US8387854B2 - Method for mounting a three-axis MEMS device with precise orientation - Google Patents

Method for mounting a three-axis MEMS device with precise orientation Download PDF

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Publication number
US8387854B2
US8387854B2 US13/402,210 US201213402210A US8387854B2 US 8387854 B2 US8387854 B2 US 8387854B2 US 201213402210 A US201213402210 A US 201213402210A US 8387854 B2 US8387854 B2 US 8387854B2
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substrate
sensing device
recited
electrically
axis
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US13/402,210
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US20120217286A1 (en
Inventor
Noureddine Hawat
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Memsic Semiconductor Tianjin Co Ltd
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Memsic Inc
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Assigned to MEMSIC, INC. reassignment MEMSIC, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HAWAT, NOUREDDINE
Priority to CN201210075851.3A priority patent/CN103288044B/zh
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Assigned to MEMSIC Semiconductor (Tianjin) Co., Ltd. reassignment MEMSIC Semiconductor (Tianjin) Co., Ltd. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MEMSIC INC.
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/002—Aligning microparts
    • B81C3/005—Passive alignment, i.e. without a detection of the position of the elements or using only structural arrangements or thermodynamic forces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/025—Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/05—Aligning components to be assembled
    • B81C2203/052—Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus
    • B81C2203/057—Passive alignment techniques not provided for in B81C2203/054 - B81C2203/055
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
    • B81C2203/0792—Forming interconnections between the electronic processing unit and the micromechanical structure

Definitions

  • MEMS micro-electro-mechanical system
  • This invention uses surface tension to align a z-axis MEMS sensing device that is mounted onto a substrate or lead frame oriented in an xy-plane.
  • the height of the z-axis sensing device is less than or substantially equal to its width (y-dimension) while the length of the device in the longitudinal direction (x-dimension) is greater than either of the y- or z-dimensions.
  • FIG. 1 provides a diagrammatic view of a z-axis-mounted MEMS sensing device on a substrate in accordance with the present invention
  • FIG. 2A shows a flow chart of a method for preparing a z-axis sensing device for mounting on a substrate or lead frame in accordance with the present invention
  • FIG. 2B shows a flow chart of a method for mounting a three-axis MEMS sensing device on a substrate or lead frame at precise angles.
  • the ASIC 16 can be electrically and mechanically coupled to the substrate 12 , e.g., by flip-chip techniques using a plurality of corresponding bond pads 17 .
  • a multi-axis sensing device 14 e.g., an xy-sensing device, is mechanically coupled to a top surface 11 of the ASIC 16 .
  • the xy-sensing device 14 includes a plurality of wire leads 13 that can be electrically coupled e.g., by wire-bonding, to corresponding bonding pads on the ASIC 15 and/or to corresponding bonding pads on the substrate 12 .
  • the z-axis sensing device 15 is mounted onto the bonding pattern on the substrate 12 , separately from the xy-sensing device 14 .
  • a bonding pattern (not shown) is provided on or applied to the surface of the substrate 12 , e.g., by at least one of screen printing, dispensing, and the like.
  • the height of the z-axis sensing device 15 is less than or substantially equal to the width of the z-axis sensing device 15 (along the y-axis). Moreover, the length of the z-axis sensing device 15 (along the x-axis) is much greater than or equal to either the height and/or the width.
  • the elongate but relatively-short z-axis sensing device 15 can be precisely aligned.
  • the z-axis sensing device 15 includes a plurality of bond pads 18 that are arrayed on one or both opposing longitudinal sides 20 of the z-axis sensing device 15 , perpendicular or substantially perpendicular to the xy-plane of the substrate 12 .
  • the bond pads 18 on one or both sides 20 of the z-axis sensing device 15 typically includes an electrically-conductive layer, e.g., copper layer, and a tin layer.
  • FIG. 2A a method of preparing a z-axis sensing device 15 for precision vertical alignment and mounting on a substrate 12 is shown. Furthermore, referring to the flow chart in FIG. 2B , a method of integrating a three-axis MEMS sensing device 10 at a precise vertical orientation on a substrate 12 in relation to the xy-plane will be described.
  • each of the bond pads 18 that are disposed on one or both opposing longitudinal sides 20 of the z-axis sensing device 15 must be prepared.
  • each of the bond pads 18 is masked using a first mask (MASK A) before an electrically-conductive material is applied to the mask (STEP 1 ). The applied electrically-conductive material should cover the bond pads 18 completely.
  • the electrically-conductive, copper-coated portions of the z-axis sensing device 15 are masked using a second mask (MASK B), and, then, the copper-coated portions within masked portions are coated or screened with a solder material, e.g., tin (STEP 2 ).
  • a solder material e.g., tin
  • the mask openings of MASK B are slightly larger in all dimensions than the mask openings of MASK A.
  • the variation between MASK A and MASK B will produce a relatively thick coating of tin 19 , e.g., 50 micrometers or more, that encases or covers the underlying plated copper completely.
  • the z-axis sensing device 15 is then finished and diced (STEP 3 ) and ready for application to the substrate 12 .
  • a bonding pattern (not shown) should be prepared on some portion of the surface of the substrate 12 , e.g., by screen printing, dispensing, and the like (STEP 4 ). Screen printing and/or dispensing can be performed using a flux material, a solder paste, an under-fill material, a combination thereof, and the like.
  • the bonding pattern provides bonding areas that are located to be in registration with the plurality of tin-coated portions 19 .
  • the tin-coated portions 19 of the z-axis sensing device 15 can be mechanically and electrically coupled to bonding areas of the bonding pattern (STEP 5 ).
  • the z-axis sensing device 15 remains perpendicular or substantially perpendicular to the surface of the substrate 12 to ensure precise vertical alignment of the z-axis sensing device 15 .
  • the tin-coated portions 19 of the z-axis sensing device 15 are oriented in registration with corresponding bonding areas of the bonding pattern before the surface of the substrate 12 is reflowed (STEP 6 ), to fixedly mount the z-axis sensing device 15 .
  • the reflow process (STEP 6 ) preserves the perpendicular or substantially perpendicular alignment of the z-axis sensing device 15 with respect to the substrate 12 .
  • the entire substrate 12 can be finished, e.g., by mold injection, and diced (STEP 9 ).
  • this invention enables an accurate vertical mounting in mass production of a smaller package with a reduced cost, and could be processed on an organic substrate technology such as LGA or BGA or lead frame technology as well as QFN, TLA, and/or HLA.
  • an organic substrate technology such as LGA or BGA or lead frame technology as well as QFN, TLA, and/or HLA.
  • the z-axis sensing device 15 could be pre-packaged and pre-oriented before the fabrication process and placed in the correct orientation, e.g., in a waffle pack or in a reel-and-tape, to facilitate and expedite mounting.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Micromachines (AREA)
US13/402,210 2011-02-25 2012-02-22 Method for mounting a three-axis MEMS device with precise orientation Active US8387854B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US13/402,210 US8387854B2 (en) 2011-02-25 2012-02-22 Method for mounting a three-axis MEMS device with precise orientation
CN201210075851.3A CN103288044B (zh) 2011-02-25 2012-03-20 精准集成三轴mems装置到基板的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161446689P 2011-02-25 2011-02-25
US13/402,210 US8387854B2 (en) 2011-02-25 2012-02-22 Method for mounting a three-axis MEMS device with precise orientation

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US20120217286A1 US20120217286A1 (en) 2012-08-30
US8387854B2 true US8387854B2 (en) 2013-03-05

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104858593A (zh) * 2015-05-25 2015-08-26 天津大学 一种用于精密箱型传感器焊接的定位工装夹具及其使用方法
US20160005708A1 (en) * 2014-07-04 2016-01-07 Rohm Co., Ltd. Semiconductor device and method for making semiconductor device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475231B (zh) * 2013-02-20 2015-03-01 Pixart Imaging Inc 多軸加速度感測裝置與相關製作方法
CN104034918A (zh) * 2013-03-06 2014-09-10 原相科技股份有限公司 多轴加速度传感装置与相关制作方法
CN105036067A (zh) * 2015-05-29 2015-11-11 中国科学院电子学研究所 Mems传感器倒装叠层封装结构及其制备方法

Citations (3)

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Publication number Priority date Publication date Assignee Title
US5461261A (en) * 1992-05-06 1995-10-24 Sumitomo Electric Industries, Ltd. Semiconductor device with bumps
US20030036219A1 (en) * 2001-08-13 2003-02-20 Mutsumi Masumoto Semiconductor device manufacturing method
US20070170228A1 (en) * 2006-01-20 2007-07-26 Memsic Corporation Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1803577A (zh) * 2005-12-20 2006-07-19 北京大学 基于mems的高精度三维微组装方法及组装件
US20090072823A1 (en) * 2007-09-17 2009-03-19 Honeywell International Inc. 3d integrated compass package
US8703543B2 (en) * 2009-07-14 2014-04-22 Honeywell International Inc. Vertical sensor assembly method
US20110234218A1 (en) * 2010-03-24 2011-09-29 Matthieu Lagouge Integrated multi-axis hybrid magnetic field sensor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5461261A (en) * 1992-05-06 1995-10-24 Sumitomo Electric Industries, Ltd. Semiconductor device with bumps
US20030036219A1 (en) * 2001-08-13 2003-02-20 Mutsumi Masumoto Semiconductor device manufacturing method
US20070170228A1 (en) * 2006-01-20 2007-07-26 Memsic Corporation Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160005708A1 (en) * 2014-07-04 2016-01-07 Rohm Co., Ltd. Semiconductor device and method for making semiconductor device
US9601455B2 (en) * 2014-07-04 2017-03-21 Rohm Co., Ltd. Semiconductor device and method for making semiconductor device
US9941237B2 (en) 2014-07-04 2018-04-10 Rohm Co., Ltd. Semiconductor device and method for making semiconductor device
CN104858593A (zh) * 2015-05-25 2015-08-26 天津大学 一种用于精密箱型传感器焊接的定位工装夹具及其使用方法

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CN103288044A (zh) 2013-09-11
US20120217286A1 (en) 2012-08-30
CN103288044B (zh) 2015-12-02

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