US3809626A - Electroplating on a truncated ball suitable for use in a typewriter - Google Patents

Electroplating on a truncated ball suitable for use in a typewriter Download PDF

Info

Publication number
US3809626A
US3809626A US29830872A US3809626A US 3809626 A US3809626 A US 3809626A US 29830872 A US29830872 A US 29830872A US 3809626 A US3809626 A US 3809626A
Authority
US
United States
Prior art keywords
ball
typewriter
solution
electroplating
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
Other languages
English (en)
Inventor
R Stene
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Buckbee Mears Co
Original Assignee
Buckbee Mears Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Buckbee Mears Co filed Critical Buckbee Mears Co
Priority to US29830872 priority Critical patent/US3809626A/en
Priority to CA177,062A priority patent/CA1028978A/en
Priority to JP11243773A priority patent/JPS4974270A/ja
Priority to DE19732350820 priority patent/DE2350820A1/de
Application granted granted Critical
Publication of US3809626A publication Critical patent/US3809626A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/04Tubes; Rings; Hollow bodies
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073Multistep pretreatment
    • C23C18/208Multistep pretreatment with use of metal first
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • C23C18/24Roughening, e.g. by etching using acid aqueous solutions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/285Sensitising or activating with tin based compound or composition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal

Definitions

  • This invention relates generally to coating plastic materials with a thin layer of metal and, more specifically to preparation of a surface of a plastic typewriter ball to receive a metal coating which is electroplated onto the surface of the typewriter ball with an improved anode design.
  • a number of modern day typewriters utilize a truncated hollow sphere or ball which contains all the characters and numerals used in typing.
  • the ball is made from a lightweight material such as plastic.
  • Plastic is preferred because of its light weight and low inertia which provides the quick response necessary for high speed typing.
  • plastics do not have the required hardness and durability to withstand repeated use. Therefore, a metallic coating is placed over the interior and exterior surfaces of the plastic ball to give it the required hardness and durability.
  • plastic materials that canV be utilized for the plastic ball such as melamine formaldehyde, phenolic formaldehyde and urea formaldehyde.
  • urea formaldehyde is presently preferred because of its high strength, high impact resistance as well as the fact that there is a relatively close correlation of the coefficient thermal expansion of the urea formaldehyde and the nickel coating that is plated on the surface of the typewriter ball.
  • the invention comprises an improved process for preparing the surface of a plastic ball to receive the electroplating as well as an improved anode configuration for simultaneously plating nickel onto the interior and exterior of the truncated hollow typewriter ball.
  • FIG. 1 shows a front elevation view partially in section of a typewriter ball being plated in an electroplating bath.
  • wetting agent a solution containing approximately 15% benzophenol and 15 sodium hydroxide and .3% of a wetting agent.
  • a suitable wetting agent is manufactured and sold by Union Carbide under the tradename of Tergitol NP-l4. This particular wetting agent is a nonylphenolethylene oxide adduct, however, any variety of wetting agents are suitable for use in my invention.
  • composition of my conditioning solution of phenol, sodium hydroxide and a wetting agent is subject to wide variations from the preferred 1 to 1 ratio of phenol and sodium hydroxide. Consequently, no precise limits can be given as to the suitable and operable ranges for use in my invention.
  • the strength and exposure time in the solution generally can be varied by decreasing the exposure time with higher concentration solutions. Likewise, one can increase the time for a lower concentration solution.
  • reference numeral 10 generally designates my plating bath which contains a plating tank 11 and va plating solution 12. Located within plating solution 12 is a typewriter 'ball 9 which is shown in section. Located within the interior of typewriter ball 9 is an anode 13 and located on the exterior of ball 9 are anodes 14 and 15 which are suitably spaced around the exterior surface of typewriter ball 9. More anodes can l be used around the exterior surface of the ball to provide a more uniform distribution of plating on the exterior lsurface of the typewriter ball. If only two anodes are used, the ball can be periodically rotated to insure that a uniform plating is obtained.
  • the anodes 13, 14 and 15 are connected to a common lead 16 which goes to an external power source and the type- '.writer ball 9 is connected to a lead 17 which goes to the cally, the top of anode 13 projects to within a distance h of the top of the typewriter ball.
  • the anode can be somewhat lower but the distance h should not exceed onequarter of the dimension T of the typewriter ball. These dimensions have been found to provide uniform plating on both the interior and exterior of typewriter ball. More specifically, this prevents the build-up of plating on the edges of the ball which would interfere with the normal use of the typewriter ball.
  • a suitable electroplating bath is a nickel sulfamate solution having a pH of approximately 5.0.
  • no limitation is intended thereto as other nickel electroplating baths will also work.
  • a process for preparing the surface of a polymer of urea formaldehyde to receive a metal coating by the steps of cleaning the surface of the polymer of urea formaldehyde, and etching the surface of the polymer of urea formaldehyde, activating the surface of the polymer of urea formaldehyde followed by chemical plating of the surface of the polymer of urea formaldehyde and then electroplating a metal coating on the surface of the polymer of urea formaldehyde with the improvement in the process comprising immersingvthe surface of the polymer of urea formaldehyde in a solution of approximately 15 by weight of phenol, approximately 15% by weight of sodium hydroxide and approximately .3% by weight of a wetting agent with the remainder water, followed by rinsing the surface of the polymer of urea formaldehyde and then immersing the surface of the polymer of urea formaldehyde in an acid etching bath followed by rinsing
  • step of electroplating a metal layer onto the polymer of urea formaldehyde comprises electroplating a truncated typewriter ball of urea formaldehyde having a height T and an inside surface and an outside surface to be electroplated by placing a first anode within said truncated typewriter ball and a second anode outside said truncated ball with the top of said first anode and said second anode spaced at least a distance of 1A T below the top of said truncated typing ball to thereby produce an even layer of metal over the'inside surface and the outside surface of said truncated typewriter ball.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Chemically Coating (AREA)
US29830872 1972-10-17 1972-10-17 Electroplating on a truncated ball suitable for use in a typewriter Expired - Lifetime US3809626A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US29830872 US3809626A (en) 1972-10-17 1972-10-17 Electroplating on a truncated ball suitable for use in a typewriter
CA177,062A CA1028978A (en) 1972-10-17 1973-07-23 Method of electroplating on a truncated plastic ball suitable for use in a typewriter
JP11243773A JPS4974270A (de) 1972-10-17 1973-10-08
DE19732350820 DE2350820A1 (de) 1972-10-17 1973-10-10 Vorbehandlungsverfahren zum ueberziehen von kunststoffen mit einer duennen metallschicht

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29830872 US3809626A (en) 1972-10-17 1972-10-17 Electroplating on a truncated ball suitable for use in a typewriter

Publications (1)

Publication Number Publication Date
US3809626A true US3809626A (en) 1974-05-07

Family

ID=23149944

Family Applications (1)

Application Number Title Priority Date Filing Date
US29830872 Expired - Lifetime US3809626A (en) 1972-10-17 1972-10-17 Electroplating on a truncated ball suitable for use in a typewriter

Country Status (4)

Country Link
US (1) US3809626A (de)
JP (1) JPS4974270A (de)
CA (1) CA1028978A (de)
DE (1) DE2350820A1 (de)

Also Published As

Publication number Publication date
CA1028978A (en) 1978-04-04
JPS4974270A (de) 1974-07-17
DE2350820A1 (de) 1974-04-18

Similar Documents

Publication Publication Date Title
US3772056A (en) Sensitized substrates for chemical metallization
US4169171A (en) Bright electroless plating process and plated articles produced thereby
EP0497925B1 (de) Herstellung von leiterplatten unter benutzung selektiv ätzbarer metallschichten
US20090202862A1 (en) Electroplated device and preparation method thereof
US3033703A (en) Electroless plating of copper
US3666529A (en) Method of conditioning aluminous surfaces for the reception of electroless nickel plating
US3096182A (en) Chemical plating solution and process for plating therewith
US3591352A (en) Processes for selectively plating one component of multi-component plastic articles and articles produced thereby
US3661538A (en) Plastics materials having electrodeposited metal coatings
US3553085A (en) Method of preparing surfaces of plastic for electro-deposition
US3377174A (en) Method and bath for chemically plating copper
US3867174A (en) Baths for activating the surface of plastics to be chemically metal-plated
US3809626A (en) Electroplating on a truncated ball suitable for use in a typewriter
KR930002744B1 (ko) 니켈 도금액, 구리-니켈-크롬 또는 니켈-크롬 전기도금 방법 및 이 도금 방법에 의한 도금 피막
US3640765A (en) Selective deposition of metal
JPS6232278B2 (de)
US3154478A (en) Chemical nickel plating processes and baths and methods of making printed electric circuits
US3681211A (en) Electroplating a black nickel-zinc alloy deposit
JPS6187894A (ja) チタン素材用メツキ法
US3632388A (en) Preactivation conditioner for electroless metal plating system
US3516848A (en) Process and solution for sensitizing substrates for electroless plating
Courduvelis Plating on plastics
US3634207A (en) Nickel etching and plating bath
US3671289A (en) Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating
US20060260780A1 (en) Use of an object as shaping tool