Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/31—Coating with metals
  • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
  • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
  • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/18—Pretreatment of the material to be coated
  • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
  • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
  • C23C18/1837—Multistep pretreatment
  • C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first

Definitions

• Aluminum and aluminum alloys are subjected to a preplating treatment which conditions the surfaces of these metals for receiving electrolessly deposited nickel plating directly thereon.
• a clean aluminous surface is prepared for electroless plating by etching in an alkaline solution and then pickling in an acidic solution containing chloride ions.
• An alkaline solution containing hypophosphite ions is employed to activate the aluminous surface which is then provided with a thin electroless nickel strike coat by immersion in an ammonical solution containing nickel ions, hypophosphite ions, and a chelating agent. After the electroless strike coat is applied, the aluminous surface is provided with a plating of electroless nickel in a conventional, essentially halogen-free bath.
• the present invention relates generally to a pre-plating treatment for aluminum and its alloys, and more particularly to an improved method of conditioning such metal for subsequently applied electroless nickel plate.
• This invention was made in the course of, or under, a contract with the U.S. Atomic Energy Commission.
• the corrosion resistance of aluminum and aluminum alloys is generally sufiicient to permit the use of such metals in many applications without providing additional protection to exposed surfaces.
• the plating of aluminum and aluminum-containing alloys has been somewhat diflicult and unreliable due to the presence of its relatively impervious and rapidly formed natural oxide film or reactions between the alloying ingredients and environmental conditions.
• the present invention also obviates the use of the previously required pre-coatings of different metals in order to obtain adherent electroless nickel plate.
• Aluminous surfaces are conditioned prior to immersion into an electroless nickel plating solution by contacting a clean and degreased surface portion with an alkaline etch and then contacting the aluminous surface with an acidic solution containing chloride ions which expose the aluminum crystals.
• the aluminous surface is then activated in an alkaline solution containing hypophosphite ions and thereafter provided with a thin strike coat of amorphous nickel to maintain the activated or catalytic condition of the surface for facilitating the reception and bonding of the subsequently deposited electroless nickel plate.
• An object of the present invention is to provide a new and improved method of conditioning aluminous surfaces for the reception of electrolessly deposited nickel.
• Another object of the present invention is to provide a method of pre-treating the surface of aluminum and aluminum-containing alloys prior to electroless nickel plating whereby the treatment conditions the surface in such a manner as to obviate both the use of a different pre-treating solution for each alloy and pre-coatings of aluminous surfaces with different metals for establishing an adequate bond with the nickel.
• the present invention provides a unique process for conditioning aluminous surfaces whereby nickel may be electrolessly plated directly onto aluminum and any of its alloys regardless of the alloying elements.
• nickel may be electrolessly plated directly onto aluminum and any of its alloys regardless of the alloying elements.
• aluminum alloys with alloying elements such as set forth in the following table have been satisfactorily treated in accordance with the teachings of the present invention.
• alloys in the above table which have been surface treated for receiving electroless nickel plate include the alloys with the Aluminum Association designation numbers 1100, 2024, 3003, 5052, 6061, and 7075.
• the aluminum and aluminum alloys are conditioned preparatory to receiving the electrolessly applied nickel by contacting a particular aluminous surface with an alkaline etchant and then with an acidic solution containing nickel chloride wherein the surface is etched by the chloride ions to expose the aluminum crystals.
• the electrochemically deposited nickel coating resulting from the etching operation is removed by contacting the coating with a concentrated nitric acid solution.
• the aluminous surface is activated by being immersed in an ammoniacal solution containing an adequate quantity of hypohosphite ions and thereafter contacted with an aqueous solution containing nickel ions, hypophosphite ions, and a chelating agent at a temperature in the range of about 3590 C.
• the activated or catalytic surface may be provided with an electrolessly deposited nickel plate of any desired thickness by employing a conventional, essentially halogen-free electroless plating solution.
• Coupons of aluminum and aluminum alloys are initially cleansed of grease and other easily removed foreign matter on the surface by a conventional cleaning procedure such as by employing a scouring powder together with a degreasing agent such as chromic acid. After rinsing the cleaned aluminous surfaces of the coupons in water, the surfaces are etched for a suitable duration of about one minute in a dilute or weak, e.g., percent, sodium or potassium hydroxide solution for dissolving surface oxides and other impurities. The coupon is then rinsed with water and etched and pickled in an acidic solution containing chloride ions for a duration of about 0.5 to 2 minutes with the solution at room temperature.
• the chloride ions attack the aluminous surface in such a manner as to expose the aluminum crystals for facilitating the reception of the subsequently applied nickel plate. Satisfactory results have been achieved by employing a solution with a chloride ion contributor such as nickel chloride hexahydrate and a carboxylic acid such as. lactic acid; or, if desired, nitric acid may be substituted for the carboxylic acid.
• a chloride ion contributor such as nickel chloride hexahydrate and a carboxylic acid such as. lactic acid; or, if desired, nitric acid may be substituted for the carboxylic acid.
• the concentration of the solution may be about 175 to 700 grams per liter of nickel chloride hexahydrate and to 750 milliliters per liter of concentrated (85 percent) lactic acid or 300 to 500 milliliters per liter of 71 percent nitric acid with the balance being a saturated solution of NiCl
• lactic acidnickel chloride solution a thin film of nickel is electrochemically deposited on the surface, which is readily removed or deplated by dipping the coupon in a concentrated (16 N) nitric acid solution.
• the electrochemically deposited nickel is immediately redissolved in the same solution.
• the deplated coupon may be desmutted in a suitable acidic solution such as a nitric acid solution containing a suflicient quantity of hydrofluoric acid to remove silicon and other surface impurities; for example, a solution with 2 milliliters per liter of 48 percent hydrofluoric acid is satisfactory.
• a suitable acidic solution such as a nitric acid solution containing a suflicient quantity of hydrofluoric acid to remove silicon and other surface impurities; for example, a solution with 2 milliliters per liter of 48 percent hydrofluoric acid is satisfactory.
• the surface of the coupon is activated or placed in a catalytic condition by immersing the coupon in a solution consisting essentially of a hypophosphite ion contributor such as sodium or potassium hypophosphite and a Weak alkali such as ammonium hydroxide.
• concentration of the solution may vary in the range of 5 to 100 grams of the hypophosphite ion contributor per liter and 5 to 50 milliliters of ammonium hydroxide per liter. With other weak alkalis the solution should be correspondingly basic.
• the time required for the activation is normally about 1 to 5 minutes at room temperature in solutions in the aforementioned concentration ranges.
• the coupon is placed in a basic solution containing hypophosphite anions and nickel cations and a chelating agent for providing the latter with a thin electroless strike coat or layer of nickel of a thickness of about 0.03 of a mil.
• This nickel is amorphous and thereby greatly enhances the bond between the subsequently applied electroless nickel and the coupon.
• the solutions found suitable for providing the strike coat are solutions containing 5-75 grams per liter of sodium or potassium hypophosphite and 5-60 grams per liter of nickel sulfate.
• a chelating agent is then added to the hypophosphite and nickel cation solution.
• the chelating agent may be any suitable compound such as ammonium citrate or any of the aminopolycarboxylic acids and alkaline earth metal salts thereof.
• the quantity of the chelating agent should be such that it will complex or tie up substantially all the nickel ions in the plating solution.
• the pH of the preplating solution is preferably maintained between 9 and 9.5 and is readily adjusted to be contained in this range by employing ammonium hydroxide or the like.
• the temperature of the bath is maintained in a range of -90 C. to provide the electroless nickel strike coat after an immersion period of about one minute.
• the coupon After the coupon has been provided with the aforementioned nickel strike coat, it is preferably dipped into an acidic, electroless nickel plating bath that is preferably substantially free of halogens since the latter form a film on the surface and prevent desirable bonding be tween the nickel plate and the aluminum. This immersion in the bath for approximately 15 seconds cleans the part of free ammonium and nitrate ions.
• the coupon In order to plate the coupon when treated by the novel pretreatment steps described above the coupon is placed in a final electroless nickel plating bath (again one essentially free of halogens for the above reasons), preferably one with a high plating rate.
• the electroless nickel plating bath may be any suitable commercially available acid-type bath such as an aqueous nickel sulfate bath in which nickel ions are chemically reduced in an aqueous hypophosphite solution.
• the nickel plate may be of any desired thickness depending upon the particular use envisioned for the nickel-plated aluminum or aluminum alloy.
• the aluminum and aluminum alloys electrolessly nickel plated when treated as aforementioned do not require any modification of the above procedure regardless of the aluminum or aluminum alloy being treated.
• the quality of the bond between the nickel and the aluminum surface was evaluated by cross sectioning, bending, and heating to 450 C. and immediately thereafter quenching in cold water. These tests showed excellent adherence of the nickel coating to all alloys.
• the coupon employed in this example is an aluminum alloy with the Aluminum Association numerical designation 5052-H32.
• the aluminum alloy coupon is prepared for receiving an electroless nickel plate by cleaning it 'with scouring powder, rinsing it thoroughly in Water, degreasing it with chromic acid, and again rinsing it thoroughly with Water.
• the coupon is then etched for one minute in a 5 percent sodium hydroxide solution, rinsed thoroughly with water, pickled one minute at room temperature in a solution of 640 grams per liter of nickel chloride hexahydrate and milliliters per liter of 85 percent lactic acid, and rinsed with Water.
• the coupon is dipped in concentrated nitric acid to deplete the electrochemically deposited nickel, dipped in an 8 N nitric acid solution which contains 2 milliliters per liter of 48 percent hydrofluoric acid to desmut the coupon surface, and rinsed with water.
• the above steps, beginning with the etching step, are repeated to assure adequate surface preparation.
• the coupon is then placed in a solution containing 25 grams of sodium hypophosphite per liter and 25 milliliters of ammonium hydroxide per liter for two minutes at room temperature to activate the surface.
• the coupon is then placed in the activation electroless nickel strike bath for approximately one minute at 85 C. to 90 C.
• the coupon is completely covered with a thin (0.03 of a mil) layer of electroless deposited nickel.
• the solution was composed of the following:
• the surface conditioning method of the present invention sets forth a singificant advancement in the art of electroless plating aluminum with nickel.
• the quality of the nickel deposition does not vary between the various aluminum alloys, and the bond between the nickel and aluminum is excellent in the asplated condition and therefore does not require the heat treatment as previously considered necessary to effect the diffusion bond between the nickel plate and the aluminous surface.
• the elimination of this heat treatment step is significant in that the use of such heating often results in a significant loss in the strength of the aluminum such as in the case of the alloy with the numerical designation 7075.
• an improved method of conditioning an alkaline etched aluminous surface preparatory to receiving the electrolessly applied nickel comprising the steps of contacting the aluminous surface with an acidic pickling solution consisting essentially of nickel chloride hexahydrate in a concentration of 175 to 700 grams per liter of solution and concentrated lactic acid in a concentration of about 10 to 750 milliliters per liter of solu tion with the contacting being for a duration of about 0.5 to 2 minutes to pickle the surface and electrochemically deposit a coating of nickel thereon, removing the coating of nickel by contacting the coating with a nitric acid solution, contacting the surface with an acidic solution containing sufficient nitric acid and hydrofluoric acid to desmut the surface, activating the aluminous surface by contacting the latter with an alkaline solution containing an adequate quantity of hypo

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• Chemical & Material Sciences (AREA)
• General Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Mechanical Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Inorganic Chemistry (AREA)
• Chemically Coating (AREA)
• ing And Chemical Polishing (AREA)
• Electroplating Methods And Accessories (AREA)

Priority Applications (6)

Applications Claiming Priority (1)

Publications (1)

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Cited By (23)

Families Citing this family (3)

• 1969
  • 1969-04-02 US US812901A patent/US3666529A/en not_active Expired - Lifetime
• 1970
  • 1970-03-09 GB GB1109070A patent/GB1251314A/en not_active Expired
  • 1970-03-19 IL IL34111A patent/IL34111A/en unknown
  • 1970-03-25 DE DE2014285A patent/DE2014285C3/de not_active Expired
  • 1970-03-31 FR FR7011490A patent/FR2042270A5/fr not_active Expired
  • 1970-04-02 JP JP45027504A patent/JPS4943063B1/ja active Pending

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