US3821692A - Slotted electrical connector of copperbased alloy separated from an indium coating by a barrier layer - Google Patents

Slotted electrical connector of copperbased alloy separated from an indium coating by a barrier layer Download PDF

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Publication number
US3821692A
US3821692A US00298809A US29880972A US3821692A US 3821692 A US3821692 A US 3821692A US 00298809 A US00298809 A US 00298809A US 29880972 A US29880972 A US 29880972A US 3821692 A US3821692 A US 3821692A
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US
United States
Prior art keywords
indium
contact
layer
wire
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00298809A
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English (en)
Inventor
R Barnard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Bell Telephone Laboratories Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bell Telephone Laboratories Inc filed Critical Bell Telephone Laboratories Inc
Priority to US00298809A priority Critical patent/US3821692A/en
Priority to CA170,331A priority patent/CA990376A/en
Priority to SE7313717A priority patent/SE383233B/xx
Priority to ES419851A priority patent/ES419851A1/es
Priority to AU61374/73A priority patent/AU494611B2/en
Priority to BE136718A priority patent/BE806108A/xx
Priority to AR250505A priority patent/AR196457A1/es
Priority to GB4806273A priority patent/GB1439060A/en
Priority to DE2351780A priority patent/DE2351780C2/de
Priority to IT70078/73A priority patent/IT996851B/it
Priority to FR7337212A priority patent/FR2204056B1/fr
Priority to CH1463573A priority patent/CH564856A5/xx
Priority to JP48116977A priority patent/JPS5247839B2/ja
Application granted granted Critical
Publication of US3821692A publication Critical patent/US3821692A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
    • H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
    • H01R4/2445—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members having additional means acting on the insulation or the wire, e.g. additional insulation penetrating means, strain relief means or wire cutting knives
    • H01R4/245—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members having additional means acting on the insulation or the wire, e.g. additional insulation penetrating means, strain relief means or wire cutting knives the additional means having two or more slotted flat portions
    • H01R4/2454—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members having additional means acting on the insulation or the wire, e.g. additional insulation penetrating means, strain relief means or wire cutting knives the additional means having two or more slotted flat portions forming a U-shape with slotted branches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors

Definitions

  • Connectors for interconnecting a plurality of insulated wires are widely used and are known as solderless connectors.”
  • Typical of such connectors is that disclosed by E. .I. Levin et al. in U.S. Pat. No. 3,0l2,2l9, dated Dec. 5, l96l.
  • These connectors include a metal contact, such as phosphor bronze or brass, formed in a U-shape with slots in the open legs of the U and extending inward from the free edge.
  • J. P. Pasternak proposed, in U.S. Pat. No. 3.5l 1,921 dated May 12, 1970, that the contact member be plated with indium.
  • Indium is nonoxidizing, solid but readily flowable and conductive. It is self-annealing and does not work-harden under compression. As a result, the indium was able to penetrate small cracks in the oxide layer and make contact with the underlying aluminum conductor. At the same time, a gas tight seal was formed preventing further oxidation at the interface.
  • indium plated contacts make excellent connections to aluminum conductors, indium is relatively expensive and it has been found that such contacts have a surprisingly short shelf life.
  • the short shelf life has been found to result from the formation of a hard, brittle alloy of the copper in the contact and the indium at the contact/plating interface.
  • the interdiffusion and alloying of the copper of the contact with the inditfm has been shown to be quite fast, even at room temperature. By way of illustration, it has been found that the time to alloy 0.2 mils of indium is only years at room temperature. If compliant or elemental indium is not present when the connection is first made, metal-to-metal contact may not be established and the connection may not be reliable. Since elemental indium must be present when the connection is first made to ensure good electrical contact, it can be seen that the effective shelf life is probably somewhat less than the 5-year period.
  • a phosphor-bronze contact is plated with a 0.1 mil thickness of nickel followed by 0.2 mil thickness of indium.
  • FIG. 1 is a perspective view of a portion of a connector contact embodying the barrier layer of my invention
  • FIG. 2 is a cross-section view of the conductor/contact interface for a prior art connector
  • FIG. 3 is a cross-section view of the conductor/contact interface for the contact shown in FIG. 1.
  • FIG. 1 An embodiment of my invention is shown in FIG. 1 where a contact 14 is formed in a U-shape with wire receiving slots 13 extending inward from the open end of the U. Contact is established between contact 14 and conductor 12 of wire 11, which has been forced into slot 13.
  • a contact 14 is formed in a U-shape with wire receiving slots 13 extending inward from the open end of the U. Contact is established between contact 14 and conductor 12 of wire 11, which has been forced into slot 13.
  • the contact 14 shown in FIG. 1 has a 0.1 mil plating of nickel over a formed phosphor bronze part followed by 0.2 mils of plated indium.
  • plating thicknesses specified herein are I applicable over substantially all of the surfaces of contact 14, the specific region referred to is the sidewall of slot 13. Since wire 11 is forced into slot 13 to pierce the insulation and make contact with conductor 12, the region of particular significance for connection purposes is the area of contact between the sidewall and the conductor.
  • FIG. 2 A prior art contact is shown in FIG. 2.
  • the underlying contact 20 is a formed phosphor bronze piece.
  • Contact 20 is then plated with a 0.4 mil thickness of indium.
  • the region of elemental indium 22 has been severely diminished by the formation of alloy 21 by diffusion.
  • the remaining region of elemental indium 22 is only marginally usable to establish a stable connection to aluminum conductor 12.
  • Contact 14 comprises an underlying phosphor bronze piece 25 plated with 0.1 mil thickness of nickel 26 followed by 0.2 mil thickness plating of indium 27.
  • the indium layer 27 makes contact with conductor 12.
  • the reduced thickness of the indium is made possible due to the barrier layer 26 which prevents alloying in indium layer 27.
  • substantially the entire plated thickness of layer 27 is useful, without the necessity of overplating to accommodate deterioration due to aging and alloy formation.
  • the indicated thicknesses of layers 26 and 27 are nominal only.
  • the nickel layer 26 could be as thin as approximately 0.07 mil before the porosity of the layer would become prohibitive. Conversely, a thickness exceeding about 0.12 mils would unduly stiffen the contact and deleteriously affect the connectors performance by excessively notching the aluminum conductors as they are forced into the slots in the contact.
  • the thickness of layer 27 should be at least 0.2 mil to be effective, there is no real upper limit to the thickness. Since the excess indium is essentially wiped of the contact by the inserted wire, thicker layers of indium merely increase the excess.
  • nickel is not the only suitable material for the blocking layer. In searching for suitable materials for this-layer, certain criteria were first established.
  • a blocking layer of metal is used to prevent an indium/- copper interface from being established.
  • the perfect metal for such a blocking layer would interdiffuse very slowly (if at all) with copper and indium, and would form no intermediate phases with either.
  • indium containing systems reveal that indium is completely soluble in very few metals, and in general forms many intermetallic phases due to partial solid solubility.
  • the metals in which indium is soluble are generally those in which extremely rapid interstitial diffusion of copper occurs. Thus, little is gained by these metals in terms of blocking capabilities.
  • Metals which form intermetallic phases with indium are unsuitable if the rate of interdiffusion is so fast that the barrier layer/indium intermetallic phase forms at the same rate as the copper/indium intermetallic phase.
  • a metal which is insoluble in indium would be satisfactory, but many are difficult to plate.
  • plating the phosphor bronze contact with a blocking layer of aluminum prior to the plating of the indium would be effective.
  • the plating of aluminum on bronze is both expensive and dangerous since it must be done under airless conditions in an ether-based solutron.
  • the interdiffusion of lead and indium causes the two metals to rapidly lose their identities.
  • an alloy does form at the copper/barrier layer interface, but at a much slower rate than at the copper-indium interface.
  • an intermediate phase of lead-indium forms, it retains many properties of the constituent metals. It is quite safe and has a low tensile strength. Electrical resistance tests reveal an excellent resistance aging characteristic.
  • nickel and indium interdiffuse rapidly at elevated temperatures near the melting point of indium, it was found, quite surprisingly, that nickel and indium interdiffuse very slowly at temperatures below that melting point. For example, it
  • the composite plating represents improvements over the heavier indium plating.
  • nickel is relatively cheap and easy to plate. Since indium plates readily over fresh nickel, the thinner plating of indium is easier to apply and handle than the thicker plating of indium over phosphor bronze as taught by the prior art. Cost comparisons indicate that the described composite plating will be no more expensive than the prior art plating of FIG. 2.
  • nickel has been indicated as the preferred material, it should be apparent that this assumes particular available manufacturing facilities and use environment. For example, where use of contact 14 to make a number of reterminations is planned, the utility of lead as the barrier should be seriously considered.
  • the lead-indium intermediate phase is harder than pure indium. This may be a particular advantage in this use environment by preventing the removed wires from carrying away too much plating from the contact.
  • a connector for making electrical connection to at least one wire comprising means for positioning said wire to be connected;
  • a contact of copper-based material having at least one receiving slot for wire to be connected
  • the separating means comprises a layer of metal and wherein the metal of the layer is selected from the group consisting of aluminum, iron, lead and nickel.
  • a connector in accordance with claim I wherein the layer of metal comprises nickel between 0.00007 and 0.00012 inches in thickness.
  • a connector for making electrical connection to at least one bare or insulated wire the connector being of the type including means for positioning wire to be connected, an indium plated contact of copper-based material having at least one wire receiving slot for wire to be connected, and means for mating with the positioning means to force said wire into said slot so that electrical connection is established to the conductors of the wire, wherein the improvement comprises a barrier layer of metal positioned between the contact and the indium plating, thereby maintaining electrical continuity between the contact and the indium while preventing interdiffusion and alloying between the copper of the contact and the indium wherein the layer of metal is selected from the group consisting of aluminum, iron, lead and nickel.
  • a connector in accordance with claim 3 wherein and 0.00012 inches in thickness.

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
US00298809A 1972-10-19 1972-10-19 Slotted electrical connector of copperbased alloy separated from an indium coating by a barrier layer Expired - Lifetime US3821692A (en)

Priority Applications (13)

Application Number Priority Date Filing Date Title
US00298809A US3821692A (en) 1972-10-19 1972-10-19 Slotted electrical connector of copperbased alloy separated from an indium coating by a barrier layer
CA170,331A CA990376A (en) 1972-10-19 1973-05-03 Slotted electrical connector of copper-based alloy separated from an indium coating by a barrier layer
SE7313717A SE383233B (sv) 1972-10-19 1973-10-09 Kontaktanordning.
AR250505A AR196457A1 (es) 1972-10-19 1973-10-15 Conectores para establecer conexiones electricas permanentes con conductores aislados
AU61374/73A AU494611B2 (en) 1973-10-15 Electrical connectors
BE136718A BE806108A (fr) 1972-10-19 1973-10-15 Connecteur pour etablir des connexions electriques avec un fil
ES419851A ES419851A1 (es) 1972-10-19 1973-10-15 Perfeccionamientos en los conectores para establecer cone- xiones electricas.
GB4806273A GB1439060A (en) 1972-10-19 1973-10-16 Electric connectors
DE2351780A DE2351780C2 (de) 1972-10-19 1973-10-16 Elektrischer Verbinder
IT70078/73A IT996851B (it) 1972-10-19 1973-10-17 Connettore elettrico con scana lature per il conduttore di le ga a base di rame separata mediante uno strato di sbarramento da un ri vestimento di indio
CH1463573A CH564856A5 (es) 1972-10-19 1973-10-18
FR7337212A FR2204056B1 (es) 1972-10-19 1973-10-18
JP48116977A JPS5247839B2 (es) 1972-10-19 1973-10-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00298809A US3821692A (en) 1972-10-19 1972-10-19 Slotted electrical connector of copperbased alloy separated from an indium coating by a barrier layer

Publications (1)

Publication Number Publication Date
US3821692A true US3821692A (en) 1974-06-28

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Application Number Title Priority Date Filing Date
US00298809A Expired - Lifetime US3821692A (en) 1972-10-19 1972-10-19 Slotted electrical connector of copperbased alloy separated from an indium coating by a barrier layer

Country Status (12)

Country Link
US (1) US3821692A (es)
JP (1) JPS5247839B2 (es)
AR (1) AR196457A1 (es)
BE (1) BE806108A (es)
CA (1) CA990376A (es)
CH (1) CH564856A5 (es)
DE (1) DE2351780C2 (es)
ES (1) ES419851A1 (es)
FR (1) FR2204056B1 (es)
GB (1) GB1439060A (es)
IT (1) IT996851B (es)
SE (1) SE383233B (es)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4094572A (en) * 1975-08-13 1978-06-13 Kollmorgen Technologies, Inc. Multi-wire electrical interconnecting member having a multi-wire matrix of insulated wires mechanically terminated thereon
US4822288A (en) * 1987-09-14 1989-04-18 Larry Conley Pin panel circuit board assembly
US4935312A (en) * 1987-06-25 1990-06-19 Nippon Mining Co., Ltd. Film carrier having tin and indium plated layers
US5045410A (en) * 1985-12-13 1991-09-03 Karl Neumayer, Erzeugung Und Vertrieb Von Kabeln, Drahten Isolierten Leitungen Ur Elektromaterial Gesellschaft Mit Beschrankter Haftung Low phosphorus containing band-shaped and/or filamentary material
US5619018A (en) * 1995-04-03 1997-04-08 Compaq Computer Corporation Low weight multilayer printed circuit board
US6319015B1 (en) 1999-08-23 2001-11-20 Michael J. Faunce Garment electrical connector

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3311447A1 (de) * 1983-03-29 1984-10-04 Siemens AG, 1000 Berlin und 8000 München Anschlussklemme zum abisolierfreien anschluss elektrischer leiter in verteilern von fernmeldeanlagen, insbesondere fernsprechvermittlungsanlagen
DE102009047043A1 (de) * 2009-10-19 2011-04-21 Robert Bosch Gmbh Lötfreie elektrische Verbindung
DE102010042526A1 (de) * 2010-10-15 2012-04-19 Continental Automotive Gmbh Kontaktelement

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4094572A (en) * 1975-08-13 1978-06-13 Kollmorgen Technologies, Inc. Multi-wire electrical interconnecting member having a multi-wire matrix of insulated wires mechanically terminated thereon
US5045410A (en) * 1985-12-13 1991-09-03 Karl Neumayer, Erzeugung Und Vertrieb Von Kabeln, Drahten Isolierten Leitungen Ur Elektromaterial Gesellschaft Mit Beschrankter Haftung Low phosphorus containing band-shaped and/or filamentary material
US4935312A (en) * 1987-06-25 1990-06-19 Nippon Mining Co., Ltd. Film carrier having tin and indium plated layers
US4822288A (en) * 1987-09-14 1989-04-18 Larry Conley Pin panel circuit board assembly
US5619018A (en) * 1995-04-03 1997-04-08 Compaq Computer Corporation Low weight multilayer printed circuit board
US6319015B1 (en) 1999-08-23 2001-11-20 Michael J. Faunce Garment electrical connector

Also Published As

Publication number Publication date
FR2204056A1 (es) 1974-05-17
BE806108A (fr) 1974-02-01
DE2351780B1 (de) 1974-04-04
JPS5247839B2 (es) 1977-12-05
ES419851A1 (es) 1976-05-01
FR2204056B1 (es) 1976-06-18
AR196457A1 (es) 1973-12-27
GB1439060A (en) 1976-06-09
CH564856A5 (es) 1975-07-31
AU6137473A (en) 1975-04-17
CA990376A (en) 1976-06-01
IT996851B (it) 1975-12-10
SE383233B (sv) 1976-03-01
JPS4973691A (es) 1974-07-16
DE2351780C2 (de) 1974-11-07

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