USB231416I5 - - Google Patents

Info

Publication number
USB231416I5
USB231416I5 US23141672A USB231416I5 US B231416 I5 USB231416 I5 US B231416I5 US 23141672 A US23141672 A US 23141672A US B231416 I5 USB231416 I5 US B231416I5
Authority
US
United States
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to US05/231,416 priority Critical patent/US4000054A/en
Publication of USB231416I5 publication Critical patent/USB231416I5/en
Application granted granted Critical
Publication of US4000054A publication Critical patent/US4000054A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
US05/231,416 1970-11-06 1972-03-02 Method of making thin film crossover structure Expired - Lifetime US4000054A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US05/231,416 US4000054A (en) 1970-11-06 1972-03-02 Method of making thin film crossover structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8754270A 1970-11-06 1970-11-06
US05/231,416 US4000054A (en) 1970-11-06 1972-03-02 Method of making thin film crossover structure

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US8754270A Continuation 1970-11-06 1970-11-06

Publications (2)

Publication Number Publication Date
USB231416I5 true USB231416I5 (enEXAMPLES) 1976-03-30
US4000054A US4000054A (en) 1976-12-28

Family

ID=26777095

Family Applications (1)

Application Number Title Priority Date Filing Date
US05/231,416 Expired - Lifetime US4000054A (en) 1970-11-06 1972-03-02 Method of making thin film crossover structure

Country Status (1)

Country Link
US (1) US4000054A (enEXAMPLES)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4097685A (en) 1975-10-17 1978-06-27 Siemens Aktiengesellschaft Discrete crossover chips for individual conductor track crossovers in hybrid circuits and method for constructing same
US4118595A (en) 1977-06-06 1978-10-03 Bell Telephone Laboratories, Incorporated Crossovers and method of fabrication
EP0005739A1 (de) * 1978-05-31 1979-12-12 Siemens Aktiengesellschaft Verfahren zur Herstellung von Leiterbahnüberkreuzungen für integrierte RC-Netzwerke
US4200975A (en) 1978-05-30 1980-05-06 Western Electric Company, Incorporated Additive method of forming circuit crossovers

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1574699A (en) * 1975-10-10 1980-09-10 Luc Technologies Ltd Conductive connections
US4141055A (en) * 1977-04-27 1979-02-20 Bell Telephone Laboratories, Incorporated Crossover structure for microelectronic circuits
US4255613A (en) * 1979-06-15 1981-03-10 Rockwell International Corporation Electrical interconnect
DE3024213C2 (de) 1980-06-27 1982-09-02 Vdo Adolf Schindling Ag, 6000 Frankfurt Verfahren zur Herstellung von auf einen Träger aufgebrachten Leiterbahnen
US4374179A (en) * 1980-12-18 1983-02-15 Honeywell Inc. Plasma polymerized ethane for interlayer dielectric
US4783697A (en) * 1985-01-07 1988-11-08 Motorola, Inc. Leadless chip carrier for RF power transistors or the like
US4727633A (en) * 1985-08-08 1988-03-01 Tektronix, Inc. Method of securing metallic members together
US4819056A (en) * 1986-07-03 1989-04-04 Delco Electronics Corporation Hybrid thick film circuit device
US4835859A (en) * 1987-12-03 1989-06-06 Tektronix, Inc. Method of forming a contact bump
US4869671A (en) * 1988-02-22 1989-09-26 Instrument Specialties Co., Inc. Electrical connector for printed circuit board
US4905371A (en) * 1988-08-26 1990-03-06 Control Data Corporation Method for cleaning process control
US5011706A (en) * 1989-04-12 1991-04-30 Dow Corning Corporation Method of forming coatings containing amorphous silicon carbide
US4920639A (en) * 1989-08-04 1990-05-01 Microelectronics And Computer Technology Corporation Method of making a multilevel electrical airbridge interconnect
US5117279A (en) * 1990-03-23 1992-05-26 Motorola, Inc. Semiconductor device having a low temperature uv-cured epoxy seal
US5060370A (en) * 1990-10-15 1991-10-29 Scales Jr James W Modification method for etched printed circuit boards
US5298687A (en) * 1990-12-27 1994-03-29 Remtec, Inc. High-density multilayer interconnection system on a ceramic substrate for high current applications and method of manufacture
US5261158A (en) * 1991-01-22 1993-11-16 Hughes Aircraft Company Method of forming a resilient interconnection bridge
US5158466A (en) * 1991-03-04 1992-10-27 Hughes Aircraft Company Metallically encapsulated elevated interconnection feature
US6378199B1 (en) 1994-05-13 2002-04-30 Dai Nippon Printing Co., Ltd. Multi-layer printed-wiring board process for producing
US5983492A (en) * 1996-11-27 1999-11-16 Tessera, Inc. Low profile socket for microelectronic components and method for making the same
US5907265A (en) * 1996-09-13 1999-05-25 Matsushita Electric Industrial Co., Ltd. High-frequency circuit board trace crossing and electronic component therefor
TW340296B (en) * 1997-02-21 1998-09-11 Ricoh Microelectronics Kk Method and apparatus of concave plate printing, method and apparatus for formation of wiring diagram, the contact electrode and the printed wiring nickel substrate
US5982268A (en) * 1998-03-31 1999-11-09 Uchihashi Estec Co., Ltd Thin type fuses
US6299456B1 (en) * 1998-04-10 2001-10-09 Micron Technology, Inc. Interposer with contact structures for electrical testing
US6616794B2 (en) 1998-05-04 2003-09-09 Tpl, Inc. Integral capacitance for printed circuit board using dielectric nanopowders
US20040109298A1 (en) * 1998-05-04 2004-06-10 Hartman William F. Dielectric material including particulate filler
US6608760B2 (en) 1998-05-04 2003-08-19 Tpl, Inc. Dielectric material including particulate filler
US6891110B1 (en) * 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
KR100385976B1 (ko) * 1999-12-30 2003-06-02 삼성전자주식회사 회로기판 및 그 제조방법
US6972379B2 (en) * 2000-05-26 2005-12-06 Visteon Global Technologies, Inc. Circuit board and a method for making the same
JP2002118049A (ja) * 2000-10-06 2002-04-19 Hitachi Ltd 半導体集積回路装置の製造方法
WO2002039796A1 (en) * 2000-11-09 2002-05-16 Tpl, Inc. Definable integrated passives for circuitry
JP3935687B2 (ja) * 2001-06-20 2007-06-27 アルプス電気株式会社 薄膜抵抗素子およびその製造方法
US20080128961A1 (en) * 2003-12-19 2008-06-05 Tpl, Inc. Moldable high dielectric constant nano-composites
US20060074166A1 (en) * 2003-12-19 2006-04-06 Tpl, Inc. Title And Interest In An Application Moldable high dielectric constant nano-composites
US20060074164A1 (en) * 2003-12-19 2006-04-06 Tpl, Inc. Structured composite dielectrics
US20060021869A1 (en) * 2004-07-28 2006-02-02 Advantech Global, Ltd System for and method of ensuring accurate shadow mask-to-substrate registration in a deposition process
US7477130B2 (en) * 2005-01-28 2009-01-13 Littelfuse, Inc. Dual fuse link thin film fuse
JP4963981B2 (ja) * 2007-02-19 2012-06-27 住友電気工業株式会社 フレキシブルプリント配線板
US20090166843A1 (en) * 2007-12-27 2009-07-02 Infineon Technologies Ag Semiconductor device and method for manufacturing a semiconductor device
US8293455B2 (en) * 2008-01-30 2012-10-23 Hewlett-Packard Development Company, L.P. Mandrel
KR20100104911A (ko) * 2009-03-19 2010-09-29 삼성전자주식회사 반도체 패키지
KR20130110966A (ko) * 2012-03-30 2013-10-10 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP6977894B2 (ja) * 2018-12-27 2021-12-08 株式会社村田製作所 伸縮性配線基板
US11461609B1 (en) * 2022-03-25 2022-10-04 Tactotek Oy Multilayer structure and method of manufacturing such

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3436611A (en) * 1965-01-25 1969-04-01 Texas Instruments Inc Insulation structure for crossover leads in integrated circuitry
GB1143957A (en) * 1965-07-13 1969-02-26 Int Computers Ltd Improvements in or relating to electrical circuit structures
US3377513A (en) * 1966-05-02 1968-04-09 North American Rockwell Integrated circuit diode matrix

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4097685A (en) 1975-10-17 1978-06-27 Siemens Aktiengesellschaft Discrete crossover chips for individual conductor track crossovers in hybrid circuits and method for constructing same
US4118595A (en) 1977-06-06 1978-10-03 Bell Telephone Laboratories, Incorporated Crossovers and method of fabrication
US4200975A (en) 1978-05-30 1980-05-06 Western Electric Company, Incorporated Additive method of forming circuit crossovers
EP0005739A1 (de) * 1978-05-31 1979-12-12 Siemens Aktiengesellschaft Verfahren zur Herstellung von Leiterbahnüberkreuzungen für integrierte RC-Netzwerke

Also Published As

Publication number Publication date
US4000054A (en) 1976-12-28

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