US3921572A - Vacuum coating apparatus - Google Patents

Vacuum coating apparatus Download PDF

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Publication number
US3921572A
US3921572A US445199A US44519974A US3921572A US 3921572 A US3921572 A US 3921572A US 445199 A US445199 A US 445199A US 44519974 A US44519974 A US 44519974A US 3921572 A US3921572 A US 3921572A
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Prior art keywords
chamber
coating
coating chamber
vacuum
evaporation
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Expired - Lifetime
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US445199A
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English (en)
Inventor
Rolf H Brunner
Quiedo J Carbone
William C Lester
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International Business Machines Corp
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International Business Machines Corp
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Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Priority to US445199A priority Critical patent/US3921572A/en
Priority to DE19742460989 priority patent/DE2460989A1/de
Priority to FR7501210A priority patent/FR2262126B1/fr
Priority to JP50012613A priority patent/JPS50116278A/ja
Priority to GB552775A priority patent/GB1429622A/en
Application granted granted Critical
Publication of US3921572A publication Critical patent/US3921572A/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Definitions

  • ABSTRACT Vacuum coating apparatus having isolatable coating and vacuum chambers whose volumes are correlated to each other to minimize contamination and pumpdown time, with the coating chamber having a closure means mounting a substrate holder for positioning substrates in an evaporant stream from a vapor source 'contained in the vacuum chamber.
  • This invention relates to coating apparatus, and more particularly, to an improved apparatus for coating substrates with an evaporant stream from a suitable source material in a vacuum system.
  • Vacuum coating of substrates from a suitable source material is extensively used for various applications.
  • such applications involve, among others, the deposition of non-metallic coatings on optical lenses, coatings on paper, and in particular, the coating of electrically conductive metal and dielectric films on semiconductorsubstrates for enabling subsequent delineation of conductor patterns in the fabrication of semiconductor devices.
  • Such systems comprise a main vacuum or evaporation chamber containing a source of coating material to be evaporated in a stream to a substrate supported in a coating chamber which is controllably placed in communication and isolation with respect to the evaporation chamber.
  • a vacuum gate valve is included intermediate the chambers to either, in the open position, place them in communication with each other or, in the closed position, to isolate each from the other.
  • a vacuum source such as a diffusion pump, is normally connected to the evaporation chamber to maintain a continuous vacuum therein.
  • the gate valve For loading of the system, the gate valve is moved in the closed position to isolate the evaporation and coating chambers, the latter of which is provided with means of access for insertion of substrate holders in an evaporant stream. On insertion of the substrate holders and resealing and rough evacuation of the coating chamber, the gate valve is moved to the open position to place the chambers in communication with each other. On development of a common vacuum atmosphere in the chambers, an evaporant stream, of a source material from an E-beam source, is directed from evaporation chamber into the coating chamber and onto the substrates, generally by removal of a shutter placed in the evaporant stream.
  • the coating chamber is also provided with an access port whose cross-sectional opening is also substantially reduced to minimize ingress of ambients during loading of substrates.
  • the ratio of 2 area of the port to the volume of the coating chamber will be in the range of about 1:20 to about 1:30.
  • the coating chamber is provided with means to introduce an inert gas flow (eg. nitrogen, argon, and the like) to flow through the chamber and out of the port during removal and loadingof substrates.
  • an inert gas flow eg. nitrogen, argon, and the like
  • the coating chamber is connected through valving to a roughing pump to generate a vacuum therein prior to placing it in communication with the evaporation chamber.
  • Another feature of the invention includes a door or closure member for the access port and having mounted thereon a holder for substrates which are positioned within the evaporant stream in the coating chamber. This feature provides the capability for automatic loading/unloading of the substrates.
  • a further feature of the invention includes an additional gating means (such as a poppet valve) in the evaporation chamber for sealing with an access port to the vacuum pump to obtain isolation therebetween, and access to the chamber without need to shut down the vacuum pump.
  • an additional gating means such as a poppet valve
  • FIG. 1 is a schematic drawing in cross-section, of one embodiment of a vacuum coating apparatus in accordance with this invention.
  • FIG. 2 is a diagrammatic view of a substrate holder for use in the embodiment of FIG. 1.
  • FIG. 3 is a partial schematic drawing, in cross-section, of a coating chamber in accordance with another embodiment of this invention.
  • the vacuum coating apparatus comprises a coating chamber 1 and an evaporation chamber 2 operatively in communication with each other under a common vacuum environment generated by a vacuum pump 3 (eg. a diffusion pump) through a vacuum access duct 4 in the lower wall of the chamber enclosure 5.
  • a vacuum pump 3 eg. a diffusion pump
  • a valve housing 6 for a conventional vacuum gate valve 7 which is movable in the housing 6 by means of a pneumatic or hydraulic cylinder 8 mounted at one end of housing 6 and having a reciprocable extending rod 9 attached to valve plate 7.
  • the gate valve is shown in the closed position in FIG. 1 to isolate or seal the coating and evaporation chambers 1 and 2, respectively, from each other to allow access to the coating chamber 1 while maintaining a continuous vacuum in the evaporation chamber 2.
  • the mounting of this valve is such that its sealing surface faces up ward, thereby inherently shielding said surface from evaporant deposits.
  • Activation of cylinder 8 to retract rod 9, will move the valve plate 7 to the open position to place coating chamber 1 and evaporation chamber 2 in communication with each other for development of a common vacuum environment.
  • the evaporation chamber 2 includes a conventional vapor or ion source of the type shown in US. letters Pat. No. 3,710,072 which may be referred to for details of construction.
  • Source 10 will normally comprise a water cooled crucible 11 having coolant passages 12 through which a coolant may be circulated by suitable means, not shown.
  • Crucible 11 contains a molten pool 14 of evaporant material from which vapor of the coating is produced, as for example aluminum or copper aluminum alloy for coating of an electrically conductive film of semiconductor substrates 13 (see FIG. 2) in device fabrication.
  • the molten pool 14 is heated by an electron beam 15, deflected in an arcuate path by suitable magnetic field, from an electron beam gun l6.
  • an enclosing evaporant shield 17 Mounted in evaporation chamber 2, about vacuum source 10, is an enclosing evaporant shield 17 having an opening 18 in top wall 19 thereof, for shaping the evaporant stream 20 of the coating material from source 10.
  • a shutter 21 is provided between the source material 10, at the shaping port 18, and the coating chamber 1.
  • the shutter 21 is mounted on a pivot shaft 22 extending through shield 17, the bottom wall 23 (of evaporation chamber 2) and in a vacuum tight bushing 24 secured thereto.
  • a poppet valve 25 having a sealing plate 26 disposed opposite vacuum access duct 4, for sealing engagement therewith when ram 27 is extended by actuation of a pneumatic or hydraulic cylinder 28.
  • Coating chamber 1 includes an access port 29 which serves to load and unload substrates 13 into and out of the chamber.
  • a second access flange is provided opposite the access port for maintenance purposes.
  • the access port 29 is adapted to be opened and closed by a door or cover member 30' pivotally mounted to a bracket 31 and having an annular groove 32 for mounting of an O-ring 33 or other suitable sealing means.
  • a bracket 34 Mounted on the exterior of closure member 30 is a bracket 34 to which is secured a motor 35 having a drive shaft 36 extending through closure member 30 into the coating chamber 1. Secured to the free end of drive shaft 36 is a substrate holder 37 for supporting substrates in a coating position with respect to the evaporant stream in coating chamber 1. Motor 35 is used to rotate the holder 37 and secure substrates 13 in the evaporant stream in order to provide an more uniform coating on the substrates.
  • Holder 37 comprises a support base 38 having a plurality of finger grips 39 having pivoted clamping lips 40 positioned over the support face of base 38 by means of compression springs 41 which are secured between annular seats 42, secured to the back side of support base 38, and like registered annular seats 43 secured to lateral extensions 44, of grips 39, pivotally mounted to brackets 45, also secured to the back side of support base 38.
  • the lips 40 are formed with an angular configuration 46 to facilitate camming of grips 39 open if a tool is desired to be employed for positioning substrate 13 on holder 37.
  • a roughing line 50 extending 4 through valve 51 to a vacuum roughing pump (not shown) in order to evacuate coating chamber 1 down to a safe level for opening valve plate 7 to place the chamber into communication with evaporation chamber 2 without drastic equilization therebetween.
  • an inert gas line 52 extending through valve 53 to an inert gas source, not shown, of nitrogen, argon and the like, for purposes of establishing a flowing atmosphere of the inert gas through the chamber 1 and out of the access port 29 when the closure member 30 is in the open position.
  • an inert gas source not shown, of nitrogen, argon and the like, for purposes of establishing a flowing atmosphere of the inert gas through the chamber 1 and out of the access port 29 when the closure member 30 is in the open position.
  • the flow of inert gas out of access port 29 will minimize ingress of ambients into the chamber and thus conversely minimize contamination thereof.
  • Mechanical movement of the closure member or lid 30 can be effected by pivotally connecting mounting bracket 34 to a clevis member 60 on the end of a piston rod 61 of a pneumatic or hydraulic cylinder 62 suitably mounted (not shown) in any convenient manner to the vacuum coating apparatus.
  • the volume of coating chamber 1 is substantially smaller than the volume of the evaporating chamber.
  • the practical ratios of the volume of the coating chamber 1 to the volume of the evaporating chamber 2 will be in the range of from about 1:10 to about 1:30.
  • the volume of coating chamber 1 was 5 liters while the volume of the evaporation chamber 2 was 150 liters.
  • the cross-sectional area of acess port 29 is also correlated to the volume of coating chamber 1.
  • the practical ratios of the cross-sectional area of access port 29 to the volume of coating chamber 1 will be in the range of from about 1:20 to about 1:30.
  • Such a restricted access port 29 also serves to throttle the flow of inert gas out of coating chamber 1 and retain temperature control of internal tooling surfaces.
  • FIG. 3 shows a variation of the coating chamber 1 of the apparatus of this invention.
  • an access port 29A to the coating chamber 1A is provided in an enclosure wall 71 formed on an angle to the evaporant stream form the source 10in evaporation chamber 2.
  • the closure member or lid 30A Pivotally mounted to a bracket 72 on the enclosure wall is the closure member or lid 30A provided on its outer surface with a motor 35A with a drive shaft 36 extending through a vacuum seal into the coating chamber 1A, and having secured to its free end a rotatable substrate holder 37 to support a substrate at an angle within the evaporant stream in the coating chamber 1A.
  • heating elements for heating substrates to deposition temperatures. The heater elements are protected from the evaporant stream by a shield 75.
  • valve plate 7 In operation, for loading of substrates, the valve plate 7 (FIG. 1) is moved to the closed position to isolate coating chamber 1 from evaporation chamber 2 in which a vacuum (eg. of about 3 to 9 X 10" TORR) is continued to be maintained by virtue of its communication through vacuum port 4 to the vacuum pump 3.
  • a vacuum eg. of about 3 to 9 X 10" TORR
  • valve 53 Prior to opening of closure member 30, valve 53 is opened in inert gas line 52 to connect coating chamber l to an inert gas source, whereupon closure member 30 is opened.
  • any substrate on holder 37 may be removed and a new substrate 13 (eg. a semiconductor wafer) mounted thereon followed by closure of lid 30.
  • the inert gas flow is stopped by closure of valve 53, and the coating chamber connected to a roughing pump by opening of valve 51 is roughing line 50.
  • the roughing line valve 51 When the coating chamber 1 is evacuated to a suitable level (eg. about 50 microns), the roughing line valve 51 is closed, followed by moving valve plate 7 to the open position. After statilization of the unit, the shutter 21 will be rotated out of in front of the shaping port 18, to permit the evaporant stream from vacuum source 10 in the evaporation chamber 2, to flow into the coating chamber 1 onto the substrate 13 mounted on holder 37. Substrate rotation, heating, and source rise and soak can be started after communication is established between the coating and evaporation chambers.
  • the vacuum source can comprise a molten pool of 70 aluminum/30 copper alloy to coat the electrically conductive metal film on the wafer (eg. substrate).
  • the poppet valve 28 For servicing of the evaporation chamber 2, without shutting down vacuum pump 3, the poppet valve 28 is extended into a closed position with vacuum port 4, and both coating and evaporation chambers vented to the atmosphere when suitable servicing access can be obtained to both chambers.
  • a vacuum coating apparatus comprising:
  • gate means reciprocally movable between an-open and closed position intermediate said coating and evaporation chambers for selectively isolating each from the other;
  • substrate holder means mounted on an inner surface of said door means for supporting substrates in a coating position within said evaporant stream in said coating chamber;
  • L. gas means for controllably introducing an inert gas flow in said coating chamber when isolated from said evaporation chamber, when said gate means is in the closed position, to minimize ingress of ambients into said coating chamber when said door means is in the open position;
  • valve means for shutting off the flow of said inert gas to said coating chamber; wherein the ratio of the volumes of said evaporation chamber to said coating chamber is in the range from about 10:1 to about 30:1.
  • a vacuum coating apparatus comprising:
  • gate means reciprocally movable between an open and closed position intermediate said coating and evaporation chambers for selectively isolating each from the other;
  • door means pivotally mounted on said wall for movement into open and closed positions relative to said port with said closed position securing said door means in sealing relation with said coating chamber;
  • substrate holder means mounted on an inner surface of said door means for supporting substrates in a coating position within said evaporant stream in said coating chamber;
  • L. gas means for controllably introducing an inert gas flow in said coating chamber when isolated from said evaporation chamber, when said gate means is in the closed position, to minimize ingress of ambients into said coating chamber when said door means is in the open position;
  • valve means for shutting off the flow of said inert gas to said coating chamber; wherein the ratio of the volumes of said evaporation chamber to said coating chamber is in' the range from about 10:1 to about 30:1.
  • a vacuum coating apparatus comprising:
  • gate means reciprocally movable between an open and closed position intermediate said coating and evaporation chambers for selectively isolating each 7 from the other;
  • door means pivotally mounted on said wall for movement into open and closed positions relative to said port with said closed position securing said door means in sealing relation with said coating chamber;
  • substrate holder means mounted on an inner surface of said door means for supporting substrates in a coating position within said evaporant stream in said coating chamber;
  • M means for isolating said second vacuum means from said coating chamber when said gate means is to ,be moved to the open position
  • gas means for controllably introducing an inert gas flow in said coating chamber when isolated from said evaporation chamber, when said gate means is in the closed position, to minimize ingress of ambients into said coating chamber when said door means is in the open position;
  • valve means for shutting off the flow of said inert gas to said coating chamber; wherein the ratio of the volumes of said evaporation chamber to said coating chamber is in the range from about 10:1 to about 30:1.
  • a vacuum coating apparatus comprising:
  • gate means reciprocally movable between an open and closed position intermediate said coating and evaporation chambers for selectively isolating each from the other;
  • valve means in said evaporation chamber reciprocally movable between an open and closed position relative to the first said vacuum means for selectively placing said evaporation chamber and the first said vacuum means in communicating and isolating relationship with each other;
  • K a second vacuum means for roughing a vacuum in said coating chamber when isolated from said evaporation chamber by said gate means;
  • gas means for controllably introducing an inert gas flow in said coating chamber when isolated from said evaporation chamber, when said gate means is in the closed position, to minimize ingress of ambients into said coating chamber when said door means is in the open position;
  • valve means for shutting off the flow of said inert gas to said coating chamber; wherein the ratio of the volumes of said evaporation chamber to said coating chamber is in the range from about 10:1 to about 30:1.
  • a vacuum coating apparatus comprising:
  • gate means reciprocally movable between an open and closed position intermediate said coating and evaporation chambers for selectively isolating each from the other;
  • door means pivotally mounted on said wall for movement into open and closed positions relative to said port with said closed position securing said door means in sealing relation with said coating chamber;
  • substrate holder means mounted on an inner surface of said door means for supporting substrates in a coating position within said evaporant stream in said coating chamber;
  • valve means in said evaporation chamber reciprocally movable between an open and closed position relative to the first said vacuum means for selectively placing said evaporator section and the first said vacuum means in communicating and isolating relationship with each other;
  • K a second vacuum means for roughing a vacuum in said coating chamber when isolated from said evaporation chamber by said gate means;
  • gas means for controllably introducing an inert gas flow in said coating chamber when isolated from said evaporation chamber, when said gate means is in the closed position, to minimize ingress of ambients into said coating chamber when said door means is in the open position;
  • valve means for shutting off the flow of said inert gas to said coating chamber; wherein the ratio of the volumes of said evaporation chamber to said coating chamber is in the range from about 10:1 to about 30:1.
  • a vacuum coating apparatus comprising:
  • A an evaporation chamber
  • gate means reciprocally movable between an open and closed position intermediate said coating and evaporation chambers for selectively isolating each from the other;
  • substrate holder means mounted on an inner surface of said door means for supporting substrates in a coating position within said evaporant stream in said coating chamber;
  • said holder means supports said substrates within and at an angle to said evaporant stream
  • a valve means in said vacuum chamber reciprocally movable between an open and closed position between said evaporation chamber and the first said vacuum means for selectively isolating each from the other;
  • M a second vacuum means for roughing a vacuum in said coating chamber when isolated from said evaporation chamber by said gate means;
  • gas means for controllably introducing an inert gas flow in said coating chamber when isolated from said evaporation chamber, when said gate means is in the closed position, to minimize ingress of ambients into said coating chamber when said door means is in the open position;
  • valve means for shutting oflf the flow of said inert gas to said coating chamber
  • the ratio of the volumes of said evaporation chamber to said coating chamber is in the range from about 10:1 to about 30:1.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
US445199A 1974-02-25 1974-02-25 Vacuum coating apparatus Expired - Lifetime US3921572A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US445199A US3921572A (en) 1974-02-25 1974-02-25 Vacuum coating apparatus
DE19742460989 DE2460989A1 (de) 1974-02-25 1974-12-21 Vorrichtung zum aufdampfen von schichten im vakuum
FR7501210A FR2262126B1 (enrdf_load_stackoverflow) 1974-02-25 1975-01-10
JP50012613A JPS50116278A (enrdf_load_stackoverflow) 1974-02-25 1975-01-31
GB552775A GB1429622A (en) 1974-02-25 1975-02-10 Vacuum coating apparatus

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US445199A US3921572A (en) 1974-02-25 1974-02-25 Vacuum coating apparatus

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US3921572A true US3921572A (en) 1975-11-25

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US445199A Expired - Lifetime US3921572A (en) 1974-02-25 1974-02-25 Vacuum coating apparatus

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US (1) US3921572A (enrdf_load_stackoverflow)
JP (1) JPS50116278A (enrdf_load_stackoverflow)
DE (1) DE2460989A1 (enrdf_load_stackoverflow)
FR (1) FR2262126B1 (enrdf_load_stackoverflow)
GB (1) GB1429622A (enrdf_load_stackoverflow)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4062319A (en) * 1975-12-18 1977-12-13 Western Electric Co., Inc. Vacuum treating apparatus
US4137865A (en) * 1976-12-30 1979-02-06 Bell Telephone Laboratories, Incorporated Molecular beam apparatus for processing a plurality of substrates
US4269137A (en) * 1979-03-19 1981-05-26 Xerox Corporation Pretreatment of substrates prior to thin film deposition
US4310614A (en) * 1979-03-19 1982-01-12 Xerox Corporation Method and apparatus for pretreating and depositing thin films on substrates
US4338883A (en) * 1979-10-03 1982-07-13 Leybold-Heraeus Gmbh Vacuum vapor-deposition installation with a vacuum chamber, a vaporizing chamber and an evaporizing chamber
US4592926A (en) * 1984-05-21 1986-06-03 Machine Technology, Inc. Processing apparatus and method
US4756815A (en) * 1979-12-21 1988-07-12 Varian Associates, Inc. Wafer coating system
US4817556A (en) * 1987-05-04 1989-04-04 Varian Associates, Inc. Apparatus for retaining wafers
US5024747A (en) * 1979-12-21 1991-06-18 Varian Associates, Inc. Wafer coating system
US5040484A (en) * 1987-05-04 1991-08-20 Varian Associates, Inc. Apparatus for retaining wafers
EP0869199A1 (en) * 1997-03-31 1998-10-07 Applied Materials, Inc. Chamber design with isolation valve to preserve vacuum during maintenance
US20070000444A1 (en) * 2005-07-04 2007-01-04 Seiko Epson Corporation Vacuum evaporation apparatus and method of producing electro-optical device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5319565U (enrdf_load_stackoverflow) * 1976-07-29 1978-02-20
EP0008807A1 (de) * 1978-09-13 1980-03-19 Elektroschmelzwerk Kempten GmbH Vorrichtung und Verfahren zum diskontinuierlichen oder kontinuierlichen thermischen Bedampfen von Formteilen oder Bandmaterial
US4478174A (en) * 1983-02-25 1984-10-23 Canadian Patents & Development Limited Vacuum coating vessel with movable shutter plate
US5529634A (en) * 1992-12-28 1996-06-25 Kabushiki Kaisha Toshiba Apparatus and method of manufacturing semiconductor device

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2239642A (en) * 1936-05-27 1941-04-22 Bernhard Berghaus Coating of articles by means of cathode disintegration
US2420722A (en) * 1942-12-11 1947-05-20 Bausch & Lomb Apparatus for coating surfaces
US2932588A (en) * 1955-07-06 1960-04-12 English Electric Valve Co Ltd Methods of manufacturing thin films of refractory dielectric materials
US3180751A (en) * 1961-05-26 1965-04-27 Bausch & Lomb Method of forming a composite article
US3236205A (en) * 1961-04-24 1966-02-22 Baird Atomic Inc High temperature furnace
US3491720A (en) * 1965-07-29 1970-01-27 Monsanto Co Epitaxial deposition reactor
US3524426A (en) * 1968-02-29 1970-08-18 Libbey Owens Ford Glass Co Apparatus for coating by thermal evaporation
US3568632A (en) * 1969-03-24 1971-03-09 Gary F Cawthon Lens coating apparatus
US3641973A (en) * 1970-11-25 1972-02-15 Air Reduction Vacuum coating apparatus
US3649339A (en) * 1969-09-05 1972-03-14 Eugene C Smith Apparatus and method for securing a high vacuum for particle coating process

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2239642A (en) * 1936-05-27 1941-04-22 Bernhard Berghaus Coating of articles by means of cathode disintegration
US2420722A (en) * 1942-12-11 1947-05-20 Bausch & Lomb Apparatus for coating surfaces
US2932588A (en) * 1955-07-06 1960-04-12 English Electric Valve Co Ltd Methods of manufacturing thin films of refractory dielectric materials
US3236205A (en) * 1961-04-24 1966-02-22 Baird Atomic Inc High temperature furnace
US3180751A (en) * 1961-05-26 1965-04-27 Bausch & Lomb Method of forming a composite article
US3491720A (en) * 1965-07-29 1970-01-27 Monsanto Co Epitaxial deposition reactor
US3524426A (en) * 1968-02-29 1970-08-18 Libbey Owens Ford Glass Co Apparatus for coating by thermal evaporation
US3568632A (en) * 1969-03-24 1971-03-09 Gary F Cawthon Lens coating apparatus
US3649339A (en) * 1969-09-05 1972-03-14 Eugene C Smith Apparatus and method for securing a high vacuum for particle coating process
US3641973A (en) * 1970-11-25 1972-02-15 Air Reduction Vacuum coating apparatus

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4062319A (en) * 1975-12-18 1977-12-13 Western Electric Co., Inc. Vacuum treating apparatus
US4137865A (en) * 1976-12-30 1979-02-06 Bell Telephone Laboratories, Incorporated Molecular beam apparatus for processing a plurality of substrates
US4269137A (en) * 1979-03-19 1981-05-26 Xerox Corporation Pretreatment of substrates prior to thin film deposition
US4310614A (en) * 1979-03-19 1982-01-12 Xerox Corporation Method and apparatus for pretreating and depositing thin films on substrates
US4338883A (en) * 1979-10-03 1982-07-13 Leybold-Heraeus Gmbh Vacuum vapor-deposition installation with a vacuum chamber, a vaporizing chamber and an evaporizing chamber
US4756815A (en) * 1979-12-21 1988-07-12 Varian Associates, Inc. Wafer coating system
US5024747A (en) * 1979-12-21 1991-06-18 Varian Associates, Inc. Wafer coating system
US5281320A (en) * 1979-12-21 1994-01-25 Varian Associates Inc. Wafer coating system
US4592926A (en) * 1984-05-21 1986-06-03 Machine Technology, Inc. Processing apparatus and method
US4817556A (en) * 1987-05-04 1989-04-04 Varian Associates, Inc. Apparatus for retaining wafers
US5040484A (en) * 1987-05-04 1991-08-20 Varian Associates, Inc. Apparatus for retaining wafers
EP0869199A1 (en) * 1997-03-31 1998-10-07 Applied Materials, Inc. Chamber design with isolation valve to preserve vacuum during maintenance
US6103069A (en) * 1997-03-31 2000-08-15 Applied Materials, Inc. Chamber design with isolation valve to preserve vacuum during maintenance
US20070000444A1 (en) * 2005-07-04 2007-01-04 Seiko Epson Corporation Vacuum evaporation apparatus and method of producing electro-optical device

Also Published As

Publication number Publication date
FR2262126A1 (enrdf_load_stackoverflow) 1975-09-19
JPS50116278A (enrdf_load_stackoverflow) 1975-09-11
FR2262126B1 (enrdf_load_stackoverflow) 1976-12-31
DE2460989A1 (de) 1975-08-28
GB1429622A (en) 1976-03-24

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