728S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor
USD1090468S1 (en) 2021-09-08 2025-08-26 Lam Research Corporation Debubbler component
USD1093328S1 (en) * 2023-01-11 2025-09-16 Nuflare Technology, Inc. Susceptor
USD1094322S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor
USD1094321S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor cover
USD1094320S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor
USD1094323S1 (en) * 2023-01-11 2025-09-23 Nuflare Technology, Inc. Susceptor unit
USD1096676S1 (en) * 2022-10-20 2025-10-07 Nuflare Technology, Inc. Cover base for susceptors
USD1098057S1 (en) * 2022-10-20 2025-10-14 Nuflare Technology, Inc. Susceptor cover
USD1109710S1 (en) * 2022-03-22 2026-01-20 Achilles Corporation Main body of a semiconductor wafer carrying container

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD238347S (en) 2022-05-13 2025-05-21 美商蘭姆研究公司 (美國) Carrier ring
GB2635058A (en) 2022-07-08 2025-04-30 Tosoh Smd Inc Dynamic vacuum seal system for physical vapor deposition sputter applications
USD1109856S1 (en) 2023-07-07 2026-01-20 Tosoh Smd, Inc. Dynamic vacuum seal system isolation ring for physical vapor deposition sputter applications

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Publication number Priority date Publication date Assignee Title
US4111438A (en) * 1976-09-02 1978-09-05 Wellworthy Limited Sealing ring assemblies for pistons
US5810931A (en) 1996-07-30 1998-09-22 Applied Materials, Inc. High aspect ratio clamp ring
US5891348A (en) 1996-01-26 1999-04-06 Applied Materials, Inc. Process gas focusing apparatus and method
US6277198B1 (en) 1999-06-04 2001-08-21 Applied Materials, Inc. Use of tapered shadow clamp ring to provide improved physical vapor deposition system
EP1134791A2 (en) 2000-03-16 2001-09-19 Applied Materials, Inc. Shadow ring with common guide member
US20040067723A1 (en) * 2002-10-02 2004-04-08 Ensinger Kunstsofftechnologie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US20040149226A1 (en) * 2003-01-30 2004-08-05 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate clamp ring with removable contract pads
US20040259485A1 (en) * 2002-10-02 2004-12-23 Ensinger Kunstsofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US20040261945A1 (en) * 2002-10-02 2004-12-30 Ensinger Kunststofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US7176403B2 (en) 2002-09-18 2007-02-13 Lam Research Corporation Method and apparatus for the compensation of edge ring wear in a plasma processing chamber
US20070034337A1 (en) 2002-09-30 2007-02-15 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
JP2011014943A (en) 1999-06-30 2011-01-20 Lam Research Corp Technique for improving etching rate uniformity
US8342119B2 (en) 1999-12-10 2013-01-01 Applied Materials, Inc. Self aligning non contact shadow ring process kit
KR20150042908A (en) * 2013-10-14 2015-04-22 삼성디스플레이 주식회사 Organic Light Emitting Diode Device
US20150283668A1 (en) * 2014-04-04 2015-10-08 SPM Technology, Inc. Retaining ring assembly with inserts
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20170002461A1 (en) 2015-07-03 2017-01-05 Applied Materials, Inc. Process kit having tall deposition ring and deposition ring clamp
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20190013232A1 (en) 2015-01-16 2019-01-10 Lam Research Corporation Moveable edge ring design
US20200118798A1 (en) 2017-02-01 2020-04-16 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
KR102124766B1 (en) 2019-12-31 2020-06-19 (주)삼양컴텍 Plasma processing apparatus and manufacturing method of the same
USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD665491S1 (en) 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
USD828524S1 (en) 2016-09-26 2018-09-11 Noritz Corporation Packing for pipe adapter for water heater
USD834156S1 (en) 2017-10-17 2018-11-20 Flsmidth A/S Valve sleeve
TWD194249S (en) 2018-03-06 2018-11-21 大晟科技股份有限公司 Wafer clamp ring

Patent Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4111438A (en) * 1976-09-02 1978-09-05 Wellworthy Limited Sealing ring assemblies for pistons
US5891348A (en) 1996-01-26 1999-04-06 Applied Materials, Inc. Process gas focusing apparatus and method
US5810931A (en) 1996-07-30 1998-09-22 Applied Materials, Inc. High aspect ratio clamp ring
US6277198B1 (en) 1999-06-04 2001-08-21 Applied Materials, Inc. Use of tapered shadow clamp ring to provide improved physical vapor deposition system
JP2011014943A (en) 1999-06-30 2011-01-20 Lam Research Corp Technique for improving etching rate uniformity
US8342119B2 (en) 1999-12-10 2013-01-01 Applied Materials, Inc. Self aligning non contact shadow ring process kit
EP1134791A2 (en) 2000-03-16 2001-09-19 Applied Materials, Inc. Shadow ring with common guide member
US7176403B2 (en) 2002-09-18 2007-02-13 Lam Research Corporation Method and apparatus for the compensation of edge ring wear in a plasma processing chamber
US20070034337A1 (en) 2002-09-30 2007-02-15 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
US20040067723A1 (en) * 2002-10-02 2004-04-08 Ensinger Kunstsofftechnologie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US20040259485A1 (en) * 2002-10-02 2004-12-23 Ensinger Kunstsofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US20040261945A1 (en) * 2002-10-02 2004-12-30 Ensinger Kunststofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US20040149226A1 (en) * 2003-01-30 2004-08-05 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate clamp ring with removable contract pads
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
KR20150042908A (en) * 2013-10-14 2015-04-22 삼성디스플레이 주식회사 Organic Light Emitting Diode Device
US20150283668A1 (en) * 2014-04-04 2015-10-08 SPM Technology, Inc. Retaining ring assembly with inserts
US20190013232A1 (en) 2015-01-16 2019-01-10 Lam Research Corporation Moveable edge ring design
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20170002461A1 (en) 2015-07-03 2017-01-05 Applied Materials, Inc. Process kit having tall deposition ring and deposition ring clamp
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20200118798A1 (en) 2017-02-01 2020-04-16 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
KR102124766B1 (en) 2019-12-31 2020-06-19 (주)삼양컴텍 Plasma processing apparatus and manufacturing method of the same
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
International Search Report and Written Opinion dated Apr. 26, 2021 for Application No. PCT/US2020/063774.
Japanese Office Action dated Jul. 20, 2021, for Japanese Patent Application No. 2021-001755.
Korean Office Action dated Oct. 28, 2021 for Application No. 30-2020-63868 (M001).
Korean Office Action dated Oct. 28, 2021 for Application No. 30-2020-63868 (M002).

Cited By (17)

* Cited by examiner, † Cited by third party
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USD1096679S1 (en) 2021-09-08 2025-10-07 Lam Research Corporation Debubbler component
USD1118897S1 (en) 2021-09-08 2026-03-17 Lam Research Corporation Debubbler component
USD1112391S1 (en) * 2021-09-08 2026-02-10 Lam Research Corporation Debubbler component
USD1090468S1 (en) 2021-09-08 2025-08-26 Lam Research Corporation Debubbler component
USD1091491S1 (en) * 2021-09-08 2025-09-02 Lam Research Corporation Debubbler component
USD1109710S1 (en) * 2022-03-22 2026-01-20 Achilles Corporation Main body of a semiconductor wafer carrying container
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1094320S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor
USD1094321S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor cover
USD1096676S1 (en) * 2022-10-20 2025-10-07 Nuflare Technology, Inc. Cover base for susceptors
USD1094322S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor
USD1098057S1 (en) * 2022-10-20 2025-10-14 Nuflare Technology, Inc. Susceptor cover
USD1082731S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor
USD1094323S1 (en) * 2023-01-11 2025-09-23 Nuflare Technology, Inc. Susceptor unit
USD1093328S1 (en) * 2023-01-11 2025-09-16 Nuflare Technology, Inc. Susceptor
USD1082728S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor
USD1082729S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor cover

Also Published As

Publication number Publication date
TWD214021S (en) 2021-09-11
JP1708662S (en) 2022-03-01
JP1704603S (en) 2022-01-13

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