US9325104B2 - Gelatinous dielectric material for high voltage connector - Google Patents

Gelatinous dielectric material for high voltage connector Download PDF

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Publication number
US9325104B2
US9325104B2 US14/242,989 US201414242989A US9325104B2 US 9325104 B2 US9325104 B2 US 9325104B2 US 201414242989 A US201414242989 A US 201414242989A US 9325104 B2 US9325104 B2 US 9325104B2
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United States
Prior art keywords
conductive
bore
internal chamber
connector device
pin assembly
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US14/242,989
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US20140349500A1 (en
Inventor
Larry N. Siebens
William K. Longcor, IV
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ABB Installation Products International LLC
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Thomas and Betts International LLC
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Assigned to THOMAS & BETTS INTERNATIONAL, INC. reassignment THOMAS & BETTS INTERNATIONAL, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LONGCOR, WILLIAM K., IV, SIEBENS, LARRY N.
Priority to US14/242,989 priority Critical patent/US9325104B2/en
Priority to AU2014202028A priority patent/AU2014202028B2/en
Priority to CA2852551A priority patent/CA2852551C/en
Priority to TW103117618A priority patent/TW201513504A/zh
Priority to MX2014006172A priority patent/MX336124B/es
Priority to CN201410212226.8A priority patent/CN104183413B/zh
Priority to JP2014105299A priority patent/JP5738455B2/ja
Priority to EP14169696.3A priority patent/EP2806510B1/en
Priority to BRBR102014012644-9A priority patent/BR102014012644A2/pt
Publication of US20140349500A1 publication Critical patent/US20140349500A1/en
Publication of US9325104B2 publication Critical patent/US9325104B2/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/53Bases or cases for heavy duty; Bases or cases for high voltage with means for preventing corona or arcing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H33/00High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
    • H01H33/02Details
    • H01H33/04Means for extinguishing or preventing arc between current-carrying parts
    • H01H33/16Impedances connected with contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H33/00High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
    • H01H33/02Details
    • H01H33/04Means for extinguishing or preventing arc between current-carrying parts
    • H01H33/22Selection of fluids for arc-extinguishing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/18Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/52Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5216Dustproof, splashproof, drip-proof, waterproof, or flameproof cases characterised by the sealing material, e.g. gels or resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28Clamped connections, spring connections
    • H01R4/48Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H01R4/4881Clamped connections, spring connections utilising a spring, clip, or other resilient member using a louver type spring
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00Cable fittings
    • H02G15/003Filling materials, e.g. solid or fluid insulation
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00Cable fittings
    • H02G15/02Cable terminations
    • H02G15/06Cable terminating boxes, frames or other structures
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • Y10T29/49208Contact or terminal manufacturing by assembling plural parts

Definitions

  • the present invention relates to high voltage electrical connectors, such as high voltage circuit breakers, switchgear, and other electrical equipment.
  • Typical dielectric materials used in high voltage applications include air, oil, or sulfur hexafluoride (SF 6 ) gas.
  • Air requires a long distance between contacts in order to reduce the likelihood of arcing in high voltage (e.g., 5+kV) environments.
  • oil requires shorter distances between contacts, but oil is subject to igniting when a fault occurs and may contain harmful polychlorinated biphenyls (PCBs).
  • PCBs polychlorinated biphenyls
  • SF 6 gas requires relatively short distances between contacts, but use of SF 6 gas is undesirable for environmental protection reasons.
  • FIG. 2 is schematic cross-sectional diagram illustrating the connector assembly of FIG. 1 in a closed position
  • FIG. 3 is a schematic cross-sectional diagram of a connector body of the connector assembly of FIG. 1 ;
  • FIG. 4 is an enlarged schematic view of the pin assembly of the connector assembly of FIG. 1 .
  • a chamber filled with silicone gel is used as a dielectric material to isolate a contact pin assembly in a high voltage electrical connector.
  • the silicone gel acts as a malleable insulating compound that is capable of adhering, separating, and re-adhereing to the contact pin assembly.
  • the silicone gel prevents voltage from creeping along an insulated surface of the pin assembly and/or flashing over or arcing to conductive components of the high voltage electrical connector.
  • FIG. 1 is a schematic cross-sectional diagram illustrating a connector assembly 10 in an open position according to implementations described herein.
  • FIG. 2 is a schematic cross-sectional diagram illustrating connector assembly 10 in a closed position.
  • Connector assembly 10 may generally include a device body 100 and a pin assembly 200 that moves axially within device body 100 between the open position of FIG. 1 and the closed position of FIG. 2 .
  • FIG. 3 is a schematic cross-sectional diagram of device body 100
  • FIG. 4 is an enlarged schematic view of pin assembly 200 .
  • device body 100 may include a connector 102 that is connected to a bus 106 .
  • connector 102 may include a threaded connection, as shown.
  • connector 102 may include a spade connector or another type of connector that is integrally formed with bus 106 .
  • Connector 102 and bus 106 may be made of an electrically conductive material, such as copper.
  • Connector 102 and/or bus 106 may extend through a bushing portion 104 of device body 100 .
  • Bushing portion 104 may form an insulative outer layer around bus 106 from which connector 102 extends.
  • Bushing portion 104 may be made of, for example, an insulative rubber or epoxy material.
  • bushing portion 104 may be sized as an ANSI standard high current interface.
  • bus 106 may include an axial bore 108 formed concentrically therein and a set of louver contacts 110 .
  • Bore 108 may be configured to receive pin assembly 200 such that pin assembly 200 may slide against louver contacts 110 , as described further below.
  • bore 108 may open into a larger opening 109 of bushing portion 104 .
  • Device body 100 may further include a conductive housing 112 .
  • Conductive housing 112 may be made of an electrically conductive material, such as copper.
  • Conductive housing 112 may include a terminal connection or another interface (not shown) to other electrical equipment or to ground.
  • conductive housing 112 may also include an axial center bore 118 formed concentrically therein and a set of louver contacts 120 .
  • a different type of contact may be used in bore 108 and bore 118 .
  • bore 108 and bore 118 may simply include a contact region in place of louver contacts 110 / 120 .
  • Center bore 118 may be configured to receive pin assembly 200 such that pin assembly 200 may slide against louver contacts 120 , as described further below.
  • center bore 118 may join a larger opening 119 of conductive housing 112 .
  • pin assembly 200 may include a non-conductive (e.g., insulative) tip 202 and a conductive pin 204 .
  • non-conductive tip 202 may be formed from a plastic material, and conductive pin 204 may be formed from copper.
  • Non-conductive tip 202 may include a threaded stud 206 and conductive pin 204 may include a corresponding threaded female opening 208 (or vice-versa) to secure non-conductive tip 202 to conductive pin 204 .
  • non-conductive tip 202 may be chemically bonded or adhered to conductive pin 204 , such as with an epoxy or other adhesive.
  • Pin assembly 200 may move axially within bores 108 / 118 and openings 109 / 119 .
  • Pin assembly 200 may be driven, for example, by a motor (not shown) or other mechanical force between the open position shown in FIG. 1 and the closed position shown in FIG. 2 .
  • connector device 10 may be in communication with a controller that initiates a motor to selectively drive pin assembly 200 between the open position of FIG. 1 and the closed position of FIG. 2 .
  • device body 100 and pin assembly 200 are configured to provide approximately two inches (e.g., ⁇ an eighth inch) of axial distance (“D” in FIG. 1 ) between bus 106 and conductive pin 204 when connector assembly 10 is in an open/ungrounded position.
  • the axial travel distance of pin assembly 200 may be between about two and three inches to ensure good contact between conductive pin 204 and louver contacts 110 when connector assembly 10 is in a closed/grounded position.
  • pin assembly 200 may be configured so that non-conductive tip 202 is at least partially within bore 108 (e.g., in contact with O-rings 134 , described below) when connector assembly 10 is in the open position of FIG. 1 and is fully within bore 108 (e.g., inserted past O-rings 134 ) when connector assembly 10 is in the closed position of FIG. 2 .
  • conductive pin 204 may be at least partially within bore 118 (e.g., in contact with O-rings 136 , described below) when connector assembly 10 is in the open position of FIG. 1 or the closed position of FIG. 2 .
  • pin assembly 200 may always remain anchored within bores 108 and 118 regardless of the particular open/closed position of connector device 10 .
  • Opening 109 and opening 119 together may form a chamber 130 inside device body 100 .
  • chamber 130 is be filled with a solid or semi-solid dielectric material.
  • a silicone gel 132 may serve as the dielectric insulating material.
  • O-rings 134 , 136 , and 138 may be used to seal silicone gel 132 within chamber 130 and to provide a watertight enclosure. More particularly, O-ring 134 may be seated along bore 108 adjacent pin assembly 200 near an entrance to bore 108 . Similarly, O-ring 136 may be seated along bore 118 adjacent pin assembly 200 near an entrance to bore 118 .
  • An additional O-ring 138 may be included at an interface between bushing portion 104 and conductive housing 112 .
  • each of O-rings 134 , 136 , and 138 may be made from identical elastomeric materials to seal a respective interface.
  • one or more of O-rings 134 , 136 , and 138 may be made of different materials.
  • Silicone gel 132 may be inserted into chamber 130 via a port 140 (shown in FIG. 3 ) after bushing portion 104 and conductive housing 112 have been joined.
  • Port 140 may be included, for example, through either bushing portion 104 or conductive housing 112 (as shown in FIG. 3 ).
  • port 140 may include a partially threaded opening that can be plugged after insertion of silicone gel 132 .
  • silicone gel 132 may be a transparent, two-part (e.g., including a base and a crosslinker) silicone gel with a relatively low viscosity.
  • silicone gel 132 may be cured within chamber 130 using, for example, heat or another accelerating process.
  • silicone gel 132 may be cured prior to insertion into chamber 130 .
  • Silicone gel 132 may also be self-healing, in that silicone gel 132 separates from a surface of pin assembly 200 when portions of pin assembly 200 slide past O-rings 134 / 136 and out of chamber 130 . Silicone gel 132 may re-adhere to the surface of pin assembly 200 as portions of pin assembly 200 slide past O-rings 134 / 136 and back into chamber 130 .
  • Silicone gel 132 in chamber 130 may be used as an insulation medium between bus 106 /louver contacts 110 and pin assembly 200 along non-conductive tip 202 .
  • Silicone gel 132 can hold off the voltage from arcing across a surface of non-conductive tip 202 (e.g., over distance, D, shown in FIG. 1 ).
  • silicone gel 132 allows conductive pin 204 and non-conductive tip 202 to move in and out of bore 108 in order to alternately make contact with bus 106 /louver contacts 110 .
  • connector assembly 10 When conductive pin 204 is in contact with bus 106 /louver contacts 110 , connector assembly 10 may be in a closed condition, such that high voltage at conductive housing 112 and voltage at connector 102 are the same (e.g., “X” Volts AC, as shown in FIG. 2 ).
  • high voltage at conductive housing 112 and voltage at connector 102 are the same (e.g., “X” Volts AC, as shown in FIG. 2 ).
  • non-conductive tip 202 When non-conductive tip 202 is in contact with bus 106 /louver contacts 110 , non-conductive tip 202 and the silicone gel can separate conductive pin 204 from bus 106 to eliminate arcing to conductive pin 204 and/or conductive housing 112 .
  • high voltage at conductive housing 112 e.g., “X” Volts AC, as shown in FIG.
  • silicone gel 132 as a dielectric insulator enables use of a relatively small distance, D ( FIG. 1 ), between conductive pin 204 and bus 106 , when pin assembly 200 is in the open position.
  • distance D may generally be less than three inches and, more particularly, about two inches.
  • the distance required for using air as an insulating medium under similar conditions would exceed ten inches.
  • connector assembly 10 may be assembled by providing a bushing portion (e.g., bushing portion 104 ) including a conductive bus having a first bore, and providing a conductive housing (e.g., conductive housing 112 ) including a second bore.
  • a pin assembly e.g., pin assembly 200
  • the pin assembly may include a conductive pin secured to a non-conductive tip, such that the pin assembly can move axially within the first and second bores between a closed position that provides an electrical connection between the conductive bus and the conductive housing and an open position that provides no electrical connection between the conductive bus and the conductive housing (e.g., that insulates the conductive housing from the conductive bus).
  • the bushing portion and the conductive housing may be joined to axially align the first bore and the second bore and to form an internal chamber (e.g., internal chamber 130 ) around a portion of the pin assembly, such that the internal chamber separates the first bore and the second bore.
  • a gelatinous silicone material e.g., silicone gel 132
  • silicone gel 132 may be inserted into the internal chamber via a port, to prevent or substantially reduce the likelihood of voltage arcing across a surface of the non-conductive tip when the pin assembly is in the open position.
  • a high-voltage connector device that includes a device body and a pin assembly.
  • the connector device may include a bushing portion with a conductive bus having a first bore, a conductive housing with a second bore that is axially aligned with the first bore, an internal chamber separating the first bore and the second bore, and a gelatinous silicone material enclosed within the internal chamber.
  • the pin assembly may include a non-conductive tip and a conductive pin secured to the non-conductive tip.
  • the pin assembly may be configured to move axially, within the first and second bores, between a closed position (e.g., that provides an electrical connection between the conductive bus and the conductive housing) and an open position (e.g., that provides no electrical connection between the conductive bus and the conductive housing).
  • the gelatinous silicone material inhibits voltage arcing across a surface of the non-conductive tip when the pin assembly is in the open position.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
US14/242,989 2013-05-24 2014-04-02 Gelatinous dielectric material for high voltage connector Active 2034-06-27 US9325104B2 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
US14/242,989 US9325104B2 (en) 2013-05-24 2014-04-02 Gelatinous dielectric material for high voltage connector
AU2014202028A AU2014202028B2 (en) 2013-05-24 2014-04-10 Gelatinous dielectric material for high voltage connector
CA2852551A CA2852551C (en) 2013-05-24 2014-05-16 Gelatinous dielectric material for high voltage connector
TW103117618A TW201513504A (zh) 2013-05-24 2014-05-20 用於高壓連接器的凝膠狀電介質材料
MX2014006172A MX336124B (es) 2013-05-24 2014-05-20 Material dielectrico gelatinoso para conector de alto voltaje.
CN201410212226.8A CN104183413B (zh) 2013-05-24 2014-05-20 用于高压连接器的凝胶状电介质材料
JP2014105299A JP5738455B2 (ja) 2013-05-24 2014-05-21 高電圧コネクタ用のゼラチン状誘電材料
EP14169696.3A EP2806510B1 (en) 2013-05-24 2014-05-23 Gelatinous dielectric material for high voltage connector
BRBR102014012644-9A BR102014012644A2 (pt) 2013-05-24 2014-05-26 Material dielétrico gelatinoso para conector de alta tensão elétrica

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361827374P 2013-05-24 2013-05-24
US14/242,989 US9325104B2 (en) 2013-05-24 2014-04-02 Gelatinous dielectric material for high voltage connector

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US20140349500A1 US20140349500A1 (en) 2014-11-27
US9325104B2 true US9325104B2 (en) 2016-04-26

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US14/242,989 Active 2034-06-27 US9325104B2 (en) 2013-05-24 2014-04-02 Gelatinous dielectric material for high voltage connector

Country Status (9)

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US (1) US9325104B2 (es)
EP (1) EP2806510B1 (es)
JP (1) JP5738455B2 (es)
CN (1) CN104183413B (es)
AU (1) AU2014202028B2 (es)
BR (1) BR102014012644A2 (es)
CA (1) CA2852551C (es)
MX (1) MX336124B (es)
TW (1) TW201513504A (es)

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CN106129710A (zh) * 2016-08-23 2016-11-16 成都阿尔刚雷科技有限公司 一种防二次电弧的电连接方法
CN107611736B (zh) * 2017-08-30 2019-09-13 江西昌河航空工业有限公司 一种可插拔临时胶体插头的制造方法
CN107834241A (zh) * 2017-10-31 2018-03-23 江苏和飞航天电子有限公司 一种基于导电凝气胶为缓冲基材的连接器
DE102019134463B3 (de) * 2019-12-16 2021-05-12 TRUMPF Hüttinger GmbH + Co. KG Hochfrequenz-Hochspannungs-Stromleiter-Vorrichtung
WO2024151867A1 (en) * 2023-01-13 2024-07-18 Cooper Power Systems, Llc Separable electrical connector with a fluid port

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CA2852551A1 (en) 2014-11-24
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