USD1034491S1 - Edge ring - Google Patents
Edge ring Download PDFInfo
- Publication number
- USD1034491S1 USD1034491S1 US29/744,119 US202029744119F USD1034491S US D1034491 S1 USD1034491 S1 US D1034491S1 US 202029744119 F US202029744119 F US 202029744119F US D1034491 S USD1034491 S US D1034491S
- Authority
- US
- United States
- Prior art keywords
- edge ring
- view
- ring
- enlarged partial
- assembled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The broken lines appearing in FIGS. 1-14 illustrate portions of the edge ring assembly that form no part of the claimed design. The dot-dot-dash broken lines show boundaries of cross sectional or enlarged views that form no part of the claimed design.
Claims (1)
- The ornamental design for an edge ring, as shown and described.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/744,119 USD1034491S1 (en) | 2020-07-27 | 2020-07-27 | Edge ring |
| TW110300464F TWD214021S (en) | 2020-07-27 | 2021-01-27 | Edge ring |
| JP2021001755F JP1704603S (en) | 2020-07-27 | 2021-01-27 | Edge ring |
| JP2021022645F JP1708662S (en) | 2020-07-27 | 2021-10-18 | Edge ring and overhang ring assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/744,119 USD1034491S1 (en) | 2020-07-27 | 2020-07-27 | Edge ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD1034491S1 true USD1034491S1 (en) | 2024-07-09 |
Family
ID=80216999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/744,119 Active USD1034491S1 (en) | 2020-07-27 | 2020-07-27 | Edge ring |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD1034491S1 (en) |
| JP (2) | JP1704603S (en) |
| TW (1) | TWD214021S (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1071103S1 (en) * | 2022-04-11 | 2025-04-15 | Applied Materials, Inc. | Gas distribution plate |
| USD1082731S1 (en) * | 2023-01-11 | 2025-07-08 | Nuflare Technology, Inc. | Susceptor |
| USD1082729S1 (en) * | 2023-01-11 | 2025-07-08 | Nuflare Technology, Inc. | Susceptor cover |
| USD1082728S1 (en) * | 2023-01-11 | 2025-07-08 | Nuflare Technology, Inc. | Susceptor |
| USD1090468S1 (en) | 2021-09-08 | 2025-08-26 | Lam Research Corporation | Debubbler component |
| USD1093328S1 (en) * | 2023-01-11 | 2025-09-16 | Nuflare Technology, Inc. | Susceptor |
| USD1094322S1 (en) * | 2022-10-20 | 2025-09-23 | Nuflare Technology, Inc. | Susceptor |
| USD1094321S1 (en) * | 2022-10-20 | 2025-09-23 | Nuflare Technology, Inc. | Susceptor cover |
| USD1094320S1 (en) * | 2022-10-20 | 2025-09-23 | Nuflare Technology, Inc. | Susceptor |
| USD1094323S1 (en) * | 2023-01-11 | 2025-09-23 | Nuflare Technology, Inc. | Susceptor unit |
| USD1096676S1 (en) * | 2022-10-20 | 2025-10-07 | Nuflare Technology, Inc. | Cover base for susceptors |
| USD1098057S1 (en) * | 2022-10-20 | 2025-10-14 | Nuflare Technology, Inc. | Susceptor cover |
| USD1109710S1 (en) * | 2022-03-22 | 2026-01-20 | Achilles Corporation | Main body of a semiconductor wafer carrying container |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD238347S (en) | 2022-05-13 | 2025-05-21 | 美商蘭姆研究公司 (美國) | Carrier ring |
| GB2635058A (en) | 2022-07-08 | 2025-04-30 | Tosoh Smd Inc | Dynamic vacuum seal system for physical vapor deposition sputter applications |
| USD1109856S1 (en) | 2023-07-07 | 2026-01-20 | Tosoh Smd, Inc. | Dynamic vacuum seal system isolation ring for physical vapor deposition sputter applications |
Citations (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4111438A (en) * | 1976-09-02 | 1978-09-05 | Wellworthy Limited | Sealing ring assemblies for pistons |
| US5810931A (en) | 1996-07-30 | 1998-09-22 | Applied Materials, Inc. | High aspect ratio clamp ring |
| US5891348A (en) | 1996-01-26 | 1999-04-06 | Applied Materials, Inc. | Process gas focusing apparatus and method |
| US6277198B1 (en) | 1999-06-04 | 2001-08-21 | Applied Materials, Inc. | Use of tapered shadow clamp ring to provide improved physical vapor deposition system |
| EP1134791A2 (en) | 2000-03-16 | 2001-09-19 | Applied Materials, Inc. | Shadow ring with common guide member |
| US20040067723A1 (en) * | 2002-10-02 | 2004-04-08 | Ensinger Kunstsofftechnologie Gbr | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| US20040149226A1 (en) * | 2003-01-30 | 2004-08-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Substrate clamp ring with removable contract pads |
| US20040259485A1 (en) * | 2002-10-02 | 2004-12-23 | Ensinger Kunstsofftechnoligie Gbr | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| US20040261945A1 (en) * | 2002-10-02 | 2004-12-30 | Ensinger Kunststofftechnoligie Gbr | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| US7176403B2 (en) | 2002-09-18 | 2007-02-13 | Lam Research Corporation | Method and apparatus for the compensation of edge ring wear in a plasma processing chamber |
| US20070034337A1 (en) | 2002-09-30 | 2007-02-15 | Tokyo Electron Limited | Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system |
| USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| JP2011014943A (en) | 1999-06-30 | 2011-01-20 | Lam Research Corp | Technique for improving etching rate uniformity |
| US8342119B2 (en) | 1999-12-10 | 2013-01-01 | Applied Materials, Inc. | Self aligning non contact shadow ring process kit |
| KR20150042908A (en) * | 2013-10-14 | 2015-04-22 | 삼성디스플레이 주식회사 | Organic Light Emitting Diode Device |
| US20150283668A1 (en) * | 2014-04-04 | 2015-10-08 | SPM Technology, Inc. | Retaining ring assembly with inserts |
| USD770992S1 (en) * | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| US20170002461A1 (en) | 2015-07-03 | 2017-01-05 | Applied Materials, Inc. | Process kit having tall deposition ring and deposition ring clamp |
| USD797691S1 (en) * | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
| USD827592S1 (en) * | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| US20190013232A1 (en) | 2015-01-16 | 2019-01-10 | Lam Research Corporation | Moveable edge ring design |
| US20200118798A1 (en) | 2017-02-01 | 2020-04-16 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
| KR102124766B1 (en) | 2019-12-31 | 2020-06-19 | (주)삼양컴텍 | Plasma processing apparatus and manufacturing method of the same |
| USD888903S1 (en) * | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD933726S1 (en) * | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD665491S1 (en) | 2012-01-25 | 2012-08-14 | Applied Materials, Inc. | Deposition chamber cover ring |
| USD828524S1 (en) | 2016-09-26 | 2018-09-11 | Noritz Corporation | Packing for pipe adapter for water heater |
| USD834156S1 (en) | 2017-10-17 | 2018-11-20 | Flsmidth A/S | Valve sleeve |
| TWD194249S (en) | 2018-03-06 | 2018-11-21 | 大晟科技股份有限公司 | Wafer clamp ring |
-
2020
- 2020-07-27 US US29/744,119 patent/USD1034491S1/en active Active
-
2021
- 2021-01-27 TW TW110300464F patent/TWD214021S/en unknown
- 2021-01-27 JP JP2021001755F patent/JP1704603S/en active Active
- 2021-10-18 JP JP2021022645F patent/JP1708662S/en active Active
Patent Citations (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4111438A (en) * | 1976-09-02 | 1978-09-05 | Wellworthy Limited | Sealing ring assemblies for pistons |
| US5891348A (en) | 1996-01-26 | 1999-04-06 | Applied Materials, Inc. | Process gas focusing apparatus and method |
| US5810931A (en) | 1996-07-30 | 1998-09-22 | Applied Materials, Inc. | High aspect ratio clamp ring |
| US6277198B1 (en) | 1999-06-04 | 2001-08-21 | Applied Materials, Inc. | Use of tapered shadow clamp ring to provide improved physical vapor deposition system |
| JP2011014943A (en) | 1999-06-30 | 2011-01-20 | Lam Research Corp | Technique for improving etching rate uniformity |
| US8342119B2 (en) | 1999-12-10 | 2013-01-01 | Applied Materials, Inc. | Self aligning non contact shadow ring process kit |
| EP1134791A2 (en) | 2000-03-16 | 2001-09-19 | Applied Materials, Inc. | Shadow ring with common guide member |
| US7176403B2 (en) | 2002-09-18 | 2007-02-13 | Lam Research Corporation | Method and apparatus for the compensation of edge ring wear in a plasma processing chamber |
| US20070034337A1 (en) | 2002-09-30 | 2007-02-15 | Tokyo Electron Limited | Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system |
| US20040067723A1 (en) * | 2002-10-02 | 2004-04-08 | Ensinger Kunstsofftechnologie Gbr | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| US20040259485A1 (en) * | 2002-10-02 | 2004-12-23 | Ensinger Kunstsofftechnoligie Gbr | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| US20040261945A1 (en) * | 2002-10-02 | 2004-12-30 | Ensinger Kunststofftechnoligie Gbr | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| US20040149226A1 (en) * | 2003-01-30 | 2004-08-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Substrate clamp ring with removable contract pads |
| USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| KR20150042908A (en) * | 2013-10-14 | 2015-04-22 | 삼성디스플레이 주식회사 | Organic Light Emitting Diode Device |
| US20150283668A1 (en) * | 2014-04-04 | 2015-10-08 | SPM Technology, Inc. | Retaining ring assembly with inserts |
| US20190013232A1 (en) | 2015-01-16 | 2019-01-10 | Lam Research Corporation | Moveable edge ring design |
| USD770992S1 (en) * | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| US20170002461A1 (en) | 2015-07-03 | 2017-01-05 | Applied Materials, Inc. | Process kit having tall deposition ring and deposition ring clamp |
| USD797691S1 (en) * | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
| USD827592S1 (en) * | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| US20200118798A1 (en) | 2017-02-01 | 2020-04-16 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
| USD888903S1 (en) * | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| KR102124766B1 (en) | 2019-12-31 | 2020-06-19 | (주)삼양컴텍 | Plasma processing apparatus and manufacturing method of the same |
| USD933726S1 (en) * | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
Non-Patent Citations (4)
| Title |
|---|
| International Search Report and Written Opinion dated Apr. 26, 2021 for Application No. PCT/US2020/063774. |
| Japanese Office Action dated Jul. 20, 2021, for Japanese Patent Application No. 2021-001755. |
| Korean Office Action dated Oct. 28, 2021 for Application No. 30-2020-63868 (M001). |
| Korean Office Action dated Oct. 28, 2021 for Application No. 30-2020-63868 (M002). |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1096679S1 (en) | 2021-09-08 | 2025-10-07 | Lam Research Corporation | Debubbler component |
| USD1118897S1 (en) | 2021-09-08 | 2026-03-17 | Lam Research Corporation | Debubbler component |
| USD1112391S1 (en) * | 2021-09-08 | 2026-02-10 | Lam Research Corporation | Debubbler component |
| USD1090468S1 (en) | 2021-09-08 | 2025-08-26 | Lam Research Corporation | Debubbler component |
| USD1091491S1 (en) * | 2021-09-08 | 2025-09-02 | Lam Research Corporation | Debubbler component |
| USD1109710S1 (en) * | 2022-03-22 | 2026-01-20 | Achilles Corporation | Main body of a semiconductor wafer carrying container |
| USD1071103S1 (en) * | 2022-04-11 | 2025-04-15 | Applied Materials, Inc. | Gas distribution plate |
| USD1094320S1 (en) * | 2022-10-20 | 2025-09-23 | Nuflare Technology, Inc. | Susceptor |
| USD1094321S1 (en) * | 2022-10-20 | 2025-09-23 | Nuflare Technology, Inc. | Susceptor cover |
| USD1096676S1 (en) * | 2022-10-20 | 2025-10-07 | Nuflare Technology, Inc. | Cover base for susceptors |
| USD1094322S1 (en) * | 2022-10-20 | 2025-09-23 | Nuflare Technology, Inc. | Susceptor |
| USD1098057S1 (en) * | 2022-10-20 | 2025-10-14 | Nuflare Technology, Inc. | Susceptor cover |
| USD1082731S1 (en) * | 2023-01-11 | 2025-07-08 | Nuflare Technology, Inc. | Susceptor |
| USD1094323S1 (en) * | 2023-01-11 | 2025-09-23 | Nuflare Technology, Inc. | Susceptor unit |
| USD1093328S1 (en) * | 2023-01-11 | 2025-09-16 | Nuflare Technology, Inc. | Susceptor |
| USD1082728S1 (en) * | 2023-01-11 | 2025-07-08 | Nuflare Technology, Inc. | Susceptor |
| USD1082729S1 (en) * | 2023-01-11 | 2025-07-08 | Nuflare Technology, Inc. | Susceptor cover |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD214021S (en) | 2021-09-11 |
| JP1708662S (en) | 2022-03-01 |
| JP1704603S (en) | 2022-01-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |