US3854069A - Method of making an electrical contact for a color pickup tube - Google Patents

Method of making an electrical contact for a color pickup tube Download PDF

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Publication number
US3854069A
US3854069A US00308656A US30865672A US3854069A US 3854069 A US3854069 A US 3854069A US 00308656 A US00308656 A US 00308656A US 30865672 A US30865672 A US 30865672A US 3854069 A US3854069 A US 3854069A
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US
United States
Prior art keywords
metal post
coating
electrical contact
faceplate assembly
post
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00308656A
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English (en)
Inventor
S Tagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
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Sony Corp
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Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
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Publication of US3854069A publication Critical patent/US3854069A/en
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Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F11/00—Compounds of calcium, strontium, or barium
    • C01F11/20—Halides
    • C01F11/24—Chlorides
    • C01F11/32—Purification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L97/00—Compositions of lignin-containing materials
    • C08L97/02—Lignocellulosic material, e.g. wood, straw or bagasse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/92—Means forming part of the tube for the purpose of providing electrical connection to it
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/28—Manufacture of leading-in conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Definitions

  • the present invention relates to an electrical contact for use in a color television camera and a method for making such a contact and more particularly to a hermetically sealed conductive post which passes through the face of a television camera tube to contact a transparent electrode disposed on the interior face of the front plate of the television camera tube.
  • a transparent electrode is disposed on an interior glass face of a color television camera and an electrical contact is passed through the glass face to provide a current connection to the transparent electrode.
  • the plate is polish-ground, including the projecting portions of the wire, and contacts are thereafter made to the fused wire.
  • the deposition process for such a Nesa layer is strongly corrosive and the fused contact wire is thereby corroded.
  • Furthermore the corrosive Nesa layer can creep into the inner space between the glass and the fused wire to oxidize the surface of the wire.
  • fused wire connections are expensive and are often not vacuum tight.
  • a connection is made to the conductive Nesa layer by drilling a hole through the glass face and depositing the Nesa layer on the interior surface of the glass plate, including at least a portion of the hole through the glass. Thereafter an indium plug is inserted from the front side of the glass plate through the hole to contact the Nesa layer.
  • a neutral material such as a synthetic resin
  • the present invention of an improved electrical contact for use with an image signal pickup tube of the type having a transparent faceplate assembly which has an inner and outer surface and at least one hole passing through the assembly between them and an electrode disposed on its inner surface
  • the improved electrical contact of the invention including a metal post having a main portion whose diameter is less than the diameter of the faceplate hole and an enlarged head portion whose diameter is greater than the diameter of the faceplate hole, the main portion of the post being coated with a deformable metal.
  • the coated main portion of the metal post is disposed in the faceplate hole and extends therethrough.
  • a portion of the coating on the end of the metal post adjacent to the interior surface of the faceplate assembly is deformed to contact the electrode and to provide a hermetic seal against the electrode and the faceplate assembly interior surface.
  • the deformable metal coating is indium.
  • the enlarged head portion of the metal post is disposed adjacent the exterior surface of the faceplate assembly.
  • the end of the metal post which is adjacent the interior surfaces of the faceplate assembly is covered with a photoconductive layer.
  • the metal post is coated with the deformable metal, such as indium, by dipping the metal post, made of a material such as copper, into a heated bath comprised of a lower layer of liquid indium covered by an upper layer of non-volatilized glycerine or other type of alcohol compound having a high surface tension and then quickly withdrawing the indium coated post. Prior to the coating the metal post is prepared by stripping away,
  • the indium coating on the post is tapered at its lower end.
  • the orientation of the post is such that the lower end corresponds to the main portion of the post whose diameter is less than the diameter of the faceplate hole.
  • FIGS. 1A, 1B, 1C and 1D show in sequence the method of making one embodiment of an electrical contact according to the invention
  • FIG. 2 is a plan view showing the arrangement of the indexing electrodes on the faceplate assembly of an image pickup tube prior to the installation of an electrical contact according to the invention
  • FIG. 3 is a sectional view taken generally along the line 33 of FIG. 2;
  • FIGS. 4A, 4B, 4C and 4D are sectional views illustrating the installation of an electrical contact in the faceplate assembly depicted in FIG. 2 by a method according to the invention.
  • the electrical contact comprises a metal post made of a conductive material such as copper.
  • the post has a main portion 12 and an enlarged head portion 14.
  • the oxide layer on the post 10 is first removed by an acid bath, such as a bath of hydrochloric acid.
  • the post 10 is immersed in a heated bath contained in a beaker 22 having a lower layer of dissolved indium 16 covered by a layer of dissolved glycerine 18.
  • the two layer bath is maintained at a temperature of less than 200 C. so that the glycerine is not allowed to volatilize.
  • the bath is maintained at a temperature of approximately 180C.
  • the purpose of using the layer of dissolved glycerine is to prevent the indium from being reacted with the atmosphere and also because the glycerine has a strong surface tension.
  • glycol is substituted for glycerine.
  • the bath is maintained at this temperature by a heater 20.
  • the head portion. 14 of the metal post is temporarily affixed to the end of a rod 11 and is immersed in the bath until it reaches the indium layer. Thereafter the metal post is quickly lifted upwardly from the bath as illustrated in FIG. 1C.
  • the surface of the main portion 12 of the post 10 is coated with a layer 24 of indium. Since the orientation of the post 10 when it is immersed and withdrawn from the bath is such that the enlarged head portion 14 is directed upwardly, the surface tension of the glycerine tapers the coating at the lower end.
  • the indium coating is hardened.
  • the coating is hermetically sealed to the post 10 as is illustrated in FIG. 10.
  • the coated metal post is thus ready to be used in the form of a rivet by a technician who assembles the faceplate assembly of the image pickup tube.
  • the interior surface of the television camera faceplate assembly 25 is illustrated.
  • the assembly initially has a transparent conductive layer, for example, of tin oxide, deposited over the entire area of the interior surface of a thin glass plate 26.
  • the interior surface of the plate 26 is then subjected to photoetching to remove selected portions of the conductive layer so that the remaining portions form two interleaved, comb-shaped indexing electrodes A and B and a surrounding electrode C.
  • the surface of the glass plate 26 facing away from the electrodes A, B and C is bonded, as by adhesive, to a glass plate 28 which may have a striped color filter F formed thereon, for example (FIG. 3). Holes 30 are bored, by the use of ultrasonic waves for example, through the plates 26 and 28 at locations within the spines or bus-bar portions of the electrodes A and B and each receives a conductive post 10 of the type described with reference to FIGS. lA-lD in a manner to be described below.
  • FIGS. 4A-4D there is shown in sectional view a portion of the faceplate assembly 25 of an image pickup tube in which the electrical contact of the invention is inserted.
  • the metal post 10 coated with indium 24 has its main portion 12 inserted within the hole 30 in the faceplate assembly 25.
  • the diameter of the main portion 12 of the electrical post 10 is smaller than the internal diameter of the hole 30.
  • the diameter of the enlarged head portion 14 of the metal post is larger than the diameter of the faceplate hole 30 so that the head portion 14 of the metal post remains adjacent to the exterior surface of the glass plate 28.
  • the indium coating is essentially a deformable metal and when the metal post 10 is inserted into the hole 30 with the desired force, for example from 2 to 3 Kg/cm the portion of the coating 24 around the enlarged head 14 hermetically seals the bore 30 at the juncture of the exterior surface of the glass plate 28 and the metal post 10.
  • the length of the metal post l0 is sufficient to project slightly beyond the interior surface of the faceplate assembly and the electrode A or B through the hole 30.
  • This projecting end of the main portion 12 of the post 10 is next covered with a layer of polytetrafluroethylene (available commercially under the tradename Teflon) 32.
  • Teflon polytetrafluroethylene
  • the Teflon sheet and the metal post 10 are subjected to a pressure of from 2 to 3 Kg/cm to spread the indium coating 24 over the Nesa layer A or B and to make an electrical contact be tween the coating 24 and the electrode layer A or B.
  • This also hermetically seals the bore 30 between the metal post 10 and the electrodes A or B.
  • the Teflon sheet 32 is thereafter removed and a photoconductive layer 34 (FIG. 4C) is vapor deposited over the electrodes A and B and the flattened indium coating 24.
  • the faceplate assembly is then attached and hermetically sealed to the main body 36 of the image pickup tube by a ring shaped indium layer 38 around the peripheral edges of the faceplate assembly 25.
  • the indium layer 38 is covered with a ring electrode 40.
  • the ring electrode 40 and indium layer 38 are manufactured by stripping a stainless steel ring of its oxide coating and then dipping it in an indium-glycerine bath as described above with reference to FIGS. lA-lC to indium coat its inner surface.
  • the indium coated ring electrode is thereafter attached to the outer, end edge of the main body 36 and the outer peripheral surface of the faceplate assembly by force fitting to effect the hermetic seal with the faceplate assembly 25.
  • a method of making an electrical contact with a conductive layer formed on a portion of a nonconductive substrate in an image signal pickup device comprising the steps of coating at least a portion of the external surface of a metal post with an electrically conductive, deformable material, boring a hole through the substrate, inserting the coated metal post into the substrate hole from the outside surface of the substrate and pressing the metal coated post at both ends with a predetermined force to hermetically seal the post coating with the interior surface of the hole, deforming a portion of the coating to contact conductive layer on the interior surface of the substrate and to form a hermetic seal therewith.
  • a method of making an electrical contact as recited in claim 5 wherein the step of coating the portion of the external surface of the metal post comprises the steps of immersing at least a main portion of the metal post in a heated bath containing a lower layer of dissolved indium and an upper layer of dissolved glycerine and forming a taper toward the lower end of the main portion of the metal post in the coating by withdrawing the indium coated metal post rapidly from the bath.
  • a method of making an electrical contact as recited in claim 6 wherein the step of coating the external surface of the metal post comprises the step of immersing at least a main portion of the metal post in a heated bath containing a layer of dissolved indium and an upper layer of dissolved glycol.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Geology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)
US00308656A 1971-11-27 1972-11-22 Method of making an electrical contact for a color pickup tube Expired - Lifetime US3854069A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46095639A JPS4860529A (sv) 1971-11-27 1971-11-27

Publications (1)

Publication Number Publication Date
US3854069A true US3854069A (en) 1974-12-10

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ID=14143067

Family Applications (1)

Application Number Title Priority Date Filing Date
US00308656A Expired - Lifetime US3854069A (en) 1971-11-27 1972-11-22 Method of making an electrical contact for a color pickup tube

Country Status (9)

Country Link
US (1) US3854069A (sv)
JP (1) JPS4860529A (sv)
BE (1) BE514701A (sv)
CA (1) CA960285A (sv)
DE (1) DE2258019A1 (sv)
FR (1) FR2163111A5 (sv)
GB (1) GB1391563A (sv)
IT (1) IT973746B (sv)
NL (2) NL172902C (sv)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2522971A1 (de) * 1974-05-23 1975-12-04 Sony Corp Elektrodenanordnung
US4025815A (en) * 1974-06-14 1977-05-24 Sony Corporation Pick-up tube having photoconductor on zinc oxide layer
US4278912A (en) * 1978-06-24 1981-07-14 U.S. Philips Corporation Electric discharge tube having a glass-sealed electric leadthrough and method of manufacturing such an electric leadthrough
US20090120317A1 (en) * 2002-06-20 2009-05-14 Metal Storm Limited Cartridge assembly for multiple projectiles
US20140021174A1 (en) * 2012-07-23 2014-01-23 Fuji Kihan Co., Ltd. Method for reinforcing welding tip and welding tip

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54134922A (en) * 1978-04-12 1979-10-19 Hitachi Ltd Pickup tube

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2928968A (en) * 1959-02-27 1960-03-15 Paramount Pictures Corp Cathode-ray tube switching grid support system
US3040124A (en) * 1956-06-25 1962-06-19 Armour Res Found Transducer head system
US3379822A (en) * 1964-07-18 1968-04-23 Philips Corp Electric conductor suitable for being sealed in the wall of an electric discharge tube
US3582978A (en) * 1969-08-28 1971-06-01 Tektronix Inc Rivet-shaped electrical lead-through contact
US3665239A (en) * 1970-11-12 1972-05-23 Tektronix Inc Electrical lead-in tubular socket member for electronic tubes
US3675062A (en) * 1966-02-11 1972-07-04 Fernseh Gmbh Method and apparatus for connecting to a nesa layer
US3714488A (en) * 1970-09-19 1973-01-30 Matsushita Electronics Corp Pick-up tube envelope sealant extending into groove of annular target support
US3721752A (en) * 1970-12-24 1973-03-20 Sony Corp Image pickup tube

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3040124A (en) * 1956-06-25 1962-06-19 Armour Res Found Transducer head system
US2928968A (en) * 1959-02-27 1960-03-15 Paramount Pictures Corp Cathode-ray tube switching grid support system
US3379822A (en) * 1964-07-18 1968-04-23 Philips Corp Electric conductor suitable for being sealed in the wall of an electric discharge tube
US3675062A (en) * 1966-02-11 1972-07-04 Fernseh Gmbh Method and apparatus for connecting to a nesa layer
US3582978A (en) * 1969-08-28 1971-06-01 Tektronix Inc Rivet-shaped electrical lead-through contact
US3714488A (en) * 1970-09-19 1973-01-30 Matsushita Electronics Corp Pick-up tube envelope sealant extending into groove of annular target support
US3665239A (en) * 1970-11-12 1972-05-23 Tektronix Inc Electrical lead-in tubular socket member for electronic tubes
US3721752A (en) * 1970-12-24 1973-03-20 Sony Corp Image pickup tube

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2522971A1 (de) * 1974-05-23 1975-12-04 Sony Corp Elektrodenanordnung
US3980917A (en) * 1974-05-23 1976-09-14 Sony Corporation Photo-electrode structure
US4025815A (en) * 1974-06-14 1977-05-24 Sony Corporation Pick-up tube having photoconductor on zinc oxide layer
US4278912A (en) * 1978-06-24 1981-07-14 U.S. Philips Corporation Electric discharge tube having a glass-sealed electric leadthrough and method of manufacturing such an electric leadthrough
US20090120317A1 (en) * 2002-06-20 2009-05-14 Metal Storm Limited Cartridge assembly for multiple projectiles
US20140021174A1 (en) * 2012-07-23 2014-01-23 Fuji Kihan Co., Ltd. Method for reinforcing welding tip and welding tip

Also Published As

Publication number Publication date
NL172902C (nl) 1983-11-01
NL81793C (sv)
NL172902B (nl) 1983-06-01
BE514701A (sv)
FR2163111A5 (sv) 1973-07-20
DE2258019A1 (de) 1973-05-30
IT973746B (it) 1974-06-10
CA960285A (en) 1974-12-31
NL7216073A (sv) 1973-05-29
JPS4860529A (sv) 1973-08-24
GB1391563A (en) 1975-04-23

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