US7224072B2 - Mounting structure for ball grid array type IC - Google Patents

Mounting structure for ball grid array type IC Download PDF

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Publication number
US7224072B2
US7224072B2 US10/761,738 US76173804A US7224072B2 US 7224072 B2 US7224072 B2 US 7224072B2 US 76173804 A US76173804 A US 76173804A US 7224072 B2 US7224072 B2 US 7224072B2
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United States
Prior art keywords
grid array
ball grid
array type
board
body portion
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US10/761,738
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US20040150974A1 (en
Inventor
Kazuteru Adachi
Shinji Yoshioka
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Funai Electric Co Ltd
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Funai Electric Co Ltd
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Assigned to FUNAI ELECTRIC CO., LTD. reassignment FUNAI ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ADACHI, KAZUTERU, YOSHIOKA, SHINJI
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array

Definitions

  • the present invention relates to a mounting structure of a ball grid array type IC which has a plurality of solder balls provided on a bottom surface of its body portion so that the ball grid array type IC can be mounted on a board.
  • FIGS. 7A , 7 B, and 7 C A first structure according to the related art is shown in FIGS. 7A , 7 B, and 7 C.
  • the first structure includes: through-holes 103 formed in at least two corners of a substrate 102 of a semiconductor package 101 ; and reinforcing leads 106 inserted into the through-holes 103 of the semiconductor package 101 and into through-holes 108 of a mounting board 107 to fix the semiconductor package 101 and the mounting board 107 to each other surely after the semiconductor package 101 is mounted on the mounting board 107 (e.g., see Japanese Patent No. 3,183,278).
  • the reinforcing leads 106 which are provided as separate elements after the mounting of the semiconductor package 101 on the mounting board 107 in order to reinforce the mounting of the semiconductor package 101 on the mounting board 107 , are soldered to the mounting board 107 to prevent the semiconductor package 101 from peeling off after the mounting.
  • FIGS. 8A , 8 B, and 8 C A second structure according to the related art is shown in FIGS. 8A , 8 B, and 8 C.
  • the second structure includes: a BGA package 202 ; a plurality of BGA terminals 221 provided on one surface side of the BGA package 202 ; solder balls 204 formed on the plurality of BGA terminals 221 ; a plurality of BGA protrusions 203 which are provided on the same surface side as the BGA terminals 221 and each of which has a step protrusion portion 232 in its middle, and a conical protrusion portion 231 extending to its tip; a printed board 201 ; a plurality of BGA connection terminals 211 which are provided on one surface side of the printed board 201 and which come into contact with the plurality of solder balls 204 on the BGA package 202 ; and BGA protrusion-inserting holes 205 which are provided on the same surface side as the BGA connection terminals 211 and in which the
  • the BGA protrusions 203 are apt to come out after the BGA protrusions 203 are inserted in the BGA protrusion-inserting holes 205 of the printed board 201 .
  • the BGA protrusions 203 are provided on four corners of a bottom surface of the BGA package 202 , orientation of the BGA package 202 cannot be decided when the BGA package 202 is mounted on the printed board 201 . Accordingly, there is a problem that the BGA package 202 is apt to be mounted in an incorrect direction.
  • a mounting structure of a ball grid array type IC including: resin guide ribs provided on opposite sides of a body portion of the ball grid array type IC; engaging pawls formed at distal ends of the guide ribs so as to be locked into locking holes of a board; springs in which the guide ribs are inserted respectively; and height adjusting ribs provided at places slightly inwardly distant from the guide ribs respectively so as to protrude from the body portion; wherein the springs prevent the ball grid array type IC from being strongly pressed against the board when the ball grid array type IC is mounted on the board; and the height adjusting ribs adjust the ball grid array type IC to a predetermined height relative to the board.
  • the invention also provides a mounting structure of a ball grid array type IC including: resin guide ribs provided on opposite sides of a body portion of the ball grid array type IC; engaging pawls formed at distal ends of the guide ribs so as to be locked into locking holes of a board; and elastic bodies provided on the guide ribs; wherein the elastic bodies prevent the ball grid array type IC from being strongly pressed against the board when the ball grid array type IC is mounted on the board.
  • the mounting structure of the ball grid array type IC according to the invention may further includes height adjusting ribs formed on sides of the guide ribs so as to be integrated with the guide ribs respectively.
  • the elastic bodies may be made of elastic pieces provided on sides of the guide ribs so as to be integrated with the guide ribs respectively and extend toward the board.
  • the invention further provides a mounting structure of a ball grid array type IC including a plurality of solder balls provided on a bottom surface of a body portion of the ball grid array type IC for mounting the ball grid array type IC on a board; wherein a pair of anti-rubbing pins to be fitted into insertion holes provided in the board are provided on diagonal corners of the bottom surface of the body portion respectively so as to protrude downward.
  • the invention further provides a mounting structure of a ball grid array type IC including a plurality of solder balls provided on a bottom surface of a body portion of the ball grid array type IC for mounting the ball grid array type IC on a board; wherein at least one anti-rubbing pin to be fitted in an insertion hole provided in the board is provided on the bottom surface of the body portion so as to protrude downward.
  • the anti-rubbing pin may be provided on each of three corners of the body portion so as to protrude downward.
  • the anti-rubbing pin may be provided on one corner of the body portion so as to protrude downward while a pin which is shaped like a square in section and which serves as an orienting pin and also as a positioning pin to be inserted into a square hole formed in the board is provided on another corner of the bottom surface of the body portion diagonally opposite the anti-rubbing pin, so as to protrude downward.
  • FIGS. 1A and 1B show a mounting structure of a ball grid array type IC according to a first embodiment of the invention, FIG. 1A being a sectional view showing a state of the ball grid array type IC before mounting, FIG. 1B being a sectional view showing a state of the ball grid array type IC after mounting;
  • FIG. 2 is a sectional view showing a state of a mounting structure of a ball grid array type IC according to a second embodiment of the invention before mounting;
  • FIG. 3 is a sectional view showing a state of a mounting structure of a ball grid array type IC according to a third embodiment of the invention after mounting;
  • FIGS. 4A and 4B show a mounting structure of a ball grid array type IC according to a fourth embodiment of the invention, FIG. 4A being a bottom view of the ball grid array type IC, FIG. 4B being a sectional view showing a state of the ball grid array type IC after mounting;
  • FIGS. 5A and 5B show a mounting structure of a ball grid array type IC according to a fifth embodiment of the invention, FIG. 5A being a bottom view of the ball grid array type IC, FIG. 5B being a sectional view showing a state of the ball grid array type IC after mounting;
  • FIG. 6 is a bottom view of a ball grid array type IC in a mounting structure according to a sixth embodiment of the invention.
  • FIGS. 7A , 7 B, and 7 C show a mounting structure of a ball grid array type semiconductor package according to the related art, FIG. 7A being a plan view of the ball grid array type semiconductor package, FIG. 7B being a side sectional view of the ball grid array type semiconductor package, FIG. 7C being a side sectional view showing a state in which the ball grid array type semiconductor package is mounted on a mounting board; and
  • FIGS. 8A , 8 B, and 8 C show the structure of a BGA package according to the related art, FIG. 8A being a perspective view of the BGA package, FIG. 8B being a sectional view of the BGA package, FIG. 8C being a sectional view of the BGA package mounted on a mounting board before soldered to the mounting board.
  • FIGS. 1A and 1B show a mounting structure of a ball grid array type IC according to a first embodiment of the invention.
  • FIG. 1A is a sectional view showing a state of the ball grid array type IC before mounting
  • FIG. 1B is a sectional view showing a state of the ball grid array type IC after mounting.
  • the mounting structure of the ball grid array type IC 1 has: a plurality of solder balls 3 provided on a bottom surface of a body portion 2 of the ball grid array type IC 1 ; a pair of resin guide ribs 4 , 4 provided on opposite sides on the bottom surface of the body portion 2 ; engaging pawls 4 a formed at lower ends of the pair of guide ribs 4 , 4 respectively so as to be locked into locking holes 5 a of a board 5 ; springs 6 in which the guide ribs 4 , 4 are inserted respectively; and a pair of height adjusting ribs 7 , 7 provided at places slightly inwardly distant from the pair of guide ribs 4 , 4 respectively so as to protrude from the bottom surface of the body portion 2 .
  • the pair of guide ribs 4 , 4 of the body portion 2 of the ball grid array type IC 1 are fitted into the locking holes 5 a of the board 5 , so that lower ends of the pair of height adjusting ribs 7 , 7 abut on a top surface of the board 5 .
  • the springs 6 prevent the ball grid array type IC 1 from being strongly pressed against the board 5 when the ball grid array type IC 1 is mounted on the board 5 , and the height adjusting ribs 7 , 7 adjust the ball grid array type IC 1 to a predetermined height relative to the board 5 .
  • the ball grid array type IC 1 can be mounted on the board 5 in parallel with the board 5 without inclination to thereby eliminate any soldering defect.
  • FIG. 2 is a sectional view showing a state of a mounting structure of a ball grid array type IC according to a second embodiment of the invention before mounting.
  • height adjusting ribs 7 , 7 are formed on sides of guide ribs 4 , 4 so as to be integrated with the guide ribs 4 , 4 respectively.
  • springs 6 are fitted around the guide ribs 4 , 4 under the height adjusting ribs 7 , 7 respectively.
  • FIG. 3 is a sectional view showing a state of a mounting structure of a ball grid array type IC according to a third embodiment of the invention after mounting.
  • elastic pieces 4 b , 4 b which are substituted for the springs 6 are formed on sides of the guide ribs 4 , 4 so as to be integrated with the guide ribs 4 , 4 respectively and extend downward.
  • the springs 6 can be dispensed with, so that the number of components can be reduced to simplify the structure to thereby attain reduction in cost.
  • FIGS. 4A and 4B show a mounting structure of a ball grid array type IC according to a fourth embodiment of the invention.
  • FIG. 4A is a bottom view of the ball grid array type IC
  • FIG. 4B is a sectional view showing a state of the ball grid array type IC after mounting.
  • the mounting structure of the ball grid array type IC according to the fourth embodiment has a plurality of solder balls 3 provided on a bottom surface of a body portion 2 of the ball grid array type IC 1 for mounting the ball grid array type IC 1 on a board 5 .
  • a pair of ant-rubbing pins 8 , 8 to be fitted into insertion holes 5 b , 5 b provided in the board 5 are provided on diagonal corners of the bottom surface of the body portion 2 so as to protrude downward.
  • the anti-rubbing pins 8 , 8 are aligned with and inserted into the insertion holes 5 b , 5 b of the board 5 .
  • the ball grid array type IC 1 can be prevented from being rubbed against the board 5 because the anti-rubbing pins 8 , 8 are inserted into the insertion holes 5 b , 5 b of the board 5 when the ball grid array type IC 1 is mounted on the board 5 .
  • FIGS. 5A and 5B show a mounting structure of a ball grid array type IC according to a fifth embodiment of the invention.
  • FIG. 5A is a bottom view of the ball grid array type IC
  • FIG. 5B is a sectional view showing a state of the ball grid array type IC after mounting.
  • an anti-rubbing pin 8 is provided on each of three corners of a body portion 2 of the ball grid array type IC so as to protrude downward.
  • the anti-rubbing pins 8 are inserted into insertion holes 5 b formed in three locations of a board 5 respectively to mount the ball grid array type IC 1 on the board 5 .
  • the ball grid array type IC 1 can be mounted on the board 5 so as to be oriented in a correct direction because the anti-rubbing pins 8 provided on the three corners of the body portion 2 are inserted into the insertion holes 5 b formed in the three locations of the board 5 .
  • FIG. 6 is a bottom view of a ball grid array type IC in a mounting structure according to a sixth embodiment of the invention.
  • an anti-rubbing pin 8 is provided on one corner of a body portion 2 of the ball grid array type IC so as to protrude downward while a pin 9 which is shaped like a square in section and which serves as an orienting pin and also as a positioning pin to be inserted into a square hole (not shown) formed in a board 5 is provided on another corner of the bottom surface of the body portion 2 diagonally opposite the anti-rubbing pin 8 , so as to protrude downward.
  • the anti-rubbing pin 8 in one location is inserted into an insertion hole 5 b of the board 5 while the orienting pin 9 shaped like a square in section and serving also as a positioning pin is fitted into the square hole (not shown) of the board 5 to mount the ball grid array type IC 1 on the board 5 .
  • the combination of the anti-rubbing pin 8 in one location and the orienting pin 9 can prevent the ball grid array type IC 1 from being rubbed against the board 5 .
  • the orienting pin 9 shaped like a square in section permits the ball grid array type IC 1 to be oriented in a correct direction relative to the board and permits the ball grid array type IC 1 to be positioned when the ball grid array type IC 1 is mounted on the board 5 .
  • a mounting structure of a ball grid array type IC including: resin guide ribs provided on opposite sides of a body portion of the ball grid array type IC; engaging pawls formed at distal ends of the guide ribs so as to be locked into locking holes of a board; springs in which the guide ribs are inserted respectively; and height adjusting ribs provided at places slightly inwardly distant from the guide ribs respectively so as to protrude from the body portion; wherein the springs prevent the ball grid array type IC from being strongly pressed against the board when the ball grid array type IC is mounted on the board; and the height adjusting ribs adjust the ball grid array type IC to a predetermined height relative to the board. Accordingly, the following advantage can be obtained.
  • the ball grid array type IC can be mounted on the board in parallel with the board without inclination to eliminate any soldering defect.
  • a ball grid array type IC including: resin guide ribs provided on opposite sides of a body portion of the ball grid array type IC; engaging pawls formed at distal ends of the guide ribs so as to be locked into locking holes of a board; and elastic bodies provided on the guide ribs; wherein the elastic bodies prevent the ball grid array type IC from being strongly pressed against the board when the ball grid array type IC is mounted on the board. Accordingly, the following advantage can be obtained.
  • the ball grid array type IC can be mounted on the board in a good condition while the ball grid array type IC is prevented from being strongly pressed against the board.
  • height adjusting ribs may be formed on sides of the guide ribs so as to be integrated with the guide ribs respectively. Accordingly, the height adjusting ribs can be made so robustly as not to be broken.
  • the elastic bodies may be made of elastic pieces provided on sides of the guide ribs so as to be integrated with the guide ribs respectively and extend downward. Accordingly, the springs can be dispensed with, so that the number of components can be reduced to simplify the structure to thereby attain reduction in cost.
  • a mounting structure of a ball grid array type IC including a plurality of solder balls provided on a bottom surface of a body portion of the ball grid array type IC for mounting the ball grid array type IC on a board, wherein a pair of anti-rubbing pins to be fitted into insertion holes provided in the board are provided on diagonal corners of the bottom surface of the body portion respectively so as to protrude downward.
  • the pair of anti-rubbing pins are inserted in the insertion holes of the board when the ball grid array type IC is mounted on the board, so that the ball grid array type IC can be prevented from being rubbed against the board.
  • a mounting structure of a ball grid array type IC including a plurality of solder balls provided on a bottom surface of a body portion of the ball grid array type IC for mounting the ball grid array type IC on a board, wherein at least one anti-rubbing pin to be fitted in an insertion hole provided in the board is provided on the bottom surface of the body portion so as to protrude downward.
  • the anti-rubbing pin is inserted in the insertion hole of the board when the ball grid array type IC is mounted on the board, so that the ball grid array type IC can be prevented from being rubbed against the board.
  • the anti-rubbing pin may be provided on each of three corners of the body portion so as to protrude downward. Accordingly, the three anti-rubbing pins provided on the three corners of the body portion are inserted into the insertion holes formed in three locations of the board, so that the ball grid array type IC can be mounted on the board so as to be oriented in a correct direction.
  • the anti-rubbing pin may be provided on one corner of the body portion so as to protrude downward while a pin which is shaped like a square in section and which serves as an orienting pin and also as a positioning pin to be inserted into a square hole formed in the board is provided on another corner of the bottom surface of the body portion diagonally opposite the anti-rubbing pin, so as to protrude downward. Accordingly, the combination of the anti-rubbing pin in one location and the orienting pin can prevent the ball grid array type IC from being rubbed against the board.
  • the orienting pin shaped like a square in section permits the ball grid array type IC to be oriented in a correct direction relative to the board and permits the ball grid array type IC to be positioned when the ball grid array type IC is mounted on the board.

Abstract

A mounting structure of a ball grid array type IC includes resin guide ribs provided on opposite sides of a body portion of the ball grid array type IC, engaging pawls formed at distal ends of the guide ribs so as to be locked into locking holes of a board, springs in which the guide ribs are inserted respectively, and height adjusting ribs provided at places slightly inwardly distant from the guide ribs respectively so as to protrude from the body portion. The springs prevent the ball grid array type IC from being strongly pressed against the board when the ball grid array type IC is mounted on the board. The height adjusting ribs adjust the ball grid array type IC to a predetermined height relative to the board.

Description

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a mounting structure of a ball grid array type IC which has a plurality of solder balls provided on a bottom surface of its body portion so that the ball grid array type IC can be mounted on a board.
2. Description of the Related Art
A first structure according to the related art is shown in FIGS. 7A, 7B, and 7C. The first structure includes: through-holes 103 formed in at least two corners of a substrate 102 of a semiconductor package 101; and reinforcing leads 106 inserted into the through-holes 103 of the semiconductor package 101 and into through-holes 108 of a mounting board 107 to fix the semiconductor package 101 and the mounting board 107 to each other surely after the semiconductor package 101 is mounted on the mounting board 107 (e.g., see Japanese Patent No. 3,183,278).
In the first structure, the reinforcing leads 106, which are provided as separate elements after the mounting of the semiconductor package 101 on the mounting board 107 in order to reinforce the mounting of the semiconductor package 101 on the mounting board 107, are soldered to the mounting board 107 to prevent the semiconductor package 101 from peeling off after the mounting.
A second structure according to the related art is shown in FIGS. 8A, 8B, and 8C. The second structure includes: a BGA package 202; a plurality of BGA terminals 221 provided on one surface side of the BGA package 202; solder balls 204 formed on the plurality of BGA terminals 221; a plurality of BGA protrusions 203 which are provided on the same surface side as the BGA terminals 221 and each of which has a step protrusion portion 232 in its middle, and a conical protrusion portion 231 extending to its tip; a printed board 201; a plurality of BGA connection terminals 211 which are provided on one surface side of the printed board 201 and which come into contact with the plurality of solder balls 204 on the BGA package 202; and BGA protrusion-inserting holes 205 which are provided on the same surface side as the BGA connection terminals 211 and in which the BGA protrusions 203 having the step protrusion portions 232 on the BGA package 202 are inserted (e.g., see JP-A-2002-246512).
In the second structure, there is however a problem that the BGA protrusions 203 are apt to come out after the BGA protrusions 203 are inserted in the BGA protrusion-inserting holes 205 of the printed board 201. In addition, since the BGA protrusions 203 are provided on four corners of a bottom surface of the BGA package 202, orientation of the BGA package 202 cannot be decided when the BGA package 202 is mounted on the printed board 201. Accordingly, there is a problem that the BGA package 202 is apt to be mounted in an incorrect direction.
SUMMARY OF THE INVENTION
It is an object of the invention to provide a mounting structure of a ball grid array type IC which makes it possible to mount the ball grid array type IC on a board in parallel with the board without inclination, eliminate any soldering defect and eliminate rubbing of the ball grid array type IC against the board during mounting to thereby prevent short-circuiting of terminals and prevent the ball grid array type IC from being mounted in an incorrect direction.
The invention is proposed to solve the problems. According to the invention, there is provided a mounting structure of a ball grid array type IC including: resin guide ribs provided on opposite sides of a body portion of the ball grid array type IC; engaging pawls formed at distal ends of the guide ribs so as to be locked into locking holes of a board; springs in which the guide ribs are inserted respectively; and height adjusting ribs provided at places slightly inwardly distant from the guide ribs respectively so as to protrude from the body portion; wherein the springs prevent the ball grid array type IC from being strongly pressed against the board when the ball grid array type IC is mounted on the board; and the height adjusting ribs adjust the ball grid array type IC to a predetermined height relative to the board.
The invention also provides a mounting structure of a ball grid array type IC including: resin guide ribs provided on opposite sides of a body portion of the ball grid array type IC; engaging pawls formed at distal ends of the guide ribs so as to be locked into locking holes of a board; and elastic bodies provided on the guide ribs; wherein the elastic bodies prevent the ball grid array type IC from being strongly pressed against the board when the ball grid array type IC is mounted on the board.
Preferably, the mounting structure of the ball grid array type IC according to the invention may further includes height adjusting ribs formed on sides of the guide ribs so as to be integrated with the guide ribs respectively.
Preferably, in the invention, the elastic bodies may be made of elastic pieces provided on sides of the guide ribs so as to be integrated with the guide ribs respectively and extend toward the board.
The invention further provides a mounting structure of a ball grid array type IC including a plurality of solder balls provided on a bottom surface of a body portion of the ball grid array type IC for mounting the ball grid array type IC on a board; wherein a pair of anti-rubbing pins to be fitted into insertion holes provided in the board are provided on diagonal corners of the bottom surface of the body portion respectively so as to protrude downward.
The invention further provides a mounting structure of a ball grid array type IC including a plurality of solder balls provided on a bottom surface of a body portion of the ball grid array type IC for mounting the ball grid array type IC on a board; wherein at least one anti-rubbing pin to be fitted in an insertion hole provided in the board is provided on the bottom surface of the body portion so as to protrude downward.
Preferably, in the invention, the anti-rubbing pin may be provided on each of three corners of the body portion so as to protrude downward.
Preferably, in the invention, the anti-rubbing pin may be provided on one corner of the body portion so as to protrude downward while a pin which is shaped like a square in section and which serves as an orienting pin and also as a positioning pin to be inserted into a square hole formed in the board is provided on another corner of the bottom surface of the body portion diagonally opposite the anti-rubbing pin, so as to protrude downward.
BRIEF DESCRIPTION OF THE DRAWINGS
FIGS. 1A and 1B show a mounting structure of a ball grid array type IC according to a first embodiment of the invention, FIG. 1A being a sectional view showing a state of the ball grid array type IC before mounting, FIG. 1B being a sectional view showing a state of the ball grid array type IC after mounting;
FIG. 2 is a sectional view showing a state of a mounting structure of a ball grid array type IC according to a second embodiment of the invention before mounting;
FIG. 3 is a sectional view showing a state of a mounting structure of a ball grid array type IC according to a third embodiment of the invention after mounting;
FIGS. 4A and 4B show a mounting structure of a ball grid array type IC according to a fourth embodiment of the invention, FIG. 4A being a bottom view of the ball grid array type IC, FIG. 4B being a sectional view showing a state of the ball grid array type IC after mounting;
FIGS. 5A and 5B show a mounting structure of a ball grid array type IC according to a fifth embodiment of the invention, FIG. 5A being a bottom view of the ball grid array type IC, FIG. 5B being a sectional view showing a state of the ball grid array type IC after mounting;
FIG. 6 is a bottom view of a ball grid array type IC in a mounting structure according to a sixth embodiment of the invention;
FIGS. 7A, 7B, and 7C show a mounting structure of a ball grid array type semiconductor package according to the related art, FIG. 7A being a plan view of the ball grid array type semiconductor package, FIG. 7B being a side sectional view of the ball grid array type semiconductor package, FIG. 7C being a side sectional view showing a state in which the ball grid array type semiconductor package is mounted on a mounting board; and
FIGS. 8A, 8B, and 8C show the structure of a BGA package according to the related art, FIG. 8A being a perspective view of the BGA package, FIG. 8B being a sectional view of the BGA package, FIG. 8C being a sectional view of the BGA package mounted on a mounting board before soldered to the mounting board.
 DETAILED DESCRIPTION OF THE PREFFERED EMBODIMENTS
Embodiments of a mounting structure of a ball grid array type IC according to the invention will be described below with reference to the drawings.
FIGS. 1A and 1B show a mounting structure of a ball grid array type IC according to a first embodiment of the invention.
FIG. 1A is a sectional view showing a state of the ball grid array type IC before mounting, and FIG. 1B is a sectional view showing a state of the ball grid array type IC after mounting.
As shown in FIG. 1A, the mounting structure of the ball grid array type IC 1 according to the first embodiment has: a plurality of solder balls 3 provided on a bottom surface of a body portion 2 of the ball grid array type IC 1; a pair of resin guide ribs 4, 4 provided on opposite sides on the bottom surface of the body portion 2; engaging pawls 4 a formed at lower ends of the pair of guide ribs 4, 4 respectively so as to be locked into locking holes 5 a of a board 5; springs 6 in which the guide ribs 4, 4 are inserted respectively; and a pair of height adjusting ribs 7, 7 provided at places slightly inwardly distant from the pair of guide ribs 4, 4 respectively so as to protrude from the bottom surface of the body portion 2.
As shown in FIG. 1B, the pair of guide ribs 4, 4 of the body portion 2 of the ball grid array type IC 1 are fitted into the locking holes 5 a of the board 5, so that lower ends of the pair of height adjusting ribs 7, 7 abut on a top surface of the board 5.
According the first embodiment, the springs 6 prevent the ball grid array type IC 1 from being strongly pressed against the board 5 when the ball grid array type IC 1 is mounted on the board 5, and the height adjusting ribs 7, 7 adjust the ball grid array type IC 1 to a predetermined height relative to the board 5.
Thus, the ball grid array type IC 1 can be mounted on the board 5 in parallel with the board 5 without inclination to thereby eliminate any soldering defect.
FIG. 2 is a sectional view showing a state of a mounting structure of a ball grid array type IC according to a second embodiment of the invention before mounting.
As shown in FIG. 2, in the mounting structure of the ball grid array type IC according to the second embodiment, height adjusting ribs 7, 7 are formed on sides of guide ribs 4, 4 so as to be integrated with the guide ribs 4, 4 respectively.
Further, springs 6 are fitted around the guide ribs 4, 4 under the height adjusting ribs 7, 7 respectively.
According to the second embodiment, the height adjusting ribs 7, 7 can be made so robustly as not to be broken. p FIG. 3 is a sectional view showing a state of a mounting structure of a ball grid array type IC according to a third embodiment of the invention after mounting.
In the mounting structure of the ball grid array type IC according to the third embodiment, elastic pieces 4 b, 4 b which are substituted for the springs 6 are formed on sides of the guide ribs 4, 4 so as to be integrated with the guide ribs 4, 4 respectively and extend downward.
Accordingly, the springs 6 can be dispensed with, so that the number of components can be reduced to simplify the structure to thereby attain reduction in cost.
FIGS. 4A and 4B show a mounting structure of a ball grid array type IC according to a fourth embodiment of the invention.
FIG. 4A is a bottom view of the ball grid array type IC, and FIG. 4B is a sectional view showing a state of the ball grid array type IC after mounting.
As shown in FIGS. 4A and 4B, the mounting structure of the ball grid array type IC according to the fourth embodiment has a plurality of solder balls 3 provided on a bottom surface of a body portion 2 of the ball grid array type IC 1 for mounting the ball grid array type IC 1 on a board 5. A pair of ant-rubbing pins 8, 8 to be fitted into insertion holes 5 b, 5 b provided in the board 5 are provided on diagonal corners of the bottom surface of the body portion 2 so as to protrude downward.
The anti-rubbing pins 8, 8 are aligned with and inserted into the insertion holes 5 b, 5 b of the board 5.
According to the fourth embodiment, the ball grid array type IC 1 can be prevented from being rubbed against the board 5 because the anti-rubbing pins 8, 8 are inserted into the insertion holes 5 b, 5 b of the board 5 when the ball grid array type IC 1 is mounted on the board 5.
FIGS. 5A and 5B show a mounting structure of a ball grid array type IC according to a fifth embodiment of the invention. FIG. 5A is a bottom view of the ball grid array type IC, and FIG. 5B is a sectional view showing a state of the ball grid array type IC after mounting.
As shown in FIG. 5A, in the mounting structure of the ball grid array type IC according to the fifth embodiment, an anti-rubbing pin 8 is provided on each of three corners of a body portion 2 of the ball grid array type IC so as to protrude downward.
As shown in FIG. 5B, the anti-rubbing pins 8 are inserted into insertion holes 5 b formed in three locations of a board 5 respectively to mount the ball grid array type IC 1 on the board 5.
According to the fifth embodiment, the ball grid array type IC 1 can be mounted on the board 5 so as to be oriented in a correct direction because the anti-rubbing pins 8 provided on the three corners of the body portion 2 are inserted into the insertion holes 5 b formed in the three locations of the board 5.
FIG. 6 is a bottom view of a ball grid array type IC in a mounting structure according to a sixth embodiment of the invention.
As shown in FIG. 6, in the mounting structure of the ball grid array type IC according to the sixth embodiment, an anti-rubbing pin 8 is provided on one corner of a body portion 2 of the ball grid array type IC so as to protrude downward while a pin 9 which is shaped like a square in section and which serves as an orienting pin and also as a positioning pin to be inserted into a square hole (not shown) formed in a board 5 is provided on another corner of the bottom surface of the body portion 2 diagonally opposite the anti-rubbing pin 8, so as to protrude downward.
The anti-rubbing pin 8 in one location is inserted into an insertion hole 5 b of the board 5 while the orienting pin 9 shaped like a square in section and serving also as a positioning pin is fitted into the square hole (not shown) of the board 5 to mount the ball grid array type IC 1 on the board 5.
According to the sixth embodiment, hence, the combination of the anti-rubbing pin 8 in one location and the orienting pin 9 can prevent the ball grid array type IC 1 from being rubbed against the board 5. In addition, the orienting pin 9 shaped like a square in section permits the ball grid array type IC 1 to be oriented in a correct direction relative to the board and permits the ball grid array type IC 1 to be positioned when the ball grid array type IC 1 is mounted on the board 5.
As described above, in accordance with the invention, there is provided a mounting structure of a ball grid array type IC including: resin guide ribs provided on opposite sides of a body portion of the ball grid array type IC; engaging pawls formed at distal ends of the guide ribs so as to be locked into locking holes of a board; springs in which the guide ribs are inserted respectively; and height adjusting ribs provided at places slightly inwardly distant from the guide ribs respectively so as to protrude from the body portion; wherein the springs prevent the ball grid array type IC from being strongly pressed against the board when the ball grid array type IC is mounted on the board; and the height adjusting ribs adjust the ball grid array type IC to a predetermined height relative to the board. Accordingly, the following advantage can be obtained.
That is, the ball grid array type IC can be mounted on the board in parallel with the board without inclination to eliminate any soldering defect.
According to the invention, there is also provided amounting structure of a ball grid array type IC including: resin guide ribs provided on opposite sides of a body portion of the ball grid array type IC; engaging pawls formed at distal ends of the guide ribs so as to be locked into locking holes of a board; and elastic bodies provided on the guide ribs; wherein the elastic bodies prevent the ball grid array type IC from being strongly pressed against the board when the ball grid array type IC is mounted on the board. Accordingly, the following advantage can be obtained.
That is, the ball grid array type IC can be mounted on the board in a good condition while the ball grid array type IC is prevented from being strongly pressed against the board.
According to the invention, height adjusting ribs may be formed on sides of the guide ribs so as to be integrated with the guide ribs respectively. Accordingly, the height adjusting ribs can be made so robustly as not to be broken.
According to the invention, the elastic bodies may be made of elastic pieces provided on sides of the guide ribs so as to be integrated with the guide ribs respectively and extend downward. Accordingly, the springs can be dispensed with, so that the number of components can be reduced to simplify the structure to thereby attain reduction in cost.
According to the invention, there is further provided a mounting structure of a ball grid array type IC including a plurality of solder balls provided on a bottom surface of a body portion of the ball grid array type IC for mounting the ball grid array type IC on a board, wherein a pair of anti-rubbing pins to be fitted into insertion holes provided in the board are provided on diagonal corners of the bottom surface of the body portion respectively so as to protrude downward. Accordingly, the following advantage can be obtained.
That is, the pair of anti-rubbing pins are inserted in the insertion holes of the board when the ball grid array type IC is mounted on the board, so that the ball grid array type IC can be prevented from being rubbed against the board.
According to the invention, there is further provided a mounting structure of a ball grid array type IC including a plurality of solder balls provided on a bottom surface of a body portion of the ball grid array type IC for mounting the ball grid array type IC on a board, wherein at least one anti-rubbing pin to be fitted in an insertion hole provided in the board is provided on the bottom surface of the body portion so as to protrude downward. Accordingly, the following advantage can be obtained.
That is, the anti-rubbing pin is inserted in the insertion hole of the board when the ball grid array type IC is mounted on the board, so that the ball grid array type IC can be prevented from being rubbed against the board.
According to the invention, the anti-rubbing pin may be provided on each of three corners of the body portion so as to protrude downward. Accordingly, the three anti-rubbing pins provided on the three corners of the body portion are inserted into the insertion holes formed in three locations of the board, so that the ball grid array type IC can be mounted on the board so as to be oriented in a correct direction.
According to the invention, the anti-rubbing pin may be provided on one corner of the body portion so as to protrude downward while a pin which is shaped like a square in section and which serves as an orienting pin and also as a positioning pin to be inserted into a square hole formed in the board is provided on another corner of the bottom surface of the body portion diagonally opposite the anti-rubbing pin, so as to protrude downward. Accordingly, the combination of the anti-rubbing pin in one location and the orienting pin can prevent the ball grid array type IC from being rubbed against the board. In addition, the orienting pin shaped like a square in section permits the ball grid array type IC to be oriented in a correct direction relative to the board and permits the ball grid array type IC to be positioned when the ball grid array type IC is mounted on the board.

Claims (2)

1. A mounting structure of a ball grid array type IC comprising:
a plurality of solder balls provided on a bottom surface of a body portion of the ball grid array type IC for mounting the ball grid array type IC on a board:
wherein at least one anti-rubbing pin to be fitted in an insertion hole provided in the board is provided on the bottom surface of the body portion so as to protrude downward,
wherein the anti-rubbing pin is provided on each of three corners of the body portion so as to protrude downward.
2. A mounting structure of a ball grid array type IC comprising:
a plurality of solder balls provided on a bottom surface of a body portion of the ball grid array type IC for mounting the ball grid array type IC on a board;
wherein at least one anti-rubbing pin to be fitted in an insertion hole provided in the board is provided on the bottom surface of the body portion so as to protrude downward,
wherein the anti-rubbing pin is provided on one corner of the body portion so as to protrude downward; and
wherein a pin which is shaped like a square in section and which serves as an orienting pin and also as a positioning pin to be inserted into a square hole formed in the board is provided on another corner of the bottom surface of the body portion diagonally opposite the anti-rubbing pin, so as to protrude downward.
US10/761,738 2003-01-23 2004-01-21 Mounting structure for ball grid array type IC Expired - Fee Related US7224072B2 (en)

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JP2003015142A JP4003230B2 (en) 2003-01-23 2003-01-23 Mounting structure of ball grid array type IC
JPP2003-015142 2003-01-23

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080158828A1 (en) * 2006-12-27 2008-07-03 Inventec Corporation Heatsink structure and assembly fixture thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5556316B2 (en) * 2010-04-02 2014-07-23 株式会社デンソー Surface mount electronic component and mounting structure of surface mount electronic component

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55155480A (en) 1979-05-24 1980-12-03 Japan Aviation Electron Method of mounting circuit flat board
JPS6473107A (en) 1987-09-11 1989-03-17 Isuzu Motors Ltd Lubricating device for internal combustion engine
US5230759A (en) * 1989-10-20 1993-07-27 Fujitsu Limited Process for sealing a semiconductor device
JPH09129766A (en) 1995-10-26 1997-05-16 Matsushita Electric Ind Co Ltd Transistor module
JPH11126800A (en) 1994-11-15 1999-05-11 Formfactor Inc Mounting of electronic component on circuit board
US6061240A (en) * 1997-08-20 2000-05-09 International Business Machines Corporation Push pin assembly for heat sink for cooling electronic modules
JP3183278B2 (en) 1999-02-08 2001-07-09 日本電気株式会社 Ball grid array type semiconductor package and its mounting structure
JP2002246512A (en) 2001-02-16 2002-08-30 Nec Corp Structure of bga package and structure of mount substrate
US6501658B2 (en) * 2001-02-16 2002-12-31 Intel Corporation Heatsink mounting with shock absorbers
US20030001254A1 (en) * 2001-06-27 2003-01-02 Jackson James Daniel Electronic assembly with separate power and signal connections
US20040084764A1 (en) * 2002-09-16 2004-05-06 Junichi Ishimine Package structure, printed circuit board mounted with the same, electronic apparatus having the printed circuit board
US20050040540A1 (en) * 2003-07-30 2005-02-24 Tessera, Inc. Microelectronic assemblies with springs
US6939742B2 (en) * 1999-09-30 2005-09-06 Intel Corporation Thermal gap control

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55155480A (en) 1979-05-24 1980-12-03 Japan Aviation Electron Method of mounting circuit flat board
JPS6473107A (en) 1987-09-11 1989-03-17 Isuzu Motors Ltd Lubricating device for internal combustion engine
US5230759A (en) * 1989-10-20 1993-07-27 Fujitsu Limited Process for sealing a semiconductor device
JPH11126800A (en) 1994-11-15 1999-05-11 Formfactor Inc Mounting of electronic component on circuit board
JPH09129766A (en) 1995-10-26 1997-05-16 Matsushita Electric Ind Co Ltd Transistor module
US6061240A (en) * 1997-08-20 2000-05-09 International Business Machines Corporation Push pin assembly for heat sink for cooling electronic modules
JP3183278B2 (en) 1999-02-08 2001-07-09 日本電気株式会社 Ball grid array type semiconductor package and its mounting structure
US6939742B2 (en) * 1999-09-30 2005-09-06 Intel Corporation Thermal gap control
JP2002246512A (en) 2001-02-16 2002-08-30 Nec Corp Structure of bga package and structure of mount substrate
US6501658B2 (en) * 2001-02-16 2002-12-31 Intel Corporation Heatsink mounting with shock absorbers
US20030001254A1 (en) * 2001-06-27 2003-01-02 Jackson James Daniel Electronic assembly with separate power and signal connections
US20040084764A1 (en) * 2002-09-16 2004-05-06 Junichi Ishimine Package structure, printed circuit board mounted with the same, electronic apparatus having the printed circuit board
US20050040540A1 (en) * 2003-07-30 2005-02-24 Tessera, Inc. Microelectronic assemblies with springs

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
English Translation of JP Office Action dated Feb. 7, 2007 issued during the prosecution of JP patent application No. 2003-015142 (2 pages).
JP Office Action dated Feb. 7, 2007 issued during the prosecution of JP patent application No. 2003-015142 (3 pages).
Patent Abstracts of Japan for Publication No. 2002-246512 dated Aug. 30, 2002 (1 page).
Patent Abstracts of Japan, Publication No. 09-129766 dated May 16, 1997 (2 pages).
Patent Abstracts of Japan, Publication No. 10-173107 dated Jun. 26, 1998 (2 pages).
Patent Abstracts of Japan, Publication No. 11-126800 dated May 11, 1999 (2 pages).

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080158828A1 (en) * 2006-12-27 2008-07-03 Inventec Corporation Heatsink structure and assembly fixture thereof

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US20040150974A1 (en) 2004-08-05
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