US3874069A - Method of bonding silicon carbide body to a metal part - Google Patents
Method of bonding silicon carbide body to a metal part Download PDFInfo
- Publication number
- US3874069A US3874069A US450293A US45029374A US3874069A US 3874069 A US3874069 A US 3874069A US 450293 A US450293 A US 450293A US 45029374 A US45029374 A US 45029374A US 3874069 A US3874069 A US 3874069A
- Authority
- US
- United States
- Prior art keywords
- silicon carbide
- metal part
- carbide body
- self
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
Definitions
- a self-bonded silicon carbide body is treated to remove free silicon from the surface of the body and electro-plated with a metal.
- the metal plating may be subsequently bonded to a metal part, by brazing for example.
- Nickel is a metal which can be satisfactorily plated. Copper is an alternative.
- the preplating treatment of the silicon carbide body to remove free silicon may be effected by immersion in caustic alkali, for example sodium hydroxide, or in a hydrofluoric acid/nitric acid mixture.
- a self-bonded silicon carbide body was leachedin boiling 30% caustic soda solution for several hours in order to remove free silicon from the surface layer.
- the body was then plated with nickel using a standard plating solution of the following composition:
- the voltage was adjusted and plating commenced with a current of A amp until the initial bond and a com plete plated layer had formed.
- the current was then increased up to 1 amp and plating continued until the required thickness has been obtained, for example between 0.020 and 0.050 inch.
- a silicon carbide body plated in the manner described in the example so as to receive a plating layer 0.020-0.050 in thick has been bonded to stainless steels using as braze material common silver solder of composition 50% silver, 15 copper, 16 zinc and 19% cadmium.
- the flux used was Easyflo stainless steel grade which was supplied by Johnson Matthey Ltd, 81 l-Iatton Garden, London, England.
- a process for joining a metal part to a self-bonded silicon carbide body comprising the steps of treating the silicon carbide body to remove free silicon from the surface of the body, electroplating the treated body with a metal and bonding the metal plating to a metal part.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
To bond a self-bonded silicon carbide body to a metal part the self-bonded silicon carbide body is treated to remove free silicon from its surface, and electroplated with a metal. The electroplating is then bonded to the metal part.
Description
United States Patent [191 Ingleby Apr. 1,1975
[ METHOD OF BONDING SILICON CARBIDE BODY TO A METAL PART [75] Inventor: Bryan Edward Ingleby, Preston,
England [73] Assignee: United Kingdom Atomic Energy Authority, London, England [22] Filed: Mar. 12, 1974 [21] Appl. N0.: 450,293
[30] Foreign Application Priority Data Mar. 22, 1973 United Kingdom 13973/73 [52] US. Cl. 29/473.l 204/32 R [51] Int. Cl. B23k 31/02 [58] Field of Search 29/4731, 502; 204/32 R,
[56] References Cited UNITED STATES PATENTS 2,885,329 5/1959 Slatin 204/32 R 3,620,799 11/l97l Hoelscher... 29/473.1 X
Miyata et al. Heap et al.
204/32 R 29/473.l X
Primary Examiner-Carl E. Hall Attorney, Agent, or FirmLarson, Taylor and Hinds 6 Claims, No Drawings METHOD OF BONDING SILICON CARBIDE BODY TO A METAL PART BACKGROUND OF THE INVENTION This invention relates to silicon carbide bodies.
There is a requirement for the bonding of metal parts to self-bonded silicon carbide bodies, that is bodies which are formed from a pressed mixture of green silicon carbide and carbon by treatment with molten silicon or silicon vapour.
SUMMARY OF THE INVENTION According to the present invention a self-bonded silicon carbide body is treated to remove free silicon from the surface of the body and electro-plated with a metal. The metal plating may be subsequently bonded to a metal part, by brazing for example.
Nickel is a metal which can be satisfactorily plated. Copper is an alternative.
The preplating treatment of the silicon carbide body to remove free silicon may be effected by immersion in caustic alkali, for example sodium hydroxide, or in a hydrofluoric acid/nitric acid mixture.
In an example of a preferred way of carrying the invention into effect a self-bonded silicon carbide body was leachedin boiling 30% caustic soda solution for several hours in order to remove free silicon from the surface layer. The body was then plated with nickel using a standard plating solution of the following composition:
Nickel chloride 100 parts Nickel sulphate 600 parts Boric acid 70 parts Sodium formate 30 parts Tcepol 40 parts Water 2000 parts The nickel plating was carried out at 60C with a nickel anode and the silicon carbide body as cathode.
LII
The voltage was adjusted and plating commenced with a current of A amp until the initial bond and a com plete plated layer had formed. The current was then increased up to 1 amp and plating continued until the required thickness has been obtained, for example between 0.020 and 0.050 inch.
A silicon carbide body plated in the manner described in the example so as to receive a plating layer 0.020-0.050 in thick has been bonded to stainless steels using as braze material common silver solder of composition 50% silver, 15 copper, 16 zinc and 19% cadmium. The flux used was Easyflo stainless steel grade which was supplied by Johnson Matthey Ltd, 81 l-Iatton Garden, London, England.
I claim:
1. A process for joining a metal part to a self-bonded silicon carbide body, the process comprising the steps of treating the silicon carbide body to remove free silicon from the surface of the body, electroplating the treated body with a metal and bonding the metal plating to a metal part.
2. A process for joining a metal part to a self-bonded silicon carbide body as claimed in claim 1 wherein the electroplated metal is nickel.
3. A process of joining a metal part to a self-bonded silicon carbide body as claimed in claim 1 wherein the electroplated metal is copper.
4. A process ofjoining a metal part to a self-bonded silicon carbide body as claimed in claim 1 wherein the free silicon is removed by immersion of the body in caustic alkali.
5. A process of joining a metal part to a self-bonded silicon carbide body as claimed in claim 1 wherein the free silicon is removed by immersion of the body in a hydrofluoric acid/nitric acid mixture.
6. A process of joining a metal part to a self-bonded silicon carbide body as claimed in claim 1 wherein the metal part is of stainless steel.
Claims (6)
1. A PROCESS FOR JOINING A METAL PART TO A SELF-BONDED SILICON CARBIDE BODY, THE PROCESS COMPRISING THE STEPS OF TREATING THE SILICON CARBIDE BODY TO REMOVE FREE SILICON FROM THE SURFACE OF THE BODY, ELECTROPLATING THE TREATED BODY WITH A METAL AND BONDING THE METAL PLATING TO A METAL PART.
2. A process for joining a metal part to a self-bonded silicon carbide body as claimed in claim 1 wherein the electroplated metal is nickel.
3. A process of joining a metal part to a self-bonded silicon carbide body as claimed in claim 1 wherein the electroplated metal is copper.
4. A process of joining a metal part to a self-bonded silicon carbide body as claimed in claim 1 wherein the free silicon is removed by immersion of the body in caustic alkali.
5. A process of joining a metal part to a self-bonded silicon carbidE body as claimed in claim 1 wherein the free silicon is removed by immersion of the body in a hydrofluoric acid/nitric acid mixture.
6. A process of joining a metal part to a self-bonded silicon carbide body as claimed in claim 1 wherein the metal part is of stainless steel.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1397373A GB1452901A (en) | 1973-03-22 | 1973-03-22 | Silicon carbide bodies |
Publications (1)
Publication Number | Publication Date |
---|---|
US3874069A true US3874069A (en) | 1975-04-01 |
Family
ID=10032734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US450293A Expired - Lifetime US3874069A (en) | 1973-03-22 | 1974-03-12 | Method of bonding silicon carbide body to a metal part |
Country Status (4)
Country | Link |
---|---|
US (1) | US3874069A (en) |
CH (1) | CH602516A5 (en) |
DE (1) | DE2412912C2 (en) |
GB (1) | GB1452901A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4618088A (en) * | 1983-12-13 | 1986-10-21 | Saint Gobain Vitrage | Process for soldering a current connecting element and a current feed conductor of a heatable glass pane |
US4730765A (en) * | 1984-12-06 | 1988-03-15 | Tomlinson Peter N | Method of bonding by use of a phosphorus containing coating |
US4871108A (en) * | 1985-01-17 | 1989-10-03 | Stemcor Corporation | Silicon carbide-to-metal joint and method of making same |
US20080131724A1 (en) * | 2006-12-05 | 2008-06-05 | Henry Shiu-Hung Chu | Ceramic armor, methods of joining a carbide with a metal-comprising piece, and methods of metallizing carbide-comprising surfaces |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102335842A (en) * | 2010-07-16 | 2012-02-01 | 贵州红林机械有限公司 | Grinding method of aluminum alloy workpiece |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2885329A (en) * | 1951-05-10 | 1959-05-05 | Harvey L Slatin | Method for electro-nickel plating wolfram carbide |
US3620799A (en) * | 1968-12-26 | 1971-11-16 | Rca Corp | Method for metallizing a ceramic body |
US3699013A (en) * | 1969-08-26 | 1972-10-17 | Nippon Kokan Kk | Method of electroplating readily oxidizable metals |
US3813759A (en) * | 1971-09-09 | 1974-06-04 | English Electric Co Ltd | Method of brazing |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE750365C (en) * | 1940-07-07 | 1945-01-09 | Process for the electroplating of carbide-containing sintered bodies or such molten alloys made of tungsten, molybdenum, titanium or zirconium |
-
1973
- 1973-03-22 GB GB1397373A patent/GB1452901A/en not_active Expired
-
1974
- 1974-03-12 US US450293A patent/US3874069A/en not_active Expired - Lifetime
- 1974-03-18 DE DE2412912A patent/DE2412912C2/en not_active Expired
- 1974-03-22 CH CH404974A patent/CH602516A5/xx not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2885329A (en) * | 1951-05-10 | 1959-05-05 | Harvey L Slatin | Method for electro-nickel plating wolfram carbide |
US3620799A (en) * | 1968-12-26 | 1971-11-16 | Rca Corp | Method for metallizing a ceramic body |
US3699013A (en) * | 1969-08-26 | 1972-10-17 | Nippon Kokan Kk | Method of electroplating readily oxidizable metals |
US3813759A (en) * | 1971-09-09 | 1974-06-04 | English Electric Co Ltd | Method of brazing |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4618088A (en) * | 1983-12-13 | 1986-10-21 | Saint Gobain Vitrage | Process for soldering a current connecting element and a current feed conductor of a heatable glass pane |
US4730765A (en) * | 1984-12-06 | 1988-03-15 | Tomlinson Peter N | Method of bonding by use of a phosphorus containing coating |
US4871108A (en) * | 1985-01-17 | 1989-10-03 | Stemcor Corporation | Silicon carbide-to-metal joint and method of making same |
US20080131724A1 (en) * | 2006-12-05 | 2008-06-05 | Henry Shiu-Hung Chu | Ceramic armor, methods of joining a carbide with a metal-comprising piece, and methods of metallizing carbide-comprising surfaces |
Also Published As
Publication number | Publication date |
---|---|
CH602516A5 (en) | 1978-07-31 |
GB1452901A (en) | 1976-10-20 |
DE2412912A1 (en) | 1974-09-26 |
DE2412912C2 (en) | 1985-04-18 |
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