US3726768A - Nickel plating baths containing aromatic sulfonic acids - Google Patents
Nickel plating baths containing aromatic sulfonic acids Download PDFInfo
- Publication number
- US3726768A US3726768A US00137062A US3726768DA US3726768A US 3726768 A US3726768 A US 3726768A US 00137062 A US00137062 A US 00137062A US 3726768D A US3726768D A US 3726768DA US 3726768 A US3726768 A US 3726768A
- Authority
- US
- United States
- Prior art keywords
- nickel
- acid
- acids
- stress
- salts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract description 108
- 229910052759 nickel Inorganic materials 0.000 title abstract description 52
- 238000007747 plating Methods 0.000 title abstract description 44
- -1 aromatic sulfonic acids Chemical class 0.000 title abstract description 8
- 229910021585 Nickel(II) bromide Inorganic materials 0.000 abstract description 19
- IPLJNQFXJUCRNH-UHFFFAOYSA-L nickel(2+);dibromide Chemical compound [Ni+2].[Br-].[Br-] IPLJNQFXJUCRNH-UHFFFAOYSA-L 0.000 abstract description 19
- 239000002253 acid Substances 0.000 abstract description 15
- 150000003839 salts Chemical class 0.000 abstract description 12
- 150000007513 acids Chemical class 0.000 abstract description 10
- 239000000654 additive Substances 0.000 abstract description 10
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 abstract description 10
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 abstract description 10
- UCTREIIEJSFTDI-UHFFFAOYSA-N 3-aminonaphthalene-2,7-disulfonic acid Chemical compound C1=C(S(O)(=O)=O)C=C2C=C(S(O)(=O)=O)C(N)=CC2=C1 UCTREIIEJSFTDI-UHFFFAOYSA-N 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 abstract description 8
- DOBIZWYVJFIYOV-UHFFFAOYSA-N 7-hydroxynaphthalene-1,3-disulfonic acid Chemical compound C1=C(S(O)(=O)=O)C=C(S(O)(=O)=O)C2=CC(O)=CC=C21 DOBIZWYVJFIYOV-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052770 Uranium Inorganic materials 0.000 abstract description 7
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 abstract description 7
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical class OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 abstract description 6
- 229940092714 benzenesulfonic acid Drugs 0.000 abstract description 5
- 238000009713 electroplating Methods 0.000 abstract description 5
- 150000003460 sulfonic acids Chemical class 0.000 abstract description 5
- 230000001464 adherent effect Effects 0.000 abstract description 4
- UQPSGBZICXWIAG-UHFFFAOYSA-L nickel(2+);dibromide;trihydrate Chemical compound O.O.O.Br[Ni]Br UQPSGBZICXWIAG-UHFFFAOYSA-L 0.000 abstract description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract description 3
- 230000000996 additive effect Effects 0.000 abstract description 3
- 229910052708 sodium Inorganic materials 0.000 abstract description 3
- 239000011734 sodium Substances 0.000 abstract description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 abstract description 2
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 46
- 150000002815 nickel Chemical class 0.000 description 14
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical class [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 12
- 238000000034 method Methods 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 239000000446 fuel Substances 0.000 description 5
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 4
- 239000004327 boric acid Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- VILFVXYKHXVYAB-UHFFFAOYSA-N naphthalene-2,7-disulfonic acid Chemical compound C1=CC(S(O)(=O)=O)=CC2=CC(S(=O)(=O)O)=CC=C21 VILFVXYKHXVYAB-UHFFFAOYSA-N 0.000 description 3
- 159000000000 sodium salts Chemical class 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical class C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 2
- 150000003871 sulfonates Chemical class 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- CKYKNSRRNDUJPY-UHFFFAOYSA-N alumane;uranium Chemical class [AlH3].[U] CKYKNSRRNDUJPY-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- WRUAHXANJKHFIL-UHFFFAOYSA-N benzene-1,3-disulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC(S(O)(=O)=O)=C1 WRUAHXANJKHFIL-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- YZMHQCWXYHARLS-UHFFFAOYSA-N naphthalene-1,2-disulfonic acid Chemical class C1=CC=CC2=C(S(O)(=O)=O)C(S(=O)(=O)O)=CC=C21 YZMHQCWXYHARLS-UHFFFAOYSA-N 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical class [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
Definitions
- the stress of nickel deposits from plating solutions can be altered from tensile to near zero, and also to compressive stress by adding to nickel plating baths, such as those containing nickel sulfate and nickel bromide, amino naphthalene diand tri-sulfonic acids, and naphthol disulfonic acids and their salts, such as, for example, 3- amino-2,7-naphthalenedisulfonic acid, and 2-naphthol-6,8- disulfonic acid, and their sodium and nickel salts.
- nickel plating baths such as those containing nickel sulfate and nickel bromide, amino naphthalene diand tri-sulfonic acids, and naphthol disulfonic acids and their salts, such as, for example, 3- amino-2,7-naphthalenedisulfonic acid, and 2-naphthol-6,8- disulfonic acid, and their sodium and nickel salts.
- nickel salts of the above sulfonic acids are used as plating solutions rather than in the small amounts require as additive, bright of semibright, adherent and nonporous nickel deposits are formed and the stress of such nickel deposits range from approximately zero p.s.i. to 26,000 p.s.i. (compressive). Similar results were also obtained with the nickel salts of benzenesulfonic acid, 'benzenedisulfonic acids, naphthalenesulfonic acids, and naphthalenedisulfonic acids. Preferably all plating solutions contain nickel bromide. These plating solutions can be used for electroplating nickel on any substrate, including uranium.
- This invention relates to the electrodeposition of nickel from aqueous baths onto uranium or other substrates, using nickel organo-sulfonates as plating solutions or using the organo-sulfonic acids or their soluble salts as additives to known nickel plating solutions.
- uranium fuel elements used in water cooled nuclear reactors be protected from corrosion.
- One method is to clada nickel plated fuel element with aluminum.
- the nickel plate acts as a diffusion and secondary corrosion barrier, prevents the formation of undesirable aluminum-uranium compounds, and the uranium-nickelaluminum bond formed in the cladding operation provides good heat transfer.
- the reliability of the fuel elements is a very important factor in the operation of a nuclear reactor. Any technique which will increase the integrity of the fuel elements will lower the cost of operation.
- One problem associated with the use of nickel electrodeposited from conventional plating solutions used in nuclear processes is that the nickel has high residual stresses which can contribute to poor adherence of the deposit, thus providing poor heat transfer in the fuel element.
- novel plating solutions disclosed herein were developed to improve the heat transfer properties of the uranium-nickel-aluminum bond by controlling the stress of the nickel deposit.
- Another application of these plating solutions is in electro-forming articles, where control of stress is necessary if the product must meet close tolerances.
- Still another use of these plating solutions is in the deposition of low stress nickel coat under chromium, which can lower the stress of the chromium deposit.
- these plating solutions can be useful in any situation where nickel needs to be deposited under controlled stress.
- these plating solutions can be used to produce semibright and mirror bright nickel deposits for decorative purposes.
- Some of these nickel organo-sulfonates used to make up the plating solutions can be used as additions to conventional plating solutions. From these solutions bright and semibright nickel plates with reduced stress can be deposited.
- reduced stress of nickel deposits are obtained by adding to known aqueous acidic nickel plating baths an organic sulfonic acid or its soluble salt, particularly a sodium or nickel salt selected from one of the groups of organosulfonic acids given below:
- GROUP I R l I R R wherein two or three of the R groups are SO H and one of the R groups is NH and the remaining R groups are H.
- An example of one of these acids is 3-amino-2,7- naphthalenedisulfonic acid.
- R groups wherein two of the R groups are SO H and one R group is --O'H the remaining R groups being H.
- An example of one of these acids is 2-naphthol-6,8-disulfonic acid.
- nickel plating baths which have substantially zero stress of nickel deposits or which can even be under compression, comprise one or more of the nickel salts of a sulfonic acid of Group I and Group II, above, or a nickel salt of one of the group of organic sulfonic acids iven below:
- GROUP III m-benzenedisulfonic acid p-benzenedisulfonic acid o-benzenedisulfonic acid GROUlP 1V benzenesulfonic acid GROUP V l-naphthalenesulfonic acid Z-naphthalenesulfonic acid GROUP VI 1' ⁇ . 1?.
- Nickel (II) salt of 2-naphthol-6,8-disulfonic acid 2-naphthol-6,8-disulfonic acid
- Nickel bromide 0.1 M pH: 2.1 Temperature: 50 C. Current density: 30 rna./cm. Properties of the nickel deposit:
- Nickel (II) salt of m-benzenedisulfonic acid 0.7 M Nickel bromide: 0.1 M pH: 3.5 Temperature: 50 C. Current density: 30 ma./crn. Properties of the deposit:
- Nickel (11) salt of benzenesulfonic acid 0.4 M
- Nickel bromide 0.1 M pH: 2.5
- Temperature 50 C.
- Current density 30 ma./cm.
- Nickel (11) salt of 1 naphthalenesulfonic acid
- Nickel (II) salt of 2,7-naphthalenedisulfonic acid
- the sulfonates from Groups I and II were found to be novel additives to existing plating solutions. By using these compounds as additives We found that the stress of the nickel deposits from the plating solutions could be altered from tensile to near zero, and also to compressive stress.
- An example of a stress reducer from the two groups is shown below, and stress of the deposits are compared to deposits from the reference Watts-bromide plating solution Reference plating solution (Watts-bromide) Nickel sulfate: 1.2 M Nickel bromide: 0.20 M Boric acid: 0.62 M Temperature: 52 C. pH: 4.0 Current density: 60 ma./cm. Stress: 18,000 p.s.i. Group I.Additive to reference plating solution:
- Nickel (II) salt of 3-amino-2,7-naphthalenedisulfonic acid .05 M Stress: 12,000 p.s.i. Change in stress: 30,000 p.s.i. more compressive Group II.--Additive to reference plating solution:
- Nickel (II) salt of 2-naphthol-6,8-disu1fonic acid
- organo sulfonates from Group I and Group II can be used as brighteners for existing plating solutions. An example from each group is shown below.
- Nickel sulfate 1.2 M
- Nickel (H) salt of 3-amino-2,7-naphthalenedisulfonic acid 0.05 M
- Carbon content 1250 p.p.m.
- Nickel sulfate 1.2 M Nickel br0mide:0.2-0 M Nickel (II) salt of 2-naphthol-6,8-disulfonic acid:
- M mols per liter.
- ma./cm. milliamperes per square centimeter.
- the organosulfonic acid itself or other soluble salts thereof may be used, the sodium salts and nickel salts being preferable.
- organo-sulfonic acids or salts when used as additives, they may be added to any of the common plating solutions such as those comprising nickel sulfate, nickel. sulfamate, nickel bromide, nickel fluoborate and nickel chloride or other nickel salts or mixtures of such salts, preferably with buffer materials as, for example, boric acid.
- the amounts of such nickel salts which may be employed are quantities which are now conventional in this art for such baths.
- the plating solution to which the Group I or Group II compounds or salts are added comprises nickel sulfate and nickel bromide.
- the concentrate of organo-sulfonic acid for sulfonate may suitably range about 0.01 mol per liter to about 0.1 mol per liter, but there is no critical upper limit and they can be used up to saturation concentration value.
- the nickel salt of the organo-sulfonic acid of Group I and Group II is preferably used with nickel bromide.
- concentration of the nickel sulfamate may suitably range from about .1 mol per liter to 1.0 mol per liter and up to saturation, and the nickel bromide from preferably .05 mol per liter to 0.2 mol per liter.
- the baths are aqueous solutions on the acid side, such as those of a pH of 2.0-6.0.
- The. baths of this invention can be used for electroplating nickel or any substrate, including uranium, by means well known to the art for electroplating nickel from nickel plating baths.
- Current densities of 30 milliamperes per square centimeter-60 milliamperes per square centimeter (30 ma./cm. -60 ma./cm. are suitable as sho wn in the examples.
- Higher current densities can be used, such as 50-400 amperes (sq. dm.) particularly with agitation of the bath.
- a bath for depositing nickel plate consisting essentially of an aqueous acidic solution of at least one nickel salt selected from the group consisting of nickel sulfate, nickel sulfamate, nickel bromide, nickel fiuoborate, and nickel chloride, and contained dissolved in said nickel plating solution in a concentration of about .01 mol per liter to saturation, a compound selected from the group of organic sulfonic acids and their salts in which the organic sulfonic acid is selected from the group of compounds having the formula It it wherein two of the R groups are SO H and one R group is OH, the remaining R groups being H.
- a bath for depositing nickel plate consisting essentially of an aqueous acidic solution of at least one nickel salt of an organic sulfonic acid selected from the group of compounds having the formula I l R R wherein two or three of the R groups are --SO H and one of the R groups is NH and the remaining R groups are l I R R wherein two of the R groups are SO H and one of R group is OH, the remaining R groups being H,
- a method of electrodepositing nickel comprising the step of electrodepositing nickel from the solution defined in claim 1.
- a method of electrodepositing nickel comprising the step of electrodcpositing nickel from the solution defined in claim 2.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13706271A | 1971-04-23 | 1971-04-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3726768A true US3726768A (en) | 1973-04-10 |
Family
ID=22475670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US00137062A Expired - Lifetime US3726768A (en) | 1971-04-23 | 1971-04-23 | Nickel plating baths containing aromatic sulfonic acids |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3726768A (enExample) |
| BE (1) | BE781965A (enExample) |
| DE (1) | DE2218967A1 (enExample) |
| FR (1) | FR2134419B1 (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4743346A (en) * | 1986-07-01 | 1988-05-10 | E. I. Du Pont De Nemours And Company | Electroplating bath and process for maintaining plated alloy composition stable |
| US4846941A (en) * | 1986-07-01 | 1989-07-11 | E. I. Du Pont De Nemours And Company | Electroplating bath and process for maintaining plated alloy composition stable |
| US4849303A (en) * | 1986-07-01 | 1989-07-18 | E. I. Du Pont De Nemours And Company | Alloy coatings for electrical contacts |
| AU612808B2 (en) * | 1988-04-01 | 1991-07-18 | E.I. Du Pont De Nemours And Company | Electroplated alloy coatings having stable alloy compositions |
| EP0892087A3 (en) * | 1997-06-18 | 2000-06-07 | ATOTECH Deutschland GmbH | Electroplating of low-stress nickel |
| CN108866594A (zh) * | 2018-08-20 | 2018-11-23 | 中国原子能科学研究院 | 一种用于铀箔镀镍的电镀液及其电镀方法 |
| USRE49141E1 (en) | 2009-03-12 | 2022-07-19 | Jason GAYER | Retaining ring for pressure vessel connection |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DK172937B1 (da) * | 1995-06-21 | 1999-10-11 | Peter Torben Tang | Galvanisk fremgangsmåde til dannelse af belægninger af nikkel, kobalt, nikkellegeringer eller kobaltlegeringer |
| DE10061186C1 (de) | 2000-12-07 | 2002-01-17 | Astrium Gmbh | Verfahren und Anordnung zur galvanischen Abscheidung von Nickel, Kobalt, Nickellegierungen oder Kobaltlegierungen mit periodischen Strompulsen und Verwendung des Verfahrens |
-
1971
- 1971-04-23 US US00137062A patent/US3726768A/en not_active Expired - Lifetime
-
1972
- 1972-04-12 BE BE781965A patent/BE781965A/xx unknown
- 1972-04-19 DE DE19722218967 patent/DE2218967A1/de active Pending
- 1972-04-21 FR FR7214290A patent/FR2134419B1/fr not_active Expired
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4743346A (en) * | 1986-07-01 | 1988-05-10 | E. I. Du Pont De Nemours And Company | Electroplating bath and process for maintaining plated alloy composition stable |
| US4846941A (en) * | 1986-07-01 | 1989-07-11 | E. I. Du Pont De Nemours And Company | Electroplating bath and process for maintaining plated alloy composition stable |
| US4849303A (en) * | 1986-07-01 | 1989-07-18 | E. I. Du Pont De Nemours And Company | Alloy coatings for electrical contacts |
| AU612808B2 (en) * | 1988-04-01 | 1991-07-18 | E.I. Du Pont De Nemours And Company | Electroplated alloy coatings having stable alloy compositions |
| EP0892087A3 (en) * | 1997-06-18 | 2000-06-07 | ATOTECH Deutschland GmbH | Electroplating of low-stress nickel |
| USRE49141E1 (en) | 2009-03-12 | 2022-07-19 | Jason GAYER | Retaining ring for pressure vessel connection |
| CN108866594A (zh) * | 2018-08-20 | 2018-11-23 | 中国原子能科学研究院 | 一种用于铀箔镀镍的电镀液及其电镀方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2134419A1 (enExample) | 1972-12-08 |
| DE2218967A1 (de) | 1972-11-09 |
| BE781965A (fr) | 1972-07-31 |
| FR2134419B1 (enExample) | 1975-06-20 |
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