US3808046A - Metallising pastes - Google Patents

Metallising pastes Download PDF

Info

Publication number
US3808046A
US3808046A US00248670A US24867072A US3808046A US 3808046 A US3808046 A US 3808046A US 00248670 A US00248670 A US 00248670A US 24867072 A US24867072 A US 24867072A US 3808046 A US3808046 A US 3808046A
Authority
US
United States
Prior art keywords
paste
glaze
metallising
oxide
replica
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00248670A
Other languages
English (en)
Inventor
N Davey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UK Atomic Energy Authority
Original Assignee
UK Atomic Energy Authority
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UK Atomic Energy Authority filed Critical UK Atomic Energy Authority
Application granted granted Critical
Publication of US3808046A publication Critical patent/US3808046A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Definitions

  • ABSTRACT A metallising paste suitable for forming an adherent electrically-and thermally-conductive metalcontaining deposit on a ceramic surface and having one application in providing screen-printed microcircuit conductors and a further application in providing heat abstracting pads, or heat sinks," applied to the underside of microcircuit substrates, comprises a heatvaporizable liquid medium containing as powder a glaze material and a component selected from aluminum or an alloy thereof, wherein the glaze dissolves the oxide of aluminum or aluminum alloy and wets ceramic surfaces at the fusion temperature of the glaze.
  • the glaze fuses at a temperature not greater than the melting temperature of the component.
  • This invention relates to metallising pastes which 5 plained, by way of example, by reference to the followform adherent electrically-and thermally-conductive metal-containing deposits on ceramic surfaces when fired in contact therewith and to methods for forming conductive elements on ceramic surfaces with said pastes: the invention has one application in forming microcircuit conductors on ceramic substrates and a further microcircuit application in providing pads adherent to the underside of ceramic substrates for abstracting heat from the substrates by thermal conduction.
  • a metallising paste suitable for forming an adherent electrically-and thermally-conductive metal-containing deposit on a ceramic surface comprises a heat-vaporizable liquid medium containing as powder a glaze material and a component selected from aluminum or an alloy thereof, wherein the glaze dissolves the oxide of aluminum or aluminum alloy and wets ceramic surfaces at the fusion temperature of the glaze.
  • the fused glaze By dissolving the oxide of aluminum or an alloy thereof the fused glaze renders soluble at least part of the insulating oxide film known to coat the metal particles; both the electrical and thermal conductivity of the deposit are thereby substantially increased.
  • the glaze fuses at a temperature not greater than the melting temperature of the component: it has been found that if the glaze fuses at a temperature greater than the melting temperature of the component i.e. the glaze fuses after the component is molten, the conductivity of the deposit formed is lowered.
  • the preferred glaze for use with aluminium or an aluminium alloy comprises an oxide of boron: the glaze may additionally comprise an oxide of lead.
  • a suitable liquid medium for use in a metallising paste comprising aluminium or an aluminium alloy and the preferred glaze is a polymerized cyclic ketone dissolved in a solvent such as terpineol.
  • A- suitable ceramic surface for use with such an aluminium-containing metallising paste is alumina. Surfaces other than alumina which may be used include silica or alumino-silicate surfaces.
  • Aluminium alloys which may be used in pastes according to the present invention include Al/Cu and Al/Ag alloys.
  • the invention also provides a method for forming an electrically-and thermally-conducting element on and adherent to a ceramic substrate comprising forming a replica of said element on said substrate using a metallising paste as afore-defined, drying the formed replica, firing the dried replica at a temperature not less than that at which the whole of the replica fuses, whereby the replica wets the substrate and is rendered conducting, and solidifying the fired replica to form a substrateadhering electrically-and thermally-conducting element.
  • the replica may be formed on the substrate by screen-printing.
  • the invention provides a ceramic substrate having an electricallyand thermally-conducting element formed thereon by the method of the present invention.
  • a heat-vaporizable liquid medium was mixed with aluminium powder, boric oxide and lead oxide to form a paste having a consistency suitable for screenprinting microcircuitry.
  • the liquid medium was a polymerized cyclic ketone dissolved in terpineol, a suitable medium being Engelhard 4/575 (supplied by Engelhard Industries).
  • a suitable paste contained 35 ccs of liquid medium for each gms of solids consisting of 92 gms Al, 6 gms PhD and 2 gms B 0
  • the preferred particle size of the Al powder was 1-2 p. and of the lead and boric oxides was 400 mesh.
  • the paste was screenprinted onto an alumina substrate to produce a replica of a microcircuit comprising a plurality of conducting elements.
  • the substrate used was a 96% A1 0 material supplied by Worcester Porcelain Co.
  • the substrate was fired for 50 mins.
  • the molten aluminium powder formed a conductive microcircuit replica and the molten boric oxide/lead oxide wetted the substrate by interfacial reaction therewith.
  • On subsequent cooling to ambient temperature a solidified and electrically-conductive micro circuit was formed which was bonded to the substrate by the solidified mixed oxide glaze.
  • the electrical conductivity of microcircuitry formed from air-fired replicas as aforesaid is typically 20-30 mQ/square (a square being 1 mm across) compared with, for example, values of 4 mQ/square for Au, 10-15 mQ/square for Pt/Au and 60 mQ/square for Pd/Ag.
  • the metal powder in the above embodiment is Al
  • powders of Al alloys may be used, in particular powders of Al/Cu and Al/Ag alloys.
  • the invention provides heat-abstracting elements bonded to the underside of microcircuit substrates for the removal of heat therefrom.
  • Such elements usually in the form of pads and termed heat sinks, can also be deposited as paste replicas by screen-printing and converted to thermally-conducting pads by firing and subsequent solidification. It is known in the art that the dissipation of the heat generated by high density microcircuitry presents a problem: one method of substantially reducing substrate heat is to form thermally conducting elements (heat sinks) according to the present invention.
  • a metallising paste suitable for forming an adherent electrical conductor on a ceramic surface consisting essentially of a heat-vaporizable liquid medium, a glaze powder and a component in powder form selected from Al or an alloy thereof, wherein the glaze dissolves the oxide of said component and wets ceramic surfaces at the fusion temperature of the glaze.
  • a method as claimed in claim 15 wherein the component in the paste is selected from the group consisting of an Al/Cu and Al/Ag alloy.
  • liquid medium in the paste is a polymerized cyclic ketone dissolved in a solvent.
  • a method as claimed in claim 17 wherein the glaze in the paste is capable of wetting a ceramic surface selected from the group consisting of alumina, silica and aluminosilicate.
  • liquid medium in the paste is a polymerized cyclic ketone dissolved in a solvent.
  • a method as claimed in claim 22 wherein the glaze in the paste is capable of wetting a ceramic surface selected from the group consisting of alumina, silica and aluminosilicate.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Fuses (AREA)
  • Conductive Materials (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
US00248670A 1971-05-10 1972-04-28 Metallising pastes Expired - Lifetime US3808046A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1409171A GB1378520A (en) 1971-05-10 1971-05-10 Metallising pastes

Publications (1)

Publication Number Publication Date
US3808046A true US3808046A (en) 1974-04-30

Family

ID=10034833

Family Applications (1)

Application Number Title Priority Date Filing Date
US00248670A Expired - Lifetime US3808046A (en) 1971-05-10 1972-04-28 Metallising pastes

Country Status (5)

Country Link
US (1) US3808046A (enExample)
DE (1) DE2222754C2 (enExample)
FR (1) FR2137660B1 (enExample)
GB (1) GB1378520A (enExample)
IT (1) IT958831B (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3919441A (en) * 1972-12-20 1975-11-11 Seinosuke Horiki Panel-styled calorific devices and a process for manufacturing the same
US4004052A (en) * 1974-03-08 1977-01-18 Vera Ivanovna Bystrova Process for producing non-porous coating for corundum substrates
US4039721A (en) * 1974-09-18 1977-08-02 Siemens Aktiengesellschaft Thick-layer conductor path pastes
US4047290A (en) * 1974-09-10 1977-09-13 Siemens Aktiengesellschaft Process for the production of a multi-chip wiring arrangement
US4053864A (en) * 1976-12-20 1977-10-11 Sprague Electric Company Thermistor with leads and method of making
US4278702A (en) * 1979-09-25 1981-07-14 Anthony J. Casella Method of making printed circuit board by induction heating of the conductive metal particles on a plastic substrate
GB2251677A (en) * 1991-01-09 1992-07-15 Rheinmetall Gmbh Drying thick-layer printed circuit boards
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5743185A (en) * 1995-01-17 1998-04-28 Mattel, Inc. Flexible thermally conductive stamp and material
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU516824B2 (en) * 1976-02-17 1981-06-25 Ford Motor Company Of Canada Limited Coagulating coating composition
US4323483A (en) * 1979-11-08 1982-04-06 E. I. Du Pont De Nemours And Company Mixed oxide bonded copper conductor compositions
JPS57143203A (en) * 1981-02-27 1982-09-04 Taiyo Yuden Kk Conductive paste for forming conductive layer by baking on porcelain
JPS57180112A (en) * 1981-04-30 1982-11-06 Taiyo Yuden Kk Method of forming electrode for porcelain electronic part
FR2515675A1 (fr) * 1981-11-05 1983-05-06 Comp Generale Electricite Encre conductrice pour prise de contact par serigraphie sur du silicium semi-conducteur et procede de realisation de contacts par serigraphie sur du silicium semi-conducteur
DE102005007933A1 (de) * 2005-02-10 2006-08-17 Schott Ag Verfahren zum Herstellen einer Heizleiterschicht auf einem Substrat und damit hergestellte Kochplatte

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2924540A (en) * 1958-05-23 1960-02-09 Du Pont Ceramic composition and article
US2950995A (en) * 1957-03-18 1960-08-30 Beckman Instruments Inc Electrical resistance element
US3023492A (en) * 1958-11-19 1962-03-06 Gen Electric Metalized ceramic member and composition and method for manufacturing same
US3080328A (en) * 1961-05-22 1963-03-05 Owens Illinois Glass Co Conducting solder glass compositions
US3110571A (en) * 1958-07-01 1963-11-12 Du Pont Ceramic material bonded to metal having refractory oxide dispersed therein
US3154503A (en) * 1961-01-12 1964-10-27 Int Resistance Co Resistance material and resistor made therefrom
US3180742A (en) * 1961-06-27 1965-04-27 Dwight G Bennett Elevated temperature resistant ceramic structural adhesives
US3207706A (en) * 1962-09-20 1965-09-21 Du Pont Resistor compositions
US3374110A (en) * 1964-05-27 1968-03-19 Ibm Conductive element, composition and method
US3413240A (en) * 1965-03-25 1968-11-26 Du Pont Compositions
US3547835A (en) * 1969-06-09 1970-12-15 Du Pont Processes of producing and applying silver compositions,and products therefrom
US3711328A (en) * 1971-01-04 1973-01-16 Matsushita Electric Industrial Co Ltd Resistor paste
US3748170A (en) * 1970-09-04 1973-07-24 North American Rockwell Method of coating metal

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2993815A (en) * 1959-05-25 1961-07-25 Bell Telephone Labor Inc Metallizing refractory substrates
US3647532A (en) * 1969-02-17 1972-03-07 Gen Electric Application of conductive inks
CA949357A (en) * 1969-03-27 1974-06-18 George R. Cole Brazeable and adherent metallizing compositions

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2950995A (en) * 1957-03-18 1960-08-30 Beckman Instruments Inc Electrical resistance element
US2924540A (en) * 1958-05-23 1960-02-09 Du Pont Ceramic composition and article
US3110571A (en) * 1958-07-01 1963-11-12 Du Pont Ceramic material bonded to metal having refractory oxide dispersed therein
US3023492A (en) * 1958-11-19 1962-03-06 Gen Electric Metalized ceramic member and composition and method for manufacturing same
US3154503A (en) * 1961-01-12 1964-10-27 Int Resistance Co Resistance material and resistor made therefrom
US3080328A (en) * 1961-05-22 1963-03-05 Owens Illinois Glass Co Conducting solder glass compositions
US3180742A (en) * 1961-06-27 1965-04-27 Dwight G Bennett Elevated temperature resistant ceramic structural adhesives
US3207706A (en) * 1962-09-20 1965-09-21 Du Pont Resistor compositions
US3374110A (en) * 1964-05-27 1968-03-19 Ibm Conductive element, composition and method
US3413240A (en) * 1965-03-25 1968-11-26 Du Pont Compositions
US3547835A (en) * 1969-06-09 1970-12-15 Du Pont Processes of producing and applying silver compositions,and products therefrom
US3748170A (en) * 1970-09-04 1973-07-24 North American Rockwell Method of coating metal
US3711328A (en) * 1971-01-04 1973-01-16 Matsushita Electric Industrial Co Ltd Resistor paste

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3919441A (en) * 1972-12-20 1975-11-11 Seinosuke Horiki Panel-styled calorific devices and a process for manufacturing the same
US4004052A (en) * 1974-03-08 1977-01-18 Vera Ivanovna Bystrova Process for producing non-porous coating for corundum substrates
US4047290A (en) * 1974-09-10 1977-09-13 Siemens Aktiengesellschaft Process for the production of a multi-chip wiring arrangement
US4039721A (en) * 1974-09-18 1977-08-02 Siemens Aktiengesellschaft Thick-layer conductor path pastes
US4053864A (en) * 1976-12-20 1977-10-11 Sprague Electric Company Thermistor with leads and method of making
US4278702A (en) * 1979-09-25 1981-07-14 Anthony J. Casella Method of making printed circuit board by induction heating of the conductive metal particles on a plastic substrate
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5830389A (en) * 1990-02-09 1998-11-03 Toranaga Technologies, Inc. Electrically conductive compositions and methods for the preparation and use thereof
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
GB2251677A (en) * 1991-01-09 1992-07-15 Rheinmetall Gmbh Drying thick-layer printed circuit boards
US5743185A (en) * 1995-01-17 1998-04-28 Mattel, Inc. Flexible thermally conductive stamp and material

Also Published As

Publication number Publication date
FR2137660A1 (enExample) 1972-12-29
DE2222754A1 (de) 1972-11-30
FR2137660B1 (enExample) 1978-11-24
DE2222754C2 (de) 1982-09-16
GB1378520A (en) 1974-12-27
IT958831B (it) 1973-10-30

Similar Documents

Publication Publication Date Title
US3808046A (en) Metallising pastes
US2993815A (en) Metallizing refractory substrates
US3776769A (en) Metallising pastes
US4880567A (en) Thick film copper conductor inks
US5165986A (en) Copper conductive composition for use on aluminum nitride substrate
EP0021538B1 (en) Air-fireable conductor composition
US4816615A (en) Thick film copper conductor inks
US4514321A (en) Thick film conductor compositions
US4540604A (en) Thick film conductor compositions
JPH0334162B2 (enExample)
KR900008274B1 (ko) 저항회로 형성방법
EP0046640B1 (en) Thick film conductor employing copper oxide
GB1566688A (en) Metallising compositions for coating dielectrics
US4312896A (en) Novel soldering process comprising coating a dielectric substrate with electroconductive metal protected by nickel carbide
EP0047071B1 (en) Thick film conductor employing nickel oxide
US3619233A (en) Method of metallizing a ceramic member
EP0200469B1 (en) Metallizing paste for silicon carbide sintered body and a semiconductor device including the same
US3726006A (en) Method for sintering thick-film oxidizable silk-screened circuitry
US3903344A (en) Adherent solderable cermet conductor
JP2005005054A (ja) 導電性ペースト
US3857798A (en) CONDUCTIVE INK COMPOSITION CONTAINING Pd AND Pb METAL POWDERS
EP0045482B1 (en) Thick film conductor compositions
EP0264121A2 (en) Aluminum enamel board
CS245210B1 (en) Mixture for preparation of protective and insulation coatings on metals
JPH0349108A (ja) 銅導体組成物