US4304818A - Insulation system for winding of electric rotating machines and process of production thereof - Google Patents
Insulation system for winding of electric rotating machines and process of production thereof Download PDFInfo
- Publication number
- US4304818A US4304818A US06/103,571 US10357179A US4304818A US 4304818 A US4304818 A US 4304818A US 10357179 A US10357179 A US 10357179A US 4304818 A US4304818 A US 4304818A
- Authority
- US
- United States
- Prior art keywords
- polyisocyanate
- polyepoxide
- residue
- winding
- catalyst
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004804 winding Methods 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims description 31
- 230000008569 process Effects 0.000 title claims description 25
- 238000009413 insulation Methods 0.000 title abstract description 14
- 238000004519 manufacturing process Methods 0.000 title description 5
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 44
- 239000002966 varnish Substances 0.000 claims abstract description 42
- 239000003054 catalyst Substances 0.000 claims abstract description 41
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 35
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 35
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 33
- WDGCBNTXZHJTHJ-UHFFFAOYSA-N 2h-1,3-oxazol-2-id-4-one Chemical group O=C1CO[C-]=N1 WDGCBNTXZHJTHJ-UHFFFAOYSA-N 0.000 claims abstract description 27
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000004020 conductor Substances 0.000 claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 150000001875 compounds Chemical class 0.000 claims abstract description 11
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 7
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 claims description 21
- 239000011810 insulating material Substances 0.000 claims description 12
- 238000005470 impregnation Methods 0.000 claims description 11
- 239000004962 Polyamide-imide Substances 0.000 claims description 7
- 239000004760 aramid Substances 0.000 claims description 7
- 229920003235 aromatic polyamide Polymers 0.000 claims description 7
- 229920002312 polyamide-imide Polymers 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 6
- 238000005829 trimerization reaction Methods 0.000 claims description 6
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- 150000002460 imidazoles Chemical class 0.000 claims description 4
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 claims description 3
- MCMFEZDRQOJKMN-UHFFFAOYSA-N 1-butylimidazole Chemical compound CCCCN1C=CN=C1 MCMFEZDRQOJKMN-UHFFFAOYSA-N 0.000 claims description 3
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 claims description 3
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 claims description 3
- SIQHSJOKAUDDLN-UHFFFAOYSA-N 2-methyl-1-propylimidazole Chemical compound CCCN1C=CN=C1C SIQHSJOKAUDDLN-UHFFFAOYSA-N 0.000 claims description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 3
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 claims description 3
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 claims description 3
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 claims description 3
- WXVKGHVDWWXBJX-UHFFFAOYSA-N 3-morpholin-4-ylpropanenitrile Chemical compound N#CCCN1CCOCC1 WXVKGHVDWWXBJX-UHFFFAOYSA-N 0.000 claims description 3
- ZRQUNTRHHLHXRX-UHFFFAOYSA-N 4-(4-morpholin-4-ylbutyl)morpholine Chemical compound C1COCCN1CCCCN1CCOCC1 ZRQUNTRHHLHXRX-UHFFFAOYSA-N 0.000 claims description 3
- CCKWMUGWAKTDIV-UHFFFAOYSA-N 4-(6-morpholin-4-ylhexyl)morpholine Chemical compound C1COCCN1CCCCCCN1CCOCC1 CCKWMUGWAKTDIV-UHFFFAOYSA-N 0.000 claims description 3
- ZRIILUSQBDFVNY-UHFFFAOYSA-N 4-dodecylmorpholine Chemical compound CCCCCCCCCCCCN1CCOCC1 ZRIILUSQBDFVNY-UHFFFAOYSA-N 0.000 claims description 3
- HVCNXQOWACZAFN-UHFFFAOYSA-N 4-ethylmorpholine Chemical compound CCN1CCOCC1 HVCNXQOWACZAFN-UHFFFAOYSA-N 0.000 claims description 3
- RIAHASMJDOMQER-UHFFFAOYSA-N 5-ethyl-2-methyl-1h-imidazole Chemical compound CCC1=CN=C(C)N1 RIAHASMJDOMQER-UHFFFAOYSA-N 0.000 claims description 3
- 238000004132 cross linking Methods 0.000 claims description 3
- 150000002780 morpholines Chemical class 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 6
- 101150108015 STR6 gene Proteins 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 abstract description 13
- 230000008646 thermal stress Effects 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 description 16
- 239000012948 isocyanate Substances 0.000 description 11
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 10
- 239000004744 fabric Substances 0.000 description 10
- 150000002513 isocyanates Chemical class 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 8
- 239000007858 starting material Substances 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000004952 Polyamide Substances 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 150000002118 epoxides Chemical class 0.000 description 6
- -1 for example Chemical class 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 6
- 229920002647 polyamide Polymers 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 230000009102 absorption Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 5
- 229920000784 Nomex Polymers 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 238000002329 infrared spectrum Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004763 nomex Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 2
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- RXUVWJWQFPJWOV-OWOJBTEDSA-N (e)-1,2-diisocyanatoethene Chemical compound O=C=N\C=C\N=C=O RXUVWJWQFPJWOV-OWOJBTEDSA-N 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- 239000005967 1,4-Dimethylnaphthalene Substances 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- ICLCCFKUSALICQ-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanato-3-methylphenyl)-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(C=2C=C(C)C(N=C=O)=CC=2)=C1 ICLCCFKUSALICQ-UHFFFAOYSA-N 0.000 description 1
- BPHYZRNTQNPLFI-UHFFFAOYSA-N 2,4,6-trihydroxytoluene Chemical compound CC1=C(O)C=C(O)C=C1O BPHYZRNTQNPLFI-UHFFFAOYSA-N 0.000 description 1
- IZXIZTKNFFYFOF-UHFFFAOYSA-N 2-Oxazolidone Chemical compound O=C1NCCO1 IZXIZTKNFFYFOF-UHFFFAOYSA-N 0.000 description 1
- NZHNJOJQMPJLFA-UHFFFAOYSA-N 2-[3,5-bis(oxiran-2-yl)phenyl]oxirane Chemical compound C1OC1C1=CC(C2OC2)=CC(C2OC2)=C1 NZHNJOJQMPJLFA-UHFFFAOYSA-N 0.000 description 1
- OWEBGWBRTKTKHR-UHFFFAOYSA-N 2-[4-[4-(oxiran-2-yl)phenyl]phenyl]oxirane Chemical group C1OC1C1=CC=C(C=2C=CC(=CC=2)C2OC2)C=C1 OWEBGWBRTKTKHR-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- AXDJCCTWPBKUKL-UHFFFAOYSA-N 4-[(4-aminophenyl)-(4-imino-3-methylcyclohexa-2,5-dien-1-ylidene)methyl]aniline;hydron;chloride Chemical compound Cl.C1=CC(=N)C(C)=CC1=C(C=1C=CC(N)=CC=1)C1=CC=C(N)C=C1 AXDJCCTWPBKUKL-UHFFFAOYSA-N 0.000 description 1
- HVMHLMJYHBAOPL-UHFFFAOYSA-N 4-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)propan-2-yl]-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1C(C)(C)C1CC2OC2CC1 HVMHLMJYHBAOPL-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- 239000010754 BS 2869 Class F Substances 0.000 description 1
- ADAHGVUHKDNLEB-UHFFFAOYSA-N Bis(2,3-epoxycyclopentyl)ether Chemical compound C1CC2OC2C1OC1CCC2OC21 ADAHGVUHKDNLEB-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- VUPOPVGVEARXGA-UHFFFAOYSA-N C[SiH2]C.N=C=O.N=C=O Chemical compound C[SiH2]C.N=C=O.N=C=O VUPOPVGVEARXGA-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- ZFIVKAOQEXOYFY-UHFFFAOYSA-N Diepoxybutane Chemical compound C1OC1C1OC1 ZFIVKAOQEXOYFY-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- IUJJPSLPEWPXBV-UHFFFAOYSA-N N=C=O.N=C=O.C(C=C1)=CC=C1[SiH2]C1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C(C=C1)=CC=C1[SiH2]C1=CC=CC=C1 IUJJPSLPEWPXBV-UHFFFAOYSA-N 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- JPYHHZQJCSQRJY-UHFFFAOYSA-N Phloroglucinol Natural products CCC=CCC=CCC=CCC=CCCCCC(=O)C1=C(O)C=C(O)C=C1O JPYHHZQJCSQRJY-UHFFFAOYSA-N 0.000 description 1
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 description 1
- 101100386054 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CYS3 gene Proteins 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- GLROGUSVUGSGPO-UHFFFAOYSA-N bis(3-methyl-7-oxabicyclo[4.1.0]heptan-4-yl) hexanedioate Chemical compound C1C2OC2CC(C)C1OC(=O)CCCCC(=O)OC1CC2OC2CC1C GLROGUSVUGSGPO-UHFFFAOYSA-N 0.000 description 1
- KVRAGBDTQYNMNO-UHFFFAOYSA-N bis[2,4-bis(oxiran-2-ylmethoxy)phenyl]methanone Chemical compound C=1C=C(OCC2OC2)C=C(OCC2OC2)C=1C(=O)C(C(=C1)OCC2OC2)=CC=C1OCC1CO1 KVRAGBDTQYNMNO-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- XJRAOMZCVTUHFI-UHFFFAOYSA-N isocyanic acid;methane Chemical compound C.N=C=O.N=C=O XJRAOMZCVTUHFI-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 208000020442 loss of weight Diseases 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- DGTNSSLYPYDJGL-UHFFFAOYSA-N phenyl isocyanate Chemical compound O=C=NC1=CC=CC=C1 DGTNSSLYPYDJGL-UHFFFAOYSA-N 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 101150035983 str1 gene Proteins 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000003878 thermal aging Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/003—Polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4028—Isocyanates; Thioisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/302—Polyurethanes or polythiourethanes; Polyurea or polythiourea
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K3/00—Details of windings
- H02K3/30—Windings characterised by the insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2936—Wound or wrapped core or coating [i.e., spiral or helical]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2964—Artificial fiber or filament
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2964—Artificial fiber or filament
- Y10T428/2967—Synthetic resin or polymer
- Y10T428/2969—Polyamide, polyimide or polyester
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2971—Impregnation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31533—Of polythioether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31547—Of polyisocyanurate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31562—Next to polyamide [nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31598—Next to silicon-containing [silicone, cement, etc.] layer
- Y10T428/31601—Quartz or glass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31725—Of polyamide
Definitions
- the present invention relates to an insulation system for winding of electric rotating machines and a process for the production of such an insulated winding for electric rotating machines. More particularly, the invention pertains to an insulated winding for electric rotating machines having thermal resistance of class H or more obtained by impregnating and curing a novel thermosetting resin and a process for the production of such an insulated winding for electric rotating machines.
- a tape or sheet of a polyimide, polyamideimide, aromatic polyamide or the like resin has heretofore been used as an insulating material having thermal resistance of class H (180° C.) for winding for such electric rotating machines.
- a polyimide resin varnish or a polyamideimide resin varnish is known as an insulating varnish of class H for impregnating insulating material but they are difficult to be a solventless varnish since they are condensation resin varnishes. Therefore, they are not suitable for winding for electric rotating machines in which the formation of voids is undesirable.
- an epoxy resin varnish As a solventless varnish for impregnating insulating materials, an epoxy resin varnish has been widely used, but the epoxy resin has thermal resistance of class F (155° C.). When the resin is heated at a temperature of 180° C. or more, therefore, delamination occurs owing to heat deterioration between the insulating layers of the winding and particularly between the conductor and the insulating layer. Thereby thermal conduction is reduced and the temperature of the winding further increases. Also, corona starting voltage is reduced and dielectric breakdown is brought about.
- said insulating layer is easy to peel from the conductor if the adhesive property of the varnish forming the insulating layer is poor. Since the machines are not immersed in an oil like a transformer, a corona is generated and dielectric breakdown occurs.
- a silicone resin varnish is known as another varnish having excellent thermal resistance, but it is inferior in adhesiveness and is not suitable for such electric rotating machines.
- An object of the present invention is to provide insulation system for winding of electric rotating machines having thermal resistance of class H or more.
- Another object of the invention is to provide insulated winding for electric rotating machines having excellent adhesiveness between a conductor and an insulating layer.
- a further object of the invention is to provide insulated windings for electric rotating machines having resistance to thermal stress.
- FIG. 1 shows a change of the breakdown voltage of a model bar coil after deterioration test.
- FIG. 2 is a plan of a field coil for a direct current motor.
- FIG. 3 shows the schedule of heat cycles in class H heat cycle test.
- FIG. 4 is a rough sketch of an armature coil for a direct current motor.
- FIG. 5 shows a relationship between dielectric loss tangent and temperature in the insulating layer of a model coil.
- FIGS. 6a-6f are infrared spectra showing structures of a resin in the course of the production thereof.
- insulated winding for electric rotating machines can be produced by wrapping a plurality of layers of a sheet-form insulating material of glass fibers, a polyimide, polyamideimide or aromatic polyamide around a winding conductor for electric rotating machines, impregnating the layers with a solventless varnish comprising a polyepoxide, an organic polyisocyanate, and then curing the varnish in the presence of a catalyst for forming isocyanurate rings and oxazolidone rings.
- thermosetting resin The detailed composition, preparation and properties of the above-mentioned thermosetting resin are described in U.S. Patent Application Ser. No. 418,905, filed Nov. 26, 1973, now abandoned.
- the term "electric rotating machines” used herein means generators and motors having an allowable temperature of 180° C. or more.
- a polyimide KAPTON® manufactured by E. I. du Pont de Nemours & Co. in U.S.A.
- an aromatic polyamide NOMEX® manufactured by E. I. du Pont de Nemours & Co. in U.S.A.
- a polyamideimide PAIFRON® manufactured by Hitachi Chemical Co., Ltd. in Japan
- another class H insulating material such as a glass cloth tape or a mica tape may be used if necessary.
- thermosetting resin having recurring units of at least two isocyanurate rings directly bonded to one another through residue of the polyisocyanate and two oxazolidone rings directly bonded to each other through residue of the polyepoxide represented by the formula (I), ##STR1## wherein R is a residue of the polyisocyanate, R' is a residue of the polyepoxide, p is an integer of at least 2, and m and r are integers of at least 1.
- the feature of the oxazolidone-modified isocyanurate polymers in the U.S. Patent is in that one isocyanurate ring is inserted between one group of oxazolidone rings and the other group of oxazolidone rings. This is an outstanding point to distinguish the cured varnish used in the present invention from the polymers disclosed in the U.S. Patent.
- the cured varnish used in the present invention there are at least two isocyanurate rings directly connected to each other through a residue of an organic polyisocyanate. By virtue of the difference in their chemical structure, they show different properties shown below.
- compositions shown in Tables 2 and 3 were cured under a condition of 80° C./5 hours plus 150° C./15 hours, respectively.
- Test pieces were prepared from the cured products obtained as above and subjected to the determination of tensile strength, elongation and thermal deterioration in accordance with the same manner as shown in the specification of U.S. Patent Application Ser. No. 418,905, respectively. The results obtained are as shown in Table 4.
- Infrared spectrum analysis of the chemical structure of the resins used in the present invention shows that trimerization of a polyisocyanate takes place at first in the presence of a catalyst for forming isocyanurate rings and oxazolidone rings and then the reaction between the polymer of polyisocyanate and a polyepoxide takes place to form oxazolidone rings. Since the equivalent ratio of the polyisocyanate to the polyepoxide is more than one and the trimerization reaction precedes the oxazolidone forming reaction, at least two isocyanurate rings are directly connected to each other through one residual group of the polyisocyanate.
- FIGS. 6a to 6f are infrared spectra showing the reaction mechanism.
- FIGS. 6a to 6f it is apparent that at first the sample exhibits the charactersitics due to isocyanate and epoxy groups (FIG. 6a) and then the characteristics due to isocyanurate and epoxy groups (FIG. 6b). With the progress of the reaction, characteristics due to oxazolidone rings are observed (FIGS. 6c to 6f) at 1760 cm -1 . The longer the reaction time, the stronger the absorption due to oxazolidone rings becomes and the weaker the absorption due to epoxy rings becomes.
- sample used in analysis at zero time was diluted two times thinner than the other samples, so as to show the full absorption peak due to isocyanate groups.
- thermosetting resin are superior as winding insulation for electric rotating machines to the winding insulated with a prior art epoxy resin since the thermosetting resin used in the present invention shows good adhesiveness for a conductor such as copper or aluminum.
- more than one equivalent of an organic polyisocyanate is blended with 1 equivalent of a polyfunctional epoxy compound.
- An amount of the polyepoxide is such that oxazolidone rings are introduced in the cured resins. From the view point of mechanical properties of the cured resin, more than 2 equivalents of the polyisocyanate per one equivalent of the polyepoxide is used. When the amount of polyisocyanate exceeds 15, there is a tendency that the cured resin becomes hard. The thus obtained hard resin can be used as it is in cases wherein flexibility is not required.
- the curing is carried out by heating at a temperature of 130° C. or less and preferably above about 60° C., for 5-15 hours and then heating at a temperature of 150° C. or more for 5-15 hours.
- isocyanurate rings are formed mainly by the trimerization of the polyisocyanate.
- oxazolidone rings are formed and cross-linking and curing occur.
- an insulating varnish which yields a thermosetting resin by heating is used, said tape or sheet insulating material and the winding conductor are tightly bonded so that delamination may not occur even at high temperatures.
- the polyfunctional epoxides or polyepoxides used in the present invention have at least two vicinal epoxy groups or 1,2-epoxy groups in the molecule.
- bifunctional epoxides such as, for example, diglycidylether of bisphenol A, butadiene diepoxide, 3,4-epoxycyclohexylmethyl-(3,4-epoxy)-cyclohexane carboxylate, vinylcyclohexene dioxide, 4,4'-di(1,2-epoxyethyl)diphenylether, 4,4'-di(1,2-epoxyethyl)biphenyl, 2,2-bis(3,4-epoxycyclohexyl)propane, diglycidylether of resorcinol, diglycidylether of phloroglucinol, diglycidylether of methylphloroglucinol, bis-(2,3-epoxycyclopentyl)
- diglycidylether of bisphenol A and polyglycidylether of phenol-formaldehyde novolac have a particular good reactivity. Therefore, they are useful compounds. Further, halides of these compounds can be used, too.
- diepoxides are employed.
- organic polyfunctional isocyanates or polyisocyanates there can be used bifunctional isocyanates, such as, for example, methane diisocyanate, butane-1,1-diisocyanate, ethane-1,2-diisocyanate, butane-1,2-diisocyanate, transvinylene diisocyanate, propane-1,3-diisocyanate, butane-1,4-diisocyanate, 2-butene-1,4-diisocyanate, 2-methylbutane-1,4-diisocyanate, pentane-1,5-diisocyanate, 2,2-dimethylpentane-1,5-diisocyanate, hexane-1,6-diisocyanate, heptane-1,7-diisocyanate, octane-1,8-diisocyanate, nonane-1,9-diisocyanate, decane-1,10
- compounds obtained by masking isocyanic radicals of the aforesaid isocyanates with phenol, cresol and the like can be used, too.
- the dimers and trimers of these isocyanates are usable, too.
- 4,4'-diphenylmethane diisocyanate, 2,4-toluene diisocyanate are preferable and useful.
- the aforesaid epoxides and isocyanates are each used solely or in combination with one another. In order to obtain a low viscosity varnish, diisocyanates are particularly useful.
- a catalyst displays an important role for obtaining the heat resistant insulating system of the present invention.
- the catalyst is used to form isocyanurate bonds and oxazolidone bonds at the time of curing.
- Such a catalyst as above includes morpholine derivatives, such as, for example, N-dodecylmorpholine, butylene dimorpholine, hexamethylene dimorpholine, cyanoethyl morpholine, triazinoethyl morpholine, N-methyl morpholine, N-ethyl morpholine and the like.
- imidazole derivatives as a catalyst, such as, for example, 2-methylimidazole, 2-ethylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-methyl-4-ethylimidazole, 1-butylimidazole, 1-propyl-2-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2,4-diamino-6-(2'-methylimidazolyl-1'-)-ethyl-s-triazine, 2,4-diamino-6-(2'-ethylimidazolyl-1'-)-ethyl-s-triazine, 2,4-diamino-6-(2'-undecylim
- heterocycle forming catalysts are used within a range of 0.01 to 10% by weight, preferably 0.1 to 2% by weight, based on a mixture of said polyfunctional epoxide and polyfunctional isocyanate.
- a method for impregnating a winding wrapped with said tape or sheet with a blend of said resin formulation comprising a polyfunctional epoxy compound and a polyfunctional isocyanate compound a method which comprises previously impregnating only the catalyst dissolved in an organic solvent and then impregnating the resin component is preferable.
- the catalyst has no adverse effect on the pot life of the resin varnish in a storage tank and there is no fear of gelation of the varnish in the tank at room temperature.
- the above-mentioned method of impregnating windings with the varnish is carried out under reduced pressure.
- the viscosity of the impregnating varnish is preferably 7 poises or less, and more preferably 2 poises or less, at the impregnation temperature. If the viscosity exceeds 7 poises, it is feared that sufficient impregnation cannot be effected.
- An aromatic polyamide (NOMEX) tape having a thickness of 0.075 mm was wound around a bar-form conductor having a section of 7.4 ⁇ 14.4 mm and a length of 550 mm, obtained by piling six flat type copper wires, four times at half lap to wrap the bar-form conductor. Further, a glass cloth tape having a thickness of 0.18 mm was wound around it one time at half lap to prepare a model winding.
- NOMEX aromatic polyamide
- the model winding was immersed in a 1% solution of 2-ethyl-4-methylimidazole, which is a catalyst forming isocyanurate rings and oxazolidone rings, in methanol to impregnate said solution, air-dried at room temperature, and dried at 40° C. and 0.1 mmHg for 5 hours.
- a resin component consisting of 1 equivalent of diepoxide DER-332 (a bisphenol A epoxy resin manufactured by Dow Chemical Co. in U.S.A., epoxy equivalent 178) and 2 equivalents of diisocyanate MDI (4,4'-diphenylmethane diisocyanate) was then introduced under reduced pressure. The impregnation was carried out at 40° C. and 3 mmHg.
- BDV breakdown voltage
- the model winding according to the present invention (1) is smaller in the reduction of BDV and higher in thermal resistance than the model winding according to the prior art process (2).
- a model coil having a shape similar to that of the field coil for a direct current motor as shown in FIG. 2 was prepared.
- a NOMEX tape having a thickness of 0.075 mm was wound four times at half lap.
- a glass cloth tape having a thickness of 0.18 mm was wound one time at half lap.
- the size of the coil including the insulating layer was 105 mm ⁇ 300 mm ⁇ 60 mm and the sectional size of the conductor was 36 mm ⁇ 58 mm.
- the delamination between the conductor and the insulating layer was judged by striking the surface of the insulating layer with a small hammer and hearing the sound. This method permitted easy and correct judgement without requiring any particular skill.
- a prior art epoxy resin varnish was applied to an armature coil for a direct current motor as shown in FIG. 4.
- slot length was about 600 mm or more, it was impossible to subject the coil and an iron core to integral impregnation since the coil insulating layer broke down owing to the stress produced by a difference in thermal expansion caused by heat cycles between the coil insulating layer and the iron core.
- a model bar coil having a length of about 1,000 mm was prepared and insulated in the same manner as in Example 1.
- the insulated model bar coil was inserted into a slot having a width of 20 mm, a depth of 36 mm and a length of 850 mm and then impregnated with the resin varnish of Example 1 to prepare an armature model.
- the impregnation and curing conditions were the same as in Example 1 except that the catalyst was directly added to the resin component in an amount of 1% by weight.
- the armature model For the armature model, 500 heat cycles of 60° C. ⁇ 180° C. were carried out, heating at 220° C. for 10 days was effected, and then 500 heat cycles of 60° C. ⁇ 180° C. were again carried out, and its BDV was measured. As a result, the armature model according to the present invention showed only a slight reduction in BDV but were all right. On the other hand, breakdown occurred in the case of armature model prepared with the prior art cycloaliphatic epoxy resin-acid anydride curing system varnish.
- the insulated winding for electric rotating machines according to the present invention has excellent thermal resistance and adhesiveness which have not been obtained, and can be used as an insulated winding having thermal resistance of class H or class C.
- the pot life of the impregnating varnish used in the present invention is short when a catalyst which forms isocyanurate rings and oxazolidone rings is added. Therefore, it is desirable to previously impregnate layers of the tape or sheet wound around a conductor with this catalyst alone.
- the impregnation is carried out by dissolving a required amount of the catalyst in an organic solvent.
- part of the epoxy resin may be used as a binder.
- the solvent methanol, acetone, toluene, benzene, ethyl alcohol, methyl ethyl ketone, dimethylformamide, etc. may be used.
- the amount of the catalyst used is 0.1-2% by weight based on the weight of the resin to be impregnated, the amount of the binder used is 10-400% by weight based on the weight of the catalyst and the amount of the solvent used is 10-100 times the weight of the catalyst.
- This example illustrates an insulation for low voltage electric machines consisting mainly of a polyamide film.
- a glass cloth tape and a polyamide (NOMEX) non-woven fabric tape were wound around a conductor a prescribed number of times. Then, 15 g of 2-phenylimidazole as a catalyst for the resin and 35 g of a novolac epoxy resin having a melting point of about 70° C. as a binder were mixed with 1 l of acetone to prepare a solution. Said winding was immersed in this catalyst treating solution for 30 minutes. After the immersion, the treated winding was dried at room temperature under reduced pressure, impregnated with a varnish obtained by mixing 1 equivalents of a bisphenol A epoxy compound with 2.5 equivalents of 4,4'-diphenylmethane diisocyanate, and then cured by heating. Thus, an insulated winding having very high thermal resistance was obtained.
- the catalyst penetrated into each layer of the insulation completely and was stuck to each layer uniformly.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Manufacture Of Motors, Generators (AREA)
- Polyurethanes Or Polyureas (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48104993A JPS5058501A (ja) | 1973-09-19 | 1973-09-19 | |
JP48/104993 | 1973-09-19 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US05506337 Continuation-In-Part | 1974-09-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
US4304818A true US4304818A (en) | 1981-12-08 |
Family
ID=14395606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US06/103,571 Expired - Lifetime US4304818A (en) | 1973-09-19 | 1979-12-14 | Insulation system for winding of electric rotating machines and process of production thereof |
Country Status (9)
Country | Link |
---|---|
US (1) | US4304818A (ja) |
JP (1) | JPS5058501A (ja) |
AU (1) | AU477108B2 (ja) |
CA (1) | CA1021245A (ja) |
DE (1) | DE2444458C3 (ja) |
ES (1) | ES430175A1 (ja) |
FR (1) | FR2244285B1 (ja) |
GB (1) | GB1462200A (ja) |
ZA (1) | ZA745933B (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4376904A (en) * | 1981-07-16 | 1983-03-15 | General Electric Company | Insulated electromagnetic coil |
US4399190A (en) * | 1981-03-11 | 1983-08-16 | Mitsubishi Denki Kabushiki Kaisha | Thin insulating mica sheet and insulated coil |
US4399191A (en) * | 1981-03-11 | 1983-08-16 | Mitsubishi Denki Kabushiki Kaisha | Thin insulating mica sheet and insulated coil |
US4400226A (en) * | 1981-07-16 | 1983-08-23 | General Electric Company | Method of making an insulated electromagnetic coil |
US5084544A (en) * | 1989-02-11 | 1992-01-28 | Bayer Aktiengesellschaft | Cold setting reaction resin mixture and use thereof |
WO2002073772A1 (en) * | 2001-03-14 | 2002-09-19 | Akzo Nobel N.V. | Powder coated rotor |
US20020187351A1 (en) * | 2001-03-14 | 2002-12-12 | Borschel Volker Karl Ottmar | Powder coated rotor |
US20040265167A1 (en) * | 2003-06-30 | 2004-12-30 | Todd Morrison | Sterilization vacuum chamber door closure |
CN102148069A (zh) * | 2009-12-23 | 2011-08-10 | 通用汽车环球科技运作有限责任公司 | 用于磁导线的自我修复的绝缘体 |
CN102148069B (zh) * | 2009-12-23 | 2016-11-30 | 通用汽车环球科技运作有限责任公司 | 用于磁导线的自我修复的绝缘体 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53116402A (en) * | 1977-03-19 | 1978-10-11 | Hitachi Ltd | Electric insulation device |
JPS54157201A (en) * | 1978-06-02 | 1979-12-12 | Hitachi Ltd | Wire manufacturing method for electric machine |
JPS6055971B2 (ja) * | 1978-12-08 | 1985-12-07 | 株式会社日立製作所 | 電機巻線 |
EP0035072B1 (de) * | 1980-03-03 | 1984-06-13 | BBC Aktiengesellschaft Brown, Boveri & Cie. | Duroplastisch härtbare lösungsmittelfreie Harzmischung und ihre Verwendung |
JPS56150813A (en) * | 1980-04-22 | 1981-11-21 | Mitsubishi Electric Corp | Manufacture of insulated coil |
FR2507024A1 (fr) * | 1981-06-01 | 1982-12-03 | Hitachi Ltd | Procede de production de bobinages electriques isoles |
DE3323122A1 (de) * | 1983-06-27 | 1985-05-23 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung von reaktionsharzformstoffen |
DE3323154A1 (de) * | 1983-06-27 | 1985-01-03 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur impraegnierung und einbettung von elektrischen wicklungen |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3793236A (en) * | 1971-02-12 | 1974-02-19 | Mitsubishi Chem Ind | Oxazolidone-modified isocyanurate resins |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE593093A (ja) * | 1959-09-12 | |||
BE613493A (ja) * | 1961-02-06 | 1900-01-01 | ||
DE1258937B (de) * | 1961-03-11 | 1968-01-18 | Asea Ab | Glimmerband zur Herstellung eines elektrischen Leiters |
US3211703A (en) * | 1962-03-23 | 1965-10-12 | Monsanto Res Corp | Polyaliphatic polyisocyanurate laminating resin prepared in the presence of a cocatalyst system |
US3206352A (en) * | 1962-03-23 | 1965-09-14 | Monsanto Res Corp | Polymeric polyisocyanurate laminating resin prepared from a diaryl dhsocyanate and acocatalyst system |
DE1219554B (de) * | 1963-03-08 | 1966-06-23 | Siemens Ag | Verfahren zur Herstellung von Isolierungen aus Folien oder Baendern mit Kunstharztraenkung |
DE1490393B1 (de) * | 1963-04-11 | 1970-07-02 | Siemens Ag | Verfahren zur Herstellung von Isolierungen fuer elektrische Maschinen,Geraete oder Apparate |
GB1050679A (ja) * | 1963-05-02 | 1900-01-01 | ||
NL6504681A (ja) * | 1965-04-13 | 1965-06-25 | ||
US3494888A (en) * | 1966-08-30 | 1970-02-10 | Wilbur R Mcelroy | Resin compositions from polyepoxides and isocyanate polymers |
US3745133A (en) * | 1968-02-05 | 1973-07-10 | Upjohn Co | Cellular isocyanurate containing polymers |
FR1566468A (ja) * | 1968-03-04 | 1969-05-09 |
-
1973
- 1973-09-19 JP JP48104993A patent/JPS5058501A/ja active Pending
-
1974
- 1974-09-17 DE DE2444458A patent/DE2444458C3/de not_active Expired
- 1974-09-17 GB GB4052274A patent/GB1462200A/en not_active Expired
- 1974-09-18 FR FR7431564A patent/FR2244285B1/fr not_active Expired
- 1974-09-18 ZA ZA00745933A patent/ZA745933B/xx unknown
- 1974-09-18 ES ES430175A patent/ES430175A1/es not_active Expired
- 1974-09-18 CA CA209,448A patent/CA1021245A/en not_active Expired
- 1974-09-19 AU AU73463/74A patent/AU477108B2/en not_active Expired
-
1979
- 1979-12-14 US US06/103,571 patent/US4304818A/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3793236A (en) * | 1971-02-12 | 1974-02-19 | Mitsubishi Chem Ind | Oxazolidone-modified isocyanurate resins |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4399190A (en) * | 1981-03-11 | 1983-08-16 | Mitsubishi Denki Kabushiki Kaisha | Thin insulating mica sheet and insulated coil |
US4399191A (en) * | 1981-03-11 | 1983-08-16 | Mitsubishi Denki Kabushiki Kaisha | Thin insulating mica sheet and insulated coil |
US4376904A (en) * | 1981-07-16 | 1983-03-15 | General Electric Company | Insulated electromagnetic coil |
US4400226A (en) * | 1981-07-16 | 1983-08-23 | General Electric Company | Method of making an insulated electromagnetic coil |
US5084544A (en) * | 1989-02-11 | 1992-01-28 | Bayer Aktiengesellschaft | Cold setting reaction resin mixture and use thereof |
WO2002073772A1 (en) * | 2001-03-14 | 2002-09-19 | Akzo Nobel N.V. | Powder coated rotor |
US20020187351A1 (en) * | 2001-03-14 | 2002-12-12 | Borschel Volker Karl Ottmar | Powder coated rotor |
US20040142189A1 (en) * | 2001-03-14 | 2004-07-22 | Volker Karl Ottmar Borschel | Powder coated rotor |
US20040265167A1 (en) * | 2003-06-30 | 2004-12-30 | Todd Morrison | Sterilization vacuum chamber door closure |
CN102148069A (zh) * | 2009-12-23 | 2011-08-10 | 通用汽车环球科技运作有限责任公司 | 用于磁导线的自我修复的绝缘体 |
CN102148069B (zh) * | 2009-12-23 | 2016-11-30 | 通用汽车环球科技运作有限责任公司 | 用于磁导线的自我修复的绝缘体 |
Also Published As
Publication number | Publication date |
---|---|
ES430175A1 (es) | 1977-01-16 |
ZA745933B (en) | 1975-10-29 |
GB1462200A (en) | 1977-01-19 |
DE2444458A1 (de) | 1975-04-24 |
AU7346374A (en) | 1976-03-25 |
JPS5058501A (ja) | 1975-05-21 |
CA1021245A (en) | 1977-11-22 |
FR2244285A1 (ja) | 1975-04-11 |
DE2444458B2 (de) | 1978-03-02 |
FR2244285B1 (ja) | 1977-07-08 |
DE2444458C3 (de) | 1985-06-20 |
AU477108B2 (en) | 1976-10-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4304818A (en) | Insulation system for winding of electric rotating machines and process of production thereof | |
US3902087A (en) | Rotor for squirrel-cage induction motor | |
US4070416A (en) | Novel thermosetting resin and a process for producing same | |
US4564651A (en) | Method for the manufacture of reaction resin molding materials | |
US3412354A (en) | Adhesive coated electrical conductors | |
US3260691A (en) | Coating compositions prepared from condensation products of aromatic primary diamines and aromatic tricarboxylic compounds | |
US3960803A (en) | Flexible nontacky prepreg for bonding coils in high voltage devices and method of making said prepreg | |
US4137275A (en) | Latent accelerators for curing epoxy resins | |
EP0012566A1 (en) | Electric windings and production thereof | |
US4222802A (en) | Process for producing electric windings | |
US5075159A (en) | Electrically insulated coil | |
US4204181A (en) | Electrical coil, insulated by cured resinous insulation | |
US3868613A (en) | Solventless epoxy resin composition and an electrical member impregnated therewith | |
US4224541A (en) | Fluid solventless epoxy-anhydride compositions containing metal acetylacetonate accelerators and organic carboxylic acid co-accelerators for use on an electrical member | |
US3979365A (en) | Process for producing thermosetting resins | |
US4131600A (en) | Hot-hardening reaction resin mixture for impregnating the insulation of electrical equipment and for the manufacture of molded materials with or without inserts | |
JPS5825703B2 (ja) | 耐熱熱硬化性接着剤ラツカ− | |
US4056579A (en) | Novel thermosetting resin composition and cured product therefrom | |
EP0181337B1 (en) | Heat curable polyglycidyl aromatic amine encapsulants | |
US4680222A (en) | Process and device for electric winding insulation by impregnation, and stabilized varnish without solvent usable therein | |
FI63430B (fi) | Hartsblandning | |
US4636556A (en) | Heat-hardening reaction resin mixture for impregnating insulation of electrical equipment and for the manufacture of molding materials with and without inserts | |
US3038831A (en) | Insulated electrical conductors and coils | |
US4269894A (en) | Electric windings and production thereof characterized by the use of a condensation type silicon resin for combination with an addition type silicon resin | |
US4748048A (en) | Method of insulating electrical conductors by impregnation |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |