US3768048A - Super lightweight microwave circuits - Google Patents

Super lightweight microwave circuits Download PDF

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Publication number
US3768048A
US3768048A US00210634A US3768048DA US3768048A US 3768048 A US3768048 A US 3768048A US 00210634 A US00210634 A US 00210634A US 3768048D A US3768048D A US 3768048DA US 3768048 A US3768048 A US 3768048A
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United States
Prior art keywords
circuit
assembly
holes
sandwich
substrate
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Expired - Lifetime
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US00210634A
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English (en)
Inventor
H Jones
R Norris
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US Department of Army
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US Department of Army
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Publication date
Application filed by US Department of Army filed Critical US Department of Army
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M25/00—Catheters; Hollow probes
    • A61M25/01—Introducing, guiding, advancing, emplacing or holding catheters
    • A61M25/06—Body-piercing guide needles or the like
    • A61M25/0612—Devices for protecting the needle; Devices to help insertion of the needle, e.g. wings or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/16—Auxiliary devices for mode selection, e.g. mode suppression or mode promotion; for mode conversion

Definitions

  • ABSTRACT An extremely lightweight microwave circuit comprising stripline printed circuitry which is highly efficient, inexpensive, and suitable for use in electronics systems for space and military applications.
  • the microwave circuit is formed by printing on a very thin substrate such as Mylar or alumina approximately 0.005 inches thick.
  • the circuit is assembled between two thin sheets of a foam material approximately 0.040 to 0.050 inches thick. This assembly forms a sandwich which has its outer surface copper-plated.
  • these holes provide mode suppression and thus, reduce the amount of 1 radiation of electromagnetic energy.
  • Thick film or "printed circuit techniques are used to provide'the electrical paths on the thin substrate.
  • the conductive metallic surface on the outside of the sandwich is appositioned by the use of electroless copper-plating techniques.
  • the connectors for the electrical paths of the circuit are secured to the assembly by means of a conductive epoxy or adhesive.
  • This invention relates to an assembly of a microwave circuit, and more particularlyQto a lightweight assembly for a microwave circuit appositioned to a substrate for use in electronics systems for space and military applications.
  • a plurality of conductive paths for microwaves are appositioned onto a thin substrate comprising either Mylar or another suitable material approximately 0.005 inches thick.
  • This circuit is assembled between two thin sheets of foam material forming a sandwich structure. These sheets are held together by means of a low loss fluid adhesive.
  • the entire assembly or sandwich is plated with 'a conductive metal coating. Holes are drilled into the sandwich and plated throughout to provide mechanical support, mode suppression and reduction of the amount of electromagnetic radiation therefrom.
  • Conductive and resistive materials define the electrical paths appositioned to the substrate. These materials are applied using thick-film, thin-film, or conventional printed circuit techniques. Plating of the outer surface of the sandwich is provided by electroless copper-plating techniques. Connectors are secured to the sandwich and connected to the electrical power input paths by a conductive epoxy.
  • FIG. 1 is a perspective drawing of one embodiment of the circuit assembly.
  • FIG. 2 is a cross-section of the assembly shown in FIG. 1 along the line 22.
  • FIG. 3 is a view of the interface between the connector and the electrical paths on the substrate along the line 3-3.
  • FIG. 1 is cut away view of a particular embodiment of a super lightweight microwave circuit using thick film metalizing techniques.
  • the circuit assembly in this figure comprises a fiat thin sheet 'of Mylar l3 approximately 0.005 inches thick sandwiched between two thin sheets polystyrene foam 12 which are approximately 0.040 to 0.050 inches thICk.
  • 'ThIS sandwich assembly is held together by means of a dielectric, low energy loss, 'epoxy bonding material 11. This bonding material is applied to the inside surfaces of the polystyrene sheets 12 (See FIG. 2).
  • the Mylar substrate with the electrical paths of metalization 15 thereon is inserted between said sheets 12 and said sheets are pressed together and thebonding epoxy allowed to solidify.
  • the metalizations defining the conductive electrical paths 15 are appositioned to the Mylar substrate 13 by silk screening (See FIG. 3).
  • the tab which is the center termination of the connector 14 is epoxy bonded to the electrical-path 15 prior to insertion of the substrate 13 between the polystyrene sheets 12.
  • the polystyrene 12 is plated.
  • Plating of the polystyrene foam material is accomplished by electroless deposition techniques already dis-closed in the referable art.
  • the connector 14 is suitably covered before plating to prevent undue buildup of metalization on the closely controlled dimensions thereof.
  • The. plating material 10 applied or appositioned to the surface of the sandwich is copper. It is applied by electroless copper plating techniques.
  • Substrates that are used in developing circuits of this type include those made of Mylar, Kapton, glass, beryllia, and alumina.
  • Various foams are available as dielectric mediums into which the circuit may be inserted.
  • these materials are polyurethane foam, certain acrylics, polystyrene foam, and rubber foam.
  • Polystyrene foam is particularly suited for this application because of its low loss and relatively stable dielectric constant of 1.05 and because of its closed cell structure is particularly applicable to polishing and electroless plating.
  • metalization 15 which provides the electrical paths on the substrate
  • other techniques such as vacuum deposition of thin films and sputtering of thin films onto a substrate selected from the group above is useful in the development of certain types of circuits.
  • the electrical paths of metallization 15 may be also developed and defined by substractive etching techniques.
  • the connector 14 amy be soldered to the substrate 13. This situation is particularly true in the case of the use of alumina or beryllia as a substrate. It is noteworthy to point out at this point that the epoxy adhesive adjoining the thin sheets of polystyrene foam is only applied to those surfaces not touching the substrate 13. Furthermore, it may be noted that a recess in one of the polystyrene members 2 conforms to the shape and thickness of the substrate 13 (See FIG. 2).
  • any adhesive suitable for adjoining styrofoam may be used toadjoin the styrofoam sheets herein described.
  • the inventor wishes it to be understood furthermore, that he does not desire to be limited to the exact detail of construction shown and described, herein, for obvious modifications will occur to a person skilled in this art.
  • a super lightweight microwave circuit comprising a dielectric substrate, at least one electrical path appositioned to said substrate, a conductive material defining said electrical path, two rigid sheets of foam, said substrate being rigidly held between and surrounded by said sheets, said substrate and said sheets forming a sandwich having an outer surface, a conductive metal plating appositioned to said outer surface, means for providing mode suppression and control of radiation from said electrical path, said means comprising at least one hole having a conductive metal plating on the surface thereof, said hole further including a closure at the bottom thereof, said closure being rigidly located above said electrical path and within said foam, and further comprising a plurality of holes extending completely through said foam, last said holes having conductive metal plating throughout for providing mechanical support for said sandwich.

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Pulmonology (AREA)
  • Engineering & Computer Science (AREA)
  • Anesthesiology (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Hematology (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Infusion, Injection, And Reservoir Apparatuses (AREA)
  • Media Introduction/Drainage Providing Device (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
US00210634A 1971-12-21 1971-12-22 Super lightweight microwave circuits Expired - Lifetime US3768048A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21063471A 1971-12-21 1971-12-21

Publications (1)

Publication Number Publication Date
US3768048A true US3768048A (en) 1973-10-23

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US00210634A Expired - Lifetime US3768048A (en) 1971-12-21 1971-12-22 Super lightweight microwave circuits

Country Status (4)

Country Link
US (1) US3768048A (fr)
JP (1) JPS4870395A (fr)
BE (1) BE792698A (fr)
DE (1) DE2260061A1 (fr)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3863181A (en) * 1973-12-03 1975-01-28 Bell Telephone Labor Inc Mode suppressor for strip transmission lines
US3936778A (en) * 1973-10-17 1976-02-03 U.S. Philips Corporation Microstrip device having mode suppressing means
US4268803A (en) * 1979-05-24 1981-05-19 Communications Satellite Corporation Periodic lid for integrated circuit
FR2514215A1 (fr) * 1981-10-02 1983-04-08 Murata Manufacturing Co Filtre du type a constante de distribution
US4513266A (en) * 1981-11-28 1985-04-23 Mitsubishi Denki Kabushiki Kaisha Microwave ground shield structure
US4647878A (en) * 1984-11-14 1987-03-03 Itt Corporation Coaxial shielded directional microwave coupler
US4673904A (en) * 1984-11-14 1987-06-16 Itt Corporation Micro-coaxial substrate
US4716387A (en) * 1985-09-30 1987-12-29 Alps Electric Co., Ltd. Waveguide-microstrip line converter
US4725793A (en) * 1985-09-30 1988-02-16 Alps Electric Co., Ltd. Waveguide-microstrip line converter
US4729510A (en) * 1984-11-14 1988-03-08 Itt Corporation Coaxial shielded helical delay line and process
US5065123A (en) * 1990-10-01 1991-11-12 Harris Corporation Waffle wall-configured conducting structure for chip isolation in millimeter wave monolithic subsystem assemblies
US5276414A (en) * 1991-12-10 1994-01-04 Mitsubishi Denki Kabushiki Kaisha Moistureproof structure for module circuits
US5724012A (en) * 1994-02-03 1998-03-03 Hollandse Signaalapparaten B.V. Transmission-line network
US5733639A (en) * 1995-06-30 1998-03-31 Poly Circuits/M-Wave Circuit board assembly with foam substrate and method of making same
ES2114434A1 (es) * 1995-02-09 1998-05-16 Consejo Superior Investigacion Sistema estructural de linea de transmision de peque¦a seccion transversal para sistemas radiantes de microondas.
EP1041665A1 (fr) * 1999-04-01 2000-10-04 Space Systems / Loral, Inc. Lignes de transmission à rubans pour antennes de satellites
US20120152454A1 (en) * 2010-12-10 2012-06-21 Mass Steven J Low mass foam electrical structure
FR2978443A1 (fr) * 2011-07-26 2013-02-01 Thales Sa Materiau pour substrat dielectrique pour circuit imprime et antennes, procede de fabrication d'un tel substrat portant des moyens d'interconnexion entre pistes et substrat dielectrique ainsi obtenu
US20180159239A1 (en) * 2016-12-07 2018-06-07 Wafer Llc Low loss electrical transmission mechanism and antenna using same

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6371047U (fr) * 1986-10-30 1988-05-12
GB2214816A (en) * 1988-02-15 1989-09-13 Michael Frank Smith Catheter grip
US5188606A (en) * 1991-09-11 1993-02-23 Medamicus, Inc. Multiple size introducer slitter
US5382239A (en) * 1992-04-24 1995-01-17 Becton, Dickinson And Company Repositional catheter fixation device
WO2022034904A1 (fr) * 2020-08-14 2022-02-17 ニプロ株式会社 Ensemble aiguille à ailettes, matériau de conditionnement pour ensemble aiguille à ailettes, capuchon pour ensemble aiguille à ailettes, et jeu d'ensemble aiguille à ailettes

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2872391A (en) * 1955-06-28 1959-02-03 Ibm Method of making plated hole printed wiring boards
US2994050A (en) * 1959-04-10 1961-07-25 Sanders Associates Inc High frequency transmission line
US3142808A (en) * 1960-12-29 1964-07-28 Ibm Transmission line filter having coupling extending quarter wave length between strip line resonators
US3310748A (en) * 1963-03-18 1967-03-21 Sanders Associates Inc Strip line hybrid ring and balanced mixer assembly
US3654573A (en) * 1970-06-29 1972-04-04 Bell Telephone Labor Inc Microwave transmission line termination

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2872391A (en) * 1955-06-28 1959-02-03 Ibm Method of making plated hole printed wiring boards
US2994050A (en) * 1959-04-10 1961-07-25 Sanders Associates Inc High frequency transmission line
US3142808A (en) * 1960-12-29 1964-07-28 Ibm Transmission line filter having coupling extending quarter wave length between strip line resonators
US3310748A (en) * 1963-03-18 1967-03-21 Sanders Associates Inc Strip line hybrid ring and balanced mixer assembly
US3654573A (en) * 1970-06-29 1972-04-04 Bell Telephone Labor Inc Microwave transmission line termination

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Dinella, Method of Grounding a Printed Circuit Board, Western Electric Technical Digest No. 16, Oct. 1969, page 1 *
Patrick, Flexible Strip Transmission Line, IBM Technical Disclosure Bulletin, Vol. 2, No. 6, Apr. 1960, pp. 35,36 *

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3936778A (en) * 1973-10-17 1976-02-03 U.S. Philips Corporation Microstrip device having mode suppressing means
US3863181A (en) * 1973-12-03 1975-01-28 Bell Telephone Labor Inc Mode suppressor for strip transmission lines
US4268803A (en) * 1979-05-24 1981-05-19 Communications Satellite Corporation Periodic lid for integrated circuit
FR2514215A1 (fr) * 1981-10-02 1983-04-08 Murata Manufacturing Co Filtre du type a constante de distribution
US4513266A (en) * 1981-11-28 1985-04-23 Mitsubishi Denki Kabushiki Kaisha Microwave ground shield structure
US4647878A (en) * 1984-11-14 1987-03-03 Itt Corporation Coaxial shielded directional microwave coupler
US4673904A (en) * 1984-11-14 1987-06-16 Itt Corporation Micro-coaxial substrate
US4729510A (en) * 1984-11-14 1988-03-08 Itt Corporation Coaxial shielded helical delay line and process
US4716387A (en) * 1985-09-30 1987-12-29 Alps Electric Co., Ltd. Waveguide-microstrip line converter
US4725793A (en) * 1985-09-30 1988-02-16 Alps Electric Co., Ltd. Waveguide-microstrip line converter
US5065123A (en) * 1990-10-01 1991-11-12 Harris Corporation Waffle wall-configured conducting structure for chip isolation in millimeter wave monolithic subsystem assemblies
US5276414A (en) * 1991-12-10 1994-01-04 Mitsubishi Denki Kabushiki Kaisha Moistureproof structure for module circuits
US5724012A (en) * 1994-02-03 1998-03-03 Hollandse Signaalapparaten B.V. Transmission-line network
ES2114434A1 (es) * 1995-02-09 1998-05-16 Consejo Superior Investigacion Sistema estructural de linea de transmision de peque¦a seccion transversal para sistemas radiantes de microondas.
US5733639A (en) * 1995-06-30 1998-03-31 Poly Circuits/M-Wave Circuit board assembly with foam substrate and method of making same
EP1041665A1 (fr) * 1999-04-01 2000-10-04 Space Systems / Loral, Inc. Lignes de transmission à rubans pour antennes de satellites
US6356245B2 (en) 1999-04-01 2002-03-12 Space Systems/Loral, Inc. Microwave strip transmission lines, beamforming networks and antennas and methods for preparing the same
US20120152454A1 (en) * 2010-12-10 2012-06-21 Mass Steven J Low mass foam electrical structure
US9293800B2 (en) * 2010-12-10 2016-03-22 Northrop Grumman Systems Corporation RF transmission line disposed within a conductively plated cavity located in a low mass foam housing
FR2978443A1 (fr) * 2011-07-26 2013-02-01 Thales Sa Materiau pour substrat dielectrique pour circuit imprime et antennes, procede de fabrication d'un tel substrat portant des moyens d'interconnexion entre pistes et substrat dielectrique ainsi obtenu
US20180159239A1 (en) * 2016-12-07 2018-06-07 Wafer Llc Low loss electrical transmission mechanism and antenna using same
WO2018106485A1 (fr) * 2016-12-07 2018-06-14 Wafer Llc Mécanisme de transmission électrique à faible perte et antenne l'utilisant
CN110140184A (zh) * 2016-12-07 2019-08-16 韦弗有限责任公司 低损耗电传输机构和使用其的天线
KR20190117481A (ko) * 2016-12-07 2019-10-16 웨이퍼 엘엘씨 저손실 전기 전송 메커니즘과 이를 이용한 안테나
EP3552217A4 (fr) * 2016-12-07 2020-07-22 Wafer LLC Mécanisme de transmission électrique à faible perte et antenne l'utilisant

Also Published As

Publication number Publication date
JPS4870395A (fr) 1973-09-22
BE792698A (fr) 1973-06-13
DE2260061A1 (de) 1973-07-05

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