US9519192B2 - Array substrate, flat display panel and manufacturing method for the same - Google Patents

Array substrate, flat display panel and manufacturing method for the same Download PDF

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US9519192B2
US9519192B2 US14/647,803 US201514647803A US9519192B2 US 9519192 B2 US9519192 B2 US 9519192B2 US 201514647803 A US201514647803 A US 201514647803A US 9519192 B2 US9519192 B2 US 9519192B2
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regions
thickness
pixel electrodes
insulation layer
electric field
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US20160291418A1 (en
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Peng DU
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/134309—Electrodes characterised by their geometrical arrangement
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133345—Insulating layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • H01L27/1288—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0231—Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133357—Planarisation layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/134309—Electrodes characterised by their geometrical arrangement
    • G02F1/134372—Electrodes characterised by their geometrical arrangement for fringe field switching [FFS] where the common electrode is not patterned
    • G02F2001/134372—

Definitions

  • the present invention relates to the liquid crystal display technology, and more particularly to an array substrate, a flat display panel and manufacturing method for the same.
  • an array substrate having a fringe-field switching (FFS) mode includes: a substrate 1 , a common electrode 2 disposed on the substrate, an insulation layer 3 disposed on the common electrode 2 and multiple pixel electrodes 4 disposed on the insulation layer 3 at intervals.
  • FFS fringe-field switching
  • the main technology problem solved by the present invention is to provide an array substrate, a flat display panel and a manufacturing for the same.
  • the electric field strength between pixel electrodes and the electric field strength above the pixel electrodes can be adjusted in order to increase the display quality of the flat display panel.
  • an array substrate comprising: a substrate; a common electrode disposed on the substrate; an insulation layer disposed on the common electrode, wherein, the insulation layer includes multiple first regions and multiple second regions, and the first regions and the second regions are disposed alternately; and multiple pixel electrodes respectively disposed on the first regions of the insulation layer; wherein, a thickness of the first regions and a thickness of the second regions are different, and the thickness of the first regions is greater than the thickness of the second regions, and the common electrode and the pixel electrodes are made by a transparent and conductive material.
  • a difference of the thickness of the first regions and the thickness of the second regions is set to maintain a difference of an electric field strength between pixel electrodes and an electric field strength above the pixel electrodes in a predetermined range.
  • a difference of the thickness of the first regions and the thickness of the second regions is set to make a difference of an electric field strength between pixel electrodes and an electric field strength above the pixel electrodes be zero.
  • an array substrate comprising: a substrate; a common electrode disposed on the substrate; an insulation layer disposed on the common electrode, wherein, the insulation layer includes multiple first regions and multiple second regions, and the first regions and the second regions are disposed alternately; and multiple pixel electrodes respectively disposed on the first regions of the insulation layer; wherein, a thickness of the first regions and a thickness of the second regions are different.
  • a flat display panel comprising: a color filter substrate; an array substrate disposed oppositely to the color filter substrate; and a liquid crystal layer disposed between the color filter substrate and the array substrate; wherein, the array substrate includes: a substrate; a common electrode disposed on the substrate; an insulation layer disposed on the common electrode, wherein, the insulation layer includes multiple first regions and multiple second regions, and the first regions and the second regions are disposed alternately; and multiple pixel electrodes respectively disposed on the first regions of the insulation layer; wherein, a thickness of the first regions and a thickness of the second regions are different.
  • a manufacturing method for an array substrate comprising: sequentially forming a common electrode, an insulation layer and pixel electrode layer on a substrate; coating a photoresist layer on the pixel electrode layer; exposing and developing the photoresist layer in order to form a patterned photoresist layer; utilizing the patterned photoresist layer and a first etching method to etch the pixel electrode layer in order to form multiple spaced pixel electrodes; and utilizing the patterned photoresist layer and a second etching method to etch the insulation layer such that the insulation layer forms multiple alternate first regions and second regions, wherein, a thickness of the first regions and a thickness of the second regions are different.
  • the first etching method is a wet etching
  • the second etching method is a dry etching
  • the insulation layer of the array substrate includes multiple first regions and multiple second regions, wherein, the first regions and the second regions are disposed alternately. Besides, the thickness of the first regions and the thickness of the second regions are different. Then, multiple pixel electrodes are respectively disposed on the first region of the insulation layer. Because the thickness of the first regions and the thickness of the second regions are different, through adjusting the thickness of the first regions and the thickness of the second regions, the electric field strength between pixel electrodes and the electric field strength above the pixel electrode can be adjusted.
  • the difference of the electric field strength between pixel electrodes and the electric field strength above the pixel electrode is maintained in a predetermined range, and even zero such that the brightness between pixel electrodes and the brightness above the pixel electrodes are uniform in order to avoid generating a water ripple phenomenon in a flat display panel so as to increase the display quality and user experience.
  • FIG. 1 is an electric field distribution diagram of a conventional array substrate
  • FIG. 2 is a schematic cross-sectional view of a flat display panel according to an embodiment of the present invention
  • FIG. 3 is an electric field distribution diagram of the flat display panel shown in FIG. 2 ;
  • FIG. 4 is a flow chart of a manufacturing method of an array substrate according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of a flat display panel according to an embodiment of the present invention.
  • the flat display panel 100 includes an array substrate 10 , a color filter substrate 30 , and a liquid crystal layer 20 disposed between the array substrate 10 and the color filter substrate 30 .
  • the array substrate 10 includes a substrate 12 , a common electrode 14 , an insulation layer 16 and multiple pixel electrodes 18 .
  • the substrate 12 is disposed at the lowest layer of the array substrate 10 (using FIG. 2 as a reference).
  • the common electrode 14 is disposed on the substrate 12 .
  • the common electrode 14 can be made by a transparent and conductive material or any other materials used for manufacturing conventional common electrodes such as the metal material, etc.
  • the insulation layer 16 includes multiple first regions 162 and multiple second regions 164 .
  • the first regions 162 and the second regions 164 are disposed alternately. Wherein, a thickness of the first regions 162 and a thickness of the second regions 164 are different. Wherein, the first regions 162 and the second regions 164 can be made by a same material or different materials.
  • the multiple pixel electrodes 18 are respectively disposed on the first regions 162 of the insulation layer 16 such that the pixel electrodes 18 are disposed on the insulation layer 16 at intervals.
  • the pixel electrodes can be made by a transparent and conductive material or any other materials used for manufacturing the conventional pixel electrodes such as a polysilicon, etc.
  • the liquid crystal layer 20 is disposed between the color filter substrate 30 and the array substrate 10 .
  • the liquid crystal layer 20 is filled with liquid crystal molecules.
  • liquid crystal molecules used for filling the conventional flat display panel are all suitable for the present invention.
  • the materials used for manufacturing the conventional flat display panel are suitable for the color filter substrate 30 of the present invention.
  • the insulation layer 16 on the array substrate 10 includes multiple first regions 162 and multiple second regions 164 , wherein, the first regions 162 and the second regions 164 are disposed alternately. Besides, a thickness of the first regions 162 and a thickness of the second regions 164 are different. Furthermore, multiple pixel electrodes 18 are respectively disposed on the first regions of the insulation layer 16 . Because thicknesses of the first regions 162 and thicknesses of the second regions 164 are different, an electric field strength between the pixel electrodes and an electric field strength above the pixel electrodes 18 are adjusted in order to increase the display quality of the flat display panel.
  • a difference of the thickness of the first regions 162 and the thickness of the second region 164 can be set such that a difference of the electric field strength between pixel electrodes 18 and the electric field strength above the pixel electrodes 18 is in a predetermined range.
  • the predetermined range means that according to an actual requirement, the difference of the electric field strength between pixel electrodes 18 and the electric field strength above the pixel electrodes 18 is in a controllable electric field strength range.
  • a difference of the thickness of the first regions 162 and the thickness of the second regions 164 is also within a range.
  • a range of the difference of the thickness of the first regions 162 and the thickness of the second regions 164 is adjusted such that the difference of the electric field strength between pixel electrodes 18 and the electric field strength above the pixel electrodes 18 is maintained in a predetermined range. Furthermore, the difference of the thickness of the first regions 162 and the thickness of the second regions 164 is set such that the difference of the electric field strength between pixel electrodes 18 and the electric field strength above the pixel electrodes 18 is zero. At this time, the portion between pixel electrodes 18 and the portion above the pixel electrodes 18 does not generate the alternate bright and dark situation and the flat display panel does not generate the water ripple phenomenon.
  • the thickness of the first regions 162 and the thickness of the second region 164 are not limited, the only requirement is that the difference of the thickness of the first regions 162 and the thickness of the second regions 164 can achieve maintaining the difference of the electric field strength between the pixel electrodes 18 and the electric field strength above the pixel electrodes 18 in a predetermined range.
  • FIG. 3 is an electric field distribution diagram of the flat display panel shown in FIG. 2 .
  • a thickness of the first regions 162 is h 1 and a thickness of the second regions 164 is h 2 .
  • h 1 >h 2 a difference of the thickness of the first regions 162 and the thickness of the second region 164 is ⁇ h.
  • the difference of the thickness of the first regions 162 and the thickness of the second region 164 being ⁇ h
  • the difference of the electric field strength between pixel electrodes 18 and the electric field strength above the pixel electrodes 18 is maintained in a predetermined range, and even zero so that an electric field distribution between pixel electrodes 18 and above the pixel electrodes 18 is uniform in order to increase the display effect.
  • the aperture ratio between the pixel electrodes 18 is increased such that a light transmittance between the pixel electrodes 18 is also increased correspondingly. Accordingly, the brightness of the display area between pixel electrodes 18 in increased in order to increase the display brightness of the flat display panel 100 .
  • the thickness h 1 of the first regions 162 of the insulation layer 16 of the array substrate 100 is smaller than the thickness h 2 of the second region 164 , that is, h 1 ⁇ h 2 .
  • a material for manufacturing the first regions 162 of the insulation layer 16 and a material for manufacturing the second regions 164 are different.
  • a dielectric constant of the first regions 162 is much greater than a dielectric constant of the second region 164 .
  • the dielectric constant is inversely proportional to the electric field strength
  • the dielectric constant of the first regions 162 is high enough and the dielectric constant of the second regions 164 is low enough, even the thickness h 1 of the first regions 162 is smaller than the thickness h 2 of the second regions 164 , the difference of the electric field strength between pixel electrodes 18 on the insulation layer 16 and the electric field strength above the pixel electrode 18 can also be maintained in a predetermined range.
  • the insulation layer of the array substrate includes multiple first regions and multiple second regions, wherein, the first regions and the second regions are disposed alternately. Besides, the thickness of the first regions and the thickness of the second regions are different. Then, multiple pixel electrodes are respectively disposed on the first region of the insulation layer. Because the thickness of the first regions and the thickness of the second regions are different, through adjusting the thickness of the first regions and the thickness of the second regions, the electric field strength between pixel electrodes and the electric field strength above the pixel electrode can be adjusted.
  • the difference of the electric field strength between pixel electrodes and the electric field strength above the pixel electrode is maintained in a predetermined range, and even zero such that the brightness between pixel electrodes and the brightness above the pixel electrodes are uniform in order to avoid generating a water ripple phenomenon in a flat display panel so as to increase the display quality and user experience.
  • the aperture ratio between pixel electrodes is also increased such that the light transmittance is also increased correspondingly in order to increase the brightness between pixel electrodes of the flat display panel. Accordingly, the display brightness of the flat display panel is increased in order to correspondingly decrease the brightness of the backlight plate, save power and save cost.
  • the present invention also provides an array substrate, and the array substrate is anyone of the array substrates described at above embodiments.
  • FIG. 4 is a flow chart of a manufacturing method of an array substrate according to an embodiment of the present invention.
  • the manufacturing method includes the following steps:
  • S 101 sequentially forming a common electrode, an insulation layer and a pixel electrode layer.
  • the common electrode can be made by a transparent conductive material or other materials which can manufacture conventional common electrodes such as metal materials, etc.
  • the materials used for manufacturing the conventional insulation layers of the array substrates are suitable for the insulation layer of the present invention.
  • the material of the insulation layer can utilize a same material or a material that is mixed by different materials;
  • the pixel electrode layer can be made by a transparent conductive material or other materials that can manufacture the conventional pixel electrodes such as polysilicon, etc.
  • the photoresist can be a conventional photosensitive material such as a positive photoresist or a negative photoresist.
  • the first etching method is anyone of the etching methods that are used for the conventional liquid crystal devices.
  • the wet etching, the dry etching, the photolithographic etching, the X ray etching, the electric beam etching, or the ion beam etching are anyone of the etching methods that are used for the conventional liquid crystal devices.
  • the wet etching, the dry etching, the photolithographic etching, the X ray etching, the electric beam etching, or the ion beam etching are anyone of the etching methods that are used for the conventional liquid crystal devices.
  • the wet etching, the dry etching, the photolithographic etching, the X ray etching, the electric beam etching, or the ion beam etching are anyone of the etching methods that are used for the conventional liquid crystal devices.
  • the first etching method is the wet etching and utilizing the wet etching to continuously etch the pixel electrode layer below the patterned photoresist layer so that the pixel electrode layer forms multiple spaced pixel electrodes.
  • the second etching method is anyone of the etching methods that are used for the conventional liquid crystal devices.
  • the wet etching, the dry etching, the photolithographic etching, the X ray etching, the electric beam etching, or the ion beam etching is anyone of the etching methods that are used for the conventional liquid crystal devices.
  • the wet etching, the dry etching, the photolithographic etching, the X ray etching, the electric beam etching, or the ion beam etching is anyone of the etching methods that are used for the conventional liquid crystal devices.
  • the wet etching, the dry etching, the photolithographic etching, the X ray etching, the electric beam etching, or the ion beam etching is anyone of the etching methods that are used for the conventional liquid crystal devices.
  • the second etching method is the dry etching and utilizing the dry etching to continuously etch the insulation layer below any two of the pixel electrodes such that the insulation layer forms the multiple alternate first regions and second regions.
  • a thickness of the first regions and a thickness of the second regions are different.
  • the manufacturing method of the present embodiment only requires etching the insulation layer using the second etching method after using a first etching method to etch the pixel electrode layer in order to form the multiple spaced pixel electrodes in the conventional art. Accordingly, the insulation layer can form multiple alternate first regions and second regions having different thicknesses.
  • the manufacturing method can adjust the thickness of the first regions and the thickness of the second regions of the insulation layer in order to adjust the electric field strength between pixel electrodes and the electric field strength above the pixel electrodes, which is simple, quick and can be widely applied.
  • the manufacturing method further includes a step of utilizing a patterned photoresist layer and a second etching method to etch the insulation layer.
  • the thickness of the first regions and the thickness of the second regions are different.
  • a difference of the thickness of the first regions and the thickness of the second regions is set such that the electric field strength between pixel electrodes and the electric field strength above pixel electrodes is maintained in a predetermined range.
  • the predetermined range means that according to an actual requirement, the difference of the electric field strength between pixel electrodes and the electric field strength above the pixel electrodes is in a controllable electric field strength range.
  • a difference of the thickness of the first regions and the thickness of the second regions is also within a range.
  • a range of the difference of the thickness of the first regions and the thickness of the second regions is adjusted such that the difference of the electric field strength between pixel electrodes and the electric field strength above the pixel electrodes is maintained in a predetermined range
  • the manufacturing method further includes a step of controlling speed and time of the second etching method in order to ensure that a difference of the thickness of the first regions and the thickness of the second region can be set such that a difference of the electric field strength between pixel electrodes and the electric field strength above the pixel electrodes is in a predetermined range.
  • step S 105 the manufacturing method further includes a step of setting the difference of the electric field strength between pixel electrodes and the electric field strength above the pixel electrodes to be zero. At this time, the portion between pixel electrodes and the portion above the pixel electrodes does not generate the alternate bright and dark situation and the flat display panel does not generate the water ripple phenomenon.
  • the thickness of the first regions and the thickness of the second region are not limited, the only requirement is that the difference of the thickness of the first regions and the thickness of the second regions can achieve maintaining the difference of the electric field strength between the pixel electrodes and the electric field strength above the pixel electrodes in a predetermined range.
  • the thickness of the first regions is greater than the thickness of the second region, or the thickness of the first regions is smaller than the thickness of the second region.
  • the manufacturing method further includes a step of removing the photoresist layer.
  • the manufacturing method of the present embodiment only requires etching the insulation layer using the second etching method after using a first etching method to etch the pixel electrode layer in order to form the multiple spaced pixel electrodes in the conventional art. Accordingly, the insulation layer can form multiple alternate first regions and second regions having different thicknesses. The manufacturing method can adjust the thickness of the first regions and the thickness of the second regions of the insulation layer in order to adjust the electric field strength between pixel electrodes and the electric field strength above the pixel electrodes.
  • the difference of the electric field strength between pixel electrodes and the electric field strength above the pixel electrode is maintained in a predetermined range, and even zero such that the brightness between pixel electrodes and the brightness above the pixel electrodes are uniform in order to avoid generating a water ripple phenomenon in a flat display panel so as to increase the display quality and user experience.
  • the manufacturing method of the array substrate of the present invention is simple, quick and can be widely applied in the industry production.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Geometry (AREA)

Abstract

The present invention provides an array substrate, a flat display panel and a manufacturing for the same. The array substrate includes a substrate, a common electrode disposed on the substrate, an insulation layer disposed on the common electrode, wherein, the insulation layer includes multiple first regions and multiple second regions, and the first regions and the second regions are disposed alternately, and multiple pixel electrodes respectively disposed on the first regions of the insulation layer. Wherein, a thickness of the first regions and a thickness of the second regions are different. Through above way, the electric field strength between pixel electrodes and the electric field strength above the pixel electrodes can be adjusted in order to increase the display quality of the flat display panel.

Description

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to the liquid crystal display technology, and more particularly to an array substrate, a flat display panel and manufacturing method for the same.
2. Description of Related Art
As shown in FIG. 1, an array substrate having a fringe-field switching (FFS) mode includes: a substrate 1, a common electrode 2 disposed on the substrate, an insulation layer 3 disposed on the common electrode 2 and multiple pixel electrodes 4 disposed on the insulation layer 3 at intervals. From FIG. 1, in the conventional art of the array substrate, an electric field strength between pixel electrodes and an electric field strength above the pixel electrode are different.
When the array substrate is applied in a flat display panel, because the electric field strength above the pixel electrode and an electric field strength between pixel electrodes are different, an alternate bright and dark situation is generated at a portion above the pixel electrode and a portion between pixel electrodes. A water ripple phenomenon is generated at a flat display panel so as to directly affect the display quality of the flat display panel.
SUMMARY OF THE INVENTION
The main technology problem solved by the present invention is to provide an array substrate, a flat display panel and a manufacturing for the same. Through the present invention, the electric field strength between pixel electrodes and the electric field strength above the pixel electrodes can be adjusted in order to increase the display quality of the flat display panel.
In order to solve the above technology problem, a technology solution adopted by the present invention is: an array substrate, comprising: a substrate; a common electrode disposed on the substrate; an insulation layer disposed on the common electrode, wherein, the insulation layer includes multiple first regions and multiple second regions, and the first regions and the second regions are disposed alternately; and multiple pixel electrodes respectively disposed on the first regions of the insulation layer; wherein, a thickness of the first regions and a thickness of the second regions are different, and the thickness of the first regions is greater than the thickness of the second regions, and the common electrode and the pixel electrodes are made by a transparent and conductive material.
Wherein, a difference of the thickness of the first regions and the thickness of the second regions is set to maintain a difference of an electric field strength between pixel electrodes and an electric field strength above the pixel electrodes in a predetermined range.
Wherein, a difference of the thickness of the first regions and the thickness of the second regions is set to make a difference of an electric field strength between pixel electrodes and an electric field strength above the pixel electrodes be zero.
In order to solve the above technology problem, another technology solution adopted by the present invention is: an array substrate, comprising: a substrate; a common electrode disposed on the substrate; an insulation layer disposed on the common electrode, wherein, the insulation layer includes multiple first regions and multiple second regions, and the first regions and the second regions are disposed alternately; and multiple pixel electrodes respectively disposed on the first regions of the insulation layer; wherein, a thickness of the first regions and a thickness of the second regions are different.
In order to solve the above technology problem, another technology solution adopted by the present invention is: a flat display panel, comprising: a color filter substrate; an array substrate disposed oppositely to the color filter substrate; and a liquid crystal layer disposed between the color filter substrate and the array substrate; wherein, the array substrate includes: a substrate; a common electrode disposed on the substrate; an insulation layer disposed on the common electrode, wherein, the insulation layer includes multiple first regions and multiple second regions, and the first regions and the second regions are disposed alternately; and multiple pixel electrodes respectively disposed on the first regions of the insulation layer; wherein, a thickness of the first regions and a thickness of the second regions are different.
In order to solve the above technology problem, another technology solution adopted by the present invention is: a manufacturing method for an array substrate, comprising: sequentially forming a common electrode, an insulation layer and pixel electrode layer on a substrate; coating a photoresist layer on the pixel electrode layer; exposing and developing the photoresist layer in order to form a patterned photoresist layer; utilizing the patterned photoresist layer and a first etching method to etch the pixel electrode layer in order to form multiple spaced pixel electrodes; and utilizing the patterned photoresist layer and a second etching method to etch the insulation layer such that the insulation layer forms multiple alternate first regions and second regions, wherein, a thickness of the first regions and a thickness of the second regions are different.
Wherein, the first etching method is a wet etching, and the second etching method is a dry etching.
Comparing to the conventional art, the insulation layer of the array substrate includes multiple first regions and multiple second regions, wherein, the first regions and the second regions are disposed alternately. Besides, the thickness of the first regions and the thickness of the second regions are different. Then, multiple pixel electrodes are respectively disposed on the first region of the insulation layer. Because the thickness of the first regions and the thickness of the second regions are different, through adjusting the thickness of the first regions and the thickness of the second regions, the electric field strength between pixel electrodes and the electric field strength above the pixel electrode can be adjusted. according to actual requirement, the difference of the electric field strength between pixel electrodes and the electric field strength above the pixel electrode is maintained in a predetermined range, and even zero such that the brightness between pixel electrodes and the brightness above the pixel electrodes are uniform in order to avoid generating a water ripple phenomenon in a flat display panel so as to increase the display quality and user experience.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an electric field distribution diagram of a conventional array substrate;
FIG. 2 is a schematic cross-sectional view of a flat display panel according to an embodiment of the present invention;
FIG. 3 is an electric field distribution diagram of the flat display panel shown in FIG. 2; and
FIG. 4 is a flow chart of a manufacturing method of an array substrate according to an embodiment of the present invention.
 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
The following content combines figures and embodiments for detail description of the present invention.
With reference to FIG. 2, FIG. 2 is a schematic cross-sectional view of a flat display panel according to an embodiment of the present invention. The flat display panel 100 includes an array substrate 10, a color filter substrate 30, and a liquid crystal layer 20 disposed between the array substrate 10 and the color filter substrate 30.
The array substrate 10 includes a substrate 12, a common electrode 14, an insulation layer 16 and multiple pixel electrodes 18.
The substrate 12 is disposed at the lowest layer of the array substrate 10 (using FIG. 2 as a reference).
The common electrode 14 is disposed on the substrate 12. The common electrode 14 can be made by a transparent and conductive material or any other materials used for manufacturing conventional common electrodes such as the metal material, etc.
The insulation layer 16 includes multiple first regions 162 and multiple second regions 164. The first regions 162 and the second regions 164 are disposed alternately. Wherein, a thickness of the first regions 162 and a thickness of the second regions 164 are different. Wherein, the first regions 162 and the second regions 164 can be made by a same material or different materials.
The multiple pixel electrodes 18 are respectively disposed on the first regions 162 of the insulation layer 16 such that the pixel electrodes 18 are disposed on the insulation layer 16 at intervals. The pixel electrodes can be made by a transparent and conductive material or any other materials used for manufacturing the conventional pixel electrodes such as a polysilicon, etc.
The liquid crystal layer 20 is disposed between the color filter substrate 30 and the array substrate 10. The liquid crystal layer 20 is filled with liquid crystal molecules. Wherein, liquid crystal molecules used for filling the conventional flat display panel are all suitable for the present invention. Besides, the materials used for manufacturing the conventional flat display panel are suitable for the color filter substrate 30 of the present invention.
In the present embodiment, the insulation layer 16 on the array substrate 10 includes multiple first regions 162 and multiple second regions 164, wherein, the first regions 162 and the second regions 164 are disposed alternately. Besides, a thickness of the first regions 162 and a thickness of the second regions 164 are different. Furthermore, multiple pixel electrodes 18 are respectively disposed on the first regions of the insulation layer 16. Because thicknesses of the first regions 162 and thicknesses of the second regions 164 are different, an electric field strength between the pixel electrodes and an electric field strength above the pixel electrodes 18 are adjusted in order to increase the display quality of the flat display panel.
Furthermore, a difference of the thickness of the first regions 162 and the thickness of the second region 164 can be set such that a difference of the electric field strength between pixel electrodes 18 and the electric field strength above the pixel electrodes 18 is in a predetermined range. The predetermined range means that according to an actual requirement, the difference of the electric field strength between pixel electrodes 18 and the electric field strength above the pixel electrodes 18 is in a controllable electric field strength range. In a predetermined range of the electric field strength range, a difference of the thickness of the first regions 162 and the thickness of the second regions 164 is also within a range.
For example, in order to eliminate the alternate bright and dark situation of a portion between pixel electrodes 18 and a portion above the pixel electrodes 18 and to eliminate the water ripple phenomenon of the flat display panel, a range of the difference of the thickness of the first regions 162 and the thickness of the second regions 164 is adjusted such that the difference of the electric field strength between pixel electrodes 18 and the electric field strength above the pixel electrodes 18 is maintained in a predetermined range. Furthermore, the difference of the thickness of the first regions 162 and the thickness of the second regions 164 is set such that the difference of the electric field strength between pixel electrodes 18 and the electric field strength above the pixel electrodes 18 is zero. At this time, the portion between pixel electrodes 18 and the portion above the pixel electrodes 18 does not generate the alternate bright and dark situation and the flat display panel does not generate the water ripple phenomenon.
Wherein, the thickness of the first regions 162 and the thickness of the second region 164 are not limited, the only requirement is that the difference of the thickness of the first regions 162 and the thickness of the second regions 164 can achieve maintaining the difference of the electric field strength between the pixel electrodes 18 and the electric field strength above the pixel electrodes 18 in a predetermined range.
Specifically, with reference to FIG. 3, FIG. 3 is an electric field distribution diagram of the flat display panel shown in FIG. 2. In the insulation layer 16 of the array substrate 100, a thickness of the first regions 162 is h1 and a thickness of the second regions 164 is h2. Wherein, h1>h2, a difference of the thickness of the first regions 162 and the thickness of the second region 164 is Δh.
For the difference of the thickness of the first regions 162 and the thickness of the second region 164 being Δh, on one hand, the difference of the electric field strength between pixel electrodes 18 and the electric field strength above the pixel electrodes 18 is maintained in a predetermined range, and even zero so that an electric field distribution between pixel electrodes 18 and above the pixel electrodes 18 is uniform in order to increase the display effect. On the other hand, the aperture ratio between the pixel electrodes 18 is increased such that a light transmittance between the pixel electrodes 18 is also increased correspondingly. Accordingly, the brightness of the display area between pixel electrodes 18 in increased in order to increase the display brightness of the flat display panel 100.
Of course, in other embodiments, the thickness h1 of the first regions 162 of the insulation layer 16 of the array substrate 100 is smaller than the thickness h2 of the second region 164, that is, h1<h2. Specifically, a material for manufacturing the first regions 162 of the insulation layer 16 and a material for manufacturing the second regions 164 are different. A dielectric constant of the first regions 162 is much greater than a dielectric constant of the second region 164. Because the dielectric constant is inversely proportional to the electric field strength, when the dielectric constant of the first regions 162 is high enough and the dielectric constant of the second regions 164 is low enough, even the thickness h1 of the first regions 162 is smaller than the thickness h2 of the second regions 164, the difference of the electric field strength between pixel electrodes 18 on the insulation layer 16 and the electric field strength above the pixel electrode 18 can also be maintained in a predetermined range.
In flat display panel of the present invention, the insulation layer of the array substrate includes multiple first regions and multiple second regions, wherein, the first regions and the second regions are disposed alternately. Besides, the thickness of the first regions and the thickness of the second regions are different. Then, multiple pixel electrodes are respectively disposed on the first region of the insulation layer. Because the thickness of the first regions and the thickness of the second regions are different, through adjusting the thickness of the first regions and the thickness of the second regions, the electric field strength between pixel electrodes and the electric field strength above the pixel electrode can be adjusted.
According to actual requirement, the difference of the electric field strength between pixel electrodes and the electric field strength above the pixel electrode is maintained in a predetermined range, and even zero such that the brightness between pixel electrodes and the brightness above the pixel electrodes are uniform in order to avoid generating a water ripple phenomenon in a flat display panel so as to increase the display quality and user experience. Besides, the aperture ratio between pixel electrodes is also increased such that the light transmittance is also increased correspondingly in order to increase the brightness between pixel electrodes of the flat display panel. Accordingly, the display brightness of the flat display panel is increased in order to correspondingly decrease the brightness of the backlight plate, save power and save cost.
The present invention also provides an array substrate, and the array substrate is anyone of the array substrates described at above embodiments.
Besides, the present invention also provides a manufacturing method for an array substrate. With reference to FIG. 4, FIG. 4 is a flow chart of a manufacturing method of an array substrate according to an embodiment of the present invention. The manufacturing method includes the following steps:
S101: sequentially forming a common electrode, an insulation layer and a pixel electrode layer.
Firstly, forming a substrate;
Then, forming the common electrode on the substrate. The common electrode can be made by a transparent conductive material or other materials which can manufacture conventional common electrodes such as metal materials, etc.
Then, forming an insulation layer on the common electrode, wherein, the materials used for manufacturing the conventional insulation layers of the array substrates are suitable for the insulation layer of the present invention. Besides, the material of the insulation layer can utilize a same material or a material that is mixed by different materials;
Finally, forming the pixel electrode layer on the insulation layer. The pixel electrode layer can be made by a transparent conductive material or other materials that can manufacture the conventional pixel electrodes such as polysilicon, etc.
S102: coating a photoresist layer on the pixel electrode layer.
Wherein, coating photoresist on the pixel electric layer in order to form the photoresist layer. The photoresist can be a conventional photosensitive material such as a positive photoresist or a negative photoresist.
S103: exposing and developing the photoresist layer in order to form a patterned photoresist layer.
Coating developer on the array substrate having the photoresist layer formed in the step S102 in order to dissolve a softened portion of the photoresist layer. Then, processing a development process after exposing under a mask. Finally, the patterned photoresist layer is formed.
S104: utilizing the patterned photoresist layer and utilizing a first etching method to etch the pixel electrode layer in order to form multiple spaced pixel electrodes.
The first etching method is anyone of the etching methods that are used for the conventional liquid crystal devices. For example, the wet etching, the dry etching, the photolithographic etching, the X ray etching, the electric beam etching, or the ion beam etching.
In the present embodiment, the first etching method is the wet etching and utilizing the wet etching to continuously etch the pixel electrode layer below the patterned photoresist layer so that the pixel electrode layer forms multiple spaced pixel electrodes.
S105: utilizing the patterned photoresist layer and utilizing a second etching method to etch the insulation layer in order to form multiple alternate first regions and second regions in the insulation layer. Wherein, a thickness of the first regions and a thickness of the second regions are different.
The second etching method is anyone of the etching methods that are used for the conventional liquid crystal devices. For example, the wet etching, the dry etching, the photolithographic etching, the X ray etching, the electric beam etching, or the ion beam etching.
In the present embodiment, the second etching method is the dry etching and utilizing the dry etching to continuously etch the insulation layer below any two of the pixel electrodes such that the insulation layer forms the multiple alternate first regions and second regions. Wherein, a thickness of the first regions and a thickness of the second regions are different.
The manufacturing method of the present embodiment only requires etching the insulation layer using the second etching method after using a first etching method to etch the pixel electrode layer in order to form the multiple spaced pixel electrodes in the conventional art. Accordingly, the insulation layer can form multiple alternate first regions and second regions having different thicknesses. The manufacturing method can adjust the thickness of the first regions and the thickness of the second regions of the insulation layer in order to adjust the electric field strength between pixel electrodes and the electric field strength above the pixel electrodes, which is simple, quick and can be widely applied.
Furthermore, in another embodiment, in step S105, the manufacturing method further includes a step of utilizing a patterned photoresist layer and a second etching method to etch the insulation layer. The thickness of the first regions and the thickness of the second regions are different. Wherein, a difference of the thickness of the first regions and the thickness of the second regions is set such that the electric field strength between pixel electrodes and the electric field strength above pixel electrodes is maintained in a predetermined range. The predetermined range means that according to an actual requirement, the difference of the electric field strength between pixel electrodes and the electric field strength above the pixel electrodes is in a controllable electric field strength range. In a predetermined range of the electric field strength range, a difference of the thickness of the first regions and the thickness of the second regions is also within a range. For example, in order to eliminate the alternate bright and dark situation of a portion between pixel electrodes and a portion above the pixel electrodes and to eliminate the water ripple phenomenon of the flat display panel, a range of the difference of the thickness of the first regions and the thickness of the second regions is adjusted such that the difference of the electric field strength between pixel electrodes and the electric field strength above the pixel electrodes is maintained in a predetermined range
Furthermore, when using the second etching method to etch the insulation layer, the manufacturing method further includes a step of controlling speed and time of the second etching method in order to ensure that a difference of the thickness of the first regions and the thickness of the second region can be set such that a difference of the electric field strength between pixel electrodes and the electric field strength above the pixel electrodes is in a predetermined range.
Furthermore, in another embodiment, in step S105, the manufacturing method further includes a step of setting the difference of the electric field strength between pixel electrodes and the electric field strength above the pixel electrodes to be zero. At this time, the portion between pixel electrodes and the portion above the pixel electrodes does not generate the alternate bright and dark situation and the flat display panel does not generate the water ripple phenomenon.
In the present invention, after using the second etching method to etch the insulation layer, the thickness of the first regions and the thickness of the second region are not limited, the only requirement is that the difference of the thickness of the first regions and the thickness of the second regions can achieve maintaining the difference of the electric field strength between the pixel electrodes and the electric field strength above the pixel electrodes in a predetermined range. For example, after using the second etching method to etch the insulation layer, the thickness of the first regions is greater than the thickness of the second region, or the thickness of the first regions is smaller than the thickness of the second region.
In the present invention, after the step S105, the manufacturing method further includes a step of removing the photoresist layer.
The manufacturing method of the present embodiment only requires etching the insulation layer using the second etching method after using a first etching method to etch the pixel electrode layer in order to form the multiple spaced pixel electrodes in the conventional art. Accordingly, the insulation layer can form multiple alternate first regions and second regions having different thicknesses. The manufacturing method can adjust the thickness of the first regions and the thickness of the second regions of the insulation layer in order to adjust the electric field strength between pixel electrodes and the electric field strength above the pixel electrodes.
According to actual requirement, through the second etching method, the difference of the electric field strength between pixel electrodes and the electric field strength above the pixel electrode is maintained in a predetermined range, and even zero such that the brightness between pixel electrodes and the brightness above the pixel electrodes are uniform in order to avoid generating a water ripple phenomenon in a flat display panel so as to increase the display quality and user experience. The manufacturing method of the array substrate of the present invention is simple, quick and can be widely applied in the industry production.
The above embodiments of the present invention are not used to limit the claims of this invention. Any use of the content in the specification or in the drawings of the present invention which produces equivalent structures or equivalent processes, or directly or indirectly used in other related technical fields is still covered by the claims in the present invention.

Claims (10)

What is claimed is:
1. An array substrate, comprising:
a substrate;
a common electrode disposed on the substrate;
an insulation layer disposed on the common electrode, wherein, the insulation layer includes multiple first regions and multiple second regions, and the first regions and the second regions are disposed alternately; and
multiple pixel electrodes respectively disposed on the first regions of the insulation layer;
wherein, a thickness of the first regions and a thickness of the second regions are different; and
wherein, a bottom of the first region and a bottom of the second region are coplanar, and a top of the second region is higher than the bottom of the first region.
2. The array substrate according to claim 1, wherein, the thickness of the first regions is greater than the thickness of the second regions.
3. The array substrate according to claim 2, wherein, a difference of the thickness of the first regions and the thickness of the second regions is set to maintain a difference of an electric field strength between pixel electrodes and an electric field strength above the pixel electrodes in a predetermined range.
4. The array substrate according to claim 3, wherein, a difference of the thickness of the first regions and the thickness of the second regions is set to make a difference of an electric field strength between pixel electrodes and an electric field strength above the pixel electrodes be zero.
5. The array substrate according to claim 1, wherein, the common electrode and the pixel electrodes are made by a transparent and conductive material.
6. A flat display panel, comprising:
a color filter substrate;
an array substrate disposed oppositely to the color filter substrate; and
a liquid crystal layer disposed between the color filter substrate and the array substrate;
wherein, the array substrate includes:
a substrate;
a common electrode disposed on the substrate;
an insulation layer disposed on the common electrode, wherein, the insulation layer includes multiple first regions and multiple second regions, and the first regions and the second regions are disposed alternately; and
multiple pixel electrodes respectively disposed on the first regions of the insulation layer;
wherein, a thickness of the first regions and a thickness of the second regions are different; and
wherein, a bottom of the first region and a bottom of the second region are coplanar, and a top of the second region is higher than the bottom of the first region.
7. The flat display panel according to claim 6, wherein, the thickness of the first regions is greater than the thickness of the second regions.
8. The flat display panel according to claim 7, wherein, a difference of the thickness of the first regions and the thickness of the second regions is set to maintain a difference of an electric field strength between pixel electrodes and an electric field strength above the pixel electrodes in a predetermined range.
9. A manufacturing method for an array substrate, comprising:
sequentially forming a common electrode, an insulation layer and pixel electrode layer on a substrate;
coating a photoresist layer on the pixel electrode layer;
exposing and developing the photoresist layer in order to form a patterned photoresist layer;
utilizing the patterned photoresist layer and a first etching method to etch the pixel electrode layer in order to form multiple spaced pixel electrodes; and
utilizing the patterned photoresist layer and a second etching method to etch the insulation layer such that the insulation layer forms multiple alternate first regions and second regions, wherein, a thickness of the first regions and a thickness of the second regions are different;
wherein, a bottom of the first region and a bottom of the second region are coplanar, and a top of the second region is higher than the bottom of the first region.
10. The manufacturing method for the array substrate according to claim 9, wherein, the first etching method is a wet etching, and the second etching method is a dry etching.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6373541B1 (en) * 1998-08-07 2002-04-16 Matsushita Electric Industrial Co., Ltd. Reflection type liquid crystal display element
US20030160918A1 (en) * 2002-02-26 2003-08-28 Soo-Guy Rho Transreflective type liquid crystal display and method of manufacturing the same
US7075602B2 (en) * 2001-10-15 2006-07-11 Sharp Kabushiki Kaisha Substrate for reflective liquid crystal display device and reflective liquid crystal display device using the same wherein the reflective surface is a wrinkled pattern of small mirrors
US20110013121A1 (en) * 2001-11-08 2011-01-20 Dai Nippon Printing Co., Ltd. Phase difference layer laminated body for three dimensional liquid crystal display device and manufacturing method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW387997B (en) * 1997-12-29 2000-04-21 Hyundai Electronics Ind Liquid crystal display and fabrication method
CN100449395C (en) * 2006-12-22 2009-01-07 北京京东方光电科技有限公司 A fringe field switching liquid crystal display with electrode protrusions
KR101307965B1 (en) * 2007-02-16 2013-09-12 엘지디스플레이 주식회사 An array substrate for In-Plane switching mode LCD and method of fabricating of the same
CN101325201B (en) * 2007-06-13 2011-04-13 北京京东方光电科技有限公司 Array substrate structure of transparent film transistor and manufacturing method thereof
CN101546733B (en) * 2008-03-28 2011-07-27 北京京东方光电科技有限公司 Method for manufacturing TFT-LCD array substrate and color film substrate
CN101285977B (en) * 2008-05-30 2010-06-02 昆山龙腾光电有限公司 Liquid crystal display device and array substrate thereof
KR101942971B1 (en) * 2012-12-03 2019-01-28 삼성전자주식회사 Electrowetting display apparatus having low power consumption and method of driving the same
JP2014178475A (en) * 2013-03-14 2014-09-25 Japan Display Inc Liquid crystal display device
CN104298018B (en) * 2014-09-23 2018-05-04 京东方科技集团股份有限公司 Array base palte and preparation method thereof, display panel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6373541B1 (en) * 1998-08-07 2002-04-16 Matsushita Electric Industrial Co., Ltd. Reflection type liquid crystal display element
US7075602B2 (en) * 2001-10-15 2006-07-11 Sharp Kabushiki Kaisha Substrate for reflective liquid crystal display device and reflective liquid crystal display device using the same wherein the reflective surface is a wrinkled pattern of small mirrors
US20110013121A1 (en) * 2001-11-08 2011-01-20 Dai Nippon Printing Co., Ltd. Phase difference layer laminated body for three dimensional liquid crystal display device and manufacturing method thereof
US20030160918A1 (en) * 2002-02-26 2003-08-28 Soo-Guy Rho Transreflective type liquid crystal display and method of manufacturing the same

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