ES2017502B3 - Enfriado de semiconductores. - Google Patents

Enfriado de semiconductores.

Info

Publication number
ES2017502B3
ES2017502B3 ES87400093T ES87400093T ES2017502B3 ES 2017502 B3 ES2017502 B3 ES 2017502B3 ES 87400093 T ES87400093 T ES 87400093T ES 87400093 T ES87400093 T ES 87400093T ES 2017502 B3 ES2017502 B3 ES 2017502B3
Authority
ES
Spain
Prior art keywords
conduit
evaporator
condenser
semiconductor cooling
tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES87400093T
Other languages
English (en)
Inventor
Jean Loup Dumoulin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jeumont Schneider SA
Original Assignee
Jeumont Schneider SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jeumont Schneider SA filed Critical Jeumont Schneider SA
Application granted granted Critical
Publication of ES2017502B3 publication Critical patent/ES2017502B3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
ES87400093T 1986-01-16 1987-01-16 Enfriado de semiconductores. Expired - Lifetime ES2017502B3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8600544A FR2592988B1 (fr) 1986-01-16 1986-01-16 Dispositifs de refroidissement de semi-conducteurs

Publications (1)

Publication Number Publication Date
ES2017502B3 true ES2017502B3 (es) 1991-02-16

Family

ID=9331163

Family Applications (1)

Application Number Title Priority Date Filing Date
ES87400093T Expired - Lifetime ES2017502B3 (es) 1986-01-16 1987-01-16 Enfriado de semiconductores.

Country Status (6)

Country Link
US (1) US4899211A (es)
EP (1) EP0233103B1 (es)
AT (1) ATE56309T1 (es)
DE (1) DE3764654D1 (es)
ES (1) ES2017502B3 (es)
FR (1) FR2592988B1 (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5714372A (en) * 1985-04-22 1998-02-03 Genentech, Inc. Tissue plasminogen activator variants
DE3905875A1 (de) * 1989-02-25 1990-08-30 Licentia Gmbh Anordnung zur kuehlung von leistungshalbleitern ueber waermerohre
US5283464A (en) * 1989-06-08 1994-02-01 The Furukawa Electric Co., Ltd. Electrically insulated heat pipe type cooling apparatus for semiconductor
AU617957B2 (en) * 1989-10-26 1991-12-05 Mitsubishi Denki Kabushiki Kaisha Boiling and condensing heat transfer type cooler device for power semiconductor switching elements
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property
CA2102662C (en) * 1992-11-09 1997-10-07 Shinya Akamatsu Structure for cooling an integrated circuit
FR2746177B1 (fr) * 1996-03-14 2000-04-07 Dispositif de refroidissement utilisant un refrigerant en ebullition et se condensant
DE60224903T2 (de) * 2001-06-13 2009-02-05 Fujikura Ltd. Einrichtung zur Kühlung einer elektronischen Anlage
DE102005062590A1 (de) * 2005-12-27 2007-06-28 Robert Bosch Gmbh Schaltungsanordnung mit einer Wärmetransfereinrichtung
US7755186B2 (en) * 2007-12-31 2010-07-13 Intel Corporation Cooling solutions for die-down integrated circuit packages
JP7341226B2 (ja) 2018-09-26 2023-09-08 カボ デンタル ゲゼルシャフト ミット ベシュレンクテル ハフツング Ｒｆｉｄトランスポンダ付きの歯科又は外科用ハンドピース

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4887779A (es) * 1972-02-01 1973-11-17
JPS5241149B2 (es) * 1974-03-16 1977-10-17
DE2611749C3 (de) * 1976-03-19 1980-11-13 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiteranordnung mit einem über Spannbolzen durch Druck kontaktierbaren Halbleiterbauelement
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
JPS5679458A (en) * 1979-11-30 1981-06-30 Mitsubishi Electric Corp Semiconductor device
JPS56115549A (en) * 1980-02-18 1981-09-10 Mitsubishi Electric Corp Semiconductor device
JPS56122150A (en) * 1980-02-28 1981-09-25 Mitsubishi Electric Corp Semiconductor device
DE3302840C2 (de) * 1983-01-28 1985-06-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Einrichtung zur Wärmeabführung von energieelektronischen Bauelementen
DE3307703A1 (de) * 1983-03-04 1984-09-06 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Dosen-siedekuehleinrichtung fuer leistungshalbleiterelemente
US4561040A (en) * 1984-07-12 1985-12-24 Ibm Corporation Cooling system for VLSI circuit chips

Also Published As

Publication number Publication date
FR2592988A1 (fr) 1987-07-17
EP0233103A1 (fr) 1987-08-19
FR2592988B1 (fr) 1988-03-18
DE3764654D1 (de) 1990-10-11
EP0233103B1 (fr) 1990-09-05
US4899211A (en) 1990-02-06
ATE56309T1 (de) 1990-09-15

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