US5544804A - Capillary designs and process for fine pitch ball bonding - Google Patents

Capillary designs and process for fine pitch ball bonding Download PDF

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Publication number
US5544804A
US5544804A US08/255,582 US25558294A US5544804A US 5544804 A US5544804 A US 5544804A US 25558294 A US25558294 A US 25558294A US 5544804 A US5544804 A US 5544804A
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United States
Prior art keywords
bore
capillary
pairs
sectors
bond
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US08/255,582
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English (en)
Inventor
Howard R. Test
Michael R. Vinson
Albert H. Kuckhahn
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Texas Instruments Inc
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Texas Instruments Inc
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Priority to US08/255,582 priority Critical patent/US5544804A/en
Assigned to TEXAS INSTRUMENTS INCORPORATED reassignment TEXAS INSTRUMENTS INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: VINSON, MICHAEL R., KUCKHAHN, ALBERT H., TEST, HOWARD R.
Priority to TW083112353A priority patent/TW322594B/zh
Priority to MYPI95001479A priority patent/MY112624A/en
Priority to SG1995000608A priority patent/SG30400A1/en
Priority to EP95304001A priority patent/EP0686454A1/en
Priority to JP14066995A priority patent/JP3996216B2/ja
Priority to KR1019950015042A priority patent/KR960002769A/ko
Publication of US5544804A publication Critical patent/US5544804A/en
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Priority to US08/865,630 priority patent/US5979743A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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Definitions

  • This invention relates to capillaries and the design thereof for use in conjunction with wire bonding to the bond pads of semiconductor devices and a method of forming the bond.
  • Ball bonding is a widely used technique in semiconductor fabrication to connect the internal semiconductor die to the external leads.
  • a fine gold wire usually about 25 ⁇ m (0.0010 inch) to about 30 ⁇ m (0.0013 inch) is fed down through a ceramic capillary, generally alumina, having an entry aperture at the top and an exit aperture at the opposite end of a bore therein.
  • a ball is formed external to the exit aperture by an electronic flame off (EFO) mechanism that melts a small portion of the wire remaining after the previous bond.
  • EFO electronic flame off
  • the ball is formed at the end of the wire by an electric discharge spark.
  • the capillary is relatively far from the ball (millimeters distant).
  • the wire is restrained from moving by a tensioner until the ball is centered in the chamfer diameter of the capillary and is forced downward by the continued motion of the capillary toward the bond pad on the die.
  • the ball is placed on a bond pad of the semiconductor device being assembled and the capillary end then forces the ball against the pad to provide the bond in conjunction with thermosonic energy.
  • the above described ball bonding step presents a major obstacle to gold wire ball bonding in integrated circuits with the bond pads closer than approximately 100 ⁇ m (0.0039 inch) due to the diameter of the capillary.
  • Current fine-pitch gold ball bonding uses a fine pitch or "bottlenose" capillary that allows finer pitch bonding than is possible with a standard capillary. However, it is not possible to shrink the capillary diameter sufficiently to produce bond pitches below approximately 90 ⁇ m (0.0035 inch) without causing stitch bond strength degradation.
  • the above described problems inherent in prior art capillaries is minimized by taking advantage of the geometry of a typical bond in that the ball bond is placed on a pad along an edge of the die with bond angles between 45° and 90° to the edge of the die.
  • the term "bond angle" is the angle that the wire makes with the edge of the chip after the bond of the wire to the pad is made and the wire is then drawn out through the capillary and bonded to a lead finger.
  • a capillary having reduced width in two of the opposing ones of four sectors relative to a standard capillary is provided.
  • the four sectors can be but need not be quadrants in that one pair of opposing sectors can be larger than the other pair of opposing sectors. This is preferably accomplished by removal of a part of the outer portion of one pair of opposing sectors, yet leaving a sufficiently thick wall in each of those opposing sectors to withstand the pressures to be applied to those walls.
  • the preferred shape of the capillary tip portion is that of a bow tie.
  • a desired property of the capillary tip shape is that the thick sectors of the capillary tip should be shaped to fit at least partially around the ball bond previously formed on an adjacent bond pad and spaced therefrom.
  • Two capillaries are used, one with its major axis parallel (longitudinal orientation) to the ultrasonic energy (Y direction with respect to the leadframe), the other with its major axis perpendicular (transverse orientation) to the ultrasonic energy (X direction with respect to the leadframe).
  • Dual-head bonders such as, for example, the TI ABACUS AIIISR, have an advantage over single head bonders since they can be set up with the longitudinally oriented capillary in one bond head and the transversely oriented capillary in the other bond head. Therefore, with the dual-head bonder, each device can be bonded in a single pass through the bonder.
  • Single headed bonders can use this approach by making a pass with the capillary set in one orientation and then changing the orientation of the capillary on that bonder before making a second pass or, alternatively, by using another bonder to make a second pass with the capillary set at the other orientation.
  • Two single head bonders can be physically linked to automatically transport the leadframe being bonded from the first to the second bonder to eliminate manual handling of the leadframe strips between bonders and producing higher quality, more reliable product.
  • wires with bond angles close to 90° to the edge of the die produce stitch bonds substantially identical to bonds made with standard capillaries. However, as bond angles move toward 45°, the face presented to the wire during stitch bonding appears modified. Degradation in key bond characteristics can be minimal and acceptable for producing high quality, reliable bonds in most applications.
  • This embodiment of the invention is particularly suitable for orthogonal fine pitch bonding, bond angles near 90°.
  • a modification of the capillary from that having flattened opposing sides in the thinned sectors to a bow tie configuration minimizes and possibly eliminates this effect by presenting a uniformly wide bond face and larger outside radius that produces stitch bonds substantially identical to those produced by a standard capillary.
  • the bow tie configuration can produce the smallest ball bond pitch possible.
  • FIG. 1 is a vertical cross-section of the tip portion 1 of a standard prior art capillary with a wire and ball;
  • FIG. 2 is a vertical cross-section as in FIG. 1 after the ball has been bonded to a bond pad;
  • FIG. 3 is a cross-sectional view of the tip portion of a capillary in accordance with a first embodiment of the invention
  • FIG. 4 is a cross-sectional view of the tip portion of a capillary in accordance with a second embodiment of the invention.
  • FIG. 5 is a schematic representation of important capillary positions required to realize the full potential of the capillary design and bond process.
  • FIG. 6 is a diagram showing capillary oriented to avoid contacting a previously formed ball bond while the capillary is making a bond at a pad thereunder.
  • FIG. 1 there is shown a vertical cross-section of the tip portion 1 of a standard prior art capillary which is generally circular in horizontal cross-section and has a central bore 3.
  • a gold wire 5 is disposed in the bore and has formed into a ball 7 which is disposed in a chamfer at the bottom portion of the bore 3.
  • a bond is made as shown in FIG. 2 by lowering the ball 7 of FIG. 1 against the pad 9 of the die 11 and applying an ultrasonic pulse and pressure from the capillary tip impinging on the ball to cause the ball to be flattened against and bond to the die pad.
  • the capillary is then lifted away from the die pad and travels to the next wire bonding position.
  • the capillary dimensions can be such to cause the capillary to interfere with the bonds on an adjacent bond pad.
  • FIG. 3 wherein the horizontal cross-section of the capillary tip is altered so that an opposing pair of sectors 21 and 23, assuming four sectors, is flattened while the same dimension as provided in the prior art capillaries is retained in the unflattened direction. Accordingly, the dimensions between walls 21 and 23 is much smaller than the dimension of a diameter between circular portions 25 and 27.
  • FIG. 4 there is shown a bow-tie configuration wherein the wall 31 and 33 of the portion of the opposing pair of sectors that has been removed is somewhat circular in nature.
  • the geometry of the walls 31 and 33 can be of any shape, it merely being necessary that the walls 35 and 37 be capable of fitting at least partially around and spaced from a previously bonded ball on an adjacent bond pad. The degree of such fit required will depend upon the dimensions of the capillary and the distance between bond pads.
  • the second embodiment of the invention is shown in typical bonding positions in FIG. 5.
  • the positions A, B and C show the capillary in the longitudinal orientation while positions D and E show the capillary in the transverse orientation.
  • the capillary places ball bonds 48 on bond pads 46 and 47 which are located on the surface of the silicon die 49. Bond wires 50 are shown running between bond pads 48 and package leads (not shown).
  • a ball bond is placed on the bond pad in capillary position A.
  • the capillary is moved by the bond head of the bonder to a position similar to and adjacent to capillary position B, where a stitch bond is made to a package lead.
  • Capillary position B represents a case where the bond angle is close to 90 degrees with respect to the edge of die 49. In this case, both embodiments of this invention produce high quality ball and stitch bonds.
  • Capillary position C represents a case where the bond angle is close to 45 degrees. In this case, the second embodiment of this invention, the bow tie configuration, produces superior stitch bonds with respect to the first embodiment of the invention.
  • Capillary position D represents a case where the ball bond is made on a side of the die 49, perpendicular to ball bonds placed by the capillary in position A.
  • Capillary position E represents a stitch bond along the side of the die 49 perpendicular to the stitch bonds made in capillary positions B and C. It is the intention that this bonding process continue along each edge of the die 49 until all bonds are completed. All bonds along the side represented by capillary position A and the side opposite this side are accomplished by the capillary oriented as in position A. Likewise, all bonds along the side represented by capillary position D and the side opposite this side are accomplished by the capillary oriented as in position D.
  • FIG. 6 there is shown how a capillary 51 is oriented to avoid contacting a previously formed ball bond 53 while the capillary 51 is making a bond at a pad thereunder.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
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US08/255,582 1994-06-08 1994-06-08 Capillary designs and process for fine pitch ball bonding Expired - Lifetime US5544804A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
US08/255,582 US5544804A (en) 1994-06-08 1994-06-08 Capillary designs and process for fine pitch ball bonding
TW083112353A TW322594B (enrdf_load_stackoverflow) 1994-06-08 1994-12-30
MYPI95001479A MY112624A (en) 1994-06-08 1995-06-06 Improved capillary designs and process for fine pitch ball bonding
EP95304001A EP0686454A1 (en) 1994-06-08 1995-06-07 Capillary and method of bonding
SG1995000608A SG30400A1 (en) 1994-06-08 1995-06-07 Improved capillary designs and process for fine pitch ball bonding
JP14066995A JP3996216B2 (ja) 1994-06-08 1995-06-07 改良されたキャピラリおよび細かいピッチのボールボンディング法
KR1019950015042A KR960002769A (ko) 1994-06-08 1995-06-08 미세 피치 볼 본딩용 개선된 모세관 구조 설계 및 처리 방법
US08/865,630 US5979743A (en) 1994-06-08 1997-05-29 Method for making an IC device using a single-headed bonder

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US08/255,582 US5544804A (en) 1994-06-08 1994-06-08 Capillary designs and process for fine pitch ball bonding

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EP (1) EP0686454A1 (enrdf_load_stackoverflow)
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KR (1) KR960002769A (enrdf_load_stackoverflow)
MY (1) MY112624A (enrdf_load_stackoverflow)
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Cited By (33)

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US5927587A (en) * 1996-12-19 1999-07-27 Texas Instruments Incorporated Capillary holder for wire bonding capillary
US5934543A (en) * 1997-12-16 1999-08-10 Texas Instuments Incorporated Wire bonding capillary having alignment features
US5938105A (en) * 1997-01-15 1999-08-17 National Semiconductor Corporation Encapsulated ball bonding apparatus and method
US5944249A (en) * 1996-12-12 1999-08-31 Texas Instruments Incorporated Wire bonding capillary with bracing component
US5954260A (en) * 1996-12-17 1999-09-21 Texas Instruments Incorporated Fine pitch bonding technique
US5979743A (en) * 1994-06-08 1999-11-09 Texas Instruments Incorporated Method for making an IC device using a single-headed bonder
US5996877A (en) * 1996-12-19 1999-12-07 Texas Instruments Incorporated Stepwise autorotation of wire bonding capillary
US6006977A (en) * 1996-12-19 1999-12-28 Texas Instruments Incorporated Wire bonding capillary alignment display system
US6065663A (en) * 1997-12-18 2000-05-23 Texas Instruments Incorporated Alignment apparatus for wire bonding capillary
US6065667A (en) * 1997-01-15 2000-05-23 National Semiconductor Corporation Method and apparatus for fine pitch wire bonding
US6080651A (en) * 1997-03-17 2000-06-27 Kabushiki Kaisha Shinkawa Wire bonding method
US6089443A (en) * 1998-10-26 2000-07-18 Texas Instruments Incorporated Balancing of x and y axis bonding by 45 degree capillary positioning
US6112972A (en) * 1996-12-19 2000-09-05 Texas Instruments Incorporated Wire bonding with capillary realignment
US6112973A (en) * 1997-10-31 2000-09-05 Texas Instruments Incorporated Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe
US6155474A (en) * 1997-12-16 2000-12-05 Texas Instruments Incorporated Fine pitch bonding technique
US6158647A (en) * 1998-09-29 2000-12-12 Micron Technology, Inc. Concave face wire bond capillary
US6180891B1 (en) * 1997-02-26 2001-01-30 International Business Machines Corporation Control of size and heat affected zone for fine pitch wire bonding
US6354479B1 (en) * 1999-02-25 2002-03-12 Sjm Technologies Dissipative ceramic bonding tip
US6563226B2 (en) 2001-05-23 2003-05-13 Motorola, Inc. Bonding pad
US6651864B2 (en) 1999-02-25 2003-11-25 Steven Frederick Reiber Dissipative ceramic bonding tool tip
US20050109814A1 (en) * 1999-02-25 2005-05-26 Reiber Steven F. Bonding tool with resistance
US20050218188A1 (en) * 2004-04-02 2005-10-06 Chippac, Inc. Wire bond capillary Tip
US20050242155A1 (en) * 1999-02-25 2005-11-03 Reiber Steven F Flip chip bonding tool and ball placement capillary
US20060071050A1 (en) * 1999-02-25 2006-04-06 Reiber Steven F Multi-head tab bonding tool
US20060261132A1 (en) * 1999-02-25 2006-11-23 Reiber Steven F Low range bonding tool
US20070085085A1 (en) * 2005-08-08 2007-04-19 Reiber Steven F Dissipative pick and place tools for light wire and LED displays
US20070131661A1 (en) * 1999-02-25 2007-06-14 Reiber Steven F Solder ball placement system
US7389905B2 (en) 1999-02-25 2008-06-24 Reiber Steven F Flip chip bonding tool tip
US20080197172A1 (en) * 1999-02-25 2008-08-21 Reiber Steven F Bonding Tool
US20090091006A1 (en) * 2007-10-04 2009-04-09 Rex Warren Pirkle Dual Capillary IC Wirebonding
US20100009499A1 (en) * 2002-04-22 2010-01-14 Gann Keith D Stacked microelectronic layer and module with three-axis channel t-connects
US20110045635A1 (en) * 2002-04-22 2011-02-24 Keith Gann Vertically stacked pre-packaged integrated circuit chips
US8242613B2 (en) 2010-09-01 2012-08-14 Freescale Semiconductor, Inc. Bond pad for semiconductor die

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Cited By (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5979743A (en) * 1994-06-08 1999-11-09 Texas Instruments Incorporated Method for making an IC device using a single-headed bonder
US5944249A (en) * 1996-12-12 1999-08-31 Texas Instruments Incorporated Wire bonding capillary with bracing component
US5954260A (en) * 1996-12-17 1999-09-21 Texas Instruments Incorporated Fine pitch bonding technique
US6112972A (en) * 1996-12-19 2000-09-05 Texas Instruments Incorporated Wire bonding with capillary realignment
US5927587A (en) * 1996-12-19 1999-07-27 Texas Instruments Incorporated Capillary holder for wire bonding capillary
US5996877A (en) * 1996-12-19 1999-12-07 Texas Instruments Incorporated Stepwise autorotation of wire bonding capillary
US6006977A (en) * 1996-12-19 1999-12-28 Texas Instruments Incorporated Wire bonding capillary alignment display system
US6065667A (en) * 1997-01-15 2000-05-23 National Semiconductor Corporation Method and apparatus for fine pitch wire bonding
US5938105A (en) * 1997-01-15 1999-08-17 National Semiconductor Corporation Encapsulated ball bonding apparatus and method
US6180891B1 (en) * 1997-02-26 2001-01-30 International Business Machines Corporation Control of size and heat affected zone for fine pitch wire bonding
US6080651A (en) * 1997-03-17 2000-06-27 Kabushiki Kaisha Shinkawa Wire bonding method
US6112973A (en) * 1997-10-31 2000-09-05 Texas Instruments Incorporated Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe
US6182882B1 (en) * 1997-10-31 2001-02-06 Texas Instruments Incorporated Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe
US6155474A (en) * 1997-12-16 2000-12-05 Texas Instruments Incorporated Fine pitch bonding technique
US5934543A (en) * 1997-12-16 1999-08-10 Texas Instuments Incorporated Wire bonding capillary having alignment features
US6065663A (en) * 1997-12-18 2000-05-23 Texas Instruments Incorporated Alignment apparatus for wire bonding capillary
US6966480B2 (en) 1998-09-29 2005-11-22 Micron Technology, Inc. Concave face wire bond capillary and method
US6311890B1 (en) * 1998-09-29 2001-11-06 Micron Technology, Inc. Concave face wire bond capillary
US7677429B2 (en) 1998-09-29 2010-03-16 Micron Technology, Inc. Concave face wire bond capillary and method
US6439450B1 (en) 1998-09-29 2002-08-27 Micron Technology, Inc. Concave face wire bond capillary
US20080302862A1 (en) * 1998-09-29 2008-12-11 Micron Technology, Inc. Concave face wire bond capillary and method
US6595406B2 (en) 1998-09-29 2003-07-22 Micron Technology, Inc. Concave face wire bond capillary and method
US6158647A (en) * 1998-09-29 2000-12-12 Micron Technology, Inc. Concave face wire bond capillary
US7416107B2 (en) 1998-09-29 2008-08-26 Micron Technology, Inc. Concave face wire bond capillary and method
US20040056072A1 (en) * 1998-09-29 2004-03-25 Chapman Gregory M. Concave face wire bond capillary and method
US20060032888A1 (en) * 1998-09-29 2006-02-16 Chapman Gregory M Concave face wire bond capillary and method
US6089443A (en) * 1998-10-26 2000-07-18 Texas Instruments Incorporated Balancing of x and y axis bonding by 45 degree capillary positioning
US6651864B2 (en) 1999-02-25 2003-11-25 Steven Frederick Reiber Dissipative ceramic bonding tool tip
US7389905B2 (en) 1999-02-25 2008-06-24 Reiber Steven F Flip chip bonding tool tip
US20050242155A1 (en) * 1999-02-25 2005-11-03 Reiber Steven F Flip chip bonding tool and ball placement capillary
US6935548B2 (en) 1999-02-25 2005-08-30 Steven-Frederick Reiber Dissipative ceramic bonding tool tip
US20050109814A1 (en) * 1999-02-25 2005-05-26 Reiber Steven F. Bonding tool with resistance
US20060071050A1 (en) * 1999-02-25 2006-04-06 Reiber Steven F Multi-head tab bonding tool
US7032802B2 (en) 1999-02-25 2006-04-25 Reiber Steven F Bonding tool with resistance
US7124927B2 (en) 1999-02-25 2006-10-24 Reiber Steven F Flip chip bonding tool and ball placement capillary
US20060261132A1 (en) * 1999-02-25 2006-11-23 Reiber Steven F Low range bonding tool
US6354479B1 (en) * 1999-02-25 2002-03-12 Sjm Technologies Dissipative ceramic bonding tip
US20070131661A1 (en) * 1999-02-25 2007-06-14 Reiber Steven F Solder ball placement system
US20040046007A1 (en) * 1999-02-25 2004-03-11 Steven-Frederick Reiber Dissipative ceramic bonding tool tip
US20080197172A1 (en) * 1999-02-25 2008-08-21 Reiber Steven F Bonding Tool
US6563226B2 (en) 2001-05-23 2003-05-13 Motorola, Inc. Bonding pad
US20100009499A1 (en) * 2002-04-22 2010-01-14 Gann Keith D Stacked microelectronic layer and module with three-axis channel t-connects
US20110045635A1 (en) * 2002-04-22 2011-02-24 Keith Gann Vertically stacked pre-packaged integrated circuit chips
US8012803B2 (en) 2002-04-22 2011-09-06 Aprolase Development Co., Llc Vertically stacked pre-packaged integrated circuit chips
US7407080B2 (en) * 2004-04-02 2008-08-05 Chippac, Inc. Wire bond capillary tip
US20050218188A1 (en) * 2004-04-02 2005-10-06 Chippac, Inc. Wire bond capillary Tip
US20070085085A1 (en) * 2005-08-08 2007-04-19 Reiber Steven F Dissipative pick and place tools for light wire and LED displays
US20090091006A1 (en) * 2007-10-04 2009-04-09 Rex Warren Pirkle Dual Capillary IC Wirebonding
US8008183B2 (en) * 2007-10-04 2011-08-30 Texas Instruments Incorporated Dual capillary IC wirebonding
US8225982B2 (en) 2007-10-04 2012-07-24 Texas Instruments Incorporated Dual capillary IC wirebonding
US8242613B2 (en) 2010-09-01 2012-08-14 Freescale Semiconductor, Inc. Bond pad for semiconductor die

Also Published As

Publication number Publication date
MY112624A (en) 2001-07-31
JPH07335688A (ja) 1995-12-22
TW322594B (enrdf_load_stackoverflow) 1997-12-11
KR960002769A (ko) 1996-01-26
EP0686454A1 (en) 1995-12-13
JP3996216B2 (ja) 2007-10-24

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