US3809626A - Electroplating on a truncated ball suitable for use in a typewriter - Google Patents
Electroplating on a truncated ball suitable for use in a typewriter Download PDFInfo
- Publication number
- US3809626A US3809626A US29830872A US3809626A US 3809626 A US3809626 A US 3809626A US 29830872 A US29830872 A US 29830872A US 3809626 A US3809626 A US 3809626A
- Authority
- US
- United States
- Prior art keywords
- ball
- typewriter
- solution
- electroplating
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Definitions
- This invention relates generally to coating plastic materials with a thin layer of metal and, more specifically to preparation of a surface of a plastic typewriter ball to receive a metal coating which is electroplated onto the surface of the typewriter ball with an improved anode design.
- a number of modern day typewriters utilize a truncated hollow sphere or ball which contains all the characters and numerals used in typing.
- the ball is made from a lightweight material such as plastic.
- Plastic is preferred because of its light weight and low inertia which provides the quick response necessary for high speed typing.
- plastics do not have the required hardness and durability to withstand repeated use. Therefore, a metallic coating is placed over the interior and exterior surfaces of the plastic ball to give it the required hardness and durability.
- plastic materials that canV be utilized for the plastic ball such as melamine formaldehyde, phenolic formaldehyde and urea formaldehyde.
- urea formaldehyde is presently preferred because of its high strength, high impact resistance as well as the fact that there is a relatively close correlation of the coefficient thermal expansion of the urea formaldehyde and the nickel coating that is plated on the surface of the typewriter ball.
- the invention comprises an improved process for preparing the surface of a plastic ball to receive the electroplating as well as an improved anode configuration for simultaneously plating nickel onto the interior and exterior of the truncated hollow typewriter ball.
- FIG. 1 shows a front elevation view partially in section of a typewriter ball being plated in an electroplating bath.
- wetting agent a solution containing approximately 15% benzophenol and 15 sodium hydroxide and .3% of a wetting agent.
- a suitable wetting agent is manufactured and sold by Union Carbide under the tradename of Tergitol NP-l4. This particular wetting agent is a nonylphenolethylene oxide adduct, however, any variety of wetting agents are suitable for use in my invention.
- composition of my conditioning solution of phenol, sodium hydroxide and a wetting agent is subject to wide variations from the preferred 1 to 1 ratio of phenol and sodium hydroxide. Consequently, no precise limits can be given as to the suitable and operable ranges for use in my invention.
- the strength and exposure time in the solution generally can be varied by decreasing the exposure time with higher concentration solutions. Likewise, one can increase the time for a lower concentration solution.
- reference numeral 10 generally designates my plating bath which contains a plating tank 11 and va plating solution 12. Located within plating solution 12 is a typewriter 'ball 9 which is shown in section. Located within the interior of typewriter ball 9 is an anode 13 and located on the exterior of ball 9 are anodes 14 and 15 which are suitably spaced around the exterior surface of typewriter ball 9. More anodes can l be used around the exterior surface of the ball to provide a more uniform distribution of plating on the exterior lsurface of the typewriter ball. If only two anodes are used, the ball can be periodically rotated to insure that a uniform plating is obtained.
- the anodes 13, 14 and 15 are connected to a common lead 16 which goes to an external power source and the type- '.writer ball 9 is connected to a lead 17 which goes to the cally, the top of anode 13 projects to within a distance h of the top of the typewriter ball.
- the anode can be somewhat lower but the distance h should not exceed onequarter of the dimension T of the typewriter ball. These dimensions have been found to provide uniform plating on both the interior and exterior of typewriter ball. More specifically, this prevents the build-up of plating on the edges of the ball which would interfere with the normal use of the typewriter ball.
- a suitable electroplating bath is a nickel sulfamate solution having a pH of approximately 5.0.
- no limitation is intended thereto as other nickel electroplating baths will also work.
- a process for preparing the surface of a polymer of urea formaldehyde to receive a metal coating by the steps of cleaning the surface of the polymer of urea formaldehyde, and etching the surface of the polymer of urea formaldehyde, activating the surface of the polymer of urea formaldehyde followed by chemical plating of the surface of the polymer of urea formaldehyde and then electroplating a metal coating on the surface of the polymer of urea formaldehyde with the improvement in the process comprising immersingvthe surface of the polymer of urea formaldehyde in a solution of approximately 15 by weight of phenol, approximately 15% by weight of sodium hydroxide and approximately .3% by weight of a wetting agent with the remainder water, followed by rinsing the surface of the polymer of urea formaldehyde and then immersing the surface of the polymer of urea formaldehyde in an acid etching bath followed by rinsing
- step of electroplating a metal layer onto the polymer of urea formaldehyde comprises electroplating a truncated typewriter ball of urea formaldehyde having a height T and an inside surface and an outside surface to be electroplated by placing a first anode within said truncated typewriter ball and a second anode outside said truncated ball with the top of said first anode and said second anode spaced at least a distance of 1A T below the top of said truncated typing ball to thereby produce an even layer of metal over the'inside surface and the outside surface of said truncated typewriter ball.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Chemically Coating (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29830872 US3809626A (en) | 1972-10-17 | 1972-10-17 | Electroplating on a truncated ball suitable for use in a typewriter |
CA177,062A CA1028978A (en) | 1972-10-17 | 1973-07-23 | Method of electroplating on a truncated plastic ball suitable for use in a typewriter |
JP11243773A JPS4974270A (de) | 1972-10-17 | 1973-10-08 | |
DE19732350820 DE2350820A1 (de) | 1972-10-17 | 1973-10-10 | Vorbehandlungsverfahren zum ueberziehen von kunststoffen mit einer duennen metallschicht |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29830872 US3809626A (en) | 1972-10-17 | 1972-10-17 | Electroplating on a truncated ball suitable for use in a typewriter |
Publications (1)
Publication Number | Publication Date |
---|---|
US3809626A true US3809626A (en) | 1974-05-07 |
Family
ID=23149944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29830872 Expired - Lifetime US3809626A (en) | 1972-10-17 | 1972-10-17 | Electroplating on a truncated ball suitable for use in a typewriter |
Country Status (4)
Country | Link |
---|---|
US (1) | US3809626A (de) |
JP (1) | JPS4974270A (de) |
CA (1) | CA1028978A (de) |
DE (1) | DE2350820A1 (de) |
-
1972
- 1972-10-17 US US29830872 patent/US3809626A/en not_active Expired - Lifetime
-
1973
- 1973-07-23 CA CA177,062A patent/CA1028978A/en not_active Expired
- 1973-10-08 JP JP11243773A patent/JPS4974270A/ja active Pending
- 1973-10-10 DE DE19732350820 patent/DE2350820A1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
CA1028978A (en) | 1978-04-04 |
JPS4974270A (de) | 1974-07-17 |
DE2350820A1 (de) | 1974-04-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3772056A (en) | Sensitized substrates for chemical metallization | |
US4169171A (en) | Bright electroless plating process and plated articles produced thereby | |
EP0497925B1 (de) | Herstellung von leiterplatten unter benutzung selektiv ätzbarer metallschichten | |
US20090202862A1 (en) | Electroplated device and preparation method thereof | |
US3033703A (en) | Electroless plating of copper | |
US3666529A (en) | Method of conditioning aluminous surfaces for the reception of electroless nickel plating | |
US3096182A (en) | Chemical plating solution and process for plating therewith | |
US3591352A (en) | Processes for selectively plating one component of multi-component plastic articles and articles produced thereby | |
US3661538A (en) | Plastics materials having electrodeposited metal coatings | |
US3553085A (en) | Method of preparing surfaces of plastic for electro-deposition | |
US3377174A (en) | Method and bath for chemically plating copper | |
US3867174A (en) | Baths for activating the surface of plastics to be chemically metal-plated | |
US3809626A (en) | Electroplating on a truncated ball suitable for use in a typewriter | |
KR930002744B1 (ko) | 니켈 도금액, 구리-니켈-크롬 또는 니켈-크롬 전기도금 방법 및 이 도금 방법에 의한 도금 피막 | |
US3640765A (en) | Selective deposition of metal | |
JPS6232278B2 (de) | ||
US3154478A (en) | Chemical nickel plating processes and baths and methods of making printed electric circuits | |
US3681211A (en) | Electroplating a black nickel-zinc alloy deposit | |
JPS6187894A (ja) | チタン素材用メツキ法 | |
US3632388A (en) | Preactivation conditioner for electroless metal plating system | |
US3516848A (en) | Process and solution for sensitizing substrates for electroless plating | |
Courduvelis | Plating on plastics | |
US3634207A (en) | Nickel etching and plating bath | |
US3671289A (en) | Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating | |
US20060260780A1 (en) | Use of an object as shaping tool |