US3681713A - High q circuits on ceramic substrates - Google Patents

High q circuits on ceramic substrates Download PDF

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Publication number
US3681713A
US3681713A US10882A US3681713DA US3681713A US 3681713 A US3681713 A US 3681713A US 10882 A US10882 A US 10882A US 3681713D A US3681713D A US 3681713DA US 3681713 A US3681713 A US 3681713A
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United States
Prior art keywords
silver
circuits
copper
circuit
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US10882A
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English (en)
Inventor
Robert Stephen Degenkolb
Eugene Raymond Skaw
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RCA Licensing Corp
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RCA Corp
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Publication date
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Assigned to RCA LICENSING CORPORATION, TWO INDEPENDENCE WAY, PRINCETON, NJ 08540, A CORP. OF DE reassignment RCA LICENSING CORPORATION, TWO INDEPENDENCE WAY, PRINCETON, NJ 08540, A CORP. OF DE ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: RCA CORPORATION, A CORP. OF DE
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Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Definitions

  • ABSTRACT High Q circuit for operation in the UHF band comprising a ceramic substrate having on one major surface a pattern of metal particle-glass frit conductors having a coating of copper thereon, and on the other major surface a metallic ground plane of similar structure.
  • the metallic inks which have been used heretofore have generally comprised a high percentage of silver particles suspended in a vehicle made up primarily of a glass frit, organic plasticizers and solvents. These inks are designed to have good thixotropic properties rendering them suitable for screen printing.
  • the circuits made from these inks have been found to have certain disadvantages.
  • One of these is that, under high humidity conditions, many of the circuits fail due to silver migration. Silver migration can occur between two silver electrodes when a continuous film of water extends between them on the substrate and when they are under DC bias.
  • the mechanism by which the silver migrates is that when a DC field is applied, silver ions tend to leave the anode. Hydroxyl ions from the water move toward the anode. Silver ions and hydroxyl ions react to form silver oxide which is precipitated as a dark ring along the edge of the anode. And, silver hydroxide, which is also present, is quite soluble in water and allows silver ions to migrate to the cathode where the silver is discharged and precipitates in a dendritic form.
  • UHF circuits composed of silver inks are not as high as desired.
  • One reason for the low Q value is that films of metallic inks have a' myriad of minute surface irregularities.
  • a measure of the Q of a circuit is the width of the-frequency band at which it can be caused to resonate at a given value of db in response to a signal of given strength. For many uses it is desirable that a circuit exhibit a very narrow-band frequency response so that it can be sharply tuned.
  • One object of the present invention is to provide a circuit for UHF band usewhich has a relatively high Q.
  • Another object of the invention is to provide a high Q circuit composed in part of silver metallizing ink in which the silver is prevented from migrating.
  • FIG. 1 is a top plan view of a partially completed test circuit on one side of a ceramic substrate, in accordance with the present invention
  • FIG. 2 is a bottom plan view of the other side of the substrate of FIG. 1;
  • FIG. 3 is a section view taken along the line 3--3 of FIG. 1;
  • FIG. 4 is a top plan view of the circuit of FIG.1 in completed form
  • FIG. 5 is a section view taken along the line 5--5 of FIG. 4.
  • the circuit dielectric portion is a ceramic substrate 2 composed of two thin sheets of a composition consisting of percent alumina and 15 percent calcium magnesium silicate laminated together. After firing, the substrate has a thickness of 0.050 inch.
  • a conductive ink pattern 6 in the shape of-aU" is screen-printed on one side 4 of the substrate.
  • the dimensions of the screened-on pattern are chosen such that, after firing, the width of the U is 2.3 cm. and the outside lengthof each leg is 3 cm.
  • the width of the lens is 0.4 cm.
  • the ink composition is not critical but may comprise silver powder 75 percent lead borosilicate glass powder 3 percent, glycerol ester of hydrogenated rosin 12 percent, nitrocellulose 2 percent and butyl carbitol acetate 8 percent.
  • the ink should have a viscosity of 75,000 to 125,000 cps. as measured on a Brookfield Model HBF Viscometer using No. 4 spindle at 10 r.p.m.
  • the ink is screen-printed on the substrate using a 325 mesh stainless steel screen.
  • the wire threads of the screen have a diameter of 0.0011 inch.
  • the thickness of the print after firing should be 00004-00006 inch.
  • Sufficient settling time should be allowed, after printing, for the ink dots to flow together and form a uniform layer. This time is usually 3-5 minutes.
  • Lower mesh screens can be used but the results have been found to be less desirable if, for example, the number is as low as 80, since there are more non-uniformities in print thickness under this condition.
  • a ground plane 8 of the ink is also deposited over the entire surface 10 on the back of the: plate.
  • the ink is dried at about l00-l50 C. and fired at 900 C. (a variation from 890-920 C. being permissible).
  • the entire time in the furnace from room temperature to maximum and back to room temperature is about 40 minutes. After firing, the conductive patterns are about percent silver.
  • the next step is to electroplate a layer of copper 12 on the fired silver ink pattern 6 on the top sides of the substrate 2 and another layer of copper 14 on the fired silver layer 8 on the bottom of the substrate 2.
  • the plating bath may comprise:
  • a preferred plating time in a non-agitated bath is 10 minutes.
  • the thickness of the copper plating is preferably 0.0002 to 0.0005 inch.
  • test circuits having the same shape shown in the drawing and having the same 2 dimensions and made by the same method described in the example were tested for their Q before and after the copper plating step. The results are set forth in the table below.
  • the frequency of maximum resonance (maximum db output) was determined. This data is noted in the column f center in the table below. Then, at the same signal strength input, the signal was tuned ofi the center frequency both higher and lower, and the frequencies noted where the oscillation output was 3 db. down from that of the center frequency. The high and low frequencies for each center frequency are given in the columns marked f high and flow in the table.
  • the Q for the circuit is then found by dividing the center frequency by the difference between the measured high frequency and the measured low frequency.
  • the data given in the first 5 columns of the Table is that obtained for each sample after copper plating.
  • the Q measured for each circuit sample before copper plating is given in the 6th column.
  • the Q data in the 6th column were obtained exactly as described for the copper plated circuits, but, to save space, the actual frequency measurements have not been included in this Table.
  • the 7th column of the Table shows the percentage increase in Q obtained by copper plating each sample.
  • the percentage increase varies because of variations in such parameters as coating thickness, coating uniformity, substrate imperfections, and the hke.
  • the circuits may be given further processingwhich does not substantially affect their Q. For example, certain areas may have solder applied so that connections may be made; and protective resin coatings may also be applied everywhere except where connections are to be made.
  • a high Q circuit for operation at ultra high frequencies comprising:
  • said fired pattern of conductors and said ground plane normally each having surfaces characterized by a myriad of minute surface irregularities

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Waveguides (AREA)
US10882A 1970-02-12 1970-02-12 High q circuits on ceramic substrates Expired - Lifetime US3681713A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1088270A 1970-02-12 1970-02-12

Publications (1)

Publication Number Publication Date
US3681713A true US3681713A (en) 1972-08-01

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US10882A Expired - Lifetime US3681713A (en) 1970-02-12 1970-02-12 High q circuits on ceramic substrates

Country Status (8)

Country Link
US (1) US3681713A (OSRAM)
JP (1) JPS5013141B1 (OSRAM)
BE (1) BE762836A (OSRAM)
DE (1) DE2104735A1 (OSRAM)
FR (1) FR2076960A5 (OSRAM)
GB (1) GB1276473A (OSRAM)
NL (1) NL7101835A (OSRAM)
SE (1) SE357283B (OSRAM)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3967223A (en) * 1974-02-19 1976-06-29 Westinghouse Electric Corporation Resonant ring transmission line having a high Q mode
US4150345A (en) * 1977-12-02 1979-04-17 Raytheon Company Microstrip coupler having increased coupling area
US4429289A (en) 1982-06-01 1984-01-31 Motorola, Inc. Hybrid filter
US4661790A (en) * 1983-12-19 1987-04-28 Motorola, Inc. Radio frequency filter having a temperature compensated ceramic resonator
US5992320A (en) * 1996-10-21 1999-11-30 Dai Nippon Printing Co., Ltd. Transfer sheet, and pattern-forming method
US6041245A (en) * 1994-12-28 2000-03-21 Com Dev Ltd. High power superconductive circuits and method of construction thereof
US20130340821A1 (en) * 2008-05-30 2013-12-26 Ei Du Pont De Nemours And Company Conductive compositions and processes for use in the manufacture of semiconductor devices - organic medium components

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2411555A (en) * 1941-10-15 1946-11-26 Standard Telephones Cables Ltd Electric wave filter
US3290171A (en) * 1962-12-05 1966-12-06 Rca Corp Method and materials for metallizing ceramics
US3374110A (en) * 1964-05-27 1968-03-19 Ibm Conductive element, composition and method
US3392054A (en) * 1965-02-03 1968-07-09 Vietory Engineering Corp Method of manufacturing thin film thermistors
US3549415A (en) * 1968-07-15 1970-12-22 Zenith Radio Corp Method of making multilayer ceramic capacitors

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2411555A (en) * 1941-10-15 1946-11-26 Standard Telephones Cables Ltd Electric wave filter
US3290171A (en) * 1962-12-05 1966-12-06 Rca Corp Method and materials for metallizing ceramics
US3374110A (en) * 1964-05-27 1968-03-19 Ibm Conductive element, composition and method
US3392054A (en) * 1965-02-03 1968-07-09 Vietory Engineering Corp Method of manufacturing thin film thermistors
US3549415A (en) * 1968-07-15 1970-12-22 Zenith Radio Corp Method of making multilayer ceramic capacitors

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3967223A (en) * 1974-02-19 1976-06-29 Westinghouse Electric Corporation Resonant ring transmission line having a high Q mode
US4150345A (en) * 1977-12-02 1979-04-17 Raytheon Company Microstrip coupler having increased coupling area
US4429289A (en) 1982-06-01 1984-01-31 Motorola, Inc. Hybrid filter
US4661790A (en) * 1983-12-19 1987-04-28 Motorola, Inc. Radio frequency filter having a temperature compensated ceramic resonator
US6041245A (en) * 1994-12-28 2000-03-21 Com Dev Ltd. High power superconductive circuits and method of construction thereof
US5992320A (en) * 1996-10-21 1999-11-30 Dai Nippon Printing Co., Ltd. Transfer sheet, and pattern-forming method
US20130340821A1 (en) * 2008-05-30 2013-12-26 Ei Du Pont De Nemours And Company Conductive compositions and processes for use in the manufacture of semiconductor devices - organic medium components
US9224885B2 (en) * 2008-05-30 2015-12-29 E I Du Pont De Nemours And Company Conductive compositions and processes for use in the manufacture of semiconductor devices—organic medium components

Also Published As

Publication number Publication date
FR2076960A5 (OSRAM) 1971-10-15
DE2104735A1 (de) 1971-08-19
GB1276473A (en) 1972-06-01
NL7101835A (OSRAM) 1971-08-16
JPS5013141B1 (OSRAM) 1975-05-17
BE762836A (fr) 1971-07-16
SE357283B (OSRAM) 1973-06-18

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Owner name: RCA LICENSING CORPORATION, TWO INDEPENDENCE WAY, P

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:RCA CORPORATION, A CORP. OF DE;REEL/FRAME:004993/0131

Effective date: 19871208