US8492653B2 - Connector for establishing an electrical connection with conductive tape - Google Patents

Connector for establishing an electrical connection with conductive tape Download PDF

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Publication number
US8492653B2
US8492653B2 US12/922,720 US92272009A US8492653B2 US 8492653 B2 US8492653 B2 US 8492653B2 US 92272009 A US92272009 A US 92272009A US 8492653 B2 US8492653 B2 US 8492653B2
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Prior art keywords
connector
conductive
perturbation
conductive tape
cells
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Expired - Fee Related, expires
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US12/922,720
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US20110005830A1 (en
Inventor
Gereon Vogtmeier
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Signify Holding BV
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Koninklijke Philips Electronics NV
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Assigned to KONINKLIJKE PHILIPS ELECTRONICS N V reassignment KONINKLIJKE PHILIPS ELECTRONICS N V ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: VOGTMEIER, GEREON
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Assigned to KONINKLIJKE PHILIPS N.V. reassignment KONINKLIJKE PHILIPS N.V. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Assigned to PHILIPS LIGHTING HOLDING B.V. reassignment PHILIPS LIGHTING HOLDING B.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KONINKLIJKE PHILIPS N.V.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/717—Structural association with built-in electrical component with built-in light source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor

Definitions

  • the invention relates to the field of electrical cabling and more specifically to a connector, a method for establishing a connection and a tool for establishing a connection with conductive tape.
  • LED lighting technology presents new possibilities for lighting. LEDs can be used to light homes and other locations in new and creative ways. LEDs typically require a supply voltage which is lower than a mains supply voltage. The transmission of power to LED devices can limit the ways in which LEDs can be used for lighting.
  • EP 1020505 discloses an electrically conductive adhesive tape which has regions which are anisotropically conductive in the direction of the thickness of the tape.
  • a connector for establishing an electrical connection with a conductive tape.
  • the conductive tape comprises at least a first conducting layer and an insulating layer.
  • the connector comprises a first conductive region and a first connection region.
  • the first connection region is adapted to establish an electrical connection with the first conducting layer of the conductive tape when a perturbation is applied.
  • Embodiments of the presentation allow electrical connections to be made with conductive tapes.
  • the conductive tapes may for example be located under wallpaper, or may be integrated into wall paper.
  • Embodiments of the presentation therefore provide a way to integrate LED lighting into a home, office or similar environment with minimal structural disturbance to that environment.
  • the perturbation comprises a first perturbation and a second perturbation.
  • the first perturbation and the second perturbation may be applications or temperature or pressure to the connector.
  • the first connection region has a plurality of needles and the perturbation is the application of pressure to the connector. This causes the needles to pierce the insulating layer of the conductive tape and establish a connection with the conducting layer of the conductive tape.
  • the first connection region comprises a first plurality of cells and the first plurality of cells contains an etching agent.
  • the etching agent may then etch an opening the insulating layer of the conductive tape thus allowing an electrical connection to be made with the first conducting layer of the conductive tape.
  • the first connection region comprises a second plurality of cells.
  • the second plurality of cells contains a conductive epoxy, which may be released on the application of the second perturbation.
  • the conductive epoxy once released establishes an electrical connection between the first conductive region of the connector and the first conducting layer of the conductive tape.
  • the first connection region comprises a third plurality of cells.
  • the third plurality of cells contains an insulating material, which sets once released to provide electrical insulation of the connection established between the first conduction region of the connector and the first conducting layer of the conductive tape.
  • the first connection region may be on the periphery of the first conductive region. Alternatively, the first connection region may overlap first conduction region.
  • the connector may comprise a second conductive region and a second connection region.
  • a method for establishing an electrical connection with a conductive tape comprises at least a first conducting layer and an insulating layer.
  • the method comprises placing a connector over the conductive tape and applying a first perturbation.
  • the method further comprises applying a second perturbation.
  • the method further comprises placing a further conductive tape over the connector.
  • Embodiments of the present invention allow a further conductive tape to be connected to a conductive tape.
  • the first and second perturbations are the application of pressure to the connector.
  • the first and second perturbations are the application of temperature to the connector.
  • a tool for establishing an electrical connection with a conductive tape comprises at least a first conducting layer and an insulating layer.
  • the tool comprises means for and applying a first perturbation.
  • the tool further comprises means for applying a second perturbation.
  • the tool further comprises means for measuring an electrical property of the connection.
  • FIG. 1 shows a conductive tape
  • FIG. 2 shows a connector
  • FIG. 3 shows a flow diagram illustrating the steps in a method of establishing a connection with a conductive tape
  • FIG. 4 shows a flow diagram illustrating the steps in a method of establishing a connection with a conductive tape
  • FIG. 5 shows the application of a connector to a conductive tape
  • FIG. 6 shows the application of a further conductive tape to a connector applied to a conductive tape
  • FIG. 7 shows a connector
  • FIG. 8 shows a flow diagram illustrating the steps in a method of establishing a connection with a conductive tape
  • FIG. 9 shows a flow diagram illustrating the steps in a method of establishing a connection with a conductive tape.
  • FIG. 1 shows conductive tape 100 .
  • Conductive tape 100 has insulating layer 102 which encloses first conducting layer 104 and second conducting layer 106 .
  • First conducting layer 104 and second conducting layer 106 may be metal foil such as copper layers.
  • Insulating layer 102 may be a laminated plastic layer laminated around first conducting layer 104 and second conducting layer 106 .
  • Conductive tape 100 may be used in the supply of power to LED lighting devices.
  • Conductive tape may be realized as a thin conducting cable.
  • Conductive tape 100 may be mounted on a wall under wallpaper.
  • Conductive tape may be formed as an integral part of wallpaper for mounting on a wall.
  • FIG. 2 shows connector 200 for establishing an electrical connection with a conductive tape such as that shown in FIG. 1 .
  • Connector 200 comprises first conductive region 204 and second conductive region 206 .
  • the first conductive region 204 and second conductive region 206 are mounted in insulating material 208 .
  • Connector 200 further comprises a first connection region, which may occupy the same area as first conductive region 204 , and a second connection region, which may occupy the same area as second conductive region 206 .
  • the first connection region is adapted to establish an electrical connection between the first conduction region 204 and the first conducting layer of a conducting tape when a first perturbation is applied.
  • perturbation is used here to describe the application of an external change to the connector.
  • perturbations include the application of a change in temperature and the application of a change in pressure to the connector.
  • First conductive region 204 and second conductive region 206 may have a plurality of needles or micro needles over their surfaces. When a pressure is applied to a connector placed over a conductive tape, the needles pierce the insulating layer and establish an electrical connection with the conducting layer of the conductive tape.
  • FIG. 3 shows a method 300 of establishing an electrical connection with a conductive tape.
  • a connector is placed over the conductive tape.
  • a first perturbation is applied to the connector.
  • the first perturbation may be the application of a pressure or a change of temperature to the connector.
  • FIG. 4 shows a method 400 of establishing an electrical connection between a conductive tape and a further conductive tape.
  • a connector is placed over a conductive tape.
  • a further conductive tape is placed over the connector.
  • a first perturbation is applied.
  • a second perturbation is applied.
  • the first and second perturbations are pressure or temperature, however, combinations of a pressure and temperature are possible, for example, the first perturbation may be the application of a pressure and the second perturbation may be the application of a temperature. Similarly, the first perturbation may be the application of a temperature and the second perturbation may be the application of a pressure.
  • FIG. 5 shows the application of a connector 510 over a conductive tape 500 .
  • Conductive tape has insulating layer 502 , first conducting layer 504 and second conducting layer 506 .
  • Connector 510 has first connection region 514 and second connection region 516 .
  • First connection region 514 and second connection region 516 are held in place by insulating material 518 .
  • FIG. 6 shows the application of a further conductive tape 520 .
  • Conductive tape 520 has insulating layer 522 , first conducting layer 524 and second conducting layer 526 .
  • first conducting layer 504 of conductive tape 500 and first conducting layer 524 of conductive tape 520 through first conductive region 514 of connector 510 .
  • second conducting layer 506 of conductive tape 500 and second conducting layer 526 of conductive tape 520 through second conductive region 516 of connector 510 .
  • FIG. 7 shows connector 700 .
  • Connector 700 has first conductive region 710 and second conductive region 720 .
  • First conductive region 710 and second conductive region are held in place by insulating material 708 .
  • First connection region 712 is located over first conduction region 710 .
  • First connection region 712 comprises a first plurality of cells; the first plurality of cells contains an etching agent. The etching agent is released from the first plurality of cells when the first perturbation is applied.
  • First connection region 712 further comprises a second plurality of cells containing a conductive epoxy, which is released when the second perturbation is applied.
  • Region 714 may contain a further plurality of cells containing an insulator, which is released when a third perturbation is applied.
  • second connection region 722 is located over second conduction region 720 .
  • Second connection region 722 comprises a first plurality of cells; the first plurality of cells contains an etching agent. The etching agent is released from the first plurality of cells when the first perturbation is applied.
  • Second connection region 722 further comprises a second plurality of cells containing a conductive epoxy, which is released when the second perturbation is applied.
  • Region 724 may contain a further plurality of cells containing an insulator, which is released when a third perturbation is applied.
  • first and second connection regions may be located on the periphery of the first and second conductive regions respectively in the locations of regions 714 and 724 .
  • the pluralities of cells containing the etching agent, the conductive epoxy and the insulating material may be located on both the top and the bottom of connector 700 to allow connections between conductive tapes as shown in FIG. 6 .
  • the pluralities of cells may only be located on a single side of the connector and the connector may be used to make a connection between a conductive tape and an LED lighting device for example.
  • the connector may be integrated into a device such as a lighting device, a power supply, a display, a switch, and an actuator or similar.
  • a device such as a lighting device, a power supply, a display, a switch, and an actuator or similar.
  • the connector When mounted on a wall with a conductive tape embedded within, the connector could be used to establish a connection between the device and the conductive tape.
  • the filling capacity of the cells may be optimized for the functionality.
  • the plurality of cells containing the etching agent may contain an amount sufficient to open the defined area of the insulating layer of the conductive tape, but not to destroy the isolating area around the conductive layer.
  • the cells containing the conductive epoxy may contain an amount sufficient to fill the area that is opened, but not an amount so great that a short circuit is made.
  • the etching agent and the conductive epoxy contained within the cells may become active after components of the etching agent or epoxy are mixed.
  • the etching agent may for example be made up of two components, the two components being contained within different cells or micro bubbles. Once the cells or burst due to the application of pressure or temperature, the two components would then mix and thus create an active etching agent.
  • the conductive epoxy may comprise two components, contained within separate cells, and the two components would then be mixed once they are released by the application of pressure or temperature.
  • FIG. 8 shows a method 800 of establishing an electrical connection between a conductive tape and a second conductive tape.
  • a connector is placed over the conductive tape.
  • a second conductive tape is placed over the connector.
  • a first pressure is applied. The application of the first pressure causes the first plurality of cells in the connection regions of the connector to release an etching agent. The etching agent removes the insulating layer from a portion of the conductive tape and a portion of the second conductive tape.
  • a second pressure is applied. The second pressure is a higher pressure than the first pressure.
  • the second pressure causes the second plurality of cells to release a conductive epoxy which establishes an electrical connection between a conducting layer of the conductive tape and a conductive region of the connector.
  • the second pressure also releases a conductive epoxy which establishes an electrical connection between the conductive region of the connector and a conducting layer of the second conductive tape.
  • a third pressure may be applied. The application of the third pressure may secure and make the interface stable. Alternatively, the application of the pressure temperature may release an insulating material to protect and insulate the interface established between the conductive tapes.
  • the insulating material may be chosen so that the connection is surrounded by a waterproof layer once the insulating material is in place. This has the advantage that substances such as paint or wallpaper paste can be applied to the connector without affecting the electrical connection.
  • the time between the first, second and third perturbation may be optimized for standard process parameters, for measured parameters (such as room temperature, electrical resistance, pressing force), and for the number of interconnects, size of pads and type of pad.
  • Different pads may be available for rough walls, for smooth wall, with a ring structure as in FIG. 7 or with multiple ring structures in one pad or other special geometries of the cells containing the etching agent, the conductive epoxy and the isolating material.
  • Possible configurations include a mixture of etching and conductive cells a ring containing cells having the isolating material contained therein.
  • the cells may be arranged in star, line, or other shape.
  • the cells containing the conductive epoxy may be surrounded by those containing the etching agent.
  • FIG. 9 shows a method 900 of establishing an electrical connection between a conductive tape and a second conductive tape.
  • a connector is placed over the conductive tape.
  • a second conductive tape is placed over the connector.
  • a first temperature is applied. The application of the first pressure causes the release of an etching agent from the fist plurality of cells in the connector. The etching agent removes a portion of the insulating layer both the conductive tape and the second conductive tape.
  • a second temperature is applied. The second temperature is higher than the first temperature. The application of the second temperature causes the release of the conductive epoxy close to the conductive regions of the connector.
  • the conductive epoxy establishes an electrical connection between the conductive regions of the connector and the conducting layers of the conductive tape and the second conductive tape.
  • a third temperature is applied.
  • the application of the third temperature may secure and make the interface stable.
  • the application of the third temperature may release an insulating material to protect and insulate the interface established between the conductive tapes.
  • the application of the pressures or temperatures as the various perturbations described above may be undertaken using a tool.
  • the tool comprises means for applying at least a first perturbation.
  • the tool may be operable to apply a pressure or a force of the correct magnitude to release the etching agent.
  • the tool may be operated to apply a force great enough such that the needles penetrate the insulating layer of a conductive tape but do not pass through the foil making up the conducting layers.
  • the tool may further comprise means to apply a second perturbation.
  • the tool may include an electrical heating element in order to generate first and second temperatures.
  • the tool may further comprise means to measure an electrical property of the connection, such as the resistance or conductance. This may be achieved by connecting the tool to both of the elements being connected. This would allow an operator of the tool to be certain that the perturbations had been applied at the correct level for the correct amount of time. Further, this would allow loose connections, due to dust or other objects being between conductive tape and the connector to be identified.
  • the tool may further be operable to apply a third perturbation.
  • the tool may have a surface optimized to support a homogenous distribution of the etching liquid, conductive epoxy, or insulating material.
  • the parameters such as the first, second and third perturbation may be programmable or defined.
  • a user may be able to vary the parameters to account for factors such as the roughness of a wall, the type of connector, the type and construction of the tape, and the room temperature.
  • Variables such as the time interval between the perturbations may be defined, or user programmable.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
US12/922,720 2008-03-19 2009-03-12 Connector for establishing an electrical connection with conductive tape Expired - Fee Related US8492653B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP08102743 2008-03-19
EP08102743 2008-03-19
EP08102743.5 2008-03-19
PCT/IB2009/051029 WO2009115953A2 (fr) 2008-03-19 2009-03-12 Connecteur permettant d'établir une connexion électrique avec une bande conductrice

Publications (2)

Publication Number Publication Date
US20110005830A1 US20110005830A1 (en) 2011-01-13
US8492653B2 true US8492653B2 (en) 2013-07-23

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US12/922,720 Expired - Fee Related US8492653B2 (en) 2008-03-19 2009-03-12 Connector for establishing an electrical connection with conductive tape

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Country Link
US (1) US8492653B2 (fr)
EP (1) EP2255406A2 (fr)
CN (1) CN102007647B (fr)
TW (1) TW200945707A (fr)
WO (1) WO2009115953A2 (fr)

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WO2014129597A1 (fr) * 2013-02-21 2014-08-28 新日鉄住金化学株式会社 Matière de carbone en vue d'une utilisation comme support de catalyseur
CN106088785A (zh) 2016-06-08 2016-11-09 江苏神马电力股份有限公司 复合横担及输电杆

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CN102007647A (zh) 2011-04-06
EP2255406A2 (fr) 2010-12-01
US20110005830A1 (en) 2011-01-13
WO2009115953A2 (fr) 2009-09-24
CN102007647B (zh) 2015-03-18
WO2009115953A3 (fr) 2010-01-28

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