US4899211A - Semiconductor cooling mechanisms - Google Patents

Semiconductor cooling mechanisms Download PDF

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Publication number
US4899211A
US4899211A US07/002,460 US246087A US4899211A US 4899211 A US4899211 A US 4899211A US 246087 A US246087 A US 246087A US 4899211 A US4899211 A US 4899211A
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United States
Prior art keywords
evaporator
power semiconductor
condenser tube
fluid
electrically insulating
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US07/002,460
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English (en)
Inventor
Jean-Loup Dumoulin
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Jeumont Schneider SA
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Jeumont Schneider SA
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Publication date
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Assigned to JEUMONT SCHNEIDER reassignment JEUMONT SCHNEIDER ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: DUMOULIN, JEAN-LOUP
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Publication of US4899211A publication Critical patent/US4899211A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention concerns devices for cooling of high power semiconductors, particularly thyristors, diodes and transistors.
  • One solution consists of placing directly upon at least one face of the package of the semiconductor a metallic radiator, for example of copper or aluminun, cooled by air or water.
  • the circulating water subjected to electric fields, must be very pure, and must remain so. Because the quality of the water degrages rather rapidly, monitoring and regenerating mechanisms are necessary to maintain suitable resistivity of the water. These mechanisms are burdensome, all the more the higher the voltage applied.
  • the present invention has as its goal to alleviate these drawbacks.
  • a mechanism is proposed which positively ensures the extraction of heat from power semiconductors and its removal to the exterior, which presents the following advantages:
  • this apparatus requires neither a filter nor a regenerator system for the cooling fluid, nor an air conditioning mechanism. Finally, this mechanism is noiseless.
  • the present invention thus has as its object an improved cooling mechanism for power semiconductors.
  • FIG. 1 represents an examplary embodime of the invention, in overview, and in section along the line A--A.
  • FIG. 2 represents a second embodiment of the invention.
  • FIG. 3 represents yet another embodiment of the invention.
  • the cooling mechanism consists essentially of a metallic evaporator 1, a condenser 5 constituted by a tube of insulating material, a conduit 7, also of insulating material, and formed, for example, together with the tube 5 as a single piece, and a section 14 connecting the condenser and the evaporator.
  • the evaporator 1 is adapted to the form of the package of a semiconductor 2, so as to be able to be placed in contact with one face of the package. It can be made of copper.
  • the condenser is preferably made of a ceramic with an aluminum base, which is an excellent electrical insulator and a relatively good thermal conductor.
  • this type of ceramic lends itself readily to applications of hermetic ceramic-metal connection.
  • the condenser tube is hermetically sealed in its upper portion by an insulating plug 6.
  • Its internal wall includes a capillary structure, in particular a latticed wick, which can be metallic.
  • the assembly constituted by the condenser 5 and the conduit 7 is attached to the upper part of the evaporator by the section 14, made preferably of copper. It enables differences of expansion between the insulation and the metal to be taken up.
  • the evaporator 1 is filled with a heat-carrying fluid, and its internal wall is designed so as to present a large exchange surface with the fluid. It presents a cross section of metal capable of conducting the maximum electric current delivered by the semiconductor, and, at its center, has a rigid core 3 which bears the forces of attachment to the semiconductors.
  • the conduit 7 is an extension of the tube 5, for example of greater thickness, so as to provide mechanical reinforcement of the tube.
  • a tube with the same axis as the tube 5, and of greater diameter, constituting an envelope 8 enclosing the tube 5, is attached to the upper portion of the conduit 7, for example by the means of a section 10 solidly attached to the envelope, and attached to a piece 9 brazed to the conduit, with a joint 13 being installed between these two parts.
  • the envelope 8 can be removed easily for cleaning of the external surface of the condensoer.
  • a chamber 11 is thus created between the tube 5 and its envelope 8.
  • Two fluted nipples 12a and 12b are installed in the evelope 8, and enable the chamber 11 to be connected to an industrial water supply.
  • the outer wall of the condenser is thus cooled by the circulation of water within the chamber 11.
  • the operation of the cooling mechanism according to the invention is as follows.
  • the heat released by the semiconductor 2 is transmitted by conductance to the evaporator 1.
  • the heat-carrying fluid which it contains evaporates easily.
  • the vapor passes through the conduit 7 without substantial change in temperature, and reaches the condenser, where it cools and condenses on the interior wall.
  • the capillary pressure of the condensates increases.
  • the heat-carrying fluid is preferably water. It is not necessary for it to have a good dielectric characteristic, since, although it is in direct contact with the evaporator under voltage, it is insulated from the external cooling water by the insulating wall of the condenser.
  • the evaporator 1 is designed to be connected to two condenser tubes 5a, 5b.
  • the constituent elements are in FIG. 2 labelled in the same manner as in FIG. 1, but are given an index a or b, according to whether they reltae to one condenser or the other.
  • This arrangement multiplies the number of pieces and insulator to metal connections, but it presents the advantage of substantially reducing the height of the cooling system, while preserving exchange surfaces identical to those of the basic embodiment.
  • FIG. 3 represents yet another embodiment of the invention, the hermetic ceramic housing of the semiconductor 2 is eliminated.
  • Two cooling mechanisms are provided, and their evaporators 1a, 1b are provided with bosses 20a, 20b which serve as electrodes for the semiconductor, and which are placed directly in contact with the semiconductor chip 16.
  • the bosses 20a, 20b enable mounting of an insulating piece 17 for centering the bosses on the two faces of the chip 16 by engagement with the chip and boss peripheries, as shown.
  • a trigger channel 18 is provided, through which the trigger wire passes to the outside.
  • the assembly constituted by the two evaporators 1a, 1b and the semiconductor chip 16 is placed within a casing of metallic or insulating material, and can then be immersed in a silicone gel which has the property of retaining good elasticity upon hardening. This gel ensures electrical insulation of the two faces of the chip.
  • this embodiment permits a gain of about 22% in energy drawn from the semiconductor relative to the basic embodiment.
  • the condenser tube 5 of insulating material is replaced by a metallic tube, preferably of copper, with optimum thermic conductance.
  • the capillary structure of the condenser tube in this case can be constituted by a fine longitudinal grooving of the internal surface of the conductive tube.
  • the tube 5 is then connected to the evaporator through the intermediary of the insulating conduit 7, and the section 14 enabling differences in expansion to be taken up.
  • the parts attaching the external envelope 8 of the tube 5 on the conduit 7 are identical to those described in the basic embodiment, except for the part 9, which in this case is brazed both to the insulating conduit 7 and the condenser tube 5.
  • this variation enables a gain of about 19% in energy drawn from the semiconductor, relative to the basic embodiment.
  • the dielectric characteristic is lower because of the internal fluid, which reduces the applicable voltage.
  • the lifespan is also linked to the alteration of the dielectric characteristic of the fluid with time. It can be long, howeve, because the fluid is under vacuum, and in contact only with two completely degassed materials.
  • the evaporator can be extended by an electrical connection flange, with the evaporator and flange constituted by a single metallic piece, resulting in a reduction in the number of pieces and electrical contacts.
  • the casing can include other electrical components, also surrounded by the silicone gel.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
US07/002,460 1986-01-16 1987-01-12 Semiconductor cooling mechanisms Expired - Lifetime US4899211A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8600544 1986-01-16
FR8600544A FR2592988B1 (fr) 1986-01-16 1986-01-16 Dispositifs de refroidissement de semi-conducteurs

Publications (1)

Publication Number Publication Date
US4899211A true US4899211A (en) 1990-02-06

Family

ID=9331163

Family Applications (1)

Application Number Title Priority Date Filing Date
US07/002,460 Expired - Lifetime US4899211A (en) 1986-01-16 1987-01-12 Semiconductor cooling mechanisms

Country Status (6)

Country Link
US (1) US4899211A (fr)
EP (1) EP0233103B1 (fr)
AT (1) ATE56309T1 (fr)
DE (1) DE3764654D1 (fr)
ES (1) ES2017502B3 (fr)
FR (1) FR2592988B1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property
US5283464A (en) * 1989-06-08 1994-02-01 The Furukawa Electric Co., Ltd. Electrically insulated heat pipe type cooling apparatus for semiconductor
US5420753A (en) * 1992-11-09 1995-05-30 Nec Corporation Structure for cooling an integrated circuit
US5832989A (en) * 1996-03-14 1998-11-10 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US6757168B2 (en) * 2001-06-13 2004-06-29 Fujikura Ltd. Cooling device for electronic unit
US20090166855A1 (en) * 2007-12-31 2009-07-02 Chia-Pin Chiu Cooling solutions for die-down integrated circuit packages

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5714372A (en) * 1985-04-22 1998-02-03 Genentech, Inc. Tissue plasminogen activator variants
DE3905875A1 (de) * 1989-02-25 1990-08-30 Licentia Gmbh Anordnung zur kuehlung von leistungshalbleitern ueber waermerohre
US5195577A (en) * 1989-10-26 1993-03-23 Mitsubishi Denki Kabushiki Kaisha Cooling device for power semiconductor switching elements
DE102005062590A1 (de) * 2005-12-27 2007-06-28 Robert Bosch Gmbh Schaltungsanordnung mit einer Wärmetransfereinrichtung
EP3856071B1 (fr) 2018-09-26 2022-10-05 KaVo Dental GmbH Pièce à main dentaire ou chirurgicale dotée d'un transpondeur rfid

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3792318A (en) * 1972-02-01 1974-02-12 Siemens Ag Cooling apparatus for flat semiconductors using one or more heat pipes
US4036291A (en) * 1974-03-16 1977-07-19 Mitsubishi Denki Kabushiki Kaisha Cooling device for electric device
US4126883A (en) * 1976-03-19 1978-11-21 Siemens Aktiengesellschaft Pressure-mounted semiconductive structure
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
JPS5679458A (en) * 1979-11-30 1981-06-30 Mitsubishi Electric Corp Semiconductor device
JPS56115549A (en) * 1980-02-18 1981-09-10 Mitsubishi Electric Corp Semiconductor device
JPS56122150A (en) * 1980-02-28 1981-09-25 Mitsubishi Electric Corp Semiconductor device
US4561040A (en) * 1984-07-12 1985-12-24 Ibm Corporation Cooling system for VLSI circuit chips
US4574877A (en) * 1983-03-03 1986-03-11 Brown, Boveri & Cie Ag Can-type evaporative cooling device for power semiconductor elements

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3302840C2 (de) * 1983-01-28 1985-06-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Einrichtung zur Wärmeabführung von energieelektronischen Bauelementen

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3792318A (en) * 1972-02-01 1974-02-12 Siemens Ag Cooling apparatus for flat semiconductors using one or more heat pipes
US4036291A (en) * 1974-03-16 1977-07-19 Mitsubishi Denki Kabushiki Kaisha Cooling device for electric device
US4126883A (en) * 1976-03-19 1978-11-21 Siemens Aktiengesellschaft Pressure-mounted semiconductive structure
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
JPS5679458A (en) * 1979-11-30 1981-06-30 Mitsubishi Electric Corp Semiconductor device
JPS56115549A (en) * 1980-02-18 1981-09-10 Mitsubishi Electric Corp Semiconductor device
JPS56122150A (en) * 1980-02-28 1981-09-25 Mitsubishi Electric Corp Semiconductor device
US4574877A (en) * 1983-03-03 1986-03-11 Brown, Boveri & Cie Ag Can-type evaporative cooling device for power semiconductor elements
US4561040A (en) * 1984-07-12 1985-12-24 Ibm Corporation Cooling system for VLSI circuit chips

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"Cooling Device for Multilayer Ceramic Modules", B. T. Clark et al., IBM Technical Disclosure Bulletin, vol. 20, No. 5, Oct. 1977, pp. 1769-1771.
Cooling Device for Multilayer Ceramic Modules , B. T. Clark et al., IBM Technical Disclosure Bulletin, vol. 20, No. 5, Oct. 1977, pp. 1769 1771. *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5283464A (en) * 1989-06-08 1994-02-01 The Furukawa Electric Co., Ltd. Electrically insulated heat pipe type cooling apparatus for semiconductor
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property
US5420753A (en) * 1992-11-09 1995-05-30 Nec Corporation Structure for cooling an integrated circuit
US5832989A (en) * 1996-03-14 1998-11-10 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US6757168B2 (en) * 2001-06-13 2004-06-29 Fujikura Ltd. Cooling device for electronic unit
US20040150951A1 (en) * 2001-06-13 2004-08-05 Fujikura Ltd. Cooling device for electronic unit
US6876548B2 (en) 2001-06-13 2005-04-05 Fujikura Ltd. Cooling device for electronic unit
US20090166855A1 (en) * 2007-12-31 2009-07-02 Chia-Pin Chiu Cooling solutions for die-down integrated circuit packages
US7755186B2 (en) * 2007-12-31 2010-07-13 Intel Corporation Cooling solutions for die-down integrated circuit packages

Also Published As

Publication number Publication date
DE3764654D1 (de) 1990-10-11
ATE56309T1 (de) 1990-09-15
FR2592988A1 (fr) 1987-07-17
EP0233103A1 (fr) 1987-08-19
EP0233103B1 (fr) 1990-09-05
ES2017502B3 (es) 1991-02-16
FR2592988B1 (fr) 1988-03-18

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