US3634209A - Electro deposited magnetic films - Google Patents
Electro deposited magnetic films Download PDFInfo
- Publication number
- US3634209A US3634209A US841988A US3634209DA US3634209A US 3634209 A US3634209 A US 3634209A US 841988 A US841988 A US 841988A US 3634209D A US3634209D A US 3634209DA US 3634209 A US3634209 A US 3634209A
- Authority
- US
- United States
- Prior art keywords
- magnetic
- film
- smoothing
- layer
- phosphorus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009499 grossing Methods 0.000 abstract description 31
- 239000000758 substrate Substances 0.000 abstract description 20
- 239000011574 phosphorus Substances 0.000 abstract description 12
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 8
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052759 nickel Inorganic materials 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 38
- 239000000463 material Substances 0.000 description 12
- 239000006185 dispersion Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 3
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 2
- 229940081974 saccharin Drugs 0.000 description 2
- 235000019204 saccharin Nutrition 0.000 description 2
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 240000005020 Acaciella glauca Species 0.000 description 1
- 241000282461 Canis lupus Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- XROFWZDRDSBPGE-UHFFFAOYSA-K [Cl-].S(=O)(=O)([O-])[O-].[Ni+3] Chemical compound [Cl-].S(=O)(=O)([O-])[O-].[Ni+3] XROFWZDRDSBPGE-UHFFFAOYSA-K 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- GQZXNSPRSGFJLY-UHFFFAOYSA-N hydroxyphosphanone Chemical compound OP=O GQZXNSPRSGFJLY-UHFFFAOYSA-N 0.000 description 1
- 229940005631 hypophosphite ion Drugs 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- FBMUYWXYWIZLNE-UHFFFAOYSA-N nickel phosphide Chemical compound [Ni]=P#[Ni] FBMUYWXYWIZLNE-UHFFFAOYSA-N 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 235000003499 redwood Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910021653 sulphate ion Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/30—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE]
- H01F41/302—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F41/309—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates for applying nanostructures, e.g. by molecular beam epitaxy [MBE] for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices electroless or electrodeposition processes from plating solution
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/923—Physical dimension
- Y10S428/924—Composite
- Y10S428/925—Relative dimension specified
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/928—Magnetic property
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
Definitions
- Clay ABSTRACT A process for improving the quality of a main magnetic film formed on a thick conductive substrate wherein a thin, fine grain, magnetic smoothing film of nickelphosphorus is first deposited on the substrate and then the main magnetic film is formed on the smoothing film.
- the product formed comprises at least one main magnetic film formed on a thin fine grain, magnetic nickel-phosphorus smoothing layer.
- the main magnetic film is at least three times as thick as the smoothing layer.
- the smoothing layer contains from 0.5 to 8 percent phosphorus with the balance nickel.
- Thin magnetic films are employed in many memory devices, such as closed flux structures, open flux structures, plated wires and the like.
- a thin magnetic film When a thin magnetic film is electrodeposited onto thick or large grained conducting substrates they have been found to be of poor quality, in that they had very large easy access dispersion when the films are of the order of 1,000 A or less in thickness.
- the poor quality of the prior art thin films has been attributed to the fact that a good deal of interaction takes place between the crystals in the metallic substrate and the atoms deposited onto the substrate. Thus, crystalline anisotropy is reported to play some role in increasing dispersion.
- the magnetic films deposited are of sufficiently high quality for use in fast, large magnetic memories
- various intermediate layer materials have been utilized.
- the results are generally unsatisfactory due to the difficulty of photoetching the sandwich configuration in a single step process, which would be a highly desirable improvement.
- the properties required of the intermediate layer material are that it must be conductive photoetchable with an etchant which would not severely undercut the magnetic layer, and sufficiently fine grained such that a low-dispersion, high-quality magnetic film may be superimposed upon the material.
- the present invention is particularly advantageous since the etching conditions can be milder and little or no nickel phosphide remains after etching.
- the present invention is not limited to those structures which are eventually etched and the smoothing layer of the present invention can be employed in any situation wherein one wishes to provide a high-quality magnetic layer.
- the nickel-phosphorus film may be deposited, for example, from any of the plating baths well known to those skilled in the art such as sulphate and sulphamate baths.
- the following table I gives the composition of a nickel-sulphate chloride bath by which the nickel-phosphorus film may be deposited.
- Plating is carried out at current densities 25-200 ma./cm.
- the composition of the resulting film must have at least one-half percent phosphorus and may contain up to 8 percent phosphorus. It has been found that if the film has less than one-half percent phosphorus, the desired smoothing effect is not obtained and the resulting main magnetic film thus does not have the desired properties. On the other hand, if one goes above 8 percent of phosphorus, a high-quality ultimate film can be produced from a magnetic standpoint, but the resulting film is difficult to etch and it is therefore imperative that the composition not contain over 8 percent phosphorus in order to achieve the desired results.
- a process for depositing a main anisotropic magnetic film layer it is necessary that the smoothing layer be not thicker 5 onto a thick large grain conductive substrate comprising the than one-third of the thickness of the ultimate magnetic layer. Since many storage elements include very thin magnetic layers such as 400A, it is obviously preferred to employ the thinnest possible smoothing layer in order to provide the desired ultimate structure wherein the smoothing layer does not exert an adverse effect on the ultimate magnetic film. Thus smoothing layers offrom about 50 to 200A are preferred.
- main film being at least three times as thick as the smoothing film.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Thin Magnetic Films (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Magnetic Record Carriers (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US84198869A | 1969-07-15 | 1969-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3634209A true US3634209A (en) | 1972-01-11 |
Family
ID=25286260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US841988A Expired - Lifetime US3634209A (en) | 1969-07-15 | 1969-07-15 | Electro deposited magnetic films |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3634209A (enrdf_load_stackoverflow) |
| JP (1) | JPS4913319B1 (enrdf_load_stackoverflow) |
| DE (1) | DE2028589C3 (enrdf_load_stackoverflow) |
| FR (1) | FR2051752B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1258205A (enrdf_load_stackoverflow) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3953654A (en) * | 1973-08-13 | 1976-04-27 | Rca Corporation | Temperature-stable non-magnetic alloy |
| US4224381A (en) * | 1978-10-19 | 1980-09-23 | Poly Disc Systems, Inc. | Abrasion resistant magnetic record members |
| US4268584A (en) * | 1979-12-17 | 1981-05-19 | International Business Machines Corporation | Nickel-X/gold/nickel-X conductors for solid state devices where X is phosphorus, boron, or carbon |
| EP0136038A1 (en) * | 1983-08-29 | 1985-04-03 | Dynamic Disk, Inc. | Method and apparatus for producing electroplated magnetic memory disk, and the like |
| US4533441A (en) * | 1984-03-30 | 1985-08-06 | Burlington Industries, Inc. | Practical amorphous iron electroform and method for achieving same |
| US4581109A (en) * | 1983-12-12 | 1986-04-08 | Digital Equipment Corporation | Magnetic plated media and process thereof |
| US4686151A (en) * | 1985-04-09 | 1987-08-11 | Dynamic Disk | Substrate material for magnetic recording media |
| US4699695A (en) * | 1984-07-20 | 1987-10-13 | Rieger Franz Metallveredelung | Nickel plating bath |
| US4786324A (en) * | 1986-01-10 | 1988-11-22 | Rieger Franz Metallveredelung | Nickel-plating bath |
| US5576099A (en) * | 1990-02-09 | 1996-11-19 | International Business Machines Corporation | Inductive head lamination with layer of magnetic quenching material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3327297A (en) * | 1963-11-07 | 1967-06-20 | Ibm | Magnetic memory element |
| US3355267A (en) * | 1964-02-12 | 1967-11-28 | Kewanee Oil Co | Corrosion resistant coated articles and processes of production thereof |
| US3393982A (en) * | 1962-11-08 | 1968-07-23 | Ncr Co | Ferromagnetic storage devices having uniaxial anisotropy |
| US3524173A (en) * | 1967-05-22 | 1970-08-11 | Ampex | Process for electrodeposition of anisotropic magnetic films and a product formed by the process |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1353536A (fr) * | 1962-01-12 | 1964-02-28 | Ibm | Procédé de fabrication de films magnétiques |
-
1969
- 1969-07-15 US US841988A patent/US3634209A/en not_active Expired - Lifetime
-
1970
- 1970-05-12 GB GB1258205D patent/GB1258205A/en not_active Expired
- 1970-06-10 DE DE2028589A patent/DE2028589C3/de not_active Expired
- 1970-06-24 JP JP45054441A patent/JPS4913319B1/ja active Pending
- 1970-07-10 FR FR707025686A patent/FR2051752B1/fr not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3393982A (en) * | 1962-11-08 | 1968-07-23 | Ncr Co | Ferromagnetic storage devices having uniaxial anisotropy |
| US3327297A (en) * | 1963-11-07 | 1967-06-20 | Ibm | Magnetic memory element |
| US3355267A (en) * | 1964-02-12 | 1967-11-28 | Kewanee Oil Co | Corrosion resistant coated articles and processes of production thereof |
| US3524173A (en) * | 1967-05-22 | 1970-08-11 | Ampex | Process for electrodeposition of anisotropic magnetic films and a product formed by the process |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3953654A (en) * | 1973-08-13 | 1976-04-27 | Rca Corporation | Temperature-stable non-magnetic alloy |
| US4224381A (en) * | 1978-10-19 | 1980-09-23 | Poly Disc Systems, Inc. | Abrasion resistant magnetic record members |
| US4268584A (en) * | 1979-12-17 | 1981-05-19 | International Business Machines Corporation | Nickel-X/gold/nickel-X conductors for solid state devices where X is phosphorus, boron, or carbon |
| EP0136038A1 (en) * | 1983-08-29 | 1985-04-03 | Dynamic Disk, Inc. | Method and apparatus for producing electroplated magnetic memory disk, and the like |
| US4581109A (en) * | 1983-12-12 | 1986-04-08 | Digital Equipment Corporation | Magnetic plated media and process thereof |
| US4533441A (en) * | 1984-03-30 | 1985-08-06 | Burlington Industries, Inc. | Practical amorphous iron electroform and method for achieving same |
| US4699695A (en) * | 1984-07-20 | 1987-10-13 | Rieger Franz Metallveredelung | Nickel plating bath |
| US4686151A (en) * | 1985-04-09 | 1987-08-11 | Dynamic Disk | Substrate material for magnetic recording media |
| US4786324A (en) * | 1986-01-10 | 1988-11-22 | Rieger Franz Metallveredelung | Nickel-plating bath |
| US5576099A (en) * | 1990-02-09 | 1996-11-19 | International Business Machines Corporation | Inductive head lamination with layer of magnetic quenching material |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2051752A1 (enrdf_load_stackoverflow) | 1971-04-09 |
| FR2051752B1 (enrdf_load_stackoverflow) | 1974-06-14 |
| DE2028589C3 (de) | 1974-06-06 |
| JPS4913319B1 (enrdf_load_stackoverflow) | 1974-03-30 |
| GB1258205A (enrdf_load_stackoverflow) | 1971-12-22 |
| DE2028589A1 (de) | 1971-02-04 |
| DE2028589B2 (de) | 1973-11-15 |
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