US7102730B2 - Exposure device - Google Patents
Exposure device Download PDFInfo
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- US7102730B2 US7102730B2 US10/807,310 US80731004A US7102730B2 US 7102730 B2 US7102730 B2 US 7102730B2 US 80731004 A US80731004 A US 80731004A US 7102730 B2 US7102730 B2 US 7102730B2
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- elements
- modulation
- light
- microlenses
- microlens array
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/52—Details
- G03B27/54—Lamp housings; Illuminating means
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
Definitions
- the present invention relates to an exposure device, and particularly to an exposure device which exposes a photosensitive material with a light beam which is modulated by a spatial light modulation device in accordance with image data.
- various exposure devices which carry out image exposure with light beams which have been modulated, using spatial light modulation devices, in accordance with image data, such as, for example, exposure devices for photo masks which are employed in liquid crystal fabrication devices, exposure devices for printing plate fabrication and the like.
- An exposure device which uses a digital micromirror device (DMD) as a spatial light modulation device has been structured by, for example, a light source 1 , a lens system 2 , a DMD 3 and lens systems 4 and 6 , as shown in FIG. 9A .
- the light source 1 irradiates laser light.
- the lens system 2 collimates the laser light irradiated from the light source 1 .
- the DMD 3 is disposed substantially at a focusing position of the lens system 2 .
- the lens systems 4 and 6 focus the laser light, which has been reflected from the DMD 3 , onto a scanning surface 5 .
- the DMD is a mirror device in which numerous micromirrors, which alter angles of reflection surfaces thereof in accordance with control signals, are arranged two-dimensionally on a semiconductor support of silicon or the like.
- the laser light is modulated by ON-OFF control of each of the micromirrors of the DMD 3 from an unillustrated control apparatus, by control signals which are generated in accordance with image data or the like, and image exposure is carried out with the modulated laser light.
- FIG. 9A is an unfolded schematic view along an optical axis.
- a microlens array (MLA) 8 may be disposed so as to correspond with an image of the DMD 3 , as shown in FIG. 9B , and image exposure with a high resolution may be carried out.
- MLA microlens array
- FIG. 9B the laser light that has been irradiated from the light source 1 and collimated at the lens system 2 is reflected at a total internal reflection (TIR) prism and illuminated to the DMD 3 . Further, the laser light that has been reflected at the DMD 3 passes through the TIR prism and is incident at the lens system 4 .
- TIR total internal reflection
- the present invention has been devised in order to solve problems with the conventional technology described above, and an object of the present invention is to provide an exposure device which can accurately project an image of a spatial light modulation device at a focusing plane.
- an exposure device of a first aspect of the present invention includes: a light source which emits a light beam for exposure; a spatial light modulation device at which a plurality of modulation elements, which respectively change light modulation states thereof in accordance with control signals, are two-dimensionally arranged, the spatial light modulation device being for modulating the light beam, which is incident at the plurality of modulation elements from the light source, at each of the modulation elements; a microlens array at which a plurality of microlenses are two-dimensionally arranged with a pitch corresponding to the plurality of modulation elements, the microlens array being for condensing light beams, which have been modulated by the modulation elements, at the respective microlenses; a shift amount detection section for detecting an offset amount of relative positions of the light beams which have been modulated by the modulation elements and the corresponding microlenses; and a position adjustment section which finely adjusts position of at least one of the spatial light modulation device and the
- the light beam that is incident at the spatial light modulation device from the light source is modulated by the modulation elements of the spatial light modulation device, and the light beams that have been modulated are condensed at the respective microlenses of the microlens array.
- relative mispositioning between the spatial light modulation device and the microlens array occurs because of thermal expansion, chronological development of residual stresses and the like. Accordingly, an offset amount of relative positions of the light beams that have been modulated by the respective modulation elements of the spatial light modulation device and the corresponding microlenses is detected by the shift amount detection section.
- the position of the at least one of the spatial light modulation device and the microlens array is finely adjusted by the position adjustment section on the basis of the detected offset amount.
- the light beams that have been modulated by the respective modulation elements are properly incident at the corresponding microlenses, and an image of the spatial light modulation device is accurately projected at the focusing plane.
- the position adjustment section finely adjusts the position of the at least one of the spatial light modulation device and the microlens array, on the basis of the detected offset amount, such that the offset amount is reduced. More specifically, it is preferable to finely adjust the position of the at least one of the spatial light modulation device and the microlens array such that the offset amount of the relative positions of the light beams modulated by the modulation elements and the corresponding microlenses, which is detected at the shift amount detection section, is not more than a predetermined amount.
- a focusing optical system may be provided which focuses the light beams that have been modulated by the modulation elements so as to correspond with the microlenses.
- the position of at least one of the spatial light modulation device, the microlens array and an optical member which structures the focusing optical system is finely adjusted.
- optical axis adjustment is easier.
- the position adjustment section finely adjusts the position of the at least one of the spatial light modulation device, the microlens array and the optical member structuring the focusing optical system, on the basis of the detected offset amount, such that the offset amount is reduced. More specifically, it is preferable to finely adjust the position of the at least one of the spatial light modulation device, the microlens array and the optical member structuring the focusing optical system such that the offset amount of the relative positions of the light beams modulated by the modulation elements and the corresponding microlenses, which is detected at the shift amount detection section, is not more than a predetermined amount.
- a shift amount detection section which includes a plurality of light detection elements, which correspond, respectively, to a mutually adjacent plurality of the modulation elements, and a calculation section, which calculates the offset amount of the light beams which have been modulated by the modulation elements and the corresponding microlenses on the basis of detection signals from the plurality of light detection elements, can be used as the shift amount detection section.
- the light detection elements beside photodiodes, phototransistors, a CCD (charge coupled device) or the like can be employed.
- a four-part (fourfold) detector may be employed which includes four photodiodes, which correspond, respectively, to four of the modulation elements which are arranged in a matrix form, and a calculation section which calculates, on the basis of detection signals from the four photodiodes, a row direction offset amount and a column direction offset amount of the light beams modulated by these modulation elements and the corresponding microlenses.
- a trimming mechanism which utilizes piezoelectric elements may be employed as the position adjustment section.
- An exposure device of one other aspect of the present invention includes: a light source which emits a light beam; a spatial light modulation device including a plurality of unit elements which are arranged two-dimensionally, the spatial light modulation device being for modulating the light beam, which is incident at the plurality of unit elements, at each of the unit elements in accordance with control signals which are inputted to the spatial light modulation device; a microlens array including microlenses which are arranged to correspond to the plurality of unit elements and which respectively condense light beams, which have been modulated by the unit elements; a displacement detection section for detecting displacement of a relative position of at least one of the plurality of unit elements and at least one of the plurality of microlenses corresponding to the at least one unit element from a predetermined relative position; and a position adjustment section which finely adjusts position of at least one of the spatial light modulation device and the microlens array on the basis of the detected displacement.
- FIG. 1 is a schematic view showing structure of an exposure device of a present embodiment.
- FIG. 2A is a plan view showing an exposure area formed on a stage.
- FIG. 2B is a plan view showing an arrangement of a four-part detector.
- FIG. 3A is a diagram showing four pixels which light up during detection of mispositioning.
- FIG. 3B is an explanatory view of a procedure for detecting mispositioning with the four-part detector.
- FIG. 4A is a diagram showing a situation in which modulation elements of a DMD conform with positions of microlenses of a microlens array.
- FIG. 4B is a diagram showing a situation in which the modulation elements of the DMD do not conform with the positions of the microlenses of the microlens array.
- FIG. 5 is a flowchart showing a control routine when correction of mispositioning of a beam is carried out.
- FIG. 6 is a plan view showing another arrangement of a four-part detector.
- FIG. 7 is a diagram showing pixels which light up when an offset amount in an X direction and an offset amount in a Y direction are to be detected separately.
- FIG. 8 is a diagram showing an example in which the four-part detector has a structure which enables insertion and withdrawal.
- FIG. 9A is a side view showing structure of a conventional exposure head along an optical axis thereof.
- FIG. 9B is a side view showing structure of a conventional exposure head along an optical axis thereof.
- the exposure device relating to the present embodiment is equipped with a digital micromirror device (DMD) 10 , which serves as a spatial light modulation device for modulating an incident light beam at each of pixels in accordance with image data.
- a light source 12 which illuminates the DMD 10 , is disposed at a light incidence side of the DMD 10 .
- an enlargement lens system 14 and a magnification adjustment lens 16 are disposed in that order from an upstream side.
- the enlargement lens system 14 enlarges a DMD image which has been reflected from the DMD 10
- the magnification adjustment lens 16 adjusts a focusing magnification.
- a microlens array 18 is disposed at a position at which the DMD image is focused by the magnification adjustment lens 16 . Microlenses thereof are distributed to correspond to respective modulation elements of the DMD 10 .
- a focusing lens system 20 is disposed at a light emission side of the microlens array 18 such that the DMD 10 and an exposure surface have a conjugative relationship.
- a stage 24 on which a light-sensitive member 22 is placed, is disposed at a light emission side of the focusing lens system 20 .
- the stage 24 is structured to be movable in three directions, an X direction, a Y direction, and a Z direction which intersects an X-Y plane.
- a four-part detector 26 is disposed on the stage 24 , at the same height as an exposure surface of the light-sensitive member 22 .
- the DMD 10 is connected to a controller 30 via a driving section 28 , which drives the respective micromirrors.
- the controller 30 is constituted by a computer which is equipped with a CPU, ROM, RAM, memory, input/output devices such as a monitor, a keyboard and the like, and the like.
- a trimming mechanism 32 which utilizes piezoelectric elements, is mounted at the magnification adjustment lens 16 .
- This trimming mechanism 32 is connected to the controller 30 via a driving section 34 .
- a position detection sensor 36 which detects position of the magnification adjustment lens 16 , is disposed in a vicinity of the magnification adjustment lens 16 .
- the trimming mechanism 32 finely adjusts the position of the magnification adjustment lens 16 in the X and Y directions on the basis of detection signals from the position detection sensor 36 .
- a trimming mechanism 38 which utilizes piezoelectric elements is mounted at the microlens array 18 , similarly to the magnification adjustment lens 16 .
- This trimming mechanism 38 is connected to the controller 30 via a driving section 40 .
- a position detection sensor 42 which detects position of the microlens array 18 , is disposed in a vicinity of the microlens array 18 .
- the trimming mechanism 38 finely adjusts the position of the microlens array 18 in the X and Y directions on the basis of detection signals from the position detection sensor 42 .
- the modulation elements of the DMD 10 and the microlenses of the microlens array 18 have a one-to-one correspondence, and a magnification rate of the enlargement lens system 14 is specified such that pixel pitches of the modulation elements and the microlenses coincide.
- the magnification rate of this lens will have an error of 1 or 2%, due to irregularities in curvatures of the lens, inter-surface spacings and refraction rates, and the like.
- the magnification adjustment lens 16 is disposed in addition to the enlargement lens system 14 , a spacing between the enlargement lens system 14 and the magnification adjustment lens 16 can be adjusted.
- errors due to lens magnification rates can be corrected for, and a lens magnification rate can be adjusted to accord with a design value.
- the stage 24 is connected to the controller 30 via a driving section 44 .
- This driving section 44 drives the stage 24 in accordance with control signals from the controller 30 .
- the four-part detector 26 disposed on the stage 24 is also connected to the controller 30 , and detection signals from the four-part detector 26 are inputted to the controller 30 .
- the controller 30 When image data is inputted to the controller 30 , the controller 30 generates control signals to control driving of the micromirrors of the DMD 10 , based on the inputted image data. On the basis of these control signals, the driving section 28 changes angles of reflection surfaces of the micromirrors of the DMD 10 .
- Illumination light that is irradiated at the DMD 10 from the light source 12 is reflected in predetermined directions in accordance with the angles of the reflection surfaces of the micromirrors, and is thus modulated.
- the modulated light is enlarged by the enlargement lens system 14 . Accordingly, a size of pixel spots of the DMD 10 on the exposure surface is enlarged, and a pitch of the pixel spots is also enlarged.
- a focusing magnification rate of the light that has been enlarged by the enlargement lens system 14 is finely adjusted by the magnification adjustment lens 16 .
- the light whose magnification rate has been thus adjusted is incident at the respective microlenses provided at the microlens array 18 , and the enlarged DMD images are contracted again.
- all flux of the light is incident on the microlens array 18 .
- the light that has been condensed at the microlens array 18 is incident at the focusing lens system 20 , and an image of the DMD 10 is focused on the exposure surface of the light-sensitive member 22 by the focusing lens system 20 .
- the four-part (fourfold) detector 26 is disposed at at least one of four corners A, B. C and D of a rectangular exposure area 46 which is formed on the stage 24 , as shown in FIG. 2A .
- the exposure area 46 is constituted by a large number of pixels, which correspond to the respective modulation elements of the DMD 10 .
- the four-part detector 26 is disposed such that four pixels 48 1 , 48 2 , 48 3 and 48 4 correspond to four diodes 26 1 , 26 2 , 26 3 and 26 4 , respectively, of the four-part detector 26 .
- the four pixels 48 1 , 48 2 , 48 3 and 48 4 (which are pixels of exposed images) are present at corner A of the exposure area 46 and are mutually adjacent.
- the four-part detector 26 With a four-part detector with a size of around 1.5 mm by 2.0 mm, if a spacing between neighboring diodes is approximately 15 ⁇ m and a spacing between neighboring pixels of an exposed image is approximately 70 ⁇ m, then it is possible for the four-part detector 26 to be disposed with a positional accuracy with respect to the four pixels of ⁇ 20 ⁇ m.
- the four modulation elements of the DMD 10 that correspond to the four pixels 48 1 , 48 2 , 48 3 and 48 4 which are present at corner A of the exposure area 46 are lit up. That is, the modulation elements modulate the light beam such that those four pixels could be exposed.
- a difference is generated between the output signals P 1 , P 2 , P 3 and P 4 of the four-part detector 26 , and the occurrence of an error (offset) can be detected. That is, an offset in relative positions of the light beams reflected at the micromirrors (modulation elements) of the DMD 10 and the microlenses that correspond thereto (below referred to as “mispositioning of the beams”) can be detected.
- FIG. 5 shows a control routine of the controller 30 when correction is carried out.
- An interrupt routine can be implemented in order to carry out detection and correction of mispositioning of the beams with a freely selected timing before commencement of exposure and/or after commencement of exposure.
- step 100 the controller 30 lights up the four modulation elements of the DMD 10 that correspond to the four pixels which are present at corner A of the exposure area 46 .
- step 102 the output signals P 1 to P 4 are acquired from the four-part detector 26 .
- step 104 the offset amount in the X direction ⁇ X and the offset amount in the Y direction ⁇ Y are calculated.
- a subsequent step 106 it is judged whether or not the calculated offset amounts ⁇ X and ⁇ Y are less than pre-specified tolerance amounts. If the offset amounts are not greater than the tolerance amounts, the routine finishes without carrying out correction of mispositioning of the beams. On the other hand, if the offset amounts exceed the tolerance amounts, correction of the mispositioning of the beams is carried out in step 108 .
- the DMD 10 is fixedly disposed, so positional adjustment of the microlens array 18 is carried out, on the basis of the offset amount ⁇ X and the offset amount ⁇ Y. Correction amounts in such a case are ⁇ X in the X direction and ⁇ Y in the Y direction.
- step 106 the processing of steps 102 to 108 is repeated until the calculated offset amounts ⁇ X and ⁇ Y are less than or equal to the tolerance amounts.
- the four diodes of the four-part detector are disposed so as to correspond, respectively, to (the images of) the four modulation elements of the DMD.
- a difference is generated in the output signals of the four-art detector, and an offset of the light beams reflected from the micromirrors of the DMD and the corresponding microlenses (the mispositioning of the beams) can be detected.
- the mispositioning of the beams is reduced by the positional correction of the microlens array being carried out repeatedly until the mispositioning of the beams is not more than the tolerance amounts.
- the mispositioning of the beams may be eradicated by putting the tolerance amounts for the mispositioning of the beams infinitesimally close to zero.
- the four-part detector 26 has been described as being disposed at at least one of the four corners A, B, C and D of the rectangular exposure area 46 .
- the four-art detector 26 may be provided at two locations, corner A and corner B. By performing measurement at two points, mispositioning in a direction of rotation can also be detected.
- offset amounts of the beams that are detected using the four-part detector 26 disposed at corner A are ⁇ X A and ⁇ Y A
- offset amounts of beams that are detected using the four-part detector 26 disposed at corner B are ⁇ X B and ⁇ Y B
- a separation between A and B is L
- the offset amount ⁇ X in the X direction, the offset amount ⁇ Y in the Y direction and an offset amount ⁇ z in the rotational direction are represented by the following equations. Accordingly, in order to eliminate the mispositioning of the beams, it is possible to just move the microlens array 18 by ⁇ X, ⁇ Y, and ⁇ z from a start position.
- the four-part detector 26 may be provided at two locations which are on a diagonal, corner A and corner D, and may be provided at each of the four corners.
- mispositioning of the beams over the whole exposure area can be detected, including mispositioning in the rotational direction (angular shifts), shifts in magnification and the like.
- the offset amount in the X direction and the offset amount in the Y direction may be detected separately.
- the offset amount in the X direction and the offset amount in the Y direction may be detected separately.
- FIG. 7 it is possible to light up (expose) a total of twelve pixels, two pixels in the X direction and six pixels in the Y direction, to detect an offset amount in the X direction.
- Each diode of the four-part detector 26 is assigned to a set of three pixels. In the example of FIG.
- pixels 481 , to 48 13 are assigned to the diode 26 1
- pixels 48 21 to 48 23 are allocated to the diode 26 2
- pixels 48 3 , to 48 33 are assigned to the diode 26 3
- pixels 48 4 , to 48 43 are assigned to the diode 26 4
- the four-part detector 26 may be disposed outside the exposure area 46 when the stage 24 is disposed at the reference position.
- the four-part detector 26 is moved together with the stage 24 , and the four-part detector 26 is disposed at a corner of the exposure area 46 , as shown by the solid lines in FIG. 8 .
- the four-part detector 26 it is possible to respond to shrinking of the exposure area, lengthening of a cycle time and the like.
- dummy pixels which are not employed for exposure may be disposed at one corner of the exposure area. Hence, mispositioning of the beams can be detected continuously.
- the position of the microlens array is adjusted to correct mispositioning of the beams.
- the position of the magnification adjustment lens may be adjusted.
- the position of the DMD may be adjusted. For example, if, of these structural members, the position of a member whose sensitivity with respect to shifting of the optical axis is lower is adjusted, such that a mispositioning of 10 ⁇ m can be corrected with an optical axis movement of 2 ⁇ m, optical axis adjustment is easier.
- mispositioning of the beams may also be corrected for by inserting a parallel flat plate at the light incidence side of the microlens array, and altering inclination of this parallel flat plate.
- trimming mechanism which utilizes piezoelectric elements is employed as the trimming mechanism which adjusts the position of a lens or the like.
- other trimming mechanisms may be employed.
- a mechanism which uses a Peltier element and thermistors and which controls temperature to control extension/compression amounts of a retaining member for an object of movement it is possible to employ a mechanism which uses a Peltier element and thermistors and which controls temperature to control extension/compression amounts of a retaining member for an object of movement, a mechanical mechanism which scales down movement amounts by combining an electric motor with a speed reduction mechanism, a cam or the like, or the like.
- an exposure device of the present invention there is an effect that it is possible to accurately project an image of a spatial light modulation device at a focusing plane.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
Description
Correction of Mispositioning of the Beams
Next, correction of mispositioning of the beams will be described. FIG. 5 shows a control routine of the
Claims (19)
Priority Applications (1)
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US11/385,694 US7184125B2 (en) | 2003-03-25 | 2006-03-22 | Exposure device |
Applications Claiming Priority (2)
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JP2003083608A JP4057937B2 (en) | 2003-03-25 | 2003-03-25 | Exposure equipment |
JP2003-83608 | 2003-03-25 |
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US11/385,694 Continuation US7184125B2 (en) | 2003-03-25 | 2006-03-22 | Exposure device |
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US20040189970A1 US20040189970A1 (en) | 2004-09-30 |
US7102730B2 true US7102730B2 (en) | 2006-09-05 |
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US10/807,310 Active 2024-09-03 US7102730B2 (en) | 2003-03-25 | 2004-03-24 | Exposure device |
US11/385,694 Expired - Lifetime US7184125B2 (en) | 2003-03-25 | 2006-03-22 | Exposure device |
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US11/385,694 Expired - Lifetime US7184125B2 (en) | 2003-03-25 | 2006-03-22 | Exposure device |
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JP (1) | JP4057937B2 (en) |
KR (1) | KR101051396B1 (en) |
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US20080130005A1 (en) * | 2006-02-20 | 2008-06-05 | Sick Ag | Optoelectronic apparatus and a method for its operation |
US10484593B2 (en) * | 2012-04-25 | 2019-11-19 | Nikon Corporation | Focus detection device, focus adjustment device and camera |
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US7061591B2 (en) * | 2003-05-30 | 2006-06-13 | Asml Holding N.V. | Maskless lithography systems and methods utilizing spatial light modulator arrays |
US20050243295A1 (en) * | 2004-04-30 | 2005-11-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing |
US7116404B2 (en) * | 2004-06-30 | 2006-10-03 | Asml Netherlands B.V | Lithographic apparatus and device manufacturing method |
US7274029B2 (en) * | 2004-12-28 | 2007-09-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4613098B2 (en) * | 2005-05-30 | 2011-01-12 | 株式会社ブイ・テクノロジー | Exposure equipment |
US7233384B2 (en) * | 2005-06-13 | 2007-06-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method, and device manufactured thereby for calibrating an imaging system with a sensor |
JP2007003829A (en) * | 2005-06-23 | 2007-01-11 | Fujifilm Holdings Corp | Image exposure device |
US7944465B2 (en) * | 2006-01-13 | 2011-05-17 | Zecotek Display Systems Pte. Ltd. | Apparatus and system for reproducing 3-dimensional images |
KR100762396B1 (en) | 2006-05-16 | 2007-10-02 | 엘지전자 주식회사 | Dmd aligning method for maskless exposure apparatus |
US8139199B2 (en) * | 2007-04-02 | 2012-03-20 | Nikon Corporation | Exposure method, exposure apparatus, light converging pattern formation member, mask, and device manufacturing method |
US8363209B2 (en) * | 2007-07-10 | 2013-01-29 | Lg Electronics Inc. | Method and apparatus to adjust misalignment of the maskless exposure apparatus |
KR101347410B1 (en) * | 2007-10-02 | 2014-01-02 | 엘지전자 주식회사 | Maskless exposure apparatus and method |
NL1036331A1 (en) * | 2007-12-27 | 2009-06-30 | Asml Netherlands Bv | Metrology apparatus, lithographic apparatus and method of measuring a property or a substrate. |
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Also Published As
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JP2004296531A (en) | 2004-10-21 |
CN1532577A (en) | 2004-09-29 |
US20060158635A1 (en) | 2006-07-20 |
US7184125B2 (en) | 2007-02-27 |
TW200502708A (en) | 2005-01-16 |
TWI360027B (en) | 2012-03-11 |
US20040189970A1 (en) | 2004-09-30 |
KR20040084744A (en) | 2004-10-06 |
KR101051396B1 (en) | 2011-07-22 |
CN100342261C (en) | 2007-10-10 |
JP4057937B2 (en) | 2008-03-05 |
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